CN103501585A - Surface mounting machine nozzle - Google Patents

Surface mounting machine nozzle Download PDF

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Publication number
CN103501585A
CN103501585A CN201310451438.7A CN201310451438A CN103501585A CN 103501585 A CN103501585 A CN 103501585A CN 201310451438 A CN201310451438 A CN 201310451438A CN 103501585 A CN103501585 A CN 103501585A
Authority
CN
China
Prior art keywords
suction nozzle
sleeve
nozzle
chip mounter
surface mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310451438.7A
Other languages
Chinese (zh)
Inventor
眭新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou City Weilang Electronic Science & Technology Co Ltd
Original Assignee
Changzhou City Weilang Electronic Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changzhou City Weilang Electronic Science & Technology Co Ltd filed Critical Changzhou City Weilang Electronic Science & Technology Co Ltd
Priority to CN201310451438.7A priority Critical patent/CN103501585A/en
Publication of CN103501585A publication Critical patent/CN103501585A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a surface mounting machine nozzle, which comprises a nozzle, a spring, a sleeve and a leather collar. The spring is arranged in the sleeve; the nozzle is arranged in the sleeve; the nozzle is fixedly arranged on the sleeve by using a pin; the front end of the nozzle is provided with the nozzle leather collar. By adopting the manner, the surface mounting machine nozzle disclosed by the invention has the advantages that the reliability is high, positioning is accurate, the structure is compact, the transfer speed is high, the noise is small, the cost is low, and the like. Meanwhile, the surface mounting machine nozzle is wide in market prospect in application and popularization of small-sized numerical control machine tools.

Description

Chip mounter suction nozzle
Technical field
The present invention relates to the chip mounter field, particularly relate to a kind of chip mounter suction nozzle.
Background technology
Along with the miniaturization of electronic component, wiring board adopts the surface-adhered type element mostly.Because element pasted on surface is simple and easy to use, but the volume smile adopts Placement usually, and existing chip mounter suction nozzle, usually without buffering, arranges the improper components and parts that easily smash, and the while suction nozzle is metal-made, and air-tightness is bad, if surface irregularity is difficult for picking up element.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of chip mounter suction nozzle, by spring and suction nozzle apron are set, certain buffering and air-tightness is provided, have that reliability is high, good buffer effect, compact conformation, air-tightness is good, suction is large, the advantage such as cheap, have a wide range of applications in chip mounter market simultaneously.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of chip mounter suction nozzle is provided, comprises: suction nozzle, spring, sleeve and suction nozzle apron, be provided with spring in sleeve, suction nozzle is arranged in sleeve, and suction nozzle is fixed on sleeve with pin, and the suction nozzle front end is provided with the suction nozzle apron.
In a preferred embodiment of the present invention, described suction nozzle is copper.
In a preferred embodiment of the present invention, described suction nozzle is provided with gathering sill.
In a preferred embodiment of the present invention, described suction nozzle gathering sill has 2.
In a preferred embodiment of the present invention, described suction nozzle apron is rubber system.
In a preferred embodiment of the present invention, be provided with air flue in the middle of described suction nozzle and sleeve.
The invention has the beneficial effects as follows: chip mounter suction nozzle of the present invention is by arranging spring and suction nozzle apron, certain buffering and air-tightness is provided, have that reliability is high, good buffer effect, compact conformation, air-tightness is good, suction is large, the advantage such as cheap, have a wide range of applications in chip mounter market simultaneously.
The accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, in below describing embodiment, the accompanying drawing of required use is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of chip mounter suction nozzle one preferred embodiment of the present invention;
In accompanying drawing, the mark of each parts is as follows: 1, suction nozzle, 2, sleeve, 3, spring, 4, the suction nozzle apron, 5, pin, 6, gathering sill, 7, air flue.
Embodiment
Below will the technical scheme in the embodiment of the present invention be clearly and completely described, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making all other embodiment that obtain under the creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of chip mounter suction nozzle comprises: suction nozzle 1, spring 3, sleeve 2 and suction nozzle apron 4, be provided with spring 3 in sleeve 2, and suction nozzle 1 is arranged in sleeve 2, and suction nozzle 1 use pin 5 is fixed on sleeve 2, and suction nozzle 1 front end is provided with suction nozzle apron 4.
Described suction nozzle 1 is copper, has good intensity.
Described suction nozzle 1 is provided with gathering sill 6, for finger setting and fixing suction nozzle.
Described suction nozzle 1 gathering sill 6 has 2, guarantees stressed even.
Described suction nozzle apron 4 is rubber system, has good air-tightness, and certain buffering can be provided.
Be provided with air flue 7 in the middle of described suction nozzle 1 and sleeve 2, for generation of pull of vacuum.
The beneficial effect of chip mounter suction nozzle of the present invention is:
One, by spring is set, there is certain shock-absorbing capacity;
Two, by the suction nozzle apron is set, improve air-tightness, increase suction;
Three, chip mounter suction nozzle of the present invention is by arranging spring and suction nozzle apron, certain buffering and air-tightness is provided, there is the advantages such as reliability is high, good buffer effect, compact conformation, air-tightness is good, suction is large, cheap, have a wide range of applications in chip mounter market simultaneously.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or directly or indirectly be used in other relevant technical field, all in like manner be included in scope of patent protection of the present invention.

Claims (6)

1. a chip mounter suction nozzle, is characterized in that, comprising: suction nozzle, spring, sleeve and suction nozzle apron, be provided with spring in sleeve, and suction nozzle is arranged in sleeve, and suction nozzle is fixed on sleeve with pin, and the suction nozzle front end is provided with the suction nozzle apron.
2. chip mounter suction nozzle according to claim 1, is characterized in that, described suction nozzle is copper.
3. chip mounter suction nozzle according to claim 2, is characterized in that, described suction nozzle is provided with gathering sill.
4. chip mounter suction nozzle according to claim 3, is characterized in that, described suction nozzle gathering sill has 2.
5. chip mounter suction nozzle according to claim 1, is characterized in that, described suction nozzle apron is rubber system.
6. chip mounter suction nozzle according to claim 1, is characterized in that, is provided with air flue in the middle of described suction nozzle and sleeve.
CN201310451438.7A 2013-09-29 2013-09-29 Surface mounting machine nozzle Pending CN103501585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310451438.7A CN103501585A (en) 2013-09-29 2013-09-29 Surface mounting machine nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310451438.7A CN103501585A (en) 2013-09-29 2013-09-29 Surface mounting machine nozzle

Publications (1)

Publication Number Publication Date
CN103501585A true CN103501585A (en) 2014-01-08

Family

ID=49866733

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310451438.7A Pending CN103501585A (en) 2013-09-29 2013-09-29 Surface mounting machine nozzle

Country Status (1)

Country Link
CN (1) CN103501585A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104883869A (en) * 2015-05-26 2015-09-02 科思技术(滁州)有限公司 LED module light bar production system
CN105109735A (en) * 2015-08-31 2015-12-02 苏州斯尔特微电子有限公司 Shock absorption manual suction cup for laminator
CN106253049A (en) * 2016-08-23 2016-12-21 中国电子科技集团公司第二研究所 The chip adsorbing mechanism of Laser Devices full-automatic eutectic chip mounter
CN106670775A (en) * 2016-12-07 2017-05-17 广东天机工业智能系统有限公司 Material taking pre-pressing mechanical arm
CN108231647A (en) * 2016-12-15 2018-06-29 鋐源光电科技(厦门)有限公司 For the buffering suction nozzle of light-emitting diode chip for backlight unit
CN109041570A (en) * 2018-09-27 2018-12-18 黄金铭 A kind of chip mounter suction nozzle structure with dust reduction capability
CN109526143A (en) * 2018-11-08 2019-03-26 江苏盐湖电子科技有限公司 A kind of chip mounter
CN109618550A (en) * 2019-01-31 2019-04-12 苏州灿途智能装备有限公司 A kind of patch SOT encapsulating products suction nozzle body

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104883869A (en) * 2015-05-26 2015-09-02 科思技术(滁州)有限公司 LED module light bar production system
CN105109735A (en) * 2015-08-31 2015-12-02 苏州斯尔特微电子有限公司 Shock absorption manual suction cup for laminator
CN106253049A (en) * 2016-08-23 2016-12-21 中国电子科技集团公司第二研究所 The chip adsorbing mechanism of Laser Devices full-automatic eutectic chip mounter
CN106670775A (en) * 2016-12-07 2017-05-17 广东天机工业智能系统有限公司 Material taking pre-pressing mechanical arm
CN108231647A (en) * 2016-12-15 2018-06-29 鋐源光电科技(厦门)有限公司 For the buffering suction nozzle of light-emitting diode chip for backlight unit
CN109041570A (en) * 2018-09-27 2018-12-18 黄金铭 A kind of chip mounter suction nozzle structure with dust reduction capability
CN109041570B (en) * 2018-09-27 2023-08-15 广州光轩电子有限公司 Chip mounter suction nozzle structure with dustproof function
CN109526143A (en) * 2018-11-08 2019-03-26 江苏盐湖电子科技有限公司 A kind of chip mounter
CN109618550A (en) * 2019-01-31 2019-04-12 苏州灿途智能装备有限公司 A kind of patch SOT encapsulating products suction nozzle body

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WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140108