CN103489986A - 提升发光角度的小尺寸发光二极管封装改良结构 - Google Patents

提升发光角度的小尺寸发光二极管封装改良结构 Download PDF

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CN103489986A
CN103489986A CN201210200084.4A CN201210200084A CN103489986A CN 103489986 A CN103489986 A CN 103489986A CN 201210200084 A CN201210200084 A CN 201210200084A CN 103489986 A CN103489986 A CN 103489986A
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林威冲
吴秉宸
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Unity Opto Technology Co Ltd
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    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract

本发明公开一种提升发光角度的小尺寸发光二极管封装改良结构，具有一不透明基座与至少一发光晶片，该发光晶片设于该不透明基座上，其中该不透明基座上环设有一透明侧壁而形成有一凹杯空间，且该透明侧壁是以模造成型方式设置于该不透明基座上，该凹杯空间以点胶方式填充有一封装胶体，且该封装胶体掺杂有至少一荧光粉体。如此，该透明侧壁可扩大发光角度达140°～180°，并大幅减少内反射的光量而避免黄圈现象，且该荧光粉体可加强显色能力而扩增色域。

Description

提升发光角度的小尺寸发光二极管封装改良结构
技术领域
本发明涉及发光二极管封装结构的技术领域，特别涉及一种提升发光角度的小尺寸发光二极管封装改良结构。
背景技术
现有发光二极管（Light-Emitting Diode,LED）主要是由一平板型基板或一凹杯型基板承载一发光晶片，并经打线及封胶作业后制成。其中，采用平板型基板的LED封装结构虽具有较广的发光角度，但由于平板型基板无法直接进行点胶，且后续组装过程较为复杂而使制程成本较高，不符经济效益。再者，胶体为浓稠的半流质物体而具有难以于固定区域内成形的特性，故LED常有因胶体成形较差导致一次光学发光效果差，进而产生影响LED整体合格率及后续发光效率的问题。
另一方面，凹杯型基板虽便于实施点胶，但一体两面者，凹杯型基板中可供以固定点胶区域的侧壁亦将限制LED的发光角度。换言之，发光晶片所发射的部份侧光受凹杯型基板的侧壁所阻挡而限制LED的发光角度，更甚者，上述部份侧光受侧壁阻挡而使LED产生内部反射，形成黄圈现象。有鉴于此，为降低上述侧光受侧壁阻挡的光量而提升发光角度，LED封装结构可依据发光晶片相对侧壁的距离针对发光晶片的原光径方向及角度调整。举例而言，若使侧壁尽可能地远离发光晶片时，侧壁较不易阻挡发光晶片所发射的侧光而可形成较广的发光角度，但此时，LED将具有一定体积的封装结构，不符电子产品微型化的趋势而不易于后续运用，使降低LED于各领域中的适用性。又，若采取仅单纯地降低侧壁高度，则导致胶体不易固合而成形不佳，影响LED发光效率。
由此可知，无论采用上述何种做法，现有的LED最大发光角度仍仅约120°，使后续运用时限制其照明范围及辐照角度。故此，如何有效增大发光角度的同时避免黄圈现象的产生即为本发明人亟欲改善的课题。
发明内容
有鉴于现有技术的问题，本发明的目的在于提供一种提升发光角度的小尺寸发光二极管封装改良结构，使加强LED的发光效率而有效提升适用性，以符合显示器背光源的照明需求。
根据本发明的目的，本发明提出一种提升发光角度的小尺寸发光二极管封装改良结构，具有一不透明基座与至少一发光晶片，该发光晶片设于该不透明基座上，其中该不透明基座上环设有一透明侧壁而形成有一凹杯空间，且该透明侧壁是以模造成型（Molding）方式设置于该不透明基座上，该凹杯空间以点胶方式填充有一封装胶体，且该封装胶体掺杂有至少一荧光粉体。如此，即可扩大发光角度达140°～180°，且无反射所造成的黄圈现象。
并且，为加强光照均匀度，该透明侧壁掺杂有至少一扩散粉体。或者，该透明侧壁是由聚甲基丙烯酸甲酯材质（Polymethylmethacrylate,PMMA）、甲基硅酸盐材质（Polysilsesquioxanes）或环氧树脂材质（Epoxy）其中之一所制成。
其中，该透明侧壁为二次光学透镜，故为加强该发光晶片的颜色呈现，该透明侧壁可为红色透明体、绿色透明体或蓝色透明体其中之一，且其剖面呈圆弧状。
综上所述本发明的有益效果在于，该小尺寸发光二极管封装改良结构可小型化以提升发光二极管于各领域的适用性，且易于实施而可降低封装制程成本。再者，该透明侧壁可视为二次光学透镜，而可轻易调整该发光晶片的原发光角度及目标照射区域的分布。如此，本发明即可运用于显示器的背光模组中，以加强R、G、B的色彩表现并实现显示器广色域的表现，或者，本发明可用于照明灯具光源中，以呈现大角度的照射表现。
附图说明
图1为本发明较佳实施例的第一实施态样的剖视图。
图2为本发明较佳实施例的第一实施态样的光径示意图。
图3为本发明较佳实施例的第二实施态样的剖视图。
图4为本发明较佳实施例的第二实施态样的光径示意图。
图5为本发明较佳实施例的第三实施态样的剖视图。
附图标记说明：1-小尺寸发光二极管封装改良结构；10-不透明基座；11-发光晶片；12-透明侧壁；13-封装胶体；14-荧光粉体；15-扩散粉体。
具体实施方式
以下结合附图，对本发明上述的和另外的技术特征和优点作更详细的说明。
请参阅图1、图2，分别为本发明较佳实施例的第一实施态样的剖视图及光径示意图。如图所示，该小尺寸发光二极管封装改良结构1适用于直下式背光源或灯泡灯具等照明装置中，具有一不透明基座10与至少一发光晶片11，该发光晶片11可为黄光、红光、蓝光或绿光LED晶片，且该不透明基座10上环设有一透明侧壁12而形成有一凹杯空间。该发光晶片11设于该不透明基座10上并容置于该凹杯空间内，且该发光晶片11透过打线后与该不透明基座10的正负电极电性连接。接着，该凹杯空间以点胶方式填充一封装胶体13，且该封装胶体13掺杂有至少一荧光粉体14，以通过该荧光粉体14的物理特性扩张并纯化显色能力。如此，该发光晶片11所发射的大部分侧光穿射该透明侧壁12后持续朝外传递，大幅降低反射于该凹杯空间内部的光量，避免黄圈现象的产生。
值得注意的是，该透明侧壁12是以模造成型方式设置于该不透明基座10上，且对该发光晶片11而言，该透明侧壁12可视为二次光学透镜，以降低照明装置的制程成本及简化组装复杂度。并且，为加强该发光晶片11的颜色呈现，该透明侧壁12可掺有染料而呈红色透明体、绿色透明体或蓝色透明体其中之一。如此，当该小尺寸发光二极管封装改良结构1应用于显示器的背光源中时，具有色彩的该透明侧壁12即可加强R、G、B的色彩表现，使显示器实现广色域的表现能力。
承上，请一并参阅图3图4，分别为本发明较佳实施例的第二实施态样的剖视图及光径示意图。如图所示，由于该透明侧壁12可视为光学透镜，且为进一步改变该发光晶片11的原光径方向而形成较广的照明范围，并提升该小尺寸发光二极管封装改良结构1的适用性，该透明侧壁12的剖面呈圆弧状，使该发光晶片11所发射的大部分侧光经该透明侧壁12后产生折射而偏移光径，以扩大发光角度达140°～180°。如此，透过调整该透明侧壁12的外观形状及透明度即可改变该小尺寸发光二极管封装改良结构1的光形。
再者，为加强光照均匀度，该小尺寸发光二极管封装改良结构1可如图5所示，其为本发明较佳实施例的第三实施态样的剖视图，使该透明侧壁12掺杂有至少一扩散粉体15，或者，该透明侧壁12由PMMA、甲基硅酸盐材质或环氧树脂材质其中之一所制成，且该扩散粉体15亦可为PMMA或甲基硅酸盐材质，以加强发散该发光晶片11所发射的侧光。如此，该小尺寸发光二极管封装改良结构1完成封装制程时即具有一次光学光扩散功效而不影响光衰度，且通过该扩散粉体15规则性地将该发光晶片11的点发光源折射形成面光源，可有效降低点发光源转换成面光源的机构间距，并改善光扩散不均的问题。
以上说明对本发明而言只是说明性的，而非限制性的，本领域普通技术人员理解，在不脱离以下所附权利要求所限定的精神和范围的情况下，可做出许多修改，变化，或等效，但都将落入本发明的保护范围内。

Claims (6)

1.一种提升发光角度的小尺寸发光二极管封装改良结构，具有一不透明基座与至少一发光晶片，该发光晶片设于该不透明基座上，其特征在于：
该不透明基座上环设有一透明侧壁而形成有一凹杯空间，且该透明侧壁是以模造成型方式设置于该不透明基座上，该凹杯空间以点胶方式填充有一封装胶体，且该封装胶体掺杂有至少一荧光粉体。
2.根据权利要求1所述的小尺寸发光二极管封装改良结构，其特征在于，该透明侧壁掺杂有至少一扩散粉体。
3.根据权利要求1所述的之小尺寸发光二极管封装改良结构，其特征在于，该透明侧壁是由聚甲基丙烯酸甲酯材质、甲基硅酸盐材质或环氧树脂材质其中之一所制成。
4.根据权利要求1至3其中任一项所述的小尺寸发光二极管封装改良结构，其特征在于，该透明侧壁为二次光学透镜。
5.根据权利要求4所述的小尺寸发光二极管封装改良结构，其特征在于，该透明侧壁为红色透明体、绿色透明体或蓝色透明体其中之一。
6.根据权利要求5所述的小尺寸发光二极管封装改良结构，其特征在于，该透明侧壁的剖面呈圆弧状。
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TWI518948B (zh) 2016-01-21
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