CN103489567B - Common mode inductance - Google Patents
Common mode inductance Download PDFInfo
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- CN103489567B CN103489567B CN201310419772.4A CN201310419772A CN103489567B CN 103489567 B CN103489567 B CN 103489567B CN 201310419772 A CN201310419772 A CN 201310419772A CN 103489567 B CN103489567 B CN 103489567B
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- common mode
- mode inductance
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- magnetic
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Abstract
The invention discloses a kind of common mode inductance, it includes magnetic core, magnetic masking layer and winding, the magnetic core includes top cover, base and two wrapping posts side by side, the top cover and base are oppositely arranged, described two wrapping posts are uprightly arranged between the top cover and base, and the two ends of each wrapping post are individually fixed in the top cover and base, and the winding is wound on described two wrapping posts, the magnetic masking layer wraps up the wrapping post and the winding, for magnetic field shielding.The common mode inductance of the invention is reduced in plate suqare by two wrapping posts side by side, by the top cover and base that are oppositely arranged, realizes the flattening of device, is easy to SMT to assemble, and reduces production crash rate.
Description
Technical field
The present invention relates to communication field, more particularly to a kind of common mode inductance.
Background technology
In communication field, enterprise network router product is in key position, the huge market demand, veneer device layout density
It is high；The miniaturization of common mode inductance, planarization, Surface Mount are one of Primary Components of integrated router.
But existing plug-in unit common mode inductance is present that plate suqare is big, packaging technology difficulty is big, device shock resistance difference
Problem.And small-power Surface Mount common mode inductance has that coplane degree is poor, solderability is poor, production crash rate is higher.
The content of the invention
Embodiment of the present invention technical problem to be solved is, there is provided a kind of in the common mode that plate suqare is small, coplane degree is good
Inductance.
On the one hand, there is provided a kind of common mode inductance, it includes magnetic core, magnetic masking layer and winding, and the magnetic core includes top cover, bottom
Seat and two wrapping posts side by side, the top cover and base are oppositely arranged, and described two wrapping posts are uprightly arranged at the top cover
And between base, the two ends of each wrapping post are individually fixed in the top cover and base, and the winding is wound in described two
On wrapping post, the magnetic masking layer wraps up the wrapping post and the winding, for magnetic field shielding.
In the first possible implementation, the common mode inductance includes electric connection terminal, and the electric connection terminal sets
It is placed on the base.
With reference to the first possible implementation, in second possible implementation, the electric connection terminal is institute
State the pad structure that electroplating metal material is formed on base.
With reference to the first possible implementation, in the third possible implementation, the electric connection terminal is to connect
Terminal.
With reference to the third possible implementation, in the 4th kind of possible implementation, the electric connection terminal be
The bolt type binding post of pre-buried sintering in the base.
In the 5th kind of possible implementation, the common mode inductance also includes insulator foot, and the base is fixed on institute
State on insulator foot, pad or binding post are provided with the insulator foot.
In the 6th kind of possible implementation, the top cover and base are slab construction.
With reference to the 6th kind of possible implementation, in the 7th kind of possible implementation, the top cover uses chamfering square
Shape platy structure, the base uses chamfering rectangular plate-like structure.
In the 8th kind of possible implementation, the winding uses enamel-covered wire or flat wire.
In the 9th kind of possible implementation, the magnetic masking layer is oval tube-in-tube structure, the magnetic masking layer set
If the magnetic core and the winding.
In the tenth kind of possible implementation, the magnetic core is made of soft magnetic materials.
In a kind of the tenth possible implementation, the magnetic masking layer is made of soft magnetic materials or magnetic particle colloid.
The common mode inductance of the invention is reduced in plate suqare by two wrapping posts side by side, by the top being oppositely arranged
Lid and base, realize the flattening of device, are easy to SMT to assemble, and reduce production crash rate.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the common mode inductance that first embodiment of the invention is provided；
Fig. 2 is the schematic diagram at another visual angle of the common mode inductance of Fig. 1；
The schematic diagram of the common mode inductance that Fig. 3 second embodiment of the invention is provided；
Fig. 4 is the schematic diagram at another visual angle of the common mode inductance of Fig. 3；
Fig. 5 is the schematic diagram of the common mode inductance that third embodiment of the invention is provided.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Common mode inductance provided in an embodiment of the present invention is realized by double upright wrapping posts and the top cover being oppositely arranged and base
It is small in plate suqare, reduce the purpose of production crash rate.
Also referring to Fig. 1 and Fig. 2, for a kind of common mode inductance 100 that first embodiment of the invention is provided.The common mode
Inductance 100 includes magnetic core 10, magnetic masking layer 20 and winding 30.The winding 30 is wound on the magnetic core 10, the magnetic screen
The parcel of layer 20 winding 30, for magnetic field shielding.
The magnetic core 10 includes top cover 11, base 12 and two wrapping posts 13 side by side.The top cover 11 and the phase of base 12
To setting, described two wrapping posts 13 are uprightly arranged between the top cover 11 and base 12.Described two wrapping posts 13 can be with
The wiring of co-mode coil is carried out respectively.In present embodiment, the magnetic core 10 is made of soft magnetic materials, such as electromagnetic pure iron,
Electrolytic iron, carbonyl iron, molybdenum permalloy, magnetic flux material high, iron sial or ferrite etc..The top cover 11 and base 12 are flat
Hardened structure.So as to facilitate suction nozzle to carry out SMT assemblings.Specifically, the top cover 11 uses chamfering rectangular plate-like structure, the base
12 use chamfering rectangular plate-like structure.Described two wrapping posts 13 are cylindrical structure.Certainly, in other embodiments, institute
Stating top cover 11 and base 12 can also set according to installation environment and overarch.The wrapping post 13 can also be prism structure or song
The structures such as axle.Uprightly it is arranged side by side by chamfering rectangular plate-like structure and described two wrapping posts 13 in present embodiment, it is described
The magnetic circuit of common mode inductance 100 can be symmetrical, and each magnetic resistance in the upper and lower, left and right of the common mode inductance 100 is evenly distributed.
Electric connection terminal 120 is also set up on the base 12.In present embodiment, the common mode inductance 100 it is through-flow small
In 2A, the electric connection terminal 120 is the pad structure that electroplating metal material is formed on the base 12.Reach low power
The common mode inductance 100 welds uniformity.Certainly, in other embodiments, if the common mode inductance 100 it is through-flow more than etc.
In 2A, the electric connection terminal 120 is binding post.Specifically, the electric connection terminal 120 is the pre-buried burning in the base 12
The bolt type binding post of knot, the bottom of the base 12 sets the thimble-type Surface Mount being electrically connected with the bolt type binding post and welds
End, reaches the soldering reliability of the common mode inductance 100.The magnetic core 10 can highly be customized according to Product Assembly.
The winding 30 is wound on described two wrapping posts 13.The winding 30 can be using traditional enamel-covered wire or flat
Line.In present embodiment, the winding 30 uses the enamel-covered wire of 0.5mm, 2A.When the electric connection terminal 120 uses pad knot
During structure, the winding 30 is welded with the electric connection terminal 120 using spot-welding technology, it is ensured that welding uniformity.It is electrically connected when described
When connecting terminal 120 is using bolt type binding post, the winding 30 is welded with the electric connection terminal 120 using bolt welding technique
Connect, it is ensured that soldering reliability.
The magnetic masking layer 20 wraps up the wrapping post 13 and the winding 30, for magnetic field shielding.The magnetic masking layer
20 can be made of soft magnetic materials or magnetic particle colloid.In present embodiment, the magnetic masking layer 20 of soft magnetic materials by being made
Oval tube-in-tube structure, the magnetic masking layer 20 is arranged the magnetic core 10 and the winding 30.The magnetic masking layer 20 can be with
Reduce interference of the common mode inductance 100 to peripheral circuit.
The common mode EMI of the common mode inductance 100 in present embodiment suppresses frequency range can reach the highest of EMC radiation tests
Frequency 1000MHz.Simultaneously, it is possible to reduce conventional common-mode in plate suqare 20%-50%；The bad band of device coplane degree can be reduced
The crash rate 100ppm for coming.
The common mode inductance 100 also supports the plate power supply flattening of enterprise network router product to design, and lifting product is close
Degree.
Also referring to the common mode inductance 200 that Fig. 3 and Fig. 4, second embodiment of the invention are provided.The common mode inductance
200 is essentially identical with the common mode inductance 100 that first embodiment is provided, and its difference is that the common mode inductance 100 is also wrapped
Insulator foot 140 is included, base 121 is fixed on the insulator foot 140, and pad can be provided with the insulator foot 140
Or binding post.Can prevent the base 121 from being ftractureed when binding post is installed by the insulator foot 140, improve yield rate.
In present embodiment, the insulator foot 140 is made of plastic cement.The insulator foot 140 is the rectangular flat structure of chamfering.
The top surface of the insulator foot 140 opens up groove 140a, and bottom surface is plane.The base 121 is fixed in the groove 140a.Institute
Two sides long for stating insulator foot 140 are symmetrical arranged 4 electric connection terminals 220.The electric connection terminal 220 is pad.
Refer to Fig. 5, the common mode inductance 300 that third embodiment of the invention is provided.The common mode inductance 300 and second is real
The common mode inductance 200 that the mode of applying is provided is essentially identical, and its difference is that electric connection terminal 320 is in insulator foot 240
The bolt type binding post of pre-buried sintering.
The present invention is reduced in plate suqare by two wrapping posts side by side, by the top cover and base that are oppositely arranged, is realized
The flattening of device, is easy to SMT to assemble, and reduces production crash rate.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
Modified with to the technical scheme described in foregoing embodiments, or equivalent is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (9)
1. a kind of common mode inductance, it includes magnetic core, magnetic masking layer and winding, and the magnetic core includes top cover, base and two side by side
Wrapping post, the top cover and base be oppositely arranged, and described two wrapping posts are uprightly arranged between the top cover and base, respectively
The two ends of the wrapping post are individually fixed in the top cover and base, and the winding is wound on described two wrapping posts, described
Magnetic masking layer wraps up the wrapping post and the winding, for magnetic field shielding, it is characterised in that the base is provided with electrical connection
Terminal；The common mode inductance it is through-flow less than 2A when, the electric connection terminal be on the base electroplating metal material formed
Pad structure；The common mode inductance it is through-flow more than or equal to 2A when, the electric connection terminal is binding post.
2. common mode inductance as claimed in claim 1, it is characterised in that the common mode inductance it is through-flow more than or equal to 2A when, institute
State the bolt type binding post that electric connection terminal is the pre-buried sintering in the base.
3. common mode inductance as claimed in claim 1, it is characterised in that the common mode inductance also includes insulator foot, the bottom
Seat is fixed on the insulator foot, and pad or binding post are provided with the insulator foot.
4. common mode inductance as claimed in claim 1, it is characterised in that the top cover and base are slab construction.
5. common mode inductance as claimed in claim 4, it is characterised in that the top cover uses chamfering rectangular plate-like structure, described
Base uses chamfering rectangular plate-like structure.
6. common mode inductance as claimed in claim 1, it is characterised in that the winding uses enamel-covered wire or flat wire.
7. common mode inductance as claimed in claim 1, it is characterised in that the magnetic masking layer is oval tube-in-tube structure, described
Magnetic masking layer is arranged the magnetic core and the winding.
8. common mode inductance as claimed in claim 1, it is characterised in that the magnetic core is made of soft magnetic materials.
9. common mode inductance as claimed in claim 1, it is characterised in that the magnetic masking layer uses soft magnetic materials or magnetic particle colloid system
Into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310419772.4A CN103489567B (en) | 2013-09-13 | 2013-09-13 | Common mode inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310419772.4A CN103489567B (en) | 2013-09-13 | 2013-09-13 | Common mode inductance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103489567A CN103489567A (en) | 2014-01-01 |
| CN103489567B true CN103489567B (en) | 2017-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310419772.4A Active CN103489567B (en) | 2013-09-13 | 2013-09-13 | Common mode inductance |
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| Country | Link |
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| CN (1) | CN103489567B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104795201B (en) * | 2015-04-23 | 2017-08-15 | 深圳振华富电子有限公司 | Common-mode inductor |
| CN105679493A (en) * | 2016-05-02 | 2016-06-15 | 杨宏 | Magnetic apparatus adopting novel structure |
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| US7057486B2 (en) * | 2001-11-14 | 2006-06-06 | Pulse Engineering, Inc. | Controlled induction device and method of manufacturing |
| CN200983312Y (en) * | 2006-09-30 | 2007-11-28 | 西安西电变压器有限责任公司 | Ultra-high voltage parallel electrical resistor |
| CN101114540A (en) * | 2006-07-28 | 2008-01-30 | 三星电子株式会社 | Coil block and electronic device using the same |
| CN202871542U (en) * | 2012-09-20 | 2013-04-10 | 成都达瑞斯科技有限公司 | Active field full magnetic shielding mouse-cage-shaped double core limb superconductivity electric reactor |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE413716B (en) * | 1978-05-02 | 1980-06-16 | Asea Ab | POWER TRANSFORMER OR REACTOR |
| TW499030U (en) * | 2000-08-18 | 2002-08-11 | Delta Electronics Inc | Base structure of the surface mount inductor |
| JP2003133137A (en) * | 2001-10-19 | 2003-05-09 | Murata Mfg Co Ltd | Wire-wound coil |
| JP4337312B2 (en) * | 2002-07-24 | 2009-09-30 | 株式会社村田製作所 | Low profile winding coil |
| JP5544721B2 (en) * | 2009-02-03 | 2014-07-09 | スミダコーポレーション株式会社 | Magnetic element |
| CN201465722U (en) * | 2009-07-17 | 2010-05-12 | 广东风华高新科技股份有限公司 | Vertical type shielded inductor |
| CN101692385A (en) * | 2009-09-01 | 2010-04-07 | 吴卫生 | Inductor and manufacturing method thereof |
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2013
- 2013-09-13 CN CN201310419772.4A patent/CN103489567B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7057486B2 (en) * | 2001-11-14 | 2006-06-06 | Pulse Engineering, Inc. | Controlled induction device and method of manufacturing |
| CN101114540A (en) * | 2006-07-28 | 2008-01-30 | 三星电子株式会社 | Coil block and electronic device using the same |
| CN200983312Y (en) * | 2006-09-30 | 2007-11-28 | 西安西电变压器有限责任公司 | Ultra-high voltage parallel electrical resistor |
| CN202871542U (en) * | 2012-09-20 | 2013-04-10 | 成都达瑞斯科技有限公司 | Active field full magnetic shielding mouse-cage-shaped double core limb superconductivity electric reactor |
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| CN103489567A (en) | 2014-01-01 |
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Effective date of registration: 20211224 Address after: 450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after: Super fusion Digital Technology Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |
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