CN201311972Y - Conductive structure and electronic device comprising same - Google Patents

Abstract

The utility model discloses a conductive structure and an electronic device comprising the conductive structure. The conductive structure comprises a copper foil and at least one conducting wire. The conducting wire is directly arranged on the surface of the copper foil in a spot welding manner. The conductive structure can be used as a primary winding and/or a secondary winding of an inductance component in the electronic device, and can also be arranged between the windings to be used as a shielding layer for reducing electromagnetic interference. Because the conductive structure of the utility model is combined with the copper foil and at least one conducting wire in the spot welding manner, the volume of the electronic device is reduced, and the assembly cost can also be reduced.

Description

Conductive structure and one comprises the electronic installation of this conductive structure

Technical field

The utility model relates to conductive structure, the conductive structure on particularly a kind of electronic installation that is used in Inductive component one class.

Background technology

In present various electronic installation, comprised the electromagnetic induction assembly mostly, to change mutually, provide effects such as filtering, energy storage and exoergic by electric energy and magnetic energy, reach the purpose of stablizing output current.These electromagnetic induction assemblies include a conductive structure usually, significant feature can be divided into two parts, one is direct elementary winding and/or secondary winding as the electromagnetic induction assembly, second it be that it is arranged between elementary winding and the secondary winding, or be arranged between each electronic building brick of electronic installation as reducing electromagnetic interference (electro-magnetic interference, one of EMI) screen avoids electromagnetic wave that human body and electronic installation are caused harmful effect.

Existing conductive structure 1 is as shown in Figure 1, and it comprises a Copper Foil 11 and a lead 13.Lead 13 is disposed on the surface of Copper Foil 11, as pin (pin), uses that conductive structure 1 and electronic installation are electrically conducted.The existing practice is fixedly welded on lead 13 on the Copper Foil 11 for utilizing the soldering mode, this mode is no doubt convenient, but the junction that Copper Foil 11 and lead are 13 can form a tin ball 15, and excessive tin ball 15 will cause the volume of conductive structure 1 to increase, take bigger space, and then the electronic installation overall dimensions is increased thereupon, do not meet the compact demand trend of present electronic installation.Moreover the use of scolding tin causes the cost of assembled material and manufacture process to increase, and influences the competitiveness of product price.

From the above, in the present conductive structure, mainly be utilize the soldering mode with lead fixed on Copper Foil, but this practice will cause the increase of volume and the raising of product cost

The utility model content

The purpose of this utility model is, a kind of novel conductive structure is provided; This conductive structure can take under the advantage of smaller size smaller, as level winding and/or secondary winding at the beginning of the Inductive component in the electronic installation, or is arranged between each winding as the screen that prevents electromagnetic interference.

For reaching above-mentioned purpose, provide a kind of conductive structure to comprise a Copper Foil and at least one lead, wherein lead system directly utilizes the mode of spot welding to be arranged on the Copper Foil at least.

The utility model is different from the existing mode of utilizing soldering, can avoid excessive tin ball to result from the contact position of Copper Foil and at least one lead, effectively reduces the conductive structure volume.Simultaneously, utilize the spot welding mode more can simplify the manufacturing production stage, reduce assembling and material cost, and then increase the competitiveness of product in market in conjunction with Copper Foil and at least one lead.

Description of drawings

Fig. 1 is the conductive structure schematic diagram of prior art;

Fig. 2 is one of the utility model conductive structure schematic diagram;

Fig. 3 A is the utility model electronic structure schematic diagram.

Fig. 3 B is another conductive structure schematic diagram that is used for Fig. 3 A.

Embodiment

One of this novel creation embodiment is that it is a conductive structure 2 as shown in Figure 2.Conductive structure 2 comprises a Copper Foil 21, a lead 23 and an insulating barrier 27.Wherein, Copper Foil 21 has a first surface 210 and with respect to one of first surface 210 second surface (scheming not shown), lead 23 is to be adjacent to first surface 210, and insulating barrier 27 is adjacent to second surface and reflexed coats below on the first surface 210 to extend.

Lead 23 is to be arranged on the first surface 210 of Copper Foil 21 by the spot welding mode, and Copper Foil 21 and lead 23 are interconnected in fact.One of lead 23 material is a copper, such as enamel covered wire, yet implements in the aspect in other, and lead 23 more can be other material.What must illustrate is that in other enforcement aspect, the number of conductors that conductive structure comprised is not limit; Simultaneously, lead also can be connected in fact with the mutual fusion of Copper Foil by other high temperature or high pressure mode; Moreover Copper Foil 21 and lead 23 be only fusion wherein also, and to be connected with another person, hereat both connected modes are not exceeded so that present embodiment is described.

Copper Foil 21 has a length direction X, and after lead 23 interconnected with Copper Foil 21, the line stretcher of lead 23 is suitable one of to become angle 22 with the length direction X-shaped of Copper Foil 21, and this angle 22 is less than 180 °.Because lead 23 is easy to bending, hereat in other embodiment, lead 23 also can be arranged on the Copper Foil 21 abreast with length direction X, therefore Copper Foil 21 does not exceed with this embodiment with the setting of lead 23, on practice, lead 23 more can other relative position or angle be connected with Copper Foil 21.

In present embodiment, insulating barrier 27 is to be connected with the second surface and the part first surface 210 of Copper Foil 21, and in this embodiment, connected mode is to bind, and implements also to can be any connected mode of spreading in aspect in other.In present embodiment, insulating barrier 27 is an insulating tape, and so its material is not limited to this, and its set position of conductive structure 2 that places is not also limit, and knowing this operator can cooperate the practical application situation to be arranged on the conductive structure 2 insulating barrier 27.Because insulating barrier 27 can be isolated with the Copper Foil on the conductive structure 2 21 and lead 23 and adjacent electronic building brick, have hereat avoided Copper Foil 21 and lead 23 to contact and caused short circuit phenomenon with adjacent electronic building brick.

In this embodiment, lead 23 combines and forms a pin (pin) with Copper Foil 21 by the spot welding mode, can be connected with other electronic building brick or circuit board and electrically conduct in order to do conductive structure 2.When the conductive structure 2 that utilizes the spot welding mode to form can avoid using the soldering mode to link lead 23 with Copper Foil 21 in the past, be easy to the situation that the junction formed large tin ball, therefore can make conductive structure 2 volume-diminished, exempt the use of scolding tin simultaneously, reduce the assembled material cost.

This novel creation more proposes a kind of electronic installation 3, and its part-structure is that this electronic installation can be an Inductive component as shown in Figure 3A, and be a transformer in this, to receive a voltage, after the changing voltage value, export from a voltage output end (scheming not shown) from a voltage input end (scheming not shown).

Electronic installation 3 comprises conductive structure 30, and the schematic diagram system of conductive structure 30 is shown in Fig. 3 B, and it has a Copper Foil 31, two leads 33 and insulating barrier 37.Similar in appearance to previous description, lead 33 is to be arranged on the Copper Foil 31 by the spot welding mode, and difference is that previous lead 23 is a wherein end that is arranged at Copper Foil 21, and two leads 33 herein are the two ends that are arranged at Copper Foil 31 respectively.Wherein the lead 33 at a conductive structure 30 two ends is to be connected to voltage input end, with as an elementary winding; And in another conductive structure 30, its lead 33 two ends then are connected to voltage output end, as secondary winding; In addition, as elementary winding and as in two conductive structures 30 of secondary winding, cording has not isometric Copper Foil 31, forms different pitch of the laps numbers, uses induction and produces different magnitudes of voltage.It should be noted that know this operator and only also can spread to the conductive structure that adopts this creation in elementary winding or secondary winding, another winding then uses coil windings.

Implement in the aspect in other, conductive structure 30 also can be arranged between elementary winding and the secondary winding, utilization is arranged at lead 33 on the Copper Foil 31 and is connected to earth terminal in the electronic installation 3, to form the ground connection effect, make conductive structure 30 form the screen of a minimizing electromagnetic interference, wherein be arranged at lead 33 quantity on the Copper Foil 31 and can be one or a plurality of, if during plural wires, the same ground connection of its other end.And as shown in Figure 3A, lead 33 quantity of its present embodiment are one.What must illustrate is that under this situation, the lead that is arranged on the Copper Foil also must be looked practical application, attaches insulating barrier in the appropriate location, takes place to prevent short circuit.By this, just can avoid causing electromagnetic interference, reduce electromagnetic wave human body is caused bad influence and the running that hinders other electronic installation because of the factors such as unstable and inner each electronic building brick operating frequency of source electric current in the electronic installation 3.Implement in the aspect in this type of, elementary winding and secondary winding can be selected from the conductive structure or the general coil windings of this creation.

More than describe only in order to explanation, implement in the aspect in other, electronic installation also can be other Inductive component, and more can be arranged between other each electronic building brick as the conductive structure 30 of electromagnetic interference shield, see through the ground connection effect of lead 33, to reach the function of electromagnetic interference shield.

Because the conductive structure of this creation expends with the unnecessary volume of reduction weld by the mode that cooperates spot welding, make and utilize this conductive structure can therefore reduce as the electronic installation volume of Inductive component and/or electromagnetic interference shield layer.In sum, the structural design of this creation conductive structure is simple, and it is little to take volume, meet now the compact requirement of electronic installation, replaced the manufacture of soldering simultaneously with spot welding, can simplify production procedure, and reduce the assembled material cost, and then improve product market competitiveness.

Claims (10)

1. a conductive structure comprises a Copper Foil; And at least one lead, it is characterized in that described lead is directly welded on this Copper Foil.

2. conductive structure as claimed in claim 1 is characterized in that wherein this Copper Foil has a length direction, and this at least one lead system and this length direction form an angle, and this angle system is less than 180 °.

3. conductive structure as claimed in claim 1 is characterized in that wherein this Copper Foil has a length direction, and this at least one lead is parallel with this length direction.

4. conductive structure as claimed in claim 1 is characterized in that, wherein this at least one lead is a pin.

5. one kind is adopted the electronic installation of conductive structure according to claim 1, it is characterized in that, wherein this electronic installation is an Inductive component.

6. one kind is adopted the electronic installation of conductive structure according to claim 1, it is characterized in that, wherein this electronic installation is a transformer.

7. electronic installation as claimed in claim 6 is characterized in that, wherein this conductive structure is an elementary winding.

8. electronic installation as claimed in claim 6 is characterized in that, wherein this conductive structure is a level winding.

9. electronic installation as claimed in claim 6 is characterized in that, wherein this transformer comprises an elementary winding and a level winding, and this conductive structure system is arranged between this elementary winding and this secondary winding.

10. electronic installation as claimed in claim 6 is characterized in that, wherein this conductive structure is a screen, and this at least one lead ground connection of this conductive structure.

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