CN103487838B - The encapsulating structure of Optical devices - Google Patents
The encapsulating structure of Optical devices Download PDFInfo
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- CN103487838B CN103487838B CN201210190740.7A CN201210190740A CN103487838B CN 103487838 B CN103487838 B CN 103487838B CN 201210190740 A CN201210190740 A CN 201210190740A CN 103487838 B CN103487838 B CN 103487838B
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- sensitive cell
- optical devices
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- 238000005516 engineering process Methods 0.000 description 6
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- 238000005538 encapsulation Methods 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/04—Systems determining the presence of a target
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
- G01S7/4813—Housing arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Abstract
The present invention relates to the encapsulating structure of a kind of Optical devices, including a substrate, a light-emitting component, a photo-sensitive cell and a light-blocking structure.Light-emitting component is configured on substrate and is connected with electrical property of substrate.Light-emitting component is adapted to provide for a light beam.Photo-sensitive cell is configured on substrate, and photo-sensitive cell is a chip size packages element, and wherein photo-sensitive cell is suitable to the light beam after receiving by an object reflection.Light-blocking structure is arranged at the periphery of photo-sensitive cell.
Description
Technical field
The present invention relates to a kind of encapsulating structure, and in particular to the encapsulating structure of a kind of Optical devices.
Background technology
Fig. 1 is the generalized section of the encapsulating structure of existing a kind of close induction type optical sensor.Refer to Fig. 1, existing
Close induction type optical sensor 100 includes luminous source 110, optical detector 120 and an encapsulating housing 130.Encapsulating housing 130 points
Not having one first accommodation space 132 and one second accommodation space 134, wherein luminous source 110 is arranged at the first accommodation space
132, and optical detector 120 is arranged at the second accommodation space 134.In close induction type optical sensor 100, when an object 101 is close
During close induction type optical sensor 100, then the light beam L1 that luminous source 110 is provided, will be reflected by object 101 and transmit light echo and detect
Survey device 120, thus would know that the message that object 101 is the most close.
But, in close induction type optical sensor 100, the luminous source 110 being positioned at the first accommodation space 132 passes through surface mount
Mode electrically connect encapsulating housing 130, and optical detector 120 typically by routing engage the mode of (wire bonding) with
Encapsulating housing 130 electrically connects, as shown in Figure 1.Consequently, it is possible to the size of the second accommodation space 134 (such as: width W1) is just difficult to contracting
Little.
Additionally, due to encapsulating structure 130 further includes a light-shielding structure 136, be positioned at luminous source 110 and optical detector 120 it
Between, directly it is transferred on optical sensor 120 with the light beam L1 avoiding luminous source 110 to be provided and then cannot action.But, logical
Though crossing the design of light-shielding structure 136 and using the travel path that can effectively limit light, but the most still can cause close induction type
The overall volume of optical sensor 100 cannot be the most reduced.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art and defect, propose the encapsulating structure of a kind of Optical devices,
It can have less size and have preferably optical appearance.
Other objects and advantages of the present invention can be further understood from the technical characteristic that disclosed herein.
For reaching above-mentioned one or part or all of purpose or other purpose, one embodiment of the invention proposes a kind of optics
The encapsulating structure of device, it includes a substrate, a light-emitting component, a photo-sensitive cell and a light-blocking structure.Light-emitting component configures
It is connected on substrate and with electrical property of substrate.Light-emitting component is adapted to provide for a light beam.Photo-sensitive cell is configured on substrate, and photosensitive unit
Part is a chip size packages element (chip scale package, CSP), wherein photo-sensitive cell be suitable to receive anti-by an object
Light beam after penetrating.Light-blocking structure is arranged at the periphery of photo-sensitive cell.
In one embodiment of this invention, above-mentioned light-blocking structure is arranged on substrate and is connected with substrate solid.At this
In one embodiment of invention, the encapsulating structure of Optical devices further includes a multilayer film, is arranged on photo-sensitive cell, wherein by object
At least part of light beam after reflection is suitable to be transferred to photo-sensitive cell by multilayer film.In one embodiment of this invention, by thing
If the angle of incidence that at least part of light beam after body reflection is incident to multilayer film is less than a predetermined angular, then light beam is suitable to pass through multilamellar
Film and be transferred to photo-sensitive cell.
In one embodiment of this invention, above-mentioned light-blocking structure entity connects photo-sensitive cell.An enforcement in the present invention
In example, the encapsulating structure of Optical devices further includes a multilayer film, is arranged on photo-sensitive cell, after being wherein reflected by the object at least
Segment beam is suitable to be transferred to photo-sensitive cell by multilayer film.In one embodiment of this invention, above-mentioned light-blocking structure bag
Including one to be in the light lid, be positioned at above photo-sensitive cell and have an opening, at least part of light beam after being wherein reflected by the object is suitable to lead to
Cross opening and be transferred to photo-sensitive cell.In one embodiment of this invention, above-mentioned opening exposes part multilayer film.At this
In a bright embodiment, the encapsulating structure of Optical devices further includes partition wall, be configured on substrate and be positioned at photo-sensitive cell with
Between light-emitting component.In one embodiment of this invention, at least part of light beam after being reflected by the object is incident to entering of multilayer film
If firing angle is less than a predetermined angular, then light beam is suitable to be transferred to photo-sensitive cell by multilayer film.
In one embodiment of this invention, above-mentioned light-blocking structure includes a transparent material layer and a light-shielding material layers, thoroughly
The side of optical material layer is connected with photo-sensitive cell entity, the opposite side of transparent material layer then with light-shielding material layers material contact.
In one embodiment of this invention, transparent material layer covers photo-sensitive cell, and light-shielding material layers has an opening, to expose portion
Point transparent material layer, and at least part of light beam after being reflected by the object is suitable to be transferred to photo-sensitive cell by opening.
In one embodiment of this invention, above-mentioned light-emitting component is black light light-emitting component, and above-mentioned photosensitive unit
Part is black light photo-sensitive cell.
In one embodiment of this invention, above-mentioned photo-sensitive cell is connected with electrical property of substrate by multiple conductive materials,
And these conductive materials are between photo-sensitive cell and substrate.
In one embodiment of this invention, the spacing of above-mentioned light-emitting component and above-mentioned photo-sensitive cell is separated by and is more than
0.1mm is less than 3mm.
Based on above-mentioned, photo-sensitive cell is adopted as chip size packages element by the encapsulating structure of the Optical devices of the present invention,
And the mode of tradition routing joint need not be used, thus overall volume and the size of the encapsulating structure of Optical devices can be reduced.Separately
Outward, multilayer film is arranged on photo-sensitive cell, in addition to can reducing veiling glare and being transferred to the chance of photo-sensitive cell, also can reduce light
Learn overall volume and the size of the encapsulating structure of device.Furthermore, by suitably adjusting the design of light-blocking structure, except reducing
Outside the overall volume of the encapsulating structure of Optical devices is with size, also can reduce cost of manufacture and make degree of difficulty.
For the features described above of the present invention and advantage can be become apparent, special embodiment below, and coordinate institute's accompanying drawings
It is described in detail below.
Accompanying drawing explanation
Fig. 1 is the generalized section of the encapsulating structure of existing a kind of close induction type optical sensor；
Fig. 2 is the schematic diagram of the encapsulating structure of the Optical devices of one embodiment of the invention；
Fig. 3 A is the schematic diagram of the encapsulating structure of the Optical devices of another embodiment of the present invention；
Fig. 3 B is the partial enlarged drawing of the encapsulating structure of the Optical devices of Fig. 3 A；
Fig. 4 is the schematic diagram of the encapsulating structure of the Optical devices of further embodiment of this invention；
Fig. 5 is the schematic diagram of the encapsulating structure of the Optical devices of yet another embodiment of the invention；
Fig. 6 is the schematic diagram of the encapsulating structure of the Optical devices of a present invention more embodiment；
Fig. 7 is the schematic diagram of the encapsulating structure of the Optical devices of a further embodiment of the present invention；
Fig. 8 is the schematic diagram of the encapsulating structure of the Optical devices of a present invention still embodiment.
Symbol description in figure
100 close induction type optical sensors
101 objects
110 luminous sources
120 optical detectors
130 encapsulating housings
132 first accommodation spaces
134 second accommodation spaces
136 light-shielding structures
The encapsulating structure of 200～800 Optical devices
201 objects
210 substrates
220 light-emitting components
230 photo-sensitive cells
232 conductive materials
240,410,710,710 ' light-blocking structure
310 multilayer films
412 are in the light lid
412a, 714a opening
610 dividing walls
712,712 ' transparent material layer
714,714 ' light-shielding material layers
Inside 712a
Outside 712b
L1 light beam
L1 ' light beam
θ angle of incidence
N1 normal
Detailed description of the invention
For the present invention aforementioned and other technology contents, feature and effect, in following cooperation with reference to graphic one preferable
In the detailed description of embodiment, can clearly present.The direction term being previously mentioned in following example, such as: upper and lower, left,
Right, front or rear etc., it is only the direction with reference to annexed drawings.Therefore, the direction term of use is used to illustrate not for limiting
The present invention.
Fig. 2 is the schematic diagram of the encapsulating structure of the Optical devices of one embodiment of the invention.The Optical devices of the present embodiment
Encapsulating structure 200 can be using the framework of close induction type optical sensor as explanation, and specifically, the encapsulating structure 200 of Optical devices wraps
Include substrate 210, light-emitting component 220, photo-sensitive cell 230 and a light-blocking structure 240.Light-emitting component 220 is configured at base
It is electrically connected with on plate 210 and with substrate 210.Light-emitting component 220 is adapted to provide for a light beam L1.In the present embodiment, light-emitting component
220 can be light emitting diode or laser diode, wherein the cheapest due to the cost of light emitting diode, therefore the present embodiment
Light-emitting component 220 be with light emitting diode as an example, but be not limited to this.If making the encapsulating structure of Optical devices
200 can provide longer operable distance and not consider the problem of cost, and light-emitting component 220 also can use laser diode.Separately
Outward, for avoiding user to observe the light of light-emitting component 220, the light-emitting component 220 of the present embodiment be using black light as
Illustrate, the most preferably light-emitting component 220 of infrared light, but be not limited to this.
Additionally, when light-emitting component 220 uses light emitting diode, in order to be effectively reduced or reduce the encapsulation of Optical devices
The overall volume of structure 200 and size, light-emitting component 220 can use SMD LED surface-mount device LED (Surface Mounted
Technology, SMT) light-emitting component, and with the electrical connection of substrate 210, wherein substrate 210 can be a circuit board
The substrate of (circuit board) or a wire support (lead frame) etc.
In the encapsulating structure 200 of Optical devices, photo-sensitive cell 230 is configured on substrate 210, and photo-sensitive cell 230 is fitted
In receiving the light beam L1 ' after being reflected by an object 201.Specifically, in order to be effectively reduced or reduce the encapsulation of Optical devices
The overall volume of structure 200 and size, photo-sensitive cell 230 can be a chip size packages element (chip scale
Package, CSP), wherein chip size packages (CSP) technology is that size is not more than 1.2 times of former chip by after chip package
Encapsulation technology.Specifically, the present embodiment so-called chip size packages element, refer to after encapsulating in every way is photosensitive
Element 230, within its packaging body length of side is compared with including the chip length of side big 20%, or the area of packaging body is include chip area 1.5
Within Bei.In other words, the photo-sensitive cell 230 of the present embodiment, can be by photo-sensitive cell by using chip size packages (CSP) technology
The package dimension of 230 is reduced to original 1/4 to 1/10, to coordinate the lightest, thin, short, little product trend.
It addition, in order to avoid tradition uses the mode of routing joint (wire bonding) to connect photo-sensitive cell 230 and base
Plate 210, and cause overall package size to be difficult to reduce, the photo-sensitive cell 230 of the present embodiment can be by multiple conductive materials 232
It is electrically connected with substrate 210, and these conductive materials 232 are between photo-sensitive cell 230 and substrate 210, as shown in Figure 2.?
In the present embodiment, these conductive materials 232 can be stannum ball.
Photo-sensitive cell directly it is transferred to please continue to refer to Fig. 2, the light beam L1 provided in order to avoid light-emitting component 220
On 220, and cause Optical devices encapsulating structure 200 cannot action (such as: determine whether object proximity), therefore, be in the light knot
Structure 240 is arranged at the periphery of photo-sensitive cell 230, wherein light-blocking structure 240 can be disposed on substrate 210 and with substrate 210
Entity connects, as shown in Figure 2.It should be noted that owing to photo-sensitive cell 230 is chip size packages element, and photo-sensitive cell
230 directly can be electrically connected with substrate 210 by conductive material 232, and need not use the mode of tradition routing joint, thus
Can make the distance between photo-sensitive cell 230 with light-blocking structure 240 considerably near (regardless of the sky needed for engaging to routing
Between), reduce overall volume and the size of the encapsulating structure 200 of Optical devices further.
Fig. 3 A is the schematic diagram of the encapsulating structure of the Optical devices of another embodiment of the present invention.Please also refer to Fig. 2 and figure
3A, the encapsulating structure 300 of the Optical devices of the present embodiment uses similar structure to the encapsulating structure 200 of aforementioned optical device,
The two difference is: the encapsulating structure 300 of Optical devices further includes a multilayer film 310, and wherein multilayer film 310 is arranged at sense
On optical element 230, and at least part of light beam L1 ' after being reflected by object 201 is suitable to be transferred to photosensitive unit by multilayer film 310
Part 230.
Specifically, multilayer film 310 can be stacked by the film layer 312 of different refractivity, to filter the light of non-specific wavelength
Line, thus the light beam L1 ' of specific wavelength can be made to penetrate, wherein the penetrated wavelength of the incident ray of off-normal N1 can be special
The wavelength shift of standing wave length.For example, if the stacked film layer 312 of multilayer film 310 be design wavelength 680nm can by time,
The incidence angle θ of the incident beam L1 ' representing wavelength 680nm can pass through when being 0 degree, and (incidence angle θ is big when more off-normal
In 0 degree time), then representing other wavelength (such as: 670nm～690nm) can be transferred on photo-sensitive cell 230 by multilayer film 310.
In other words, the multilayer film 310 of the present embodiment can be the filter element of a kind of IR pass.
Specifically, at least part of light beam L1 ' after being reflected by object 201 is if the incidence angle θ being incident to multilayer film 310 is little
In a predetermined angular, then light beam L1 ' is suitable to be transferred to photo-sensitive cell 230 by multilayer film 310, as shown in Figure 3 B, and Qi Zhongtu
3B is the partial enlarged drawing of the encapsulating structure of the Optical devices of Fig. 3 A.Specifically, incident as the light beam L1 ' of particular range of wavelengths
Incidence angle θ to multilayer film 310 is the least (when i.e. light beam L1 ' is the closer to normal N 1), then the light beam L1 ' of particular range of wavelengths relatively holds
Easily it is transferred to photo-sensitive cell 230 by multilayer film 310, otherwise, when the light beam L1 ' of particular range of wavelengths is incident to multilayer film
The incidence angle θ of 310 is the biggest (when i.e. light beam L1 ' is further away from normal N 1), then the light beam L1 ' of particular range of wavelengths just cannot be by many
Tunic 310 and be transferred to photo-sensitive cell 230.It is noted that above-mentioned particular range of wavelengths can refer to that light-emitting component 220 is carried
The wavelength of the light beam L1 ' of confession, and the light-blocking structure 240 of suitable height will can limit to entering of the light beam L1 ' that is incident to multilayer film 310
Firing angle θ, thus can more effectively filter the light beam L1 ' of non-specific wavelength scope, and make the light beam L1 ' of particular range of wavelengths pass through
Multilayer film 310 and be transferred on photo-sensitive cell 230.In one embodiment, the height of light-blocking structure 240 be more than light-emitting component with
And the height of photo-sensitive cell, and less than 5mm.
Understanding based on above-mentioned, the encapsulating structure 300 of the Optical devices of the present embodiment is except having above-mentioned Optical devices
Outside advantage mentioned by encapsulating structure 200, also can reduce veiling glare be transferred to photo-sensitive cell 230 by the use of multilayer film 310
Chance, thus can improving optical device encapsulating structure 300 optics sensing performance.
Fig. 4 is the schematic diagram of the encapsulating structure of the Optical devices of further embodiment of this invention.Please also refer to Fig. 4 and Fig. 3,
The encapsulating structure 400 of the Optical devices of the present embodiment uses similar structure to the encapsulating structure 300 of aforementioned optical device, the two
Difference is: light-blocking structure 410 entity connects photo-sensitive cell 230, but is not connected with substrate 210 entity.Specifically, originally
Light-blocking structure 410 is mainly arranged at the periphery of photo-sensitive cell 230 and is connected, so with photo-sensitive cell 230 entity by embodiment
Once to arrange aforesaid light-blocking structure 240 on substrate 210.This means, when photo-sensitive cell 230 is arranged at substrate 210,
This light-blocking structure 240 will be arranged on substrate 210 along with photo-sensitive cell 230 simultaneously.So can be further
Reduce overall volume and the size of the encapsulating structure 400 of Optical devices.
Understanding based on above-mentioned, the encapsulating structure 400 of the Optical devices of the present embodiment is except having above-mentioned Optical devices
Outside advantage mentioned by encapsulating structure 200,300, also can by by light-blocking structure 410 entity connect photo-sensitive cell 230 design,
And further reduce overall volume and the size of the encapsulating structure 400 of Optical devices.
Fig. 5 is the schematic diagram of the encapsulating structure of the Optical devices of yet another embodiment of the invention.Please also refer to Fig. 5 and Fig. 4,
The encapsulating structure 500 of the Optical devices of the present embodiment uses similar structure to the encapsulating structure 400 of aforementioned optical device, the two
Difference is: light-blocking structure 410 also includes that one is in the light lid 412, and the lid 412 that is wherein in the light is positioned at above photo-sensitive cell 230 also
There is an opening 412a exposing part multilayer film 310, and at least part of light beam L1 ' after being reflected by object 201 is suitable to lead to
Cross opening 412a and be transferred to photo-sensitive cell 230.In the present embodiment, the encapsulating structure 500 of Optical devices except having on
State outside the advantage mentioned by encapsulating structure 200～400 of Optical devices, also can arrange have opening 412a be in the light lid 412 in
The top of photo-sensitive cell 230, and then can more effectively reduce veiling glare and be transferred on photo-sensitive cell 230.
Fig. 6 is the schematic diagram of the encapsulating structure of the Optical devices of a present invention more embodiment.Please also refer to Fig. 6 and Fig. 5,
The encapsulating structure 600 of the Optical devices of the present embodiment uses similar structure to the encapsulating structure 500 of aforementioned optical device, the two
Difference is: the encapsulating structure 600 of Optical devices further includes partition wall 610, and wherein dividing wall 610 is configured at substrate
On 210 and between photo-sensitive cell 230 and light-emitting component 220, direct in order to reduce the light beam L1 that light-emitting component 220 provided
Ground is transferred to the probability of photo-sensitive cell 230 from side, also can reduce veiling glare simultaneously and be transferred on photo-sensitive cell 230.Except this
Outside, the encapsulating structure 600 of the Optical devices of the present embodiment also has the encapsulating structure 200～500 of aforementioned optical device and is carried
And advantage, just repeat no more at this.
Fig. 7 is the schematic diagram of the encapsulating structure of the Optical devices of a further embodiment of the present invention.Please also refer to Fig. 7 and Fig. 4,
The encapsulating structure 700 of the Optical devices of the present embodiment uses similar structure to the encapsulating structure 400 of aforementioned optical device, the two
Difference is: the light-blocking structure 710 of the present embodiment includes transparent material layer 712 and a light-shielding material layers 714, Qi Zhongtou
The side 712a of optical material layer 712 is connected with photo-sensitive cell 230 entity, the opposite side 712b of transparent material layer 712 then with screening
Optical material layer 714 material contact.In the present embodiment, light transmissive material (such as: transparent adhesive tape material) can be first used to be formed at photo-sensitive cell
The transparent material layer 712 that the periphery of 230 shows as depicted in fig. 7 with formation, the mode of recycling coating afterwards or attaching is by lightproof material
Material (such as: black resin) is formed at the outside 712b of transparent material layer.Or be to be initially formed being in the light of showing as depicted in fig. 7
After structure 710, then light-blocking structure 710 is connected with photo-sensitive cell 230 (such as: attach), above-mentioned is all enforceable example, but not
Being limited to this, this part slightly can adjust according to user.Understand based on above-mentioned, the encapsulating structure of the Optical devices of the present embodiment
700 advantages mentioned by encapsulating structure 200 ~ 400 can with above-mentioned Optical devices, just repeat no more at this.
Fig. 8 is the schematic diagram of the encapsulating structure of the Optical devices of a present invention still embodiment.Please also refer to Fig. 8 and Fig. 7,
The encapsulating structure 800 of the Optical devices of the present embodiment uses similar structure to the encapsulating structure 700 of aforementioned optical device, the two
Difference is: transparent material layer 712 ' covers photo-sensitive cell 230, and light-shielding material layers 714 ' has an opening 714a, with
Exposing partial light permeability material layer 712 ', at least part of light beam L1 ' after wherein being reflected by object 201 is suitable to by opening 714a
And it is transferred to photo-sensitive cell 230, as shown in Figure 8.In the present embodiment, transparent encapsulant glue material can be first used to be formed directly on sense
The transparent material layer 712 ' shown as depicted in figure 8 with formation on optical element 230, the mode of recycling coating afterwards or attaching is by shading
Material (such as: black resin) is formed at the outside of transparent material layer 712 ', shows as depicted in figure 8.Similarly, the optics of the present embodiment
The encapsulating structure 800 of device can have the advantage mentioned by encapsulating structure 200 ~ 400 of above-mentioned Optical devices, the most superfluous at this
State.
It is noted that owing to encapsulating structure 200 ~ 800 overall dimensions of Optical devices of the present embodiment is compared to biography
Encapsulating structure 100 overall dimensions of system Optical devices can be the most reduced, and therefore, above-mentioned light-emitting component 210 is with above-mentioned
Spacing W1 of photo-sensitive cell 230 at least can fall between 0.1mm～3mm.
In sum, the encapsulating structure of the Optical devices of the present invention at least has the following advantages.First, photo-sensitive cell is core
Chip size potted element, and the mode of tradition routing joint need not be used, thus the whole of the encapsulating structure of Optical devices can be reduced
Body volume and size.It addition, be arranged on photo-sensitive cell by multilayer film, it is transferred to the machine of photo-sensitive cell except veiling glare can be reduced
Outside Hui, also can reduce overall volume and the size of the encapsulating structure of Optical devices.Furthermore, by suitably adjusting light-blocking structure
Design, in addition to the overall volume that can reduce the encapsulating structure of Optical devices and size, also can reduce cost of manufacture and be stranded with making
Difficulty.
Being the above, only presently preferred embodiments of the present invention, when not limiting, with this, the scope that the present invention implements, i.e.
Generally the simple equivalence change made according to claims of the present invention and description of the invention content and modification, the most still belong to the present invention
In the range of patent contains.Additionally any embodiment or the claim of the present invention is not necessary to reach the whole mesh that disclosed herein
Or advantage or feature.Additionally, summary part and title are intended merely to assist patent document retrieval to be used, not it is used for limiting this
The interest field of invention.
Claims (10)
1. the encapsulating structure of Optical devices, it is characterised in that including:
One substrate；
One light-emitting component, is configured on this substrate and is connected with this electrical property of substrate, and this light-emitting component is adapted to provide for a light beam；
One photo-sensitive cell, is configured on this substrate, and this photo-sensitive cell is a chip size packages element, wherein this photo-sensitive cell
Being suitable to this light beam after receiving by an object reflection, wherein this photo-sensitive cell is by multiple conductive materials with this electrical property of substrate even
Connect, but engage not by routing and be connected with this electrical property of substrate, and those conductive materials are positioned at this photo-sensitive cell and this substrate
Between, and regard it from the direction of this substrate vertical, within those conductive materials are positioned at a region of this photo-sensitive cell；And
One light-blocking structure, is arranged at the periphery of this photo-sensitive cell, and wherein, this light-blocking structure entity connects this photo-sensitive cell, and should
Light-blocking structure is connected with this substrate with those conductive materials by this photo-sensitive cell, but not by walking around this photo-sensitive cell
Connected mode and be connected with this substrate.
2. the encapsulating structure of Optical devices as claimed in claim 1, wherein, also includes:
One multilayer film, is arranged on this photo-sensitive cell, and this light beam at least part of after wherein being reflected by this object is suitable to by this
Multilayer film and be transferred to this photo-sensitive cell.
3. the encapsulating structure of Optical devices as claimed in claim 2, wherein, this light beam at least part of after being reflected by this object
If being incident to the angle of incidence of this multilayer film less than a predetermined angular, then to be suitable to be transferred to this by this multilayer film photosensitive for this light beam
Element.
4. the encapsulating structure of Optical devices as claimed in claim 2, wherein, this light-blocking structure includes:
One is in the light lid, is positioned at above this photo-sensitive cell and has an opening, this light at least part of after wherein being reflected by this object
Bundle is suitable to be transferred to this photo-sensitive cell by this opening.
5. the encapsulating structure of Optical devices as claimed in claim 4, wherein, this opening exposes this multilayer film of part.
6. the encapsulating structure of Optical devices as claimed in claim 4, wherein, also includes:
Partition wall, is configured on this substrate and between this photo-sensitive cell and this light-emitting component.
7. the encapsulating structure of Optical devices as claimed in claim 1, wherein, this light-blocking structure includes a transparent material layer and
Light-shielding material layers, the side of this transparent material layer is connected with this photo-sensitive cell entity, the opposite side of this transparent material layer then with
This light-shielding material layers material contact.
8. the encapsulating structure of Optical devices as claimed in claim 7, wherein, this transparent material layer covers this photo-sensitive cell, and
This light-shielding material layers has an opening, to expose this transparent material layer of part, and by least partly should after the reflection of this object
Light beam is suitable to be transferred to this photo-sensitive cell by this opening.
9. the encapsulating structure of Optical devices as claimed in claim 1, wherein, this light-emitting component is black light light-emitting component,
And this photo-sensitive cell is black light photo-sensitive cell.
10. the encapsulating structure of Optical devices as claimed in claim 1, wherein, phase between this light-emitting component with this photo-sensitive cell
Every being less than 3mm more than 0.1mm.
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| CN201610592320.XA CN106125153B (en) | 2012-06-11 | 2012-06-11 | The encapsulating structure of Optical devices |
| CN201210190740.7A CN103487838B (en) | 2012-06-11 | 2012-06-11 | The encapsulating structure of Optical devices |
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| TWI491059B (en) * | 2012-10-04 | 2015-07-01 | Upi Semiconductor Corp | Proximity sensor and circuit layout method thereof |
| CN104332524B (en) * | 2014-08-26 | 2018-01-09 | 日月光半导体制造股份有限公司 | Electronic installation, optical module and its manufacture method |
| US10170658B2 (en) * | 2015-11-13 | 2019-01-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structures and method of manufacturing the same |
| CN108074918B (en) * | 2016-11-18 | 2019-11-29 | 光宝光电(常州)有限公司 | Raw doctor's sensor mould group of optical profile type and preparation method thereof |
| CN109244093B (en) | 2018-08-30 | 2020-09-29 | 维沃移动通信有限公司 | Optical packaging assembly and mobile terminal |
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| CN106125153B (en) | 2019-06-04 |
| CN106125153A (en) | 2016-11-16 |
| CN103487838A (en) | 2014-01-01 |
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