CN103487474A - MEMS (micro-electromechanical systems) capacitive humidity sensor with high sensitivity and fast response - Google Patents
MEMS (micro-electromechanical systems) capacitive humidity sensor with high sensitivity and fast response Download PDFInfo
- Publication number
- CN103487474A CN103487474A CN201310461445.5A CN201310461445A CN103487474A CN 103487474 A CN103487474 A CN 103487474A CN 201310461445 A CN201310461445 A CN 201310461445A CN 103487474 A CN103487474 A CN 103487474A
- Authority
- CN
- China
- Prior art keywords
- interdigital
- humidity sensor
- high sensitivity
- substrate
- positive electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004044 response Effects 0.000 title claims abstract description 15
- 230000035945 sensitivity Effects 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 8
- 229910021426 porous silicon Inorganic materials 0.000 claims description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 239000003990 capacitor Substances 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 230000006872 improvement Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种基于体硅工艺的MEMS(微电子机械系统)电容式湿度传感器,尤其是一种采用多孔硅和空气层作为介质的叉指结构的电容式湿度传感器。The invention relates to a MEMS (micro-electro-mechanical system) capacitive humidity sensor based on bulk silicon technology, in particular to a capacitive humidity sensor with an interdigital structure using porous silicon and an air layer as a medium.
背景技术Background technique
湿度测量在工业和农业以及人们的日常生活中上有着广泛的应用,也是研究气象状况不可缺少的一个因素。湿度传感器作为湿度测量系统的重要组成部分,已经发展了很多年。采用硅基制造的湿度传感器也已经存在了十几年,按照工作类型可分为电容式、电阻式、压阻式、悬臂梁式、热电偶式。其中电容式湿度传感器具有高灵敏度,低功耗,好的温度特性,结构坚固,对外部应力的灵敏度高等优点,使得其研究最为广泛。Humidity measurement is widely used in industry and agriculture as well as people's daily life, and it is also an indispensable factor for studying meteorological conditions. Humidity sensors have been developed for many years as an important part of humidity measurement systems. Humidity sensors made of silicon have also existed for more than ten years, and can be divided into capacitive, resistive, piezoresistive, cantilever beam, and thermocouple types according to their working types. Among them, the capacitive humidity sensor has the advantages of high sensitivity, low power consumption, good temperature characteristics, firm structure, and high sensitivity to external stress, making it the most widely studied.
目前,主要的电容式湿度传感器有两种,一种是叉指电容式湿度传感器,常用的叉指电容式湿度传感器通过表面加工工艺形成,其敏感电容较小,且寄生电容大,不利于测量,另一种是三明治结构的湿度传感器,这种传感器将感湿材料置于敏感电容极板之间作为感湿介质,虽然灵敏度高,寄生电容小,但是响应速度慢。At present, there are two main capacitive humidity sensors, one is the interdigital capacitive humidity sensor, the commonly used interdigital capacitive humidity sensor is formed by surface processing technology, its sensitive capacitance is small, and the parasitic capacitance is large, which is not conducive to measurement , and the other is a sandwich-structured humidity sensor. This sensor places a moisture-sensitive material between sensitive capacitor plates as a moisture-sensing medium. Although it has high sensitivity and small parasitic capacitance, its response speed is slow.
发明内容Contents of the invention
技术问题:本发明的目的是提供一种具有高灵敏度快速响应的MEMS电容式湿度传感器,解决的技术问题在于,针对现有技术中电容式传感器上述缺陷,提出一种结构简单,加工方便,敏感电容大,寄生电容小的电容式湿度传感器。Technical problem: The purpose of the present invention is to provide a MEMS capacitive humidity sensor with high sensitivity and fast response. The technical problem to be solved is to propose a simple structure, convenient processing, sensitive Capacitive humidity sensor with large capacitance and small parasitic capacitance.
技术方案:本发明的具有高灵敏度快速响应的MEMS电容式湿度传感器包括衬底,覆盖有感湿介质的叉指正电极;其中,衬底位于检测电容的底部,起基座作用,感湿介质覆盖在叉指正电极、叉指负电极的表面,叉指负电极与衬底之间设有空腔,感湿介质与叉指正电极、叉指负电极之间的空气层构成检测电容的感湿结构。Technical solution: The MEMS capacitive humidity sensor with high sensitivity and fast response of the present invention includes a substrate and an interdigitated positive electrode covered with a moisture-sensitive medium; wherein, the substrate is located at the bottom of the detection capacitor and acts as a base, and the moisture-sensitive medium covers On the surface of the interdigital positive electrode and interdigital negative electrode, there is a cavity between the interdigital negative electrode and the substrate, and the air layer between the moisture-sensing medium and the interdigital positive electrode and interdigital negative electrode constitutes a moisture-sensing structure for detecting capacitance .
所述感湿层为多孔硅层。The moisture-sensing layer is a porous silicon layer.
所述叉指正电极、叉指负电极为低阻硅。The interdigitated positive electrode and the interdigitated negative electrode are low-resistance silicon.
所述叉指正电极、叉指负电极为体硅工艺加工的具有高深宽比的叉指结构。The interdigital positive electrode and the interdigital negative electrode are interdigital structures with a high aspect ratio processed by bulk silicon technology.
所述叉指正电极、叉指负电极的叉指结构与衬底之间是空气层。There is an air layer between the interdigitated positive electrode and the interdigitated negative electrode and the substrate.
所述衬底为玻璃。The substrate is glass.
本发明所述具有高灵敏度的电容式湿度传感器的工作原理为:在本发明所述技术方案中,所述电容式湿度传感器包括介质层、空气层和叉指电极,其中,叉指电容呈悬臂梁结构状,其中,介质层在叉指电极之上,覆盖了介质层的叉指之间以及叉指和衬底之间还有空气层。当感湿介质层吸湿后,其介电常数会发生变化,进而引起检测电容发生形变,从而实现湿度测量功能。The working principle of the capacitive humidity sensor with high sensitivity in the present invention is: in the technical solution of the present invention, the capacitive humidity sensor includes a medium layer, an air layer and interdigital electrodes, wherein the interdigital capacitance is in the form of a cantilever The beam structure is in which the dielectric layer is above the interdigital electrodes, and there is an air layer between the interdigital electrodes covering the dielectric layer and between the interdigital fingers and the substrate. When the moisture-sensitive medium layer absorbs moisture, its dielectric constant will change, which will cause the detection capacitor to deform, thereby realizing the humidity measurement function.
有益效果:作为对本发明所述技术方案的一种改进,叉指电极为体硅工艺加工的具有高深宽比的叉指结构。综合其材料的加工成本、制作工艺的实现方式以及敏感电容的大小来说,体加工工艺加工的叉指电极具有成本低、制作工艺简单、敏感电容大的优点。Beneficial effects: As an improvement to the technical solution of the present invention, the interdigital electrode is an interdigital structure with a high aspect ratio processed by bulk silicon technology. In terms of the processing cost of the material, the realization of the manufacturing process, and the size of the sensitive capacitor, the interdigitated electrode processed by the bulk processing process has the advantages of low cost, simple manufacturing process, and large sensitive capacitor.
作为对本发明所述技术方案的一种改进,衬底为玻璃衬底,通过键合工艺与低阻硅形成结构。综合所选材料的成本,制作工艺以及材料性能来说,选用玻璃衬底可以减少寄生电容,硅-玻璃键合工艺成熟的优点。As an improvement to the technical solution of the present invention, the substrate is a glass substrate, and a structure is formed with low-resistance silicon through a bonding process. In terms of the cost of the selected material, the manufacturing process and the performance of the material, choosing a glass substrate can reduce parasitic capacitance and has the advantage of a mature silicon-glass bonding process.
作为对本发明所述技术方案的一种改进,叉指结构与玻璃衬底之间有空气腔,可以使得高深宽比的叉指结构可以实现双面感湿,提高相应时间。As an improvement to the technical solution of the present invention, there is an air cavity between the interdigital structure and the glass substrate, so that the interdigital structure with a high aspect ratio can sense moisture on both sides and improve the response time.
作为对本发明所述技术方案的一种改进,叉指结构之间有空气腔,使得响应时间提高。As an improvement to the technical solution of the present invention, there is an air cavity between the interdigital structures, so that the response time is improved.
附图说明Description of drawings
图1是本发明电容式相对湿度传感器的俯视图。Fig. 1 is a top view of the capacitive relative humidity sensor of the present invention.
图2是本发明电容式相对湿度传感器的截面图。Fig. 2 is a cross-sectional view of the capacitive relative humidity sensor of the present invention.
图中有:衬底1,叉指正电极1-2,叉指负电极1-3,空气间隙1-4,空腔1-5,感湿介质2,空气层3。In the figure, there are: substrate 1, interdigitated positive electrodes 1-2, interdigitated negative electrodes 1-3, air gaps 1-4, cavities 1-5, moisture
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本发明,并不用于限定本发明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
本发明优选实施例如下:Preferred embodiments of the present invention are as follows:
如图1所示,本实施例所述电容式湿度传感器包括呈悬臂梁结构状的检测电容,该传感器包括衬底1,覆盖有感湿介质2的叉指正电极1-2;其中,衬底1位于检测电容的底部,起基座作用,感湿介质2覆盖在叉指正电极1-2、叉指负电极1-3的表面,叉指正电极1-2、叉指负电极1-3与衬底1之间设有空腔1-5,感湿介质2与叉指正电极1-2、叉指负电极1-3之间的空气层3构成检测电容的介质层用来敏感湿度所引起的电极之间的介电常数的变化;所述检测电容呈叉指悬臂梁结构。As shown in Figure 1, the capacitive humidity sensor described in the present embodiment comprises the detection capacitance that is cantilever beam structure, and this sensor comprises substrate 1, is covered with the interdigital positive electrode 1-2 of
在本实施例中,衬底1选用玻璃衬底,感湿介质2为多孔硅,叉指正电极1-2和叉指负电极1-3都为低阻硅。In this embodiment, the substrate 1 is a glass substrate, the moisture-
如图2所示,本实施例所述电容式湿度传感器的制作过程如下:首先,选用低阻硅作为初始材料,对其背面进行光刻工艺和湿法腐蚀工艺,形成背面的空腔1-5;进行硅片和玻璃衬底1键合,形成带有底座的空腔结构;对硅片正面进行光刻和深反应离子刻蚀工艺,形成具有高深宽比的叉指电容结构,即形成叉指正电极1-2和叉指负电极1-3;将成型的硅叉指结构作为阳极在HF酸溶液中通以电流进行阳极氧化,即可以在硅片表面得到感湿介质2。As shown in Figure 2, the manufacturing process of the capacitive humidity sensor described in this embodiment is as follows: first, low-resistance silicon is selected as the initial material, and a photolithography process and a wet etching process are performed on the back thereof to form a cavity 1- 5. Bond the silicon wafer and the glass substrate 1 to form a cavity structure with a base; perform photolithography and deep reactive ion etching processes on the front of the silicon wafer to form an interdigitated capacitor structure with a high aspect ratio, that is, to form The interdigitated positive electrode 1-2 and the interdigitated negative electrode 1-3; the molded silicon interdigitated structure is used as an anode to pass an electric current in HF acid solution for anodic oxidation, that is, the moisture-
在本实施例中,正负电极、多孔硅感湿层以及空气层构成叉指结构状的检测电容,当湿度发生变化时,由于多孔硅的多孔性会改变其介电常数,进而引起电容发生形变,而由于多孔硅之间有空气层,因而不存在聚合物感湿时的扩散速度慢的问题,进而该电容式湿度传感器的响应时间得到很大的提高。In this embodiment, the positive and negative electrodes, the porous silicon moisture-sensing layer and the air layer constitute the detection capacitance of the interdigitated structure. When the humidity changes, the porosity of the porous silicon will change its dielectric constant, which will cause capacitance to occur. deformation, and because there is an air layer between the porous silicon, there is no problem of slow diffusion of the polymer when it senses moisture, and the response time of the capacitive humidity sensor is greatly improved.
应当理解的是,对本领域普通技术人员来说,可以根据上述说明加以改进或变换,而所有这些改进和变换都应属于本发明所附权利要求的保护范围。It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should belong to the protection scope of the appended claims of the present invention.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310461445.5A CN103487474B (en) | 2013-09-30 | 2013-09-30 | A kind of have the MEMS capacitive humidity sensor that high sensitivity quickly responds |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310461445.5A CN103487474B (en) | 2013-09-30 | 2013-09-30 | A kind of have the MEMS capacitive humidity sensor that high sensitivity quickly responds |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103487474A true CN103487474A (en) | 2014-01-01 |
CN103487474B CN103487474B (en) | 2016-08-17 |
Family
ID=49827865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310461445.5A Expired - Fee Related CN103487474B (en) | 2013-09-30 | 2013-09-30 | A kind of have the MEMS capacitive humidity sensor that high sensitivity quickly responds |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103487474B (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103792267A (en) * | 2014-02-19 | 2014-05-14 | 苏州能斯达电子科技有限公司 | Differential capacitive humidity sensor |
CN104089990A (en) * | 2014-07-15 | 2014-10-08 | 合肥工业大学 | Relative humidity sensor of monolithic integrated porous silicon and preparation method of humidity sensor |
CN104634832A (en) * | 2015-02-28 | 2015-05-20 | 苏州工业园区纳米产业技术研究院有限公司 | CMOS MEMS capacitance-type humidity sensor and preparation method thereof |
CN104634833A (en) * | 2015-02-28 | 2015-05-20 | 苏州工业园区纳米产业技术研究院有限公司 | MEMS capacitance-type relative humidity sensor and preparation method thereof |
CN104849325A (en) * | 2014-02-18 | 2015-08-19 | 无锡华润上华半导体有限公司 | MEMS humidity sensor compatible with CMOS process, and manufacturing method thereof |
CN106197537A (en) * | 2016-06-29 | 2016-12-07 | 东南大学 | The passive wireless sensor that a kind of humiture is integrated |
CN106796192A (en) * | 2014-08-20 | 2017-05-31 | ams国际有限公司 | Capacitance type sensor |
CN107884457A (en) * | 2017-09-28 | 2018-04-06 | 东南大学 | A kind of humidity sensor based on metamaterial structure |
CN110108763A (en) * | 2019-04-29 | 2019-08-09 | 南京邮电大学 | A kind of Low Drift Temperature capacitance type humidity sensor |
CN113418969A (en) * | 2021-06-07 | 2021-09-21 | 武汉大学 | High-sensitivity millimeter wave dielectric resonance sensor for biomedical detection |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2148329Y (en) * | 1992-12-25 | 1993-12-01 | 中国科学技术大学 | Porous silicon humidity-sensitive sensor |
US20080092649A1 (en) * | 2006-10-18 | 2008-04-24 | Industrial Technology Research Institute | Resistive-type humidity sensing structure with microbridge and method therefor |
CN201522471U (en) * | 2009-07-23 | 2010-07-07 | 东南大学 | Capacitive relative humidity sensor |
CN102944325A (en) * | 2012-11-29 | 2013-02-27 | 东南大学 | Passive wireless temperature and humidity integrated sensor |
-
2013
- 2013-09-30 CN CN201310461445.5A patent/CN103487474B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2148329Y (en) * | 1992-12-25 | 1993-12-01 | 中国科学技术大学 | Porous silicon humidity-sensitive sensor |
US20080092649A1 (en) * | 2006-10-18 | 2008-04-24 | Industrial Technology Research Institute | Resistive-type humidity sensing structure with microbridge and method therefor |
CN201522471U (en) * | 2009-07-23 | 2010-07-07 | 东南大学 | Capacitive relative humidity sensor |
CN102944325A (en) * | 2012-11-29 | 2013-02-27 | 东南大学 | Passive wireless temperature and humidity integrated sensor |
Non-Patent Citations (1)
Title |
---|
霍明学等: ""体硅工艺微振动传感器的研制"", 《哈尔滨工业大学学报》, vol. 36, no. 8, 31 August 2004 (2004-08-31), pages 1092 - 1094 * |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104849325A (en) * | 2014-02-18 | 2015-08-19 | 无锡华润上华半导体有限公司 | MEMS humidity sensor compatible with CMOS process, and manufacturing method thereof |
CN103792267B (en) * | 2014-02-19 | 2015-12-02 | 苏州能斯达电子科技有限公司 | A kind of differential capacitance type humidity sensor |
CN103792267A (en) * | 2014-02-19 | 2014-05-14 | 苏州能斯达电子科技有限公司 | Differential capacitive humidity sensor |
CN104089990A (en) * | 2014-07-15 | 2014-10-08 | 合肥工业大学 | Relative humidity sensor of monolithic integrated porous silicon and preparation method of humidity sensor |
CN104089990B (en) * | 2014-07-15 | 2016-08-24 | 合肥工业大学 | A kind of relative humidity sensor of single-chip integration porous silicon and preparation method thereof |
CN106796192A (en) * | 2014-08-20 | 2017-05-31 | ams国际有限公司 | Capacitance type sensor |
US10274450B2 (en) | 2014-08-20 | 2019-04-30 | Ams International Ag | Capacitive sensor |
CN106796192B (en) * | 2014-08-20 | 2019-10-29 | ams国际有限公司 | Capacitance type sensor |
CN104634833A (en) * | 2015-02-28 | 2015-05-20 | 苏州工业园区纳米产业技术研究院有限公司 | MEMS capacitance-type relative humidity sensor and preparation method thereof |
CN104634832A (en) * | 2015-02-28 | 2015-05-20 | 苏州工业园区纳米产业技术研究院有限公司 | CMOS MEMS capacitance-type humidity sensor and preparation method thereof |
CN104634833B (en) * | 2015-02-28 | 2017-09-26 | 苏州工业园区纳米产业技术研究院有限公司 | MEMS capacitive relative humidity sensor and preparation method thereof |
CN106197537A (en) * | 2016-06-29 | 2016-12-07 | 东南大学 | The passive wireless sensor that a kind of humiture is integrated |
CN106197537B (en) * | 2016-06-29 | 2018-02-23 | 东南大学 | A kind of integrated passive wireless sensor of humiture |
CN107884457A (en) * | 2017-09-28 | 2018-04-06 | 东南大学 | A kind of humidity sensor based on metamaterial structure |
CN107884457B (en) * | 2017-09-28 | 2019-07-12 | 东南大学 | A kind of humidity sensor based on metamaterial structure |
CN110108763A (en) * | 2019-04-29 | 2019-08-09 | 南京邮电大学 | A kind of Low Drift Temperature capacitance type humidity sensor |
CN113418969A (en) * | 2021-06-07 | 2021-09-21 | 武汉大学 | High-sensitivity millimeter wave dielectric resonance sensor for biomedical detection |
Also Published As
Publication number | Publication date |
---|---|
CN103487474B (en) | 2016-08-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103487474B (en) | A kind of have the MEMS capacitive humidity sensor that high sensitivity quickly responds | |
CN103344377B (en) | Capacitive barometric sensor of micro electro mechanical system | |
CN103471740B (en) | A kind of capacitive temperature sensor | |
CN101620197B (en) | Rapid response CMOS relative humidity sensor | |
CN103018289B (en) | Capacitive humidity sensor | |
CN201653604U (en) | Pressure sensor | |
CN106841331B (en) | A kind of flexible capacitive humidity sensor and preparation method thereof | |
CN104990968B (en) | Moisture sensor device based on FBAR | |
CN103434999B (en) | The integrated manufacturing method of a kind of temperature, humidity, air pressure and acceleration transducer | |
CN103438936B (en) | Based on the condenser type temperature of SOI sheet device layer silicon anode linkage, humidity and baroceptor integrated manufacturing method | |
CN103675042B (en) | CMOS MEMS capacitive humidity sensor | |
CN1845327A (en) | Monolithic integrated temperature, humidity and pressure sensor chip based on polymer materials | |
CN203365045U (en) | Capacitive air pressure sensor of microelectronic mechanical system | |
CN105510404A (en) | Rapidly-responsive humidity sensor and manufacturing method thereof | |
CN103792267B (en) | A kind of differential capacitance type humidity sensor | |
CN103063867A (en) | Capacitance type wind speed and wind direction transducer | |
CN102243199A (en) | Relative humidity sensor of fast-response microelectronic mechanical system | |
CN201522471U (en) | Capacitive relative humidity sensor | |
CN104634832B (en) | CMOS MEMS capacitive humidity sensors and preparation method thereof | |
CN206601357U (en) | A kind of flexible capacitance type humidity sensor | |
CN1327215C (en) | Relative humidity sensor compatible of CMOS process | |
CN103234669B (en) | Pressure sensor utilizing electrostatic negative stiffness and production method of pressure sensor | |
CN102901520B (en) | Method for improving temperature stability of capacitor type micromechanical sensor and micromechanical sensor | |
CN110108763A (en) | A kind of Low Drift Temperature capacitance type humidity sensor | |
WO2011149331A1 (en) | Capacitive humidity sensor and method of fabricating thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: 210093 Nanjing University Science Park, 22 Hankou Road, Gulou District, Nanjing City, Jiangsu Province Patentee after: SOUTHEAST University Address before: 211103 No. 5 Runfa Road, Jiangning District, Nanjing City, Jiangsu Province Patentee before: Southeast University |
|
CP02 | Change in the address of a patent holder | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20210930 |
|
CF01 | Termination of patent right due to non-payment of annual fee |