CN103484860A - Wet etching equipment and supply device thereof - Google Patents
Wet etching equipment and supply device thereof Download PDFInfo
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- CN103484860A CN103484860A CN201210194565.9A CN201210194565A CN103484860A CN 103484860 A CN103484860 A CN 103484860A CN 201210194565 A CN201210194565 A CN 201210194565A CN 103484860 A CN103484860 A CN 103484860A
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- delivery member
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- wet
- etching equipment
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Abstract
The invention relates to wet etching equipment and a supply device thereof. The supply device comprises a supply part and an adjustment part, wherein the supply part has a penetrating supply channel for transporting a fluid, the adjustment part has a channel and recovery channels, the channel and the recovery channels are adjacent, and the supply part is arranged inside the channel in a penetrating manner, such that the fluid passing through the supply part is output through the channel, and the recovery channel sucks the part of the etching liquid output through the channel so as to control output of the fluid.
Description
Technical field
The present invention relates to a kind ofly for etched equipment, refer in particular to a kind of Wet-type etching equipment and feeding mechanism thereof.
Background technology
At present in semiconductor technology, the spaces of a whole page (pannel) such as wafer, base plate for packaging, encapsulating structure or circuit card, all can be used etching solution to clean the surface residue of this space of a whole page, such as copper ashes, glue slag, resistance layer etc.In general cleaning process, first utilize etching solution to remove the surface residue of the space of a whole page, then clean the etching solution on this space of a whole page with scavenging solution (as water), the last surface of dry this space of a whole page again.
Figure 1A and Figure 1B those shown, for the available circuit plate space of a whole page 5 carry out etch cleaning technique on look and schematic side view.As shown in the figure, Wet-type etching equipment (figure slightly) is delivered to a plurality of nozzles 11 that array row establishes that are by etching solution 3 through transfer lime 10, by those nozzles 11, etching solution 3 is sprayed on this circuit card space of a whole page 5.
Yet, existing nozzle 11 is fixed, namely can't adjust the position and indivedual these nozzles 11 of running of this nozzle 11, so the design of this nozzle 11 needs to spray the quite wide scope of etching solution 3, to avoid cleaning not exclusively, but the work output because of this etching solution 3 of uncontrollable sprinkling, causing can't be to specific region microetch or selective etch, and cause being cleaned for the surface of tiny area, also the selectivity processing of high precision control can't be carried out for the product performance variation, so that the demand that improves the etching control fineness can't be met.
In addition, in existing Wet-type etching equipment, those transfer limes 10 and nozzle 11 be for being uniformly distributed, and can't adjust the position of those transfer limes 10 and nozzle 11, can't operate individually nozzle 11 again, so can't carry out precision zone etching operation for the specific region of this circuit card space of a whole page 5.For example, can't, to the specific region microetch, cause cleaning up the surperficial residue of tiny area.Therefore, when at present general Wet-type etching equipment carries out the etching operation, be comprehensive working continuously by the gross, and can't carry out for the product performance variation selectivity processing of high precision control, so that be difficult to improve the etching control fineness, thereby have influence on the validity of performance capabilities of product and the output yield of product.
Therefore, how to overcome the variety of problems of above-mentioned prior art, become in fact the problem of desiring most ardently at present solution.
Summary of the invention
In view of all deficiencies of above-mentioned prior art, main purpose of the present invention is to provide a kind of Wet-type etching equipment and feeding mechanism thereof, to control the work output of this fluid.
Feeding mechanism of the present invention, establish an adjustment part by the peripheral lid of the delivery member in just like nozzle, this adjustment part has adjacent channel and reclaims road, and this delivery member is arranged in this channel, so that etching solution can be by this channel output, and make this recovery road draw the etching solution of part by this channel output, to reduce the work output of this etching solution.
In aforesaid feeding mechanism, it can be located on the board of Wet-type etching equipment, and this board has positioning element, for this delivery member, is arranged on this positioning element, to borrow this positioning element, drives this delivery member and adjustment part to desired position.
In addition, but this board has program logic control system, with the running of controlling this positioning element, the maybe running in this recovery road of motion of etching solution.
As from the foregoing, Wet-type etching equipment of the present invention and feeding mechanism thereof, reclaim the design in road by this, make this adjustment part can control the work output of spraying etching solution, namely can control the scope of spraying etching solution, with to specific region microetch or selective etch, and can be cleaned the surface of tiny area, and can carry out to the product performance variation selectivity processing of high precision control, so can improve the ability of the fine etching of this Wet-type etching equipment, to reach the demand of high yield and high performance capabilities.
In addition, this board by positioning element to drive this delivery member and adjustment part to desired position, but and by program logic control system, to operate individually this delivery member, so can carry out precision zone etching operation to the specific region of each space of a whole page.Therefore, while working continuously in the space of a whole page is comprehensive by the gross, the selectivity processing that can make a variation and carry out high precision control for product performance on demand, to improve the etching control fineness.
The accompanying drawing explanation
Figure 1A be the available circuit plate space of a whole page carry out etch cleaning technique on look schematic diagram;
Figure 1B is the schematic side view that the available circuit plate space of a whole page carries out etch cleaning technique;
The side cross-sectional schematic that Fig. 2 A is feeding mechanism of the present invention;
Look schematic diagram on the adjustment part that Fig. 2 B is feeding mechanism of the present invention; And
Look schematic diagram on the different embodiment that Fig. 3 A to Fig. 3 C is Wet-type etching equipment of the present invention.
The primary clustering nomenclature
10 transfer limes
11 nozzles
2,2 ', 2 " Wet-type etching equipment
The 2a feeding mechanism
20 positioning elements
21 delivery member
21a, the 21b feeding unit
22 adjustment parts
220 channels
221 reclaim road
3 etching solutions
The 5 circuit card spaces of a whole page
The h difference of altitude
The x transverse shifting
Y vertically moves.
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by content disclosed in the present specification.
Notice, appended graphic the illustrated structure of this specification sheets, ratio, size etc., equal contents in order to coordinate specification sheets to disclose only, understanding and reading for those skilled in the art, not in order to limit the enforceable qualifications of the present invention, so technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionlity or size, not affecting under the effect that the present invention can produce and the purpose that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this specification sheets, quote as " on ", D score and terms such as " one ", also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under without essence change technology contents, when also being considered as the enforceable category of the present invention.
The schematic diagram that Fig. 2 A and Fig. 2 B are the feeding mechanism 2a that uses of Wet-type etching equipment of the present invention.As shown in Figure 2 A, this feeding mechanism 2a comprises a delivery member 21 and an adjustment part 22.
Described delivery member 21 has the supply road (figure slightly) run through, with conveyance fluid.In the present embodiment, this delivery member 21 is nozzle.
Described adjustment part 22 has adjacent channel 220 and reclaims road 221, this delivery member 21 is arranged in this channel 220, so that flow through, the etching solution 3 of this delivery member 21 is by these channel 220 outputs, and this reclaims road 221 in order to draw the etching solution 3 of part by these channel 220 outputs, to reduce the work output of this etching solution 3.
In the present embodiment, this recovery road 221 utilizes flue gas to reclaim this etching solution 3, the direction of arrow as shown in Figure 2 A.
In addition, the port of the port in this recovery road 221 and this channel 220 has difference of altitude h, as shown in Figure 2 A, this port position that reclaims road 221 is lower than the port position of this channel 220, namely the port in this recovery road 221 is positioned at the port below of this channel 220, is beneficial to this recovery road 221 and draws the etching solution 3 of part by these channel 220 outputs.
Moreover this reclaims the outside of road 221 around this channel 220, as shown in Fig. 2 B, to promote the rate of recovery in this recovery road 221, the accuracy that namely improves micro-supply of this etching solution 3.
In feeding mechanism 2a of the present invention, by this channel 220 to control etching area, and reclaim road 221 by this and reclaim this etching solution 3, make this adjustment part 22 can control the work output of spraying etching solution 3, namely can control the scope of spraying etching solution 3, with to specific region microetch or selective etch, and can be cleaned the surface of tiny area (as a zone), and the selectivity processing of high precision control can be carried out to the product performance variation, so can reach the effect that high precision is controlled.
See also Fig. 3 A to Fig. 3 C, it is the Wet- type etching equipment 2,2 ', 2 with this feeding mechanism 2a ", it is located at this feeding mechanism 2a on one board (figure is slightly).
Described board has in order to the accommodation space of store fluid (as etching solution 3) (figure slightly), and this delivery member 21 is arranged on this board, and this supply road is communicated with the accommodation space of this board, to make etching solution 3 in this accommodation space this supply road of flowing through, move to outside this board.The recovery road 221 of this adjustment part 22 is communicated with the accommodation space of this board in addition, with the etching solution 3 that part is exported by this channel 220, sucks back the accommodation space of this board, the direction of arrow as shown in Figure 2 A by this recovery road 221.
In the present embodiment, but this board has program logic control system (Programmable Logic Controller, PLC) with positioning element 20, this PLC is in order to control the etch cleaning operation, for example, maybe this reclaims the running in road 221 in the motion of this etching solution 3, and this positioning element 20 is in order to provided thereon by this delivery member 21, to control this this delivery member 21 of positioning element 20 drives and adjustment part 22 by means of this PLC to desired position.
In addition, when this delivery member 21 is a plurality of, by least two these delivery member 21, form one group of feeding unit 21a, 21b, as shown in Fig. 3 A and Fig. 3 B.Perhaps, as shown in Figure 3 C, those delivery member 21 are array row establishes, the etching shower nozzle group who arranges to form high-density matrix.
Described feeding unit 21a can be comprised of a plurality of delivery member 21 of lining up rectangle, as shown in Figure 3A; Perhaps, this feeding unit 21b can be comprised of a plurality of delivery member 21 of alinement, as shown in Figure 3 B.
Moreover, this delivery member 21 or feeding unit 21a, 21b can vertically move y by this positioning element 20, as shown in Fig. 3 A and Fig. 3 B.
In addition, this positioning element 20 can be used as track, make this delivery member 21 or feeding unit 21a can be on this positioning element 20 horizontal mobile x, as shown in Figure 3A.
Wet- type etching equipment 2,2 ', 2 of the present invention " in; by the design of this PLC, can operate individually this delivery member 21 or feeding unit 21a, 21b; with tool selective etch controllability, so can carry out precision zone etching operation to the specific region of this circuit card space of a whole page 5.
In addition, by the design of this positioning element 20, to drive this delivery member 21 or feeding unit 21a, 21b and adjustment part 22 are to desired position, and tool selective etch controllability, so also can carry out precision zone etching operation to the specific region of this circuit card space of a whole page 5.
Therefore, while working continuously in the space of a whole page is comprehensive by the gross, can use the Wet-type etching equipment 2 of packaged type (as shown in Fig. 3 A and Fig. 3 B) or multi-part type (as shown in Figure 3 C), 2 '; 2 " this circuit card space of a whole page 5 of etch cleaning, with the selectivity processing that makes a variation and carry out high precision control for product performance on demand, and improve the etching control fineness.For example, after first step etching operation, carry out optical check, then carry out second etch processing for the zone that still has residue (as residual copper billet) (i.e. zone), and without carrying out the processing of justifying facet etch.
In addition, the relevant space of a whole page of a great variety, for example wafer, base plate for packaging or encapsulating structure, be not limited to circuit card.
In addition, the type of fluid in the relevant accommodation space of board is various, is not limited to etching solution, also can be other liquid (as water), hereby states clearly.
In sum, Wet-type etching equipment of the present invention and feeding mechanism thereof, the design of mainly by this, reclaiming road, make this adjustment part can control the work output of spraying etching solution, to carry out microetch or selective etch, and improve the ability of the fine etching of this Wet-type etching equipment.
In addition, but the design by positioning element with program logic control system, carry out the etching operation with the specific region to each space of a whole page, so while working continuously in the space of a whole page is comprehensive by the gross, can carry out on demand the selectivity processing of high precision control, to improve the etching control fineness, and the output yield of the validity of the performance capabilities of improving product and product.
Above-described embodiment is only in order to illustrative principle of the present invention and effect thereof, but not for limiting the present invention.Any those skilled in the art all can, under spirit of the present invention and category, modify to above-described embodiment.So the scope of the present invention, should be as listed as claims.
Claims (11)
1. a Wet-type etching equipment comprises:
Board, it has the accommodation space in order to store fluid;
At least one delivery member, it is located on this board, and this delivery member has the supply road run through, and this supply road is communicated with the accommodation space of this board, to make the fluid in this accommodation space, through this supply road, moves to outside this board; And
Adjustment part, it has adjacent channel and reclaims road, and this channel is in order to accommodating this delivery member, so that the fluid of this delivery member of flowing through is by this channel output, and this recovery road is communicated with the accommodation space of this board.
2. Wet-type etching equipment according to claim 1, is characterized in that, this board has positioning element, for this delivery member, is arranged on this positioning element, to drive this delivery member and adjustment part by means of this positioning element to desired position.
3. Wet-type etching equipment according to claim 2, is characterized in that, but this board has program logic control system, with the running of controlling this positioning element and the motion of this fluid, and controls the running in this recovery road.
4. Wet-type etching equipment according to claim 1, is characterized in that, this delivery member is nozzle.
5. Wet-type etching equipment according to claim 1, is characterized in that, when this delivery member is a plurality of, by least two these delivery member, forms one group of feeding unit.
6. Wet-type etching equipment according to claim 1, is characterized in that, when this delivery member is a plurality of, those delivery member are array row and establish.
7. Wet-type etching equipment according to claim 1, is characterized in that, the port in this recovery road and the port of this channel have difference of altitude.
8. Wet-type etching equipment according to claim 1, is characterized in that, this reclaims the outside of road around this channel.
9. the feeding mechanism that Wet-type etching equipment is used, it comprises:
Delivery member, it has the supply road run through, with conveyance fluid; And
Adjustment part, it has adjacent channel and reclaims road, and this delivery member is arranged in this channel, so that the fluid of this delivery member of flowing through is by this channel output.
10. feeding mechanism according to claim 9, is characterized in that, the port in this recovery road and the port of this channel have difference of altitude.
11. feeding mechanism according to claim 9, is characterized in that, this reclaims the outside of road around this channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210194565.9A CN103484860A (en) | 2012-06-13 | 2012-06-13 | Wet etching equipment and supply device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210194565.9A CN103484860A (en) | 2012-06-13 | 2012-06-13 | Wet etching equipment and supply device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103484860A true CN103484860A (en) | 2014-01-01 |
Family
ID=49825440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210194565.9A Pending CN103484860A (en) | 2012-06-13 | 2012-06-13 | Wet etching equipment and supply device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103484860A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020086535A1 (en) * | 2000-10-26 | 2002-07-04 | Frank Adler | Method for local etching |
| CN101040067A (en) * | 2004-10-19 | 2007-09-19 | 法国圣-戈班玻璃公司 | Device for etching a conductive layer and etching method |
| CN101717935A (en) * | 2008-10-09 | 2010-06-02 | 欣兴电子股份有限公司 | Etching method of metal layer of substrate |
-
2012
- 2012-06-13 CN CN201210194565.9A patent/CN103484860A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020086535A1 (en) * | 2000-10-26 | 2002-07-04 | Frank Adler | Method for local etching |
| CN101040067A (en) * | 2004-10-19 | 2007-09-19 | 法国圣-戈班玻璃公司 | Device for etching a conductive layer and etching method |
| CN101717935A (en) * | 2008-10-09 | 2010-06-02 | 欣兴电子股份有限公司 | Etching method of metal layer of substrate |
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Application publication date: 20140101 |