CN103476203A - Wet process film pasting method of flexible printed circuit board - Google Patents

Wet process film pasting method of flexible printed circuit board Download PDF

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Publication number
CN103476203A
CN103476203A CN2013104171620A CN201310417162A CN103476203A CN 103476203 A CN103476203 A CN 103476203A CN 2013104171620 A CN2013104171620 A CN 2013104171620A CN 201310417162 A CN201310417162 A CN 201310417162A CN 103476203 A CN103476203 A CN 103476203A
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CN
China
Prior art keywords
printed circuit
circuit board
flexible printed
film
mixed liquor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013104171620A
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Chinese (zh)
Inventor
叶飚
李兆辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PANYU NANSHA YINTIAN CHEMICAL INDUSTRY Co Ltd
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PANYU NANSHA YINTIAN CHEMICAL INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PANYU NANSHA YINTIAN CHEMICAL INDUSTRY Co Ltd filed Critical PANYU NANSHA YINTIAN CHEMICAL INDUSTRY Co Ltd
Priority to CN2013104171620A priority Critical patent/CN103476203A/en
Publication of CN103476203A publication Critical patent/CN103476203A/en
Priority to PCT/CN2014/072602 priority patent/WO2015035754A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B2037/109—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using a squeegee
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/14—Velocity, e.g. feed speeds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention discloses a wet process film pasting method of a flexible printed circuit board. The wet process film pasting method includes the steps that firstly, a flexible printed circuit board base material is chemically coarsened and then preheated, then, a sponge wet roller is utilized to evenly coat the copper surface of the printed circuit board base material with mixed liquor to form a liquid film, wherein the mixed liquor is formed by adding water into a surface active agent, and eventually a dry film is pasted on a base plate. Due to the fact that the surface active agent exists in the mixed liquor which coats the base plate, the formed liquid film can effectively prevent the surface of copper foil from being oxidized, and then the effect of protecting the copper surface is achieved; meanwhile, the surface active agent of the liquid film can also improve mobility of the dry film, scratches and pits of the copper surface can be well filled, therefore, binding force of the dry film and the copper surface is enhanced, a circuit is still complete after the copper foil is etched, the yield of pattern transfer is increased, and production cost can be saved.

Description

A kind of wet filming method of flexible printed circuit board
Technical field
The present invention relates to the wet filming method of printed circuit board (PCB), particularly a kind of soft (softening) property printed circuit board (PCB) wet filming method.
Background technology
Printed circuit board (PCB) is a kind of insulation board with printed circuit, comprises insulated substrate and printed circuit, and printed circuit board (PCB) has rigidity, flexibility and hard and soft in conjunction with three kinds according to its hardness; Its plate face generally has multi-layer sheet, HDI plate, IC base plate for packaging etc., and no matter which kind of plate, all need to use Copper Foil, so as on circuit board printing, etched circuit.Existing circuit, its width is more and more thinner, also more and more higher to the requirement of figure transfering process, the HDI plate that blind buried via hole is particularly arranged, due to the blind buried via hole that is clipped in internal layer, thereby cause outer copper face depression uneven, bring very large difficulty to film process, had a strong impact on the yields that figure shifts.In addition, the easy oxidized corrosion of copper foil surface, uneven more difficult the removing again in its copper face oxidation rear surface, bring very big inconvenience to film on surface.Thereby need to adopt wet filming method, and its technological process is for to be added in warm water on the surperficial Copper Foil of wiring board, then dry film is attached on Copper Foil by laminator, and its principle is to utilize mobility and the absorption affinity of water, makes dry film have mobility at copper foil surface.But its shortcoming is, water long-time stop on Copper Foil can cause the copper face oxidation, affects the adhesion of dry film and copper face.
Summary of the invention
The present invention is intended to provide a kind of wet filming method of flexible printed circuit board, to improve the adhesion property of water, strengthens the oxidation resistance of Copper Foil under wet condition, thereby improves the yields of figure transfering process.
The wet filming method of the described flexible printed circuit board of the inventive method, its step is as follows:
A. add the surfactant of 0.01-1.5% in water, make mixed liquor, control temperature at 18 to 55 ℃;
B. by flexible circuit plate substrate chemical roughen, after oven dry, through the preheating machine preheating, make its plate surface temperature reach 45-55 ℃;
C. mixed liquor is added to the sponge running roller, and will carry out substrate after aforementioned processing through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
D. laminator is at heating roller temperature 80-110 ℃, and pressure 3.5KG, under the condition of pad pasting speed 1.0-3.5m/min, be affixed on dry film on the copper face substrate that scribbles liquid film.
The wet filming method of flexible printed circuit board of the present invention has increased surfactant in the moisture film of coated panel face, can effectively prevent the copper foil surface oxidation, plays the effect of protection copper face; Add surfactant in moisture film, strengthened the mobility of dry film, can fill better cut and the indenture of copper face, thereby strengthen the adhesion of dry film and copper face, after its Copper Foil etching, circuit is complete, can improve the yields that figure shifts, thereby can greatly save production cost.
Described surfactant is methacrylic acid lipid, or one or more and the mixing of methacrylic acid lipid in butanone MEK, carboxy benzotriazole or lemon acids alcohols antioxidant.
The surfactant added comprises MEK butanone, carboxy benzotriazole, lemon acids, alcohols antioxidant or methacrylic acid lipid (water-soluble) additive.
Selectable lemon acids surfactant, its classes of compounds is also unrestricted, mainly comprises citric acid, citric trialkyl amide, tributyl 2-acetylcitrate or triethyl citrate.
Same, alcohol surfactants comprises positive certain herbaceous plants with big flowers alcohol, 2 methyl cyclohexanol, 2-Ethylhexyl Alcohol or 1,2-PD.
Water-soluble methacrylic acid lipid comprises methacrylate, methymethacrylate, ethyl acrylate etc.
Increase MEK butanone, carboxy benzotriazole, lemon acids, alcohols antioxidant can make the copper layer of substrate surface be difficult for oxidation, can better with dry film, be combined, increase water-soluble methacrylic acid lipid comprise methacrylate, methymethacrylate, ethyl acrylate etc. can with dry film in acrylic monomer the effect of similar compatibility is arranged, make the copper layer of dry film and substrate surface in conjunction with tightr.
The accompanying drawing explanation
Fig. 1 is the dry film electron microscope image after developing with the conventional wet method for adhering film.
Fig. 2 is the dry film electron microscope image after developing by this method.
Fig. 3 is with the electron microscope image after the etching of conventional wet method for adhering film.
Fig. 4 is with the electron microscope image after this method etching.
Embodiment
Embodiment mono-
A kind of wet filming method of flexible printed circuit board, its step is as follows successively:
A. in the ratio of 100 gram water, 1.0 gram MEK butanone and 0.5 gram methacrylate, make mixed liquor, temperature is controlled to 18 to 55 ℃;
B. by flexible circuit plate substrate chemical roughen, after oven dry, in preheat temperature, be through the preheating machine preheating under 45 ℃;
C. will join mixed liquor add the sponge running roller, and will carry out substrate after pre-treatment through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
The substrate that d. will scribble moisture film is 110 ℃ through excess temperature, and pressure 4KG, closely be attached to dry film on the copper face base material after the laminator that pad pasting speed is 1.5m/min.
Embodiment bis-
A kind of wet filming method of flexible printed circuit board, its step is as follows successively:
A. in the ratio of 100 gram water, 0.1 gram carboxy benzotriazole and 0.5 gram methyl methacrylate, make mixed liquor, temperature is controlled to 18 to 50 ℃; B. by flexible circuit plate substrate chemical roughen, after oven dry, in preheat temperature, be through the preheating machine preheating under 50 ℃;
C. will join mixed liquor add the sponge running roller, and will carry out substrate after pre-treatment through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
The substrate that d. will scribble moisture film is 100 ℃ through excess temperature, and pressure 3.5KG closely is attached to dry film on the copper face base material after the volume to volume automatic film applicator that pad pasting speed is 2.5m/min.
Embodiment tri-
A kind of wet filming method of flexible printed circuit board, its step is as follows successively:
A. in the ratio of 100 gram water, 0.5 gram 2-Ethylhexyl Alcohol and 0.5 gram ethyl acrylate, make mixed liquor, temperature is controlled to 18 to 55 ℃; B. by flexible circuit plate substrate chemical roughen, after oven dry, in preheat temperature, be through the preheating machine preheating under 55 ℃;
C. will join mixed liquor add the sponge running roller, and will carry out substrate after pre-treatment through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
The substrate that d. will scribble moisture film is 80 ℃ through excess temperature, and pressure 4KG, closely be attached to dry film on the copper face base material after the laminator that pad pasting speed is 2m/min.
Embodiment tetra-
A kind of wet filming method of flexible printed circuit board, its step is as follows successively:
A. in the ratio of 100 gram water, 0.01 gram tributyl 2-acetylcitrate and 0.01 methacrylate, make mixed liquor, temperature is controlled to 18 to 55 ℃; B. by flexible circuit plate substrate chemical roughen, after oven dry, in preheat temperature, be through the preheating machine preheating under 50 ℃;
C. will join mixed liquor add the sponge running roller, and will carry out substrate after pre-treatment through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
The substrate that d. will scribble moisture film is 110 ℃ through excess temperature, and pressure 4KG, closely be attached to dry film on the copper face base material after the laminator that pad pasting speed is 1.0m/min.
Embodiment five
A kind of wet filming method of flexible printed circuit board, its step is as follows successively:
A. in the ratio of 100 gram water and 0.5 gram methacrylate, make mixed liquor, temperature is controlled to 18 to 55 ℃; B. by soft (softening) property board substrate chemical roughen, after oven dry, in preheat temperature, be through the preheating machine preheating under 50 ℃;
C. will join mixed liquor add the sponge running roller, and will carry out substrate after pre-treatment through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
The substrate that d. will scribble moisture film is 90 ℃ through excess temperature, and pressure 3.5KG closely is attached to dry film on the copper face base material after the volume to volume automatic film applicator that pad pasting speed is 2.5m/min.
Embodiment six
A kind of wet filming method of flexible printed circuit board, its step is as follows successively:
A. in the ratio of 100 gram water and 1.5 gram methyl methacrylates, make mixed liquor, temperature is controlled to 18 to 55 ℃; B. by soft (softening) property board substrate chemical roughen, after oven dry, in preheat temperature, be through the preheating machine preheating under 45 ℃;
C. will join mixed liquor add the sponge running roller, and will carry out substrate after pre-treatment through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
The substrate that d. will scribble moisture film is 80 ℃ through excess temperature, and pressure 3.0KG closely is attached to dry film on the copper face base material after the volume to volume automatic film applicator that pad pasting speed is 1.0m/min.
Embodiment seven
A kind of wet filming method of flexible printed circuit board, its step is as follows successively:
A. in the ratio of 100 gram water and 1.5 gram ethyl acrylates, make mixed liquor, temperature is controlled to 18 to 55 ℃; B. by soft (softening) property board substrate chemical roughen, after oven dry, in preheat temperature, be through the preheating machine preheating under 55 ℃;
C. will join mixed liquor add the sponge running roller, and will carry out substrate after pre-treatment through two pairs of sponge running rollers, be coated with equably the last layer liquid film on copper face;
The substrate that d. will scribble moisture film is 110 ℃ through excess temperature, and pressure 4.5KG closely is attached to dry film on the copper face base material after the volume to volume automatic film applicator that pad pasting speed is 3.5m/min.
Fig. 1 is the dry film imaging after developing with the conventional wet method for adhering film, and Fig. 2 is with the dry film imaging of originally improving one's methods after developing, and Fig. 3 is with the imaging after the etching of conventional wet method for adhering film, and Fig. 4 is with the imaging after the etching of originally improving one's methods.As can be seen from the figure, conventional wet pad pasting mode can not be filled the copper face depression well, thereby cause a large amount of line shorts after etching, yields descends, cause product rejection, and utilize the printed circuit board (PCB) of the preparation of originally improving one's methods, after etching, circuit is complete, improve yields, can greatly save production cost.

Claims (6)

1. the wet filming method of a flexible printed circuit board, is characterized in that: comprise the steps:
A. add the surfactant of 0.01-1.5% in water, make mixed liquor, temperature is controlled to 18 to 55 ℃;
B. by flexible circuit plate substrate chemical roughen, after oven dry, through the preheating machine preheating, make its plate surface temperature reach 45-55 ℃;
C. will join mixed liquor add sponge roller, and will carry out substrate after pre-treatment through two pairs of sponge rollers, be coated with equably the last layer liquid film on copper face;
D. laminator is at heating roller temperature 80-110 ℃, and pressure 3.0-4.5KG, under the condition of pad pasting speed 1.0-3.5m/min, be affixed on dry film on the copper face substrate that scribbles moisture film.
2. the wet filming method of flexible printed circuit board according to claim 1 is characterized in that: described surfactant is one or more and the mixing of water-soluble methacrylic acid lipid in butanone MEK, carboxy benzotriazole or lemon acids alcohols antioxidant.
3. the wet filming method of flexible printed circuit board according to claim 1, it is characterized in that: described surfactant is water-soluble methacrylic acid lipid.
4. the wet filming method of flexible printed circuit board according to claim 2, it is characterized in that: described lemon acids antioxidant is citric acid, citric trialkyl amide, tributyl 2-acetylcitrate or triethyl citrate.
5. the wet filming method of flexible printed circuit board according to claim 2, it is characterized in that: described alcohols antioxidant is positive certain herbaceous plants with big flowers alcohol, 2 methyl cyclohexanol, 2-Ethylhexyl Alcohol or 1,2-PD.
6. according to the wet filming method of claim 2 or 3 described flexible printed circuit boards, it is characterized in that: described methacrylic acid lipid additive is methacrylate, methymethacrylate, ethyl acrylate.
CN2013104171620A 2013-09-13 2013-09-13 Wet process film pasting method of flexible printed circuit board Pending CN103476203A (en)

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CN2013104171620A CN103476203A (en) 2013-09-13 2013-09-13 Wet process film pasting method of flexible printed circuit board
PCT/CN2014/072602 WO2015035754A1 (en) 2013-09-13 2014-02-27 Wet process-based film pasting method for flexible printed circuit board

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Application Number Priority Date Filing Date Title
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015035754A1 (en) * 2013-09-13 2015-03-19 番禺南沙殷田化工有限公司 Wet process-based film pasting method for flexible printed circuit board
CN105682367A (en) * 2016-04-01 2016-06-15 广州兴森快捷电路科技有限公司 Preparation method of external-layer circuit of backplane having warp surface
CN106102332A (en) * 2016-07-07 2016-11-09 深圳市景旺电子股份有限公司 A kind of wiring board and method for adhering film thereof
CN106793528A (en) * 2016-12-05 2017-05-31 东莞市科佳电路有限公司 A kind of method of pcb board part electrolytic copper wet method press mold
CN111885830A (en) * 2020-07-16 2020-11-03 胜宏科技（惠州）股份有限公司 Film pasting method for thin plate

Citations (3)

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Publication number Priority date Publication date Assignee Title
WO2003069967A1 (en) * 2002-02-13 2003-08-21 Shindo Company, Ltd. Circuit substrate production method
CN101906736A (en) * 2009-06-04 2010-12-08 张明 Method for achieving laser effect on common paper
CN101605432B (en) * 2009-07-10 2011-08-24 番禺南沙殷田化工有限公司 Automatic wet process lamination method of rigid printed circuit boards

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CN100379324C (en) * 2005-01-10 2008-04-02 安捷利（番禺）电子实业有限公司 Wet filming method of flexible printed circuit
CN1968575A (en) * 2005-11-17 2007-05-23 上海华仕德电路技术有限公司 Wet film coating process for flexible circuit board
CN103476203A (en) * 2013-09-13 2013-12-25 番禺南沙殷田化工有限公司 Wet process film pasting method of flexible printed circuit board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003069967A1 (en) * 2002-02-13 2003-08-21 Shindo Company, Ltd. Circuit substrate production method
CN101906736A (en) * 2009-06-04 2010-12-08 张明 Method for achieving laser effect on common paper
CN101605432B (en) * 2009-07-10 2011-08-24 番禺南沙殷田化工有限公司 Automatic wet process lamination method of rigid printed circuit boards

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015035754A1 (en) * 2013-09-13 2015-03-19 番禺南沙殷田化工有限公司 Wet process-based film pasting method for flexible printed circuit board
CN105682367A (en) * 2016-04-01 2016-06-15 广州兴森快捷电路科技有限公司 Preparation method of external-layer circuit of backplane having warp surface
CN105682367B (en) * 2016-04-01 2018-10-19 广州兴森快捷电路科技有限公司 A kind of preparation method of the outer-layer circuit with warped surface backboard
CN106102332A (en) * 2016-07-07 2016-11-09 深圳市景旺电子股份有限公司 A kind of wiring board and method for adhering film thereof
CN106102332B (en) * 2016-07-07 2019-01-01 深圳市景旺电子股份有限公司 A kind of wiring board and its method for adhering film
CN106793528A (en) * 2016-12-05 2017-05-31 东莞市科佳电路有限公司 A kind of method of pcb board part electrolytic copper wet method press mold
CN111885830A (en) * 2020-07-16 2020-11-03 胜宏科技（惠州）股份有限公司 Film pasting method for thin plate

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Application publication date: 20131225