CN111885830A - Film pasting method for thin plate - Google Patents

Film pasting method for thin plate Download PDF

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Publication number
CN111885830A
CN111885830A CN202010686094.8A CN202010686094A CN111885830A CN 111885830 A CN111885830 A CN 111885830A CN 202010686094 A CN202010686094 A CN 202010686094A CN 111885830 A CN111885830 A CN 111885830A
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CN
China
Prior art keywords
thin plate
pressing roller
plate
hot pressing
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010686094.8A
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Chinese (zh)
Inventor
蒋华
张亚锋
谢易松
张永谋
叶锦群
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victory Giant Technology Huizhou Co Ltd
Original Assignee
Victory Giant Technology Huizhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Victory Giant Technology Huizhou Co Ltd filed Critical Victory Giant Technology Huizhou Co Ltd
Priority to CN202010686094.8A priority Critical patent/CN111885830A/en
Publication of CN111885830A publication Critical patent/CN111885830A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The invention discloses a film pasting method for a thin plate, which comprises the following steps: s1: preheating and stacking: preheating a thin plate, and stacking a supporting plate below the thin plate after preheating; s2: pasting a film I: fixing the stacked thin plates with a support plate, arranging an upper hot pressing roller above the thin plates, and attaching the dry film to the upper surfaces of the thin plates through the upper hot pressing roller; s3: turning: separating the thin plate from the supporting plate, and stacking the thin plate on the thin plate after the thin plate is turned over for 180 degrees; s4: and (5) pasting a second film: the dry film is attached to the upper surface of the thin plate through the upper hot pressing roller above the thin plate, the lower hot pressing roller is arranged below the supporting plate, the lower hot pressing roller corresponds to the upper hot pressing roller in position, and the upper hot pressing roller and the lower hot pressing roller move synchronously. The thin plate can be subjected to film pasting by using a conventional film pasting machine, the problems of a rolled plate, a clamping plate and a wrinkled plate cannot occur, the method is high in universality, and the production efficiency is improved; the method is simple, can reduce the production cost and has good film pasting effect.

Description

Film pasting method for thin plate
Technical Field
The invention relates to the field of circuit boards, in particular to a film pasting method for a thin plate.
Background
The film sticking is a common process in the production process of the circuit board, the processing capacity of a common film sticking machine is about 0.1mm, and for a thin plate with the plate thickness of less than 0.1mm, the problems of plate rolling, clamping plate and film wrinkling are easy to occur during film sticking. At present, most PCB manufacturers have single manufacturing process, if the manufacturing process capability needs to be improved, new equipment needs to be purchased, installed and debugged, the time is long, the loss of customers is easy to cause, and the production cost is increased. Therefore, there is a need for developing a new film pasting method, which can use a common film pasting machine for pasting a thin film, and reduce the production cost.
Disclosure of Invention
The invention provides a film pasting method for a thin plate, aiming at solving the problems of a rolling plate, a clamping plate and film wrinkles existing in the existing film pasting process for the thin plate.
A film pasting method for a thin plate comprises the following steps:
s1: preheating and stacking: preheating a thin plate, and stacking a supporting plate below the thin plate after preheating;
s2: pasting a film I: fixing the stacked thin plates with a support plate, arranging an upper hot pressing roller above the thin plates, and attaching the dry film to the upper surfaces of the thin plates through the upper hot pressing roller;
s3: turning: separating the thin plate from the supporting plate, and stacking the thin plate on the thin plate after the thin plate is turned over for 180 degrees;
s4: and (5) pasting a second film: the dry film is attached to the upper surface of the thin plate through the upper hot pressing roller above the thin plate, the lower hot pressing roller is arranged below the supporting plate, the lower hot pressing roller corresponds to the upper hot pressing roller in position, and the upper hot pressing roller and the lower hot pressing roller move synchronously. The method has high universality, can reduce the production cost and has good film pasting effect.
Optionally, step S2 further includes the following steps: after the thin plate and the supporting plate are fixed, the thin plate and the supporting plate are placed on a clapper or on the side edge of the clapper, the clapper comprises clapboards positioned on two sides of the thin plate, and the clapboards are aligned with two sides of the thin plate and the supporting plate.
Optionally, before the thin plate is preheated, the thin plate is subjected to chemical treatment, and the surface of the thin plate is roughened, so that the bonding force between the dry film and the thin plate can be improved.
Optionally, the temperature of the upper hot pressing roller is 100-120 ℃, and the binding force between the dry film and the thin plate can be improved.
Optionally, the lower hot pressing roller is at normal temperature, and the lower hot pressing roller provides upward acting force, so that the dry film and the thin plate are attached more tightly.
Optionally, the film sticking speed of the first film sticking and/or the second film sticking is controlled to be 2.2-2.8 m/min, and the film sticking effect is improved.
Optionally, the film sticking pressure of the first film sticking and/or the second film sticking is controlled to be 3-5 kg/cm2And the film sticking effect is improved.
Optionally, the size and shape of the support plate correspond to the size and shape of the thin plate, respectively.
Optionally, the thickness of the thin plate is less than 0.1 mm.
The invention provides a film pasting method for a thin plate, which can be used for pasting the film by using a conventional film pasting machine without the problems of a rolled plate, a clamping plate and a wrinkled plate, and has high universality and improved production efficiency; the method is simple, the production cost can be reduced, the supporting plate is arranged below the thin plate, double-sided film pasting of the thin plate is achieved through the first film pasting and the second film pasting, and the film pasting effect is good.
Drawings
FIG. 1 is a first schematic diagram of a method for laminating a sheet according to the present invention;
FIG. 2 is a second schematic diagram of the film-pasting method of the thin plate of the present invention.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
A film pasting method for a thin plate comprises the following steps:
s1: preheating and stacking: preheating the thin plate 1, and stacking a support plate 2 below the thin plate 1 after preheating; before preheating the thin plate 1, carrying out chemical treatment on the thin plate 1, and roughening the surface of the thin plate; the support plate 2 may be a waste plate, a photo substrate, an expired substrate, or the like, which can reduce the production cost.
The support plate 2 can completely cover the lower surface of the thin plate 1, and in one embodiment, the size and shape of the support plate 2 are respectively consistent with the size and shape of the thin plate 1; the thickness of the sheet 1 is 0.1mm or less.
S2: pasting a film I: referring to the attached drawing 1, the stacked thin plate 1 and the supporting plate 2 are fixed, an upper hot pressing roller 4 is arranged above the thin plate 1, and the dry film 3 is attached to the upper surface of the thin plate 1 through the upper hot pressing roller 4, so that the film attaching on the upper surface of the thin plate 1 is completed. Due to the supporting effect of the supporting plate 2 on the thin plate 1 and the preheating of the thin plate 1 in the previous step, the problems of rolling plates, clamping plates and film wrinkles cannot occur when the thin plate 1 is pasted with the film, and the film pasting effect is improved.
In one embodiment, the temperature of the upper hot-pressing roller 4 is 100-120 ℃, the film-sticking speed of the first film-sticking is controlled at 2.2-2.8 m/min, and the film-sticking pressure of the first film-sticking is controlled at 3-5 kg/cm2
Step S2 further includes the steps of: after the thin plate 1 and the supporting plate 2 are fixed, the thin plate 1 and the supporting plate 2 are placed on a clapper or on the side of the clapper, the clapper comprises clapboards positioned on two sides of the thin plate, and the clapboards are aligned with two sides of the thin plate 1 and the supporting plate 2. The clapper is of a conventional clapper structure, for example, the clapper comprises an air cylinder and a clapper connected with the air cylinder, and the air cylinders on two sides of the thin plate drive the clappers to press the thin plate and two ends of the supporting plate to be even.
S3: turning: the thin plate 1 and the supporting plate 2 are separated, the thin plate is turned by 180 degrees and then is stacked on the thin plate 1, and the clapper is used for re-stacking the fixed thin plate 1 and the supporting plate 2 in alignment.
S4: and (5) pasting a second film: referring to fig. 2, the dry film 3 is attached to the upper surface of the thin plate 1 through the upper hot pressing roller 4 above the thin plate 1, the lower hot pressing roller 5 is arranged below the supporting plate 2, the lower hot pressing roller 4 corresponds to the upper hot pressing roller 5 in position, and the upper hot pressing roller 4 and the lower hot pressing roller 5 move synchronously. The upper hot-pressing roller is matched with the lower hot-pressing roller to finish the film pasting on the lower surface of the thin plate.
In one embodiment, the temperature of the upper hot-pressing roller 4 is 100-120 ℃, and the lower hot-pressing roller 4 is at room temperature; the film sticking speed of the second film sticking is controlled to be 2.2-2.8 m/min, and the film sticking pressure of the second film sticking is controlled to be 3-5 kg/cm2
The invention provides a film pasting method for a thin plate, which can be used for pasting the film by using a conventional film pasting machine without the problems of a rolled plate, a clamping plate and a wrinkled plate, and has high universality and improved production efficiency; the method is simple, the production cost can be reduced, the supporting plate is arranged below the thin plate, double-sided film pasting of the thin plate is achieved through the first film pasting and the second film pasting, and the film pasting effect is good.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.

Claims (9)

1. A film pasting method for a thin plate is characterized by comprising the following steps: the method comprises the following steps:
s1: preheating and stacking: preheating the thin plate (1), and stacking a support plate (2) below the thin plate (1) after preheating;
s2: pasting a film I: fixing the stacked thin plates (1) with a supporting plate (2), arranging an upper hot pressing roller (4) above the thin plates, and attaching a dry film (3) to the upper surfaces of the thin plates (1) through the upper hot pressing roller (4);
s3: turning: separating the thin plate (1) from the support plate (2), and overlapping the thin plate on the thin plate after the thin plate is turned over for 180 degrees;
s4: and (5) pasting a second film: the dry film (3) is attached to the upper surface of the thin plate through the upper hot pressing roller (4) above the thin plate (1), the lower hot pressing roller (5) is arranged below the supporting plate (2), the lower hot pressing roller (5) corresponds to the upper hot pressing roller (4), and the upper hot pressing roller (4) and the lower hot pressing roller (4) move synchronously.
2. The method for laminating a sheet according to claim 1, wherein: step S2 further includes the steps of: after the thin plate (1) and the supporting plate (2) are fixed, the thin plate (1) and the supporting plate (2) are placed on a clapper machine or on the side edge of the clapper machine, the clapper machine comprises clappers positioned on two sides of the thin plate (1), and the clappers are aligned with two sides of the thin plate (1) and the supporting plate (2).
3. The method for laminating a sheet according to claim 1, wherein: before the thin plate (1) is preheated, the thin plate (1) is subjected to chemical treatment, and the surface of the thin plate is roughened.
4. The method for laminating a sheet according to claim 1, wherein: the temperature of the upper hot pressing roller (4) is 100-120 ℃.
5. The method for laminating a sheet according to claim 1, wherein: and the lower hot pressing roller (5) adopts normal temperature.
6. The method for laminating a sheet according to claim 1, wherein: and the film sticking speed of the first film sticking and/or the second film sticking is controlled to be 2.2-2.8 m/min.
7. The method for laminating a sheet according to claim 1, wherein: the film sticking pressure of the first film sticking and/or the second film sticking is controlled to be 3-5 kg/cm2
8. The method for laminating a sheet according to claim 1, wherein: the size and the shape of the supporting plate (2) are respectively consistent with those of the thin plate (1).
9. The method for laminating a sheet according to claim 1, wherein: the thickness of the thin plate (1) is less than 0.1 mm.
CN202010686094.8A 2020-07-16 2020-07-16 Film pasting method for thin plate Pending CN111885830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010686094.8A CN111885830A (en) 2020-07-16 2020-07-16 Film pasting method for thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010686094.8A CN111885830A (en) 2020-07-16 2020-07-16 Film pasting method for thin plate

Publications (1)

Publication Number Publication Date
CN111885830A true CN111885830A (en) 2020-11-03

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08267579A (en) * 1995-03-31 1996-10-15 Matsushita Electric Works Ltd Method and apparatus for laminating dry film
CN202271625U (en) * 2011-09-22 2012-06-13 湖南维胜科技有限公司 Dry film fit device for flexible circuit board
CN103203943A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 Film mounting method for substrate
CN103217865A (en) * 2012-01-18 2013-07-24 昆山允升吉光电科技有限公司 Method for pasting film on ultrathin steel sheet
CN103476203A (en) * 2013-09-13 2013-12-25 番禺南沙殷田化工有限公司 Wet process film pasting method of flexible printed circuit board
CN104015467A (en) * 2013-03-01 2014-09-03 昆山允升吉光电科技有限公司 Cushion plate for laminating and using method of cushion plate
CN205793667U (en) * 2016-05-26 2016-12-07 深圳市迅捷兴电路技术有限公司 Flexible circuit film sticking apparatus
CN207166868U (en) * 2017-07-21 2018-03-30 江西崇政科技有限公司 A kind of high sealed monitoring camera circuit board film sticking apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08267579A (en) * 1995-03-31 1996-10-15 Matsushita Electric Works Ltd Method and apparatus for laminating dry film
CN202271625U (en) * 2011-09-22 2012-06-13 湖南维胜科技有限公司 Dry film fit device for flexible circuit board
CN103203943A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 Film mounting method for substrate
CN103217865A (en) * 2012-01-18 2013-07-24 昆山允升吉光电科技有限公司 Method for pasting film on ultrathin steel sheet
CN104015467A (en) * 2013-03-01 2014-09-03 昆山允升吉光电科技有限公司 Cushion plate for laminating and using method of cushion plate
CN103476203A (en) * 2013-09-13 2013-12-25 番禺南沙殷田化工有限公司 Wet process film pasting method of flexible printed circuit board
CN205793667U (en) * 2016-05-26 2016-12-07 深圳市迅捷兴电路技术有限公司 Flexible circuit film sticking apparatus
CN207166868U (en) * 2017-07-21 2018-03-30 江西崇政科技有限公司 A kind of high sealed monitoring camera circuit board film sticking apparatus

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