CN103474371A - 一种半导体晶片兼容测试载台及其使用方法 - Google Patents
一种半导体晶片兼容测试载台及其使用方法 Download PDFInfo
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111190276A (zh) * | 2020-02-27 | 2020-05-22 | 西安微电子技术研究所 | 一种体视显微镜移动载物台及其使用方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20040075624A (ko) * | 2003-02-22 | 2004-08-30 | 삼성전자주식회사 | 볼 타입 오링을 구비한 웨이퍼 정렬 장치 |
CN101221370A (zh) * | 2008-01-24 | 2008-07-16 | 上海微电子装备有限公司 | 硅片边缘曝光系统及其光强控制方法 |
CN201989054U (zh) * | 2010-12-10 | 2011-09-28 | 北京有色金属研究总院 | 一种适用于多尺寸晶圆的喷砂用载具 |
CN203466168U (zh) * | 2013-09-22 | 2014-03-05 | 瀚天天成电子科技(厦门)有限公司 | 一种半导体晶片兼容测试载台 |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20040075624A (ko) * | 2003-02-22 | 2004-08-30 | 삼성전자주식회사 | 볼 타입 오링을 구비한 웨이퍼 정렬 장치 |
CN101221370A (zh) * | 2008-01-24 | 2008-07-16 | 上海微电子装备有限公司 | 硅片边缘曝光系统及其光强控制方法 |
CN201989054U (zh) * | 2010-12-10 | 2011-09-28 | 北京有色金属研究总院 | 一种适用于多尺寸晶圆的喷砂用载具 |
CN203466168U (zh) * | 2013-09-22 | 2014-03-05 | 瀚天天成电子科技(厦门)有限公司 | 一种半导体晶片兼容测试载台 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111190276A (zh) * | 2020-02-27 | 2020-05-22 | 西安微电子技术研究所 | 一种体视显微镜移动载物台及其使用方法 |
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Address after: 361006 first floor, block B, Jianye Building, No. 96, Xiangxing Road, industrial zone, Xiamen Torch High tech Zone (Xiang'an), Xiamen, Fujian Patentee after: Hantiantiancheng Electronic Technology (Xiamen) Co.,Ltd. Address before: 361006 first floor, block B, Jianye Building, No. 96, Xiangxing Road, industrial zone, Xiamen Torch High tech Zone (Xiang'an), Xiamen, Fujian Patentee before: EPIWORLD INTERNATIONAL CO.,LTD. |
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