CN103871939B - 用于生产蓝宝石图形衬底的分选方法 - Google Patents
用于生产蓝宝石图形衬底的分选方法 Download PDFInfo
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- CN103871939B CN103871939B CN201410126845.5A CN201410126845A CN103871939B CN 103871939 B CN103871939 B CN 103871939B CN 201410126845 A CN201410126845 A CN 201410126845A CN 103871939 B CN103871939 B CN 103871939B
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- microstructure
- pattern substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 25
- 239000010980 sapphire Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000002310 reflectometry Methods 0.000 claims abstract description 21
- 238000005259 measurement Methods 0.000 claims abstract description 13
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 230000006872 improvement Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410126845.5A CN103871939B (zh) | 2014-04-01 | 2014-04-01 | 用于生产蓝宝石图形衬底的分选方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410126845.5A CN103871939B (zh) | 2014-04-01 | 2014-04-01 | 用于生产蓝宝石图形衬底的分选方法 |
Publications (2)
Publication Number | Publication Date |
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CN103871939A CN103871939A (zh) | 2014-06-18 |
CN103871939B true CN103871939B (zh) | 2017-07-14 |
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CN201410126845.5A Active CN103871939B (zh) | 2014-04-01 | 2014-04-01 | 用于生产蓝宝石图形衬底的分选方法 |
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CN (1) | CN103871939B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107481950A (zh) * | 2017-07-28 | 2017-12-15 | 苏州阿特斯阳光电力科技有限公司 | 一种基于pl检测的品质分档方法及装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6984533B1 (en) * | 2001-10-09 | 2006-01-10 | Xilinx, Inc. | Method of sorting dice by speed during die bond assembly and packaging to customer order |
CN104025276A (zh) * | 2011-11-07 | 2014-09-03 | Bt成像股份有限公司 | 用于光伏电池制造的晶圆分级和分类 |
CN103077914B (zh) * | 2013-01-09 | 2015-09-02 | 广东志成华科光电设备有限公司 | 一种全自动晶粒分选设备及全自动晶粒分选方法 |
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2014
- 2014-04-01 CN CN201410126845.5A patent/CN103871939B/zh active Active
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Address after: 2 / F, building 1, South extension, Haiyang South Road, Chengnan street, Rugao City, Nantong City, Jiangsu Province 226500 Patentee after: Haidixin semiconductor (Nantong) Co.,Ltd. Address before: 215131 Chaoyang industrial square, Lake Industrial Park, Xiangcheng District Economic Development Zone, Suzhou, Jiangsu Patentee before: Dura Chip (Suzhou) Ltd. |
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Effective date of registration: 20230506 Address after: 226500 No.1, Nanyan, Haiyang South Road, Chengnan street, Rugao City, Nantong City, Jiangsu Province Patentee after: DURA-CHIP (NANTONG) Ltd. Address before: 226500 2nd floor, building 1, Nanyan No.1, Haiyang South Road, Chengnan street, Rugao City, Nantong City, Jiangsu Province Patentee before: Haidixin semiconductor (Nantong) Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20240318 Address after: 528225, Room A206, Building A, Nanhai Industrial Think Tank City Phase I, Taoyuan Road, Software Park, Shishan Town, Nanhai District, Foshan City, Guangdong Province (Residence Declaration) Patentee after: Foshan xinweilai Photoelectric Technology Co.,Ltd. Country or region after: China Address before: 226500 No.1, Nanyan, Haiyang South Road, Chengnan street, Rugao City, Nantong City, Jiangsu Province Patentee before: DURA-CHIP (NANTONG) Ltd. Country or region before: China |