CN103472631A - Seal agent curing method and display device - Google Patents
Seal agent curing method and display device Download PDFInfo
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- CN103472631A CN103472631A CN2013104248001A CN201310424800A CN103472631A CN 103472631 A CN103472631 A CN 103472631A CN 2013104248001 A CN2013104248001 A CN 2013104248001A CN 201310424800 A CN201310424800 A CN 201310424800A CN 103472631 A CN103472631 A CN 103472631A
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Abstract
The embodiment of the invention provides a seal agent curing method and a display device, which relate to the field of display device manufacturing. A distance from seal agent to a display area can be reduced, and the design of a slim bezel is favored. The method comprises the following steps of manufacturing a first resistance heating layer at an adhesive position on a first base plate, corresponding to the seal agent; a first leading wire is manufactured on the first base plate, and is electrically connected with the first resistance heating layer; the seal agent is coated on the first base plate or a second base plate, the first base plate is adhered with the second base plate through utilizing the seal agent, the first leading wire is electrified, and the seal agent is cured to form a seal agent layer.
Description
Technical field
The present invention relates to display device and make field, relate in particular to a kind of sealed plastic box curing and display device.
Background technology
Recently, increasing display is towards the future development of lightening, high image quality, narrow frame, and the narrow frame design of display becomes a development trend in demonstration field.And sealed plastic box is lower to the distance at edge, described viewing area, more be conducive to narrow frame design.
In prior art, the curing of sealed plastic box often adopts UV(ultraviolet, ultraviolet ray) photocuring sealed plastic box, UV light is radiated on sealed plastic box by UV mask, completes to the solidifying of described sealed plastic box, while due to described UV illumination, being mapped to liquid crystal molecule, can destroy the structure of liquid crystal molecule, so, when coating frame sealing glue, can leave certain space between sealed plastic box and liquid crystal molecule, therefore, sealed plastic box will be distant to the distance of described viewing area, is unfavorable for the design of narrow frame.
Summary of the invention
Embodiments of the invention provide a kind of sealed plastic box curing and display device, can reduce the distance of sealed plastic box to viewing area, are conducive to narrow frame design.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of sealed plastic box curing, bonding for first substrate and second substrate, is characterized in that, comprising:
On described first substrate, corresponding to sealed plastic box, bonding position makes the first resistance heating layer;
Make the first lead-in wire on described first substrate, described the first lead-in wire is electrically connected to described the first resistance heating layer;
Coating frame sealing glue on described first substrate or described second substrate, utilize described sealed plastic box that described first substrate and described second substrate are carried out bonding, then gives described the first lead-in wire energising, and described sealed plastic box solidify to form the sealed plastic box layer.
Optionally, the resistance of described the first resistance heating layer is greater than the resistance of described the first lead-in wire.
Optionally, described the first lead-in wire extends to the edge of described first substrate.
Optionally, the material of described the first resistance heating layer is inorganic conductive material, and the material of described the first lead-in wire is metal material.
Optionally, the material of described the first resistance heating layer is tin indium oxide, and the material of described the first lead-in wire is aluminium.
Optionally, described the first resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described first substrate.
Optionally, before the described sealed plastic box of coating, described method also comprises:
On described second substrate, corresponding to described sealed plastic box, bonding position makes the second resistance heating layer;
Make the second lead-in wire on described second substrate, described the second lead-in wire is electrically connected to described the second resistance heating layer;
When giving described the first lead-in wire energising, give described the second lead-in wire energising.
Optionally, described the second resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described second substrate.
A kind of display device, comprise first substrate and second substrate, between described first substrate and described second substrate, is provided with the sealed plastic box layer,
Position corresponding to described sealed plastic box layer on described first substrate also is provided with the first resistance heating layer, and described the first resistance heating layer contacts with described sealed plastic box layer.
Optionally, described the first resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described first substrate.
Optionally, the position corresponding to described sealed plastic box layer on described second substrate is provided with the second resistance heating layer, and described the second resistance heating layer contacts with described sealed plastic box layer.Optionally, described the second resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described second substrate.
Optionally, the material of described the first resistance heating layer and described the second resistance heating layer is inorganic conductive material.
Optionally, the material of described the first resistance heating layer and described the second resistance heating layer is tin indium oxide.
Optionally, described first substrate is array base palte, and described second substrate is color membrane substrates.
Or described first substrate is color membrane substrates, described second substrate is array base palte.
The sealed plastic box curing that the embodiment of the present invention provides and the display device of making according to described sealed plastic box curing, by the position bonding in sealed plastic box, make and the resistance heating layer, like this after coating frame sealing glue, just can make described resistance heating layer heating power by giving the lead-in wire energising, and then make sealed plastic box solidify to form the sealed plastic box layer, the sealed plastic box layer of making like this, the heat curing completed by the heating power with the contacted resistance heating layer of sealed plastic box layer, can so that sealed plastic box from described viewing area very close to and not on the impact of the liquid crystal in viewing area or other structure generations, be conducive to narrow frame design.
The accompanying drawing explanation
The plan structure schematic diagram of a kind of first substrate that Fig. 1 provides for the embodiment of the present invention;
The plan structure schematic diagram of the another kind of first substrate that Fig. 2 provides for the embodiment of the present invention;
The schematic diagram of the plan structure to the liquid crystal panel after box that Fig. 3 provides for the embodiment of the present invention;
The cross-sectional view of a kind of liquid crystal panel on the A-B direction shown in Fig. 3 that Fig. 4 provides for the embodiment of the present invention;
The cross-sectional view of another kind of liquid crystal panel on the A-B direction shown in Fig. 3 that Fig. 5 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.
The embodiment of the present invention provides a kind of sealed plastic box curing, said method comprising the steps of:
S1, as shown in Figure 1, on first substrate 11, corresponding to sealed plastic box, bonding position makes the first resistance heating layer 111.
After first substrate 11 completes, can on first substrate, deposit the resistance heating layer film, the coating photoresist, then, by composition techniques such as exposure, development, etchings, on first substrate 11, corresponding to sealed plastic box, bonding position makes the first resistance heating layer 111.
S2, as shown in Figure 2 makes the first lead-in wire 112, the first lead-in wires 112 and is electrically connected to the first resistance heating layer 111 on first substrate 11.
Can, by making the first lead material film and photoresist, then by composition techniques such as exposure, development, etchings, produce first lead-in wire 112, the first lead-in wire 112 all resistance heating layers 111 that can be communicated with on first substrate 11 here.
Here it should be noted that, can first carry out step S1 produces the first resistance heating layer and carries out step S2 again and produce the first lead-in wire, also can first carry out step S2 and produce the first lead-in wire and carry out step S1 again and produce the first resistance heating layer, this is not restricted.
S3, above first substrate or second substrate coating frame sealing glue, utilize sealed plastic box that first substrate and second substrate are carried out bonding, then to the first lead-in wire energising.
On first substrate, complete after the first lead-in wire and the first resistance heating layer, just can coating frame sealing glue, here, sealed plastic box can be coated on first substrate, also can be coated on second substrate.
Utilize sealed plastic box first substrate and second substrate are carried out bonding after, because the first resistance heating layer is produced on the bonding position of sealed plastic box, therefore the first resistance heating layer will contact with the sealed plastic box of coating.To the first lead-in wire energising, after the first resistance heating layer heating power that makes to be connected with the first lead-in wire, with the contacted sealed plastic box of the first resistance heating layer, will, by heat curing, form the sealed plastic box layer so.
The sealed plastic box curing that the embodiment of the present invention provides, make the resistance heating layer by the position bonding in sealed plastic box, like this after coating frame sealing glue, just can make resistance heating layer heating power by giving the lead-in wire energising, and then just completed solidifying sealed plastic box, form the sealed plastic box layer, the sealed plastic box layer of making like this, it is the heat curing completed by the heating power with the contacted resistance heating layer of sealed plastic box layer, can so that sealed plastic box from viewing area very close to and not on the impact of the liquid crystal in viewing area or other structure generations, our experiments show that, the distance of applying the sealed plastic box leafing viewing area of method making provided by the invention can be controlled in 10 μ m, with 400 μ m-600 μ m of the distance of sealed plastic box leafing viewing area in available technology adopting UV curing, compare, more be conducive to narrow frame design.
Optionally, the first lead-in wire extends to the edge of first substrate, with regard to more convenient first lead-in wire of giving, switches on like this; It should be noted that, after making sealed plastic box solidify to the lead-in wire energising, can in the process of carrying out subsequent technique, cut away lead-in wire, also can cut away.
Optionally, the resistance of the first resistance heating layer is greater than the resistance of the first lead-in wire; By formula Q=I
2after known the first resistance heating layer energising of R, because resistance is larger, therefore it is more to generate heat, more be conducive to the heat curing of sealed plastic box.
Optionally, the material of the first resistance heating layer can be inorganic conductive material, and the material of the first lead-in wire can be metal material, generally, inorganic conductive material is larger than the resistivity of metal material, and the resistance of such the first resistance heating layer will be greater than the resistance of the first lead-in wire.Example, the material of the first resistance heating layer can be ITO(Indium Tin Oxides, tin indium oxide), one or more in the inorganic conductive materials such as zinc oxide aluminum and tin ash antimony, the material of the first lead-in wire is one or more in the metal materials such as copper, aluminium or silver.
Optionally, the first resistance heating layer with the sealed plastic box layer orthogonal projection figure on first substrate consistent.So just can guarantee that in the situation that apply appropriate sealed plastic box, the heating surface area of sealed plastic box is larger, solidify faster.
In said method, only on first substrate, made the first resistance heating layer, the sealed plastic box of coating only one side is heated, in order to strengthen the heating surface area of sealed plastic box, it is solidified faster, can also on second substrate, also make a resistance heating layer and heat sealed plastic box, therefore, before coating frame sealing glue, method also comprises:
Q1, on second substrate, corresponding to sealed plastic box, bonding position makes the second resistance heating layer.
Q2, make the second lead-in wire on second substrate, the second lead-in wire is electrically connected to the second resistance heating layer.
Here, making the method for making the second lead-in wire in the second resistance heating layer and Q2 in step Q1 can refer step S1 and S2, and its sequencing does not limit.
Carry out step S3 to the first lead-in wire energising in, switch on also to the second lead-in wire.The two sides of the sealed plastic box of coating is heated by the first resistance heating layer and the second resistance heating layer respectively like this, and heating surface area is larger, solidifies faster.
Here it should be noted that, the resistance of the second resistance heating layer is greater than the resistance of the second lead-in wire.Optionally, the material of the second resistance heating layer is inorganic conductive material, and the material of the second lead-in wire is metal material.Example, the material of the second resistance heating layer is one or more in the inorganic conductive materials such as tin indium oxide, zinc oxide aluminum and tin ash antimony, the material of the second lead-in wire is one or more in the metal materials such as copper, aluminium and silver.
Optionally, the second lead-in wire extends to the edge of second substrate, with regard to more convenient second lead-in wire of giving, switches on like this.
Optionally, the second resistance heating layer with the sealed plastic box layer orthogonal projection figure on second substrate consistent.So just can guarantee that in the situation that apply appropriate sealed plastic box, the heating surface area of sealed plastic box is larger, solidify faster.
Here, if for liquid crystal indicator, can be that first substrate is color membrane substrates, second substrate is array base palte; Perhaps, can be also that first substrate is array base palte, second substrate is color membrane substrates.In the method for making provided in the embodiment of the present invention, preferably, more convenient when first substrate is array base palte.Because the motherboard of array base palte generally is larger than the motherboard of color membrane substrates, when first substrate is array base palte, can guarantee that lead-in wire exposes a part outside, more conveniently give the lead-in wire energising.
If for the OLED display device, first substrate can be base plate for packaging, and second substrate is exactly array base palte; First substrate can be also array base palte, and second substrate is exactly base plate for packaging.So, for the type of substrate, do not do specific (special) requirements.
The embodiment of the present invention also provides a kind of display device, this display device comprises first substrate and second substrate, be provided with the sealed plastic box layer between first substrate and second substrate, position corresponding to the sealed plastic box layer on first substrate also is provided with the first resistance heating layer, and the first resistance heating layer contacts with the sealed plastic box layer.。
Display device can be: any product or parts with Presentation Function such as liquid crystal panel, Electronic Paper, oled panel, mobile phone, panel computer, televisor, display, notebook computer, digital album (digital photo frame), navigating instrument.
Embodiment of the present invention display device be take liquid crystal panel as example, as shown in Figure 3, is the plan structure schematic diagram of liquid crystal panel 1, and Fig. 4 is the cross-sectional view of a kind of liquid crystal panel 1 on the A-B direction shown in Fig. 3.As shown in Figure 4, liquid crystal panel 1 comprises the first substrate 11 after box and second substrate 21 is formed with to liquid crystal layer 31 and sealed plastic box layer 113 between first substrate 11 and second substrate 21, and sealed plastic box layer 113 is arranged on the periphery of liquid crystal layer 31.Also be provided with the first resistance heating layer 111 on first substrate 11, and the first resistance heating layer 111 contacts with sealed plastic box layer 113.
Optionally, the first resistance heating layer 111 with sealed plastic box layer 113 the orthogonal projection figure on first substrate 11 consistent, so just can guarantee that in the situation that apply appropriate sealed plastic box, the heating surface area of sealed plastic box is larger, solidify faster.
Optionally, as shown in Figure 5, the position corresponding to sealed plastic box layer 113 on second substrate 21 is provided with the second resistance heating layer 114, and the second resistance heating layer 114 contacts with sealed plastic box layer 113.
Optionally, the second resistance heating layer 114 with sealed plastic box layer 113 the orthogonal projection figure on second substrate 21 consistent, so just can guarantee that in the situation that apply appropriate sealed plastic box, the heating surface area of sealed plastic box is larger, solidify faster.
Optionally, the first resistance heating layer 111 and the second resistance heating layer 114 all with sealed plastic box layer 113 the orthogonal projection figure on first substrate 11 consistent, so just can guarantee that in the situation that apply appropriate sealed plastic box, the heating surface area of sealed plastic box is larger, solidify faster.The two sides of the sealed plastic box of coating is heated by the first resistance heating layer 113 and the second resistance heating layer 114 respectively like this, and heating surface area is larger, and curing rate is faster.
Optionally, the material of the first resistance heating layer 111 and the second resistance heating layer 114 is inorganic conductive material, and generally, inorganic conductive material is larger than the resistivity of metal material, is conducive to like this heating and makes sealed plastic box carry out heat curing.
Optionally, the material of the first resistance heating layer 111 and the second resistance heating layer 114 can be ITO(Indium Tin Oxides, tin indium oxide), one or more in the inorganic conductive material such as zinc oxide aluminum and tin ash antimony; Preferably, the material of the first resistance heating layer 111 and the second resistance heating layer 114 is tin indium oxide.
Here, first substrate can be color membrane substrates, and second substrate is exactly array base palte; First substrate can be also array base palte, and second substrate is exactly color membrane substrates, at this, is not restricted.
The display device that the embodiment of the present invention provides, be provided with and the contacted resistance heating layer of sealed plastic box layer, when making the sealed plastic box layer, just can make its heating by giving the energising of resistance heating layer like this, complete the solidifying of sealed plastic box, and then formation sealed plastic box layer.The sealed plastic box layer of making like this, it is the heat curing completed by the heating power with the contacted resistance heating layer of sealed plastic box layer, can so that sealed plastic box from viewing area very close to and not on the impact of the liquid crystal in viewing area or other structure generations, reduce the distance of sealed plastic box to viewing area, be conducive to narrow frame design.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claim.
Claims (15)
1. a sealed plastic box curing, bonding for first substrate and second substrate, is characterized in that, comprising:
On described first substrate, corresponding to sealed plastic box, bonding position makes the first resistance heating layer;
Make the first lead-in wire on described first substrate, described the first lead-in wire is electrically connected to described the first resistance heating layer;
On described first substrate or described second substrate, the described sealed plastic box of coating, utilize described sealed plastic box that described first substrate and described second substrate are carried out bonding, switches on then to described the first lead-in wire, makes described sealed plastic box solidify to form the sealed plastic box layer.
2. method according to claim 1, is characterized in that, the resistance of described the first resistance heating layer is greater than the resistance of described the first lead-in wire.
3. method according to claim 1, is characterized in that, described the first lead-in wire extends to the edge of described first substrate.
4. according to the described method of claim 1-3 any one, it is characterized in that, the material of described the first resistance heating layer is inorganic conductive material, and the material of described the first lead-in wire is metal material.
5. method according to claim 4, is characterized in that, the material of described the first resistance heating layer is tin indium oxide, and the material of described the first lead-in wire is aluminium.
6. according to the described method of claim 1-3 any one, it is characterized in that, described the first resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described first substrate.
7. according to the described method of claim 1-3 any one, it is characterized in that, before the described sealed plastic box of coating, described method also comprises:
On described second substrate, corresponding to described sealed plastic box, bonding position makes the second resistance heating layer;
Make the second lead-in wire on described second substrate, described the second lead-in wire is electrically connected to described the second resistance heating layer;
When giving described the first lead-in wire energising, give described the second lead-in wire energising.
8. method according to claim 7, is characterized in that, described the second resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described second substrate.
9. a display device, comprise first substrate and second substrate, it is characterized in that, between described first substrate and described second substrate, is provided with the sealed plastic box layer,
Position corresponding to described sealed plastic box layer on described first substrate also is provided with the first resistance heating layer, and described the first resistance heating layer contacts with described sealed plastic box layer.
10. display device according to claim 9, is characterized in that, described the first resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described first substrate.
11. according to the described display device of claim 9 or 10, it is characterized in that, the position corresponding to described sealed plastic box layer on described second substrate is provided with the second resistance heating layer, and described the second resistance heating layer contacts with described sealed plastic box layer.
12. display device according to claim 11, is characterized in that, described the second resistance heating layer is consistent with the orthogonal projection figure of described sealed plastic box layer on described second substrate.
13. display device according to claim 11, is characterized in that, the material of described the first resistance heating layer and described the second resistance heating layer is inorganic conductive material.
14. display device according to claim 13, is characterized in that, the material of described the first resistance heating layer and described the second resistance heating layer is tin indium oxide.
15. according to the described display device of claim 9 or 10, it is characterized in that, described first substrate is array base palte, described second substrate is color membrane substrates;
Or described first substrate is color membrane substrates, described second substrate is array base palte.
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| CN2013104248001A CN103472631A (en) | 2013-09-17 | 2013-09-17 | Seal agent curing method and display device |
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| CN2013104248001A CN103472631A (en) | 2013-09-17 | 2013-09-17 | Seal agent curing method and display device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0943614A (en) * | 1995-07-31 | 1997-02-14 | Canon Inc | Production of liquid crystal element |
| JP2000298285A (en) * | 1999-04-14 | 2000-10-24 | Tosei Electro Beam Kk | Liquid crystal display panel and production thereof |
| CN101089706A (en) * | 2006-06-16 | 2007-12-19 | Lg.菲利浦Lcd株式会社 | Display panel assembly and method of manufacturing the same |
| CN101561591A (en) * | 2008-04-17 | 2009-10-21 | 北京京东方光电科技有限公司 | Frame sealant coating and curing method, frame sealant and liquid crystal panel |
-
2013
- 2013-09-17 CN CN2013104248001A patent/CN103472631A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0943614A (en) * | 1995-07-31 | 1997-02-14 | Canon Inc | Production of liquid crystal element |
| JP2000298285A (en) * | 1999-04-14 | 2000-10-24 | Tosei Electro Beam Kk | Liquid crystal display panel and production thereof |
| CN101089706A (en) * | 2006-06-16 | 2007-12-19 | Lg.菲利浦Lcd株式会社 | Display panel assembly and method of manufacturing the same |
| CN101561591A (en) * | 2008-04-17 | 2009-10-21 | 北京京东方光电科技有限公司 | Frame sealant coating and curing method, frame sealant and liquid crystal panel |
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Application publication date: 20131225 |