CN103453339A - Lighting device with light-emitting diodes - Google Patents
Lighting device with light-emitting diodes Download PDFInfo
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- CN103453339A CN103453339A CN2012101757791A CN201210175779A CN103453339A CN 103453339 A CN103453339 A CN 103453339A CN 2012101757791 A CN2012101757791 A CN 2012101757791A CN 201210175779 A CN201210175779 A CN 201210175779A CN 103453339 A CN103453339 A CN 103453339A
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Abstract
The invention discloses a lighting device with light-emitting diodes. The lighting device at least comprises a metal base, a substrate and an insulation patch, wherein the substrate is arranged on the surface of the base and provided with electrodes and at least one light-emitting diode wafer, and the insulation patch is arranged between the substrate and the base. The insulation patch and the substrate meet the relationship of L2+2*T>=L1+2*Cr and W2+2*T>=W1+2*Cr, wherein Cr refers to the shortest distance between any point at the edge of the substrate and the base along the surface of the insulation patch and is larger than or equal to 1.6mm, L1 refers to the length of the substrate, L2 refers to the length of the insulation patch, W1 refers to the width of the substrate, W2 refers to the width of the insulation patch, and T refers to the thickness of the insulation patch. By controlling the size of the insulation patch, the creepage distance between each electrode and the base can be increased, safety of the lighting device is ensured, and manufacturing cost is not increased.
Description
Technical field
The lighting device of the relevant a kind of light emitting diode of the present invention, refer in particular to a kind of lighting apparatus that minimum creepage distance (Creepage Distance) need be arranged according to standard.
Background technology
In recent years, for reaching the requirement of saving the energy and meeting environmental protection, the relevant manufacturer of lighting apparatus changes the light source of lighting apparatus gradually and adopts light emitting diode (LED) with the research and development unit.Light emitting diode is a kind of solid-state semiconductor element, utilizes electric current to pass through in light emitting diode, and energy is discharged with the form of light, has that volume is little, reaction speed is fast, an advantage such as the low and low pollution of power consumption.
But, lighting apparatus belongs to electric product, must consider safety standard in the use, ensure personal safety, property and environment etc. preserve from and lose, and for the safety standard of LED lighting apparatus, country variant and different regulations is arranged according to different operating voltage (working voltage).
Wherein, numbering IEC 60598-1 (light fixture, part 1: General Requirements and test in IEC (International Electrotechnical Commission) light fixture standard; Luminaires-Part 1:General requirements and tests), its content provided the safety standard of operating voltage at the following illuminating product of 1000V, and minimum creepage distance (Creepage Distance) is had to detailed definition and standard.Creepage distance refers between two electrical bodies or electrical body and can touch between surface the beeline along insulating surface; Creepage distance will cause the problems such as punch-through that electric leakage produces and failure of insulation not, whether directly affects the safety of product, is also emphasis and difficulty that can product be tested by safety standard.
In order to solve this problem; most designer can use mode in parallel in the LED driving; make the operating voltage of whole system lower than SELV (Safety Extra Low Voltage; SELV); SELV refers between any two assemblies that may touch; or human body may touch the voltage between the ground protection terminal of random component and product; can not surpass normal value; so under SELV; need not consider the problem of creepage distance, and for SELV, different standards be arranged in different countries.But the type of drive of this kind of parallel connection can be because the interior resistance difference of every LEDs easily causes the even problem of current unevenness, and then affects the uniformity of luminance of lighting apparatus, and easily reduces the LED life-span.And existing manufacturer is in order to solve the even problem of LED current unevenness out of the ordinary, need on lighting device, adopt in addition Current Control IC to control the LED electric current distinctly be arranged in parallel, yet along with the wattage demand increases, the LED quantity that is arranged in parallel increases, can cause IC quantity to increase, to make and cause manufacturing cost significantly to increase, not a perfect solution.
Therefore, how the structure for lighting apparatus is improved, and allows and need have the lighting apparatus of creepage distance to meet the standard of creepage distance according to standard, and not increasing manufacturing cost is current problem to be solved simultaneously.
Summary of the invention
For solving above-mentioned disappearance, the invention provides a kind of lighting device of light emitting diode, by the paster of an insulation material is set between substrate and pedestal, the edge any point of design substrate meets the standard of minimum creepage distance in safety standard (Creepage Distance) along this insulation paster surface to the beeline of this pedestal, and can not cause the increase of production cost.
Another object of the present invention is providing a kind of lighting device of light emitting diode, by the paster of an insulation material is set between substrate and pedestal, and allow this insulation paster there is good heat conduction function, can, by the thermal energy conduction on substrate to metal base, reach the effect of heat radiation.
The lighting device of provided by the invention kind of light emitting diode, this lighting device at least comprises: the pedestal of a metal material; At least one substrate is arranged at a surface of this pedestal, and has at least one electrode and at least one LED wafer on this substrate, and this LED wafer and this electrode are electrically connected; Reach at least one insulation paster and be arranged between this substrate and this pedestal, this insulation paster and this substrate meet the relation of L2+2 * T>=L1+2 * Cr and W2+2 * T>=W1+2 * Cr; Wherein, the beeline of the edge any point that Cr is this substrate along this insulation paster surface to this pedestal, and Cr>=1.6mm, the length that L1 is this substrate, L2 is the length of this insulation paster, the width that W1 is this substrate, W2 is the width of this insulation paster, and T is the thickness of this insulation paster.
As optimal technical scheme, this pedestal is housing.
As optimal technical scheme, this pedestal tool radiating fin.
As optimal technical scheme, there is a plurality of substrates and a plurality of insulation paster on the surface of this pedestal, and a corresponding insulation paster of substrate, or the corresponding insulation paster of a plurality of substrate.
As optimal technical scheme, the thickness of this insulation paster is more than or equal to 0.4mm; This insulation paster further has the heat conduction function, and the thermal conductivity factor of this insulation paster is more than or equal to 1 W/m-K.
The invention has the advantages that, by the paster of an insulation material is set between substrate and pedestal, the edge any point of design substrate meets the standard of minimum creepage distance in safety standard (Creepage Distance) along this insulation paster surface to the beeline of this pedestal, avoid this lighting apparatus and easily safety is worked the mischief because can't meet safety standard; And utilize the low cost of insulation paster, make lighting apparatus of the present invention meeting under the purpose of climbing linear distance, can not cause the increase of production cost.Again, allow this insulation paster there is good heat conduction function, can, by the thermal energy conduction on substrate to metal base, reach the effect of heat radiation.Preferably, the hot Xi Shuo of Dao of this insulation paster>=1 W/m-K, Hou Du>=0.4mm; When thermal conductivity factor<1 W/m-K, the heat-conducting effect of insulation paster is bad, can't be effectively by thermal conductance to pedestal, easily make the LED wafer temperature surpass operating temperature, can make the brightness of LED wafer and life-span reduce; When the thickness<0.4mm of insulation paster,, when the lighting apparatus excess Temperature, insulation penetration range deficiency, can cause the reliability of insulation system to reduce, and can't meet insulation reliability demand, thereby the security of reduction lighting apparatus.
The accompanying drawing explanation
The second preferred embodiment schematic diagram that Fig. 1 is lighting device of the present invention.
The part enlarged drawing that Fig. 2 is Fig. 1.
The side diagram that Fig. 3 is Fig. 2.
The second preferred embodiment schematic diagram that Fig. 4 is lighting device of the present invention.
The 3rd preferred embodiment schematic diagram that Fig. 5 is lighting device of the present invention.
[main element symbol description]
100: lighting device;
110: pedestal;
111: surface;
112: radiating fin;
120: substrate;
121: electrode;
130: LED wafer;
131: electrode;
140: the insulation paster;
L1: the length of substrate;
W1: the width of substrate;
L2: the length of insulation paster;
W2: the width of insulation paster;
T: the thickness of insulation paster;
Cr: beeline.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, so that those skilled in the art can better understand the present invention also, can be implemented, but illustrated embodiment is not as a limitation of the invention.
Refer to Fig. 1, Fig. 2 and Fig. 3, it is the first preferred embodiment schematic diagram of lighting device of the present invention.This lighting device 100 at least comprises: the pedestal 110 of a metal material, wherein this pedestal 110 can be directly as the housing of this lighting device 100, and this pedestal 110 further can have a radiating fin 112, in order to increase the radiating effect of this pedestal 110.
At least one substrate 120 is arranged at a surface 111 of this pedestal 110, and there is at least one electrode 121 on this substrate 120 as the positive and negative electrode that is electrically connected to main power source, and at least one LED wafer 130, the electrode 131 of this LED wafer 130 is electrically connected with former electrodes 121.
Again, at least one insulation paster 140 is arranged between this substrate 120 and this pedestal 110, and the beeline of the edge any point that meets this substrate 120 along these insulation paster 140 surfaces to this pedestal 110 is more than or equal to 1.6mm.
Wherein, this substrate 120 is generally printed circuit board (PCB) (PCB), metal substrate (MCPCB), the ceramic material of take is main ceramic substrate (Ceramic Substrate), cover copper ceramic substrate (DBC).PCB and MCPCB can be used in the product of general LED application, when not excessive unit heat flow density is higher, it is important that the demand of heat conduction more seems, so the LED heat-radiating substrate mainly adopts metal substrate and ceramic substrate two classes to carry out enhance heat, and this substrate 120 has disclosed relevant structure technology for existing market and patent, and these substrate 120 top electrodes 121 are also known technology with the composition structure technology of LED wafer 130, and non-this patent emphasis, at this, do not add to repeat.
In enforcement, this substrate 120 is considered in order to dispel the heat, mostly use metal material to plate insulating surface, security regulations with the U.S., although the substrate of metal material 120 has insulating surface, also can not be used as is that the some of creepage distance is (with reference to UL 1598 6.11.8:For the purposes of measuring spacings, a lm-coated conductor shall be considered an uninsulated part.), thus the thickness of this substrate 120 of no-trump of the present invention and surface distance be used as be the insulation creepage distance some.
Therefore, the present invention is the beeline demand along these insulation paster 140 surfaces to this pedestal 110 according to these substrate 120 sizes and this electrode 121, decide the size of this insulation paster 140, so as to make this lighting device 100 can meet its operating voltage the safety standard of corresponding minimum creepage distance.What at this, will specify is, since plate that the substrate 120 of the metal material of insulating surface can not be used as, it is the part of creepage distance, creepage distance should be started by the edge of substrate 120 to start at, so creepage distance is the beeline of edge any point along these insulation paster 140 surfaces to this pedestal 110 of this substrate 120.
With the present embodiment, adopt the set-up mode of insulation paster 140 corresponding substrates 120 on this lighting device 100, and each substrate 120 is provided with a LED wafer 130 and is connected the electrode 121 of main power source with one group, wherein Fig. 1 has tetragonal eight substrates 120 and eight insulation pasters 140.The length that definition L1 is this substrate 120, L2 is the length of this insulation paster 140, the width that W1 is this substrate 120, W2 is the width of this insulation paster 140, T is the thickness of this insulation paster 140, Cr is the beelines (as 2nd figure and 3rd figure as shown in) of these substrate 120 edges along these heat-conducting patch 140 surfaces to this pedestal 110, and according to lighting apparatus, different operating voltage and countries designs (the creepage distance standard of existing major country/regional illumination apparatus is as shown in table 1) to the size of Cr, minimumly to meet the Cr>=1.6mm relation minimum specification of creepage distance (in the lower list 1 to), thus, these substrate 120 edge any points meet the safety standard in various countries/zone along these insulation paster 140 surfaces to the beeline Cr of this pedestal 110.
Table 1:
In table 1, basic insulation (Basic Insulation) is the insulation that is attached on electrical body and shock-proof basic protection can be provided; Superinsulation (Supplementary Insulation) is except basic insulation, additional independent insulation in addition, the anti-electric shock protection while losing efficacy in order to be provided at basic insulation; Heavy insulation (Reinforced Insulation) is the single insulating system be attached on electrical body, can provide and the anti-electric shock protection effect of double insulation (simultaneously having basic insulation and superinsulation) same levels.
To adopt the present embodiment of eight LED wafers 130, these LED wafer 130 specifications are 1500mA and 3.1V, the about 25V of this lighting device 100 operating voltage, these insulation paster 140 thickness T are 0.5mm, L2 is that 48mm and W2 are 32mm, L1 is that 35mm and W1 are 19mm, and adopt the design of heavy insulation, creepage distance normative form (table 1) with reference to existing major country/regional illumination apparatus, Cr value up to specification is 5.5mm (TaiWan, China/China's Mainland), but the extendibility of this lighting device 100 that looks to the future, for example improve operating voltage, but voltage is no more than 250V, therefore designing Cr is 6.5mm (TaiWan, China/China's Mainland), due to 48mm+2 * 0.5mm>35mm+2 * 6.5mm, 32mm+2 * 0.5mm>19mm+2 * 6.5mm, meet the relation of L2+2 * T>=L1+2 * Cr and W2+2 * T>=W1+2 * Cr at this, and Cr=6.5mm > 1.6mm.
Please refer to Fig. 4, is the second preferred embodiment of the present invention.This lighting device 100 adopts the set-up mode of insulation paster 140 corresponding substrates 120, wherein differently from the first preferred embodiment be, there are seven LED wafers 130 on each substrate 120 and be connected the electrode 121 of main power source with one group, the surface 111 of this pedestal 110 has four substrates 120 and four insulation pasters 140, the advantage that the assembling of simplifying is arranged in this way.
It is illustrative examples that the present embodiment of take adopts 28 LED wafers 130, these LED wafer 130 specifications are 1500mA and 3.1V, the about 87V of this lighting device 100 operating voltage, dimension definitions with reference to aforementioned components, wherein T is 0.5mm, L2 is that 174mm and W2 are 32mm, L1 is that 161mm and W1 are 19mm, and adopt the design of heavy insulation, creepage distance normative form (table 1) with reference to aforementioned existing major country/regional illumination apparatus, Cr value up to specification is 5.5mm (TaiWan, China/China's Mainland), but extendibility looks to the future, for example improve operating voltage but voltage is no more than 250V, therefore designing Cr is 6.5mm (TaiWan, China/China's Mainland), due to 174mm+2 * 0.5mm>161mm+2 * 6.5mm, 32mm+2 * 0.5mm>19mm+2 * 6.5mm, meet the relation of L2+2 * T>=L1+2 * Cr and W2+2 * T>=W1+2 * Cr at this, and Cr=6.5mm>1.6mm.
Please refer to Fig. 5, is the 3rd preferred embodiment of the present invention.Different from the second preferred embodiment is, this lighting device 100 adopts the set-up mode of the corresponding a plurality of substrates 120 of insulation paster 140, and implement on a substrate 120 to have seven LED wafers 130 and be connected the electrode 121 of main power source with one group, the surface 111 of this pedestal 110 has four substrates 120 and an insulation paster 140, the advantage that the assembling of simplifying is arranged in this way.
It is illustrative examples that the present embodiment of take adopts 28 LED wafers 130, these LED wafer 130 specifications are 1500mA and 3.1V, the about 87V of this lighting device 100 operating voltage, dimension definitions with reference to aforementioned components, wherein T is 0.5mm, L2 is that 348.5mm and W2 are 102mm, L1 is that 161mm and W1 are 19mm, and adopt the design of heavy insulation, creepage distance normative form (table 1) with reference to aforementioned existing major country/regional illumination apparatus, Cr value up to specification is 5.5mm (TaiWan, China/China's Mainland), but extendibility looks to the future, for example improve operating voltage but voltage is no more than 250V, therefore designing Cr is 6.5mm (TaiWan, China/China's Mainland), due to 348.5mm+2 * 0.5mm>161mm+2 * 6.5mm, 32mm+2 * 0.5mm>19mm+2 * 6.5mm, meet the relation of L2+2 * T>=L1+2 * Cr and W2+2 * T>=W1+2 * Cr at this, and Cr=6.5mm>1.6mm.
In addition, in enforcement, this insulation paster 140 has the heat conduction function simultaneously, and the previous embodiment of take substrate 120 materials used are aluminium alloy (by section's model electron institute, being made), and the material of this pedestal 110 is aluminium (model is 6063T5).
Table 2 is the thickness measuring table of insulation paster 140, and table 3 is the coefficient of heat conduction (Thermal Conductivity) test chart of insulation paster 140.Wherein specimen I produces (model is A100-42J-2B) for combining safe science and technology, specimen II is that DENKA produces (model is BS40/BS80), specimen III is the solid TM series (TM 32050/TM 32100/TM 32200/TM 32600) of producing of group, specimen IV is emerging writing brush production (model is 86/500), specimen V is emerging writing brush production (model is 86/600), specimen VI produces (model is TM 18000 series) for the group is solid, specimen VII is that DENKA produces (DNK series), specimen VIII is that DENKA produces (BFG20/BFG03 of BFG series), specimen IX is that DENKA produces (BS20/BS30 of BS series).
Table 2
Table 3
| specimen I | specimen II | specimen III | specimen IV | specimen V | |
| the coefficient of heat conduction | 3.0W/m-K | 3.9W/m-K | 3.2W/m-K | 5W/m-K | 6W/m-K |
| effect | can effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. | can effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. | can effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. | can fast and effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. | can fast and effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. |
| specimen VI | specimen VII | specimen VIII | specimen IX | |
| the coefficient of heat conduction | 1.8W/m-K | 1.5 ~ 2.0W/m-K | 4.1W/m-K | 3.9W/m-K |
| effect | can effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. | can effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. | can effectively the heat energy of substrate be led to pedestal, make the LED temperature be no more than operating temperature. | can effectively the heat energy of substrate be led to housing, make the LED temperature be no more than operating temperature. |
Thickness measuring effect by insulation paster 140 in table 2 is known, when this insulate paster 140 thickness when 0.4mm is above, the insulation penetration range is larger, the naked Problem of Failure, can meet the reliability demand of insulation, and product safety promotes, when if these insulation paster 140 thickness are no more than 0.4mm, can can't meet insulation reliability demand because the insulation penetration range is less, cause the security of product to reduce.
Known by 140 coefficient of heat conduction test effects of insulation paster in table 3, when heat conductivity is more than or equal to 1W/m-K, can effectively the heat of substrate 120 be transmitted on pedestal 110, make the LED temperature be no more than operating temperature, avoid LED to reduce light emission rate because temperature is too high, also can avoid the LED life-span to reduce, this insulation paster 140 preferably coefficient of heat conduction is: 1.5W/m-K<=heat conduction Xi Shuo<=7W/m-K.
The above embodiment is only the preferred embodiment for absolutely proving that the present invention lifts, and protection scope of the present invention is not limited to this.Being equal to that those skilled in the art do on basis of the present invention substitutes or conversion, all in protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (8)
1. the lighting device of a light emitting diode, is characterized in that, this lighting device at least comprises:
The pedestal of one metal material;
At least one substrate, be arranged at a surface of this pedestal, and have at least one electrode and at least one LED wafer on this substrate, and this LED wafer and this electrode are electrically connected; And
At least one insulation paster, be arranged between this substrate and this pedestal, and this insulation paster and this substrate meet the relation of L2+2 * T>=L1+2 * Cr and W2+2 * T>=W1+2 * Cr; Wherein, the beeline of the edge any point that Cr is this substrate along this insulation paster surface to this pedestal, and Cr>=1.6mm, the length that L1 is this substrate, L2 is the length of this insulation paster, the width that W1 is this substrate, W2 is the width of this insulation paster, and T is the thickness of this insulation paster.
2. lighting device as claimed in claim 1, is characterized in that, this pedestal is housing.
3. lighting device as claimed in claim 1, is characterized in that, this pedestal tool radiating fin.
4. lighting device as claimed in claim 1, is characterized in that, has a plurality of substrates and a plurality of insulation paster on the surface of this pedestal, and a corresponding insulation paster of substrate.
5. lighting device as claimed in claim 1, is characterized in that, has a plurality of substrates on the surface of this pedestal, and the corresponding insulation paster of a plurality of substrate.
6. lighting device as claimed in claim 1, is characterized in that, the thickness of this insulation paster is more than or equal to 0.4mm.
7. lighting device as claimed in claim 1, is characterized in that, this insulation paster further has the heat conduction function.
8. lighting device as claimed in claim 7, is characterized in that, the thermal conductivity factor of this insulation paster is more than or equal to 1W/m-K.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101757791A CN103453339A (en) | 2012-05-31 | 2012-05-31 | Lighting device with light-emitting diodes |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101757791A CN103453339A (en) | 2012-05-31 | 2012-05-31 | Lighting device with light-emitting diodes |
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| CN103453339A true CN103453339A (en) | 2013-12-18 |
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| CN2012101757791A Pending CN103453339A (en) | 2012-05-31 | 2012-05-31 | Lighting device with light-emitting diodes |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201462530U (en) * | 2009-06-26 | 2010-05-12 | 黄光科 | LED light source fluorescent lamp |
| CN201582632U (en) * | 2010-01-06 | 2010-09-15 | 广州南科集成电子有限公司 | Led lamp tube |
| CN102109116A (en) * | 2010-12-27 | 2011-06-29 | 秦彪 | Led light module and led chip |
| CN102384386A (en) * | 2011-11-08 | 2012-03-21 | 无锡瑞威光电科技有限公司 | Led lamp tube |
-
2012
- 2012-05-31 CN CN2012101757791A patent/CN103453339A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201462530U (en) * | 2009-06-26 | 2010-05-12 | 黄光科 | LED light source fluorescent lamp |
| CN201582632U (en) * | 2010-01-06 | 2010-09-15 | 广州南科集成电子有限公司 | Led lamp tube |
| CN102109116A (en) * | 2010-12-27 | 2011-06-29 | 秦彪 | Led light module and led chip |
| CN102384386A (en) * | 2011-11-08 | 2012-03-21 | 无锡瑞威光电科技有限公司 | Led lamp tube |
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Application publication date: 20131218 |