CN201121859Y - High cooling property led lamp substrates - Google Patents
High cooling property led lamp substrates Download PDFInfo
- Publication number
- CN201121859Y CN201121859Y CNU2007200089699U CN200720008969U CN201121859Y CN 201121859 Y CN201121859 Y CN 201121859Y CN U2007200089699 U CNU2007200089699 U CN U2007200089699U CN 200720008969 U CN200720008969 U CN 200720008969U CN 201121859 Y CN201121859 Y CN 201121859Y
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- CN
- China
- Prior art keywords
- led lamp
- heat sink
- metal heat
- substrate
- led
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides an LED lamp base plate with good radiation capability, and the LED lamp base plate is composed of a base plate for arranging an LED lamp and is characterized in that the base plate comprises an insulating board and high thermal conduction metal heat sink pieces which are stuck on the two lateral surfaces of the insulating board along the lengthwise direction, a P connection foot and an N connection foot of the LED lamp are respectively in electric connection with the metal heat sink pieces on the two lateral surfaces directly to form a circuit; the two lateral surfaces of the insulating board are respectively provided with good heat conducting property metal heat sink pieces, the two connection feet of the LED lamp are directly in electric connection with the metal heat sink pieces on the two lateral surfaces, the LED lamp performs heat exchange and electrode conduction by the metal heat sink pieces. The LED lamp, especially the lamp consisting of a plurality of LED lamps in assembly, generates a large amount of heat quantity which is led and discharged in time by the metal heat sink pieces. The metal heat sink piece has good thermal conductivity; the radiating channel is smooth and has small thermal resistance. The LED lamp has low connection temperature, thereby guaranteeing the illumination performance of the LED lamp perfectly, prolonging the service life of the LED lamp, and greatly reducing the energy consumption.
Description
Technical field
The utility model relates to led lamp, specifically is a kind of led lamp substrate of high-cooling property.
Background technology
With reference to Fig. 1, Fig. 2.Common light emitting diode (LED) light fixture is that light emitting diode 7 is installed on lamp substrate 1, substrate 1 adopts surperficial both sides to be coated with the printed circuit board (PCB) 11 of Copper Foil 12 at interval, two wiring pin 71 of light emitting diode (LED) 7 connect with corresponding Copper Foil 12 respectively, external circuit imposes direct current by P level, the N level of 1 pair of light emitting diode of substrate (LED) 7, impels light emitting diode (LED) 7 to produce brightness.But, because printed circuit board (PCB) 11 is non-high heat conductive body, its thermal conductivity coefficient is low, heat dispersion is poor, particularly a large amount of heat energy of the light fixture generation of most LED lamp concentrating type encapsulation compositions can't in time be dredged and be got rid of, directly cause light emitting diode (LED) 7 junction temperatures to raise, light fixture hot polymerization effect and thermal resistance are excessive, cause light emitting diode (LED) short and light decay phenomenon in 7 service lifes easily, and therefore improve energy consumption.
The utility model content
The purpose of this utility model be overcome existing LED light fixture because of dispel the heat bad cause shorten service life, light decay and the high deficiency of power consumption, a kind of led lamp substrate of high-cooling property is provided.
The purpose of this utility model is achieved through the following technical solutions:
A kind of led lamp substrate of high-cooling property, comprise the substrate that is used for device LED lamp, it is characterized in that: the high-termal conductivity metal heat sink sheet that described substrate includes an insulation board and is attached at these insulation board two sides along its length, the P of LED lamp, N level wiring pin directly electrically connect with both sides metal heat sink sheet respectively and form the loop.
Described metal heat sink sheet is vertical to be installed on the corresponding side surface of insulating trip.
Described metal heat sink sheet undulate.
Described substrate integral body is strip, discoid or square frame shape.
Described two metal heat sink sheets are the staggered layout at interval of multisection type, and the relative metal heat sink fragment in adjacent both sides forms P electrode district, the N electrode district that connects the LED lamp respectively, to realize a plurality of LED concentrating type series, parallel loop.
Correspondence is provided with jack on the described two metal heat sink sheets, and sealing-in LED lamp wiring pin is inserted in the jack and with the metal heat sink sheet and welds.
The utlity model has following advantage:
Two sides of insulation board are equiped with high-termal conductivity metal heat sink sheet respectively, two wiring pin of LED lamp metal heat sink sheets direct and both sides electrically connect, the LED lamp carries out the heat conduction by the metal heat sink sheet and electrode connects, LED light fixture particularly a large amount of heat energy of the light fixture generation of most LED lamp concentrating type assembling formations is in time dredged by the metal heat sink sheet and is got rid of, metal heat sink sheet heat-conductive characteristic is good, heat dissipation channel is unimpeded, thermal resistance is little, LED lamp junction temperature is just low, ensure the luminescent properties of LED lamp well, prolong the service life of LED lamp, cut down the consumption of energy greatly.
Description of drawings
Below in conjunction with accompanying drawing the utility model is described in further detail.
Fig. 1 is the structural representation of existing light emitting diode (LED) light fixture.
Fig. 2 is the vertical view of the substrate among Fig. 1.
Fig. 3 is the vertical view of the utility model first embodiment.
Fig. 4 is the cutaway view along A-A direction among Fig. 3.
Fig. 5 is the structure vertical view of the utility model second embodiment.
The specific embodiment
Embodiment 1: with reference to Fig. 3, Fig. 4.The led lamp substrate of high-cooling property comprises the substrate 1 (not shown LED lamp) of a plurality of concentrating type LED of device lamp, the high-termal conductivity metal heat sink sheet 3,4 that substrate 1 includes an insulation board 2 and is attached at these insulation board 2 two sides along its length.Substrate 1 integral body is strip; But the shape of substrate is not limited to shown in the figure, can be designed to discoid or other moulding such as square frame shape according to concrete needs.
With reference to Fig. 3, Fig. 4.Metal heat sink sheet 3,4 is vertical to be installed on the two sides of insulation board 2, and metal heat sink sheet 3,4 plays thermolysis, and the P electrode, the N electrode that also are electrically connected with external power source as the LED lamp respectively simultaneously are to realize a plurality of concentrating type LED parallel connection formations loop.Metal heat sink sheet 3,4 is continuously whole, and the insulating trip 2 that is located between the metal heat sink sheet 3,4 will be separated as two metal heat sink sheets of conductive electrode.The corresponding jack 5,6 that is provided with grafting LED lamp two wiring pin on the two metal heat sink sheets 3,4, jack 5,6 is arranged near insulation board 2.LED lamp two wiring pin are inserted in respectively in the corresponding jack 5,6, and firmly weld to form with the metal heat sink sheet and reliably be electrically connected, and are connected with external power source to pass through metal heat sink sheet 3,4.For ease of dismounting metal heat sink sheet, be respectively equipped with clasp 31,41 at the two ends of metal heat sink sheet 3,4, correspondence is provided with catching groove 21 on insulation board 2, two metal heat sink sheets are snapped in the catching groove 21 by the clasp 31,41 of end, and metal heat sink sheet 3,4 is close on the two sides that are installed in insulation board 2.For guaranteeing that substrate has good thermal diffusivity, metal heat sink sheet 3,4 is designed to waveform, to increase metal heat sink sheet and outside contact area, improves radiating effect.But be not limited to this, the cross section of metal heat sink sheet also can design the shape that other help dispelling the heat.
Embodiment 2: with reference to Fig. 5.Present embodiment is as different from Example 1: the metal heat sink sheet 3,4 of insulation board 2 both sides is made of the spaced apart metal heat sink fragment of multistage 3a, 4a respectively, and both sides metal heat sink fragment 3a, 4a are staggered to arrange that at interval adjacent both sides relative metal heat sink fragment 3a, 4a form P electrode district, the N electrode district that connects the LED lamp respectively.Multistage metal heat sink fragment 3a, 4a all are snapped in the corresponding catching groove 21 of insulation board by the clasp 31,41 of end, and metal heat sink sheet 3,4 is close on the side that is installed in insulation board 2.Be parallel with a plurality of LED lamp (not shown)s respectively on corresponding metal heat sink fragment 3a, the 4a, a plurality of LED lamps of each section are serially connected by metal heat sink fragment 3a or 4a and constitute the series, parallel link circuit.All the other structures are identical with embodiment 1, do not repeat them here.
The above, it only is the utility model preferred embodiment, so can not limit the scope that the utility model is implemented with this, i.e. the equivalence of doing according to the utility model claim and description changes and modifies, and all should still belong in the scope that the utility model patent contains.
Claims (6)
1, a kind of led lamp substrate of high-cooling property, comprise the substrate that is used for device LED lamp, it is characterized in that: the high-termal conductivity metal heat sink sheet that described substrate includes an insulation board and is attached at these insulation board two sides along its length, the P of LED lamp, N level wiring pin directly electrically connect with both sides metal heat sink sheet respectively and form the loop.
2, substrate according to claim 1 is characterized in that: described metal heat sink sheet is vertical to be installed on the corresponding side surface of insulating trip.
3, substrate according to claim 1 is characterized in that: described metal heat sink sheet undulate.
4, substrate according to claim 1 is characterized in that: described substrate integral body is strip, discoid or square frame shape.
5, substrate according to claim 1 is characterized in that: described two metal heat sink sheets are the staggered layout at interval of multisection type, and the relative metal heat sink fragment in adjacent both sides forms P electrode district, the N electrode district that connects the LED lamp respectively.
6, substrate according to claim 1 is characterized in that: correspondence is provided with jack on the described two metal heat sink sheets, and sealing-in LED lamp wiring pin is inserted in the jack and with the metal heat sink sheet and welds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200089699U CN201121859Y (en) | 2007-11-30 | 2007-11-30 | High cooling property led lamp substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200089699U CN201121859Y (en) | 2007-11-30 | 2007-11-30 | High cooling property led lamp substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201121859Y true CN201121859Y (en) | 2008-09-24 |
Family
ID=40009086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200089699U Expired - Lifetime CN201121859Y (en) | 2007-11-30 | 2007-11-30 | High cooling property led lamp substrates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201121859Y (en) |
-
2007
- 2007-11-30 CN CNU2007200089699U patent/CN201121859Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20071130 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |