CN103441087B - method for manufacturing flexible substrate - Google Patents
method for manufacturing flexible substrate Download PDFInfo
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- CN103441087B CN103441087B CN201310244253.9A CN201310244253A CN103441087B CN 103441087 B CN103441087 B CN 103441087B CN 201310244253 A CN201310244253 A CN 201310244253A CN 103441087 B CN103441087 B CN 103441087B
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- base plate
- polymeric layer
- cover body
- flexible substrate
- hole
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- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 239000013047 polymeric layer Substances 0.000 claims description 175
- 239000010410 layer Substances 0.000 claims description 102
- 238000010030 laminating Methods 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 abstract description 20
- 239000007789 gas Substances 0.000 description 71
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A method for manufacturing a flexible substrate includes: providing a bottom plate with a polymer layer, wherein the bottom plate is provided with a through hole, and the polymer layer is positioned on the bottom plate and covers the through hole; providing a first cover body covering the polymer layer; and providing a gas, wherein the gas flows into the space between the polymer layer and the bottom plate from the through hole, so that the polymer layer is separated from the bottom plate.
Description
Technical field
This case about a kind of method making substrate and device thereof, a kind of method making flexible substrate and
Device.
Background technology
The characteristic of flexible substrate deflection so that display is no longer limited to the design of plane, and can have diversification
Exterior design.And flexible substrate is lightweight, thickness is thin, the most broken and impact-resistant characteristic, then it is applicable to mobile electricity
In the portable products such as words, personal digital assistant (Personal Digital Assistant, PDA) or notebook computer.Remove
Outside this, use flexible substrate to manufacture flexible display and also there is the advantage of manufacturing cost.Therefore replace with flexible base plate
Glass substrate has become the new trend of current flat-panel screens technology development.
In the middle of the process making flexible substrate, it usually needs flexible substrate is configured on the base plate of a hard,
Again flexible substrate is carried out all kinds of technique.Such as, flexible substrate carries out film-forming process, or at flexible substrate
Upper manufacture thin film transistor (TFT).It is said that in general, this typically requires use one temporary sticker, flexible substrate is bonded in firmly
To be processed on the base plate of matter, then by physical method or chemical method, flexible substrate is peeled off from base plate.
For use physical method by flexible substrate from the mode that base plate is peeled off for, if direct by flexible substrate
Peel off from base plate, then easily cause the fracture of circuit on substrate because the angle peeled off is excessive.If by roller bearing through flexible
Between formula substrate and base plate, by the way of roller bearing rolls between flexible substrate and base plate, flexible substrate is shelled from base plate
From, then may be by the surface scratches of flexible substrate.
On the other hand, a kind of method flexible substrate peeled off from base plate by high temperature laser or irradiation.This
It is that flexible substrate is attached on base plate by an adhesion coating, in the completed after continuous processing, by high temperature laser or photograph
The mode of the bond (debonding) between light removal adhesion coating and base plate removes the viscosity of adhesion coating, so as to completing
Flexible substrate from base plate depart from.This kind of method needs to use expensive laser or irradiation to remove bond equipment, and the longest
And effect is limited.If the viscosity of adhesion coating is too strong, by flexible substrate during base plate takes off, it is also possible to infringement
Precision element on flexible substrate.
For make chemically by flexible substrate from the mode that base plate is peeled off for, then need consider base material anti-corrosion
Property, this can increase again the complexity in flexible base plate design, and further increase the production cost of flexible base plate.Separately
On the one hand, the chemical agent used again may be to environment.
Therefore, how to design a kind of method making flexible substrate and device thereof, to solve in prior art, bendable
Substrate is difficult to the problem peeled off from base plate, just becomes the problem that designer needs to solve.
Summary of the invention
In view of the above problems, the present invention is about a kind of method making flexible substrate and device thereof, so as to solving
The problem that in prior art, flexible substrate is difficult to peel off from base plate.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, and its step includes: provides and has
One base plate of one polymeric layer, wherein this base plate has pass through aperture, and this polymeric layer is positioned on this base plate and covers this and runs through
Hole；One first cover body is provided to be covered on this polymeric layer；And a gas is provided, this gas flows in this from this through hole and gathers
Between compound layer and this base plate, and then this polymeric layer is made to separate with this base plate.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, it is provided that the step bag of this gas
Include: one second cover body is configured on this base plate, so that this base plate is between this polymeric layer and this second cover body, and make
This through hole is positioned in the range of this second cover body covered；And this gas is sent between this second cover body and this base plate.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, further includes: provide this first cover
Before body is covered on this polymeric layer, form a line layer on this polymeric layer.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, further includes: form this polymer
After layer is on this base plate, this polymeric layer of through part, make this through hole run through this base plate and this polymeric layer.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, further includes: through part this gather
After compound layer, it is provided that a laminating layer fits on this polymeric layer, and cover this through hole.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, in this polymeric layer of this formation
Step on this base plate, partly this polymeric layer inserts this through hole.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, further includes: provide this gas it
Before, it is provided that a microscope carrier is arranged under this base plate, and this microscope carrier has a thimble；This thimble is stretched into this through hole and withstands this and gather
Compound layer, makes this polymeric layer separate with this bottom parts；And remove this thimble.
For reaching above-mentioned purpose, the present invention provides a kind of method making flexible substrate, further includes in forming this polymerization
This through hole is closed before nitride layer.
For reaching above-mentioned purpose, the present invention provides a kind of device for making flexible substrate, comprising: a base plate,
Having pass through aperture, this through hole has two the first relative ports and one second port, and this base plate has a conformable region, should
Second port is positioned at this conformable region；One blowning installation, has a puff prot, and this puff prot is connected with this first port；And
One first cover body, is configured on this conformable region, and this first cover body is around this second port.
For reaching above-mentioned purpose, the present invention provides a kind of device for making flexible substrate, further includes a microscope carrier and sets
Being placed under this base plate, this microscope carrier has a thimble, and this thimble is to should through hole.
For reaching above-mentioned purpose, the present invention provides a kind of device for making flexible substrate, further includes one and may move
Mechanism, is positioned at the side of this base plate, and this movable mechanism has a fixture.
The method making flexible substrate provided according to embodiments of the present invention and device thereof, be passed through gas by then passing through
Body flows through between polymeric layer and base plate, to be separated with base plate by polymeric layer.Therefore polymeric layer can be avoided to separate with base plate
Time, on polymeric layer, fracture or the polymer layer surface of circuit damage.Further, by adjusting the size of base plate through hole, number
Mesh and the pressure of injection gas and flow, can regulate and control the disengaging time needed for polymeric layer and base plate.Therefore it is able to simpler
Singlely polymeric layer is separated from base plate, and solve the problem that flexible substrate in prior art is difficult to peel off from base plate.
The above explanation about present invention and the explanation of following embodiment are in order to demonstrate and to explain the present invention
Principle, and provide the patent claim of the present invention further to explain.
Accompanying drawing explanation
Figure 1A is the side view according to the device making flexible substrate disclosed by one embodiment of the invention；
Figure 1B is the side view according to the device making flexible substrate disclosed by another embodiment of the present invention；
Fig. 1 C is the side view according to the device making flexible substrate disclosed by another embodiment of the present invention；
Fig. 1 D is the side view according to the device making flexible substrate disclosed by another embodiment of the present invention；
Fig. 1 E is the side view according to the device making flexible substrate disclosed by one embodiment of the invention；
Fig. 2 is the flow chart according to the method making flexible substrate disclosed by one embodiment of the invention；
Fig. 3 A to Fig. 3 F is the structural side view of step S101 to S106 in difference corresponding diagram 2；
Fig. 3 G is the top view of Fig. 3 F；
Fig. 3 H is the structural side view of step S107 in corresponding diagram 2；
Fig. 3 I is the flexible substrate that completes of the flow process according to Fig. 2 and the structural side view of base plate thereof；
Fig. 4 is the flow chart according to the method making flexible substrate disclosed by another embodiment of the present invention；
Fig. 5 A to Fig. 5 D is the structural side view of step S201 to S204 in difference corresponding diagram 4；
Fig. 5 E is the top view of Fig. 5 D；
Fig. 5 F to Fig. 5 H is the structural side view of step S205 to S207 in difference corresponding diagram 4；
Fig. 5 I is the flexible substrate that completes of the flow process according to Fig. 4 and the structural side view of base plate thereof；
Fig. 6 A is the side view according to the device making flexible substrate disclosed by one embodiment of the invention；
Fig. 6 B is the side view according to the device making flexible substrate disclosed by another embodiment of the present invention；
Fig. 7 is the flow chart according to the method making flexible substrate disclosed by another embodiment of the present invention；
Fig. 8 A to Fig. 8 K is the structural side view of step S301 to S311 in difference corresponding diagram 7；
Fig. 8 L is the flexible substrate that completes of the flow process according to Fig. 7 and the structural side view of base plate thereof；
Fig. 9 A is the flow chart according to the method making flexible substrate disclosed by another embodiment of the present invention；
Fig. 9 B is the structural side view of step S402 in corresponding diagram 9A；
Fig. 9 C is the flexible substrate that completes of the flow process according to Fig. 9 A and the structural side view of base plate thereof.Wherein, attached
Figure mark:
10,10a～10d makes the device of flexible substrate
11 base plates 111,111a through hole
1111,1111a the first port 1112,1112a the second port
112 conformable region 12 blowning installations
121 puff prot 13 first cover bodies
131 first perforate 14 air extractors
141 bleeding point 15 second cover bodies
151 second perforate 16 movable mechanisms
161 fixture 20 polymeric layers
30 line layer 40 laminating layers
50 device 51 base plates making flexible substrate
511 plate body 5,111 first openings
512 release layer 5,121 second openings
513 through hole 5,131 first ports
5132 second port 514 conformable regions
52 blowning installation 521 puff prots
53 first cover body 531 first perforates
54 air extractor 541 bleeding points
55 second cover body 551 second perforates
56 microscope carrier 561,561 ' first thimbles
562,562 ' second thimble 60 polymeric layer
70 line layer 80 laminating layers
Detailed description of the invention
Hereinafter describing detailed features and the advantage of the present invention the most in detail, its content be enough to make any ability
Field technique personnel understand the technology contents of the present invention and implement according to this, and according to the content disclosed by this specification, apply for a patent
Scope and accompanying drawing, purpose that any present invention of skilled person readily understands that is correlated with and advantage.Below example
Further describe the viewpoint of the present invention, but non-to limit scope of the invention anyways.
In the following description, the first, second, third, etc. wording used be distinguish different elements in accompanying drawing,
Composition, region.These wordings also are not used to limit element, composition, region.It is to say, without departing from the present invention spirit and
In the range of, the first element of being described, the first composition, first area can also be the second element, the second composition, second area.
First, referring to Figure 1A, Figure 1A is according to the device making flexible substrate disclosed by one embodiment of the invention
Side view.Make the device 10 of flexible substrate, including base plate 11, blowning installation 12 and the first cover body 13.
Base plate 11 has the pass through aperture 111 running through base plate 11.Through hole 111 have the first relative port 1111 and
Second port 1112, lays respectively at the opposite sides of through hole 111.Base plate 11 has a conformable region 112.Second port 1112
In conformable region 112, and the first port 1111 is positioned at the base plate 11 side in contrast to conformable region 112.
Blowning installation 12 has a puff prot 121, corresponding to the first port 1111.Specifically, blowning installation 12 can wrap
A feeder containing the steel cylinder being such as filled with gas.By puff prot 121 being connected to the first port 1111, air blowing can be made
Gas in device 12 sequentially by puff prot the 121, first port 1111 and the second port 1112 flow into the first cover body 13 with
Between base plate 11.
First cover body 13 is configured at the conformable region 112 of base plate 11 in a detachable fashion, and the first cover body 13 is around
Two-port netwerk 1112.It is to say, the first cover body 13 orthographic projection covers the second port of through hole 111 in the region of base plate 11
1112。
Then referring to Figure 1B, Figure 1B is according to the device making flexible substrate disclosed by another embodiment of the present invention
Side view.Owing to the embodiment of Figure 1B and the embodiment of Figure 1A are similar, the most identical label represents the enforcement with Figure 1A
The same or similar element of example, therefore explains just for difference.
In the embodiment of Figure 1B, make flexible substrate device 10a also comprise the first cover body 13, air extractor 14,
Second cover body 15 and movable mechanism 16, the first cover body 13 has the first perforate 131, and air extractor 14 has bleeding point 141.
Specifically, air extractor 14 such as can comprise an aspiration pump, opens by bleeding point 141 is connected to the first of the first cover body 13
Hole 131, outside the gas between the first cover body 13 and base plate 11 can being drawn out of the first cover body 13 via the first perforate 131,
The side making base plate 11 have the second port 1112 produces negative pressure.
Second cover body 15 is configured at the base plate 11 side in contrast to the first cover body 13, and the second cover in a detachable fashion
Body 15 is around the first port 1111.It is to say, the second cover body 15 orthographic projection covers through hole 111 in the region of base plate 11
First port 1111.Wherein, the second cover body 15 has the second perforate 151.Connect the puff prot 121 of blowning installation 12, can make to blow
Gas in device of air 12 flows between the second cover body 15 and base plate 11, and the side making base plate 11 have the first port 1111 is just producing
Pressure, and then make the opposite sides of base plate 11 produce pressure differential.
Movable mechanism 16 is arranged at the side of base plate 11.Specifically, to be arranged at base plate 11 close for movable mechanism 16
The side of the second port 1112, and movable mechanism 16 has a fixture 161.Movable mechanism 16 can make fixture 161 end of towards
Plate 11 moves or makes fixture 161 away from base plate 11.Wherein, movable mechanism 16 such as can comprise a mechanical arm.
It is noted that air extractor the 14, second cover body 15 and movable mechanism 16 are not used to limit the present invention.Please join
Read Fig. 1 C to Fig. 1 E, Fig. 1 C to Fig. 1 E to be respectively according to the device making flexible substrate disclosed by other embodiments of the invention
Side view.In the embodiment of Fig. 1 C, the device 10b making flexible substrate can not comprise air extractor 14, and only leads to
Crossing blowning installation 12 makes the both sides of base plate 11 produce pressure differential (as shown in Figure 1 C).In the embodiment of Fig. 1 D, make bendable
The device 10c of substrate can not comprise the second cover body 15, and makes the puff prot 121 of blowning installation 12 be directly connected in the first port
1111 (as shown in figure ip).In the embodiment of Fig. 1 E, the device 10d making flexible substrate can not comprise movable mechanism
16 (as referring to figure 1e).
Then the device 10a making flexible substrate how using Figure 1B will be introduced to make flexible substrate.Please be same
Time refering to Figure 1B, Fig. 2 and Fig. 3 A to Fig. 3 I.Fig. 2 is according to the making flexible substrate disclosed by one embodiment of the invention
The flow chart of method, Fig. 3 A to Fig. 3 F is the structural side view of step S101 to S106 in difference corresponding diagram 2, and Fig. 3 G is Fig. 3 F's
Top view, Fig. 3 H is the structural side view of step S107 in corresponding diagram 2, Fig. 3 I be the flow process according to Fig. 2 complete flexible
Formula substrate and the structural side view of base plate thereof.
First, it is provided that a base plate 11, a polymeric layer 20 (S101) (as shown in Figure 3A) and is formed on base plate 11.The end
Plate 11 is such as but not limited to a glass baseplate, and polymeric layer 20 is in order to make a flexible substrate.Wherein, polymeric layer 20
Material for example, Merlon (polycarbonate, PC), polyimides (polyimide, PI), polyether sulfone (polyether
Sulfone, PES), polyacrylate (poly acrylate, PAR), PEN (polyethylene
Naphthalate, PEN), polyethylene terephthalate (polyethylene terephthalate, PET), noncrystalline
Type TPO (amorphous polyolefine, APO), cyclic olefine copolymer
(MetallocenebasedCyclicOlefinCopolymer, mCOC), polymethyl methacrylate
(Polymethacrylate, PMMA) or organic/inorganic composite material.In the present embodiment, the thickness of base plate 11 between 10～
800 microns (micrometer, μm).In other embodiments of part, the thickness of base plate 11 is between 50～500 microns.In part
In other embodiments, the thickness of base plate 11 is between 100～250 microns.Wherein, the flexibility of polymeric layer 20 scratching more than base plate 11
Property.
In the present embodiment and other embodiments of part, it is such as to utilize rotary coating (spin coating), slit
Coating or scraper plate are smeared the mode of (blade coating) and are formed the polymer of one layer of liquid at base plate 11, then pass through natural wind
Dry or heated baking mode makes polymer be solidified to form in the surface of base plate 11.In other embodiments of part, can be straight
Connect and a polymer is attached at base plate 11.Specifically, in the way of laminating or coating, a release layer can be formed (not at base plate 11
Illustrate) after, then a polymer is attached at base plate 11 forms polymeric layer 20, and made polymeric layer 20 attach by release layer
In base plate 11, make polymeric layer 20 have good release effect, and good release effect refers to when release layer and another base
After material contact, it is difficult to stick with another base material and there is good separating effect.Wherein, the material of a release layer for example, silicon is high
Molecule (for example, siloxane polymer), an organic polymer (for example, polyethylene, polyvinyl chloride, polymethyl methacrylate,
Polyethylene terephthalate), a metal (for example, gold, silver, copper, chromium, alloy) or above-mentioned composite, and release
Layer can be liquid or solid-state.In order to avoid the viscosity between base plate 11 and polymeric layer 20 is too strong, and cause follow-up
Process separates the difficulty of base plate 11 and polymeric layer 20, after forming release layer, it be also possible to use ultraviolet light or laser comes
Irradiate release layer, so as to reducing the viscosity of release layer.Furthermore, it is understood that the viscosity between release layer and base plate 11 is more than release layer
And the viscosity between polymeric layer 20.Consequently, it is possible to polymeric layer 20 can be made to be attached at base plate 11 and be not result in base plate 11
It is difficult to separate with polymeric layer 20.Additionally, the size of polymeric layer 20 can affect polymeric layer 20 separates institute with base plate 11
The time needed.It is said that in general, the area of polymeric layer 20 is the biggest, need the time more grown to separate with base plate 11.
Then, forming the pass through aperture 111 (S102) running through base plate 11 on base plate 11, wherein, through hole 111 does not pass through
Wear polymeric layer 20 (as shown in Figure 3 B).Through hole 111 has the first port 1111 and relatively relative to base plate 11 side
The second port 1112 in polymeric layer 20 side.In the present embodiment and other embodiments of part, it is to pass through abnormity cutting
The mode of (Abnormity Cutting) gets out through hole 111 on base plate 11, but forms the mode of through hole 111 not
In order to limit the present invention.Wherein, the quantity of above-mentioned through hole 111 and position, all can make more according to actual demand in time implementing
Change.Such as, pass through aperture can be offered respectively at the dual-side of base plate 11, or offer respectively always in four corners of base plate 11
Perforation.It is said that in general, the quantity of through hole 111 is the most, it is the shortest that polymeric layer 20 separates the required time with base plate 11.
Then, in the present embodiment and other embodiments of part, a line layer 30 can also be formed on polymeric layer 20
(S103) (as shown in Figure 3 C).Wherein, line layer 30 includes a transparent electrode arrays, using the circuit as flexible substrate, and
Through hole 111 is positioned at outside transparent electrode arrays.Form the technique of line layer 30 such as but not limited to a thin film transistor (TFT) technique
(Thin Film Transistors, TFT).It is not limited to it is noted that form line layer 30 on polymeric layer 20
The present invention.
Then, one first cover body 13 is configured at (S104) on polymeric layer 20.Wherein, the first cover body 13 has and runs through
One first perforate 131 (as shown in Figure 3 D) of one cover body 13.Whereby, polymeric layer 20 is made to be clipped in the first cover body 13 and base plate 11
Between, and the second port 1112 be positioned at first cover body 13 institute around in the range of.It is to say, the first cover body 13 orthographic projection exists
The region of base plate 11 covers the second port 1112 of through hole 111.By the first cover body 13 is configured on polymeric layer 20,
And making to define between polymeric layer 20 and the first cover body 13 one first space S 1, the first space S 1 is connected with through hole 111
Logical.
In the present embodiment and other embodiments of part, also one second cover body 15 can be configured at (S105) on base plate 11.
Wherein, the second cover body 15 has one second perforate 151 (as shown in FIGURE 3 E) running through the second cover body 15.Whereby, base plate 11 is made to be situated between
Between polymeric layer 20 and the second cover body 15, and the first port 1111 be positioned at second cover body 15 institute around in the range of.
It is to say, the second cover body 15 orthographic projection covers the first port 1111 of through hole 111 in the region of base plate 11.And base plate 11
And define a second space S2, second space S2 between the second cover body 15 to be connected with through hole 111 and the second perforate 151
Logical.
It is noted that in the present embodiment and other embodiments of part, be first the first cover body 13 to be configured at polymer
Layer 20, then the second cover body 15 is configured at base plate 11.In other embodiments of part, it is also possible to first the second cover body 15 is configured at
Base plate 11, then the first cover body 13 is configured at polymeric layer 20.First cover body 13 is configured at polymeric layer 20 and by second
Cover body 15 is configured at the sequencing of base plate 11 and is not limited to the present invention.If additionally, the making of use Figure 1A, Fig. 1 D can
Scratch the device of formula substrate to make flexible substrate, then can install the second cover body 15 to make flexible substrate.
Finally, a gas (S106) (as illustrated in Figure 3 F) is inputted from through hole 111.Wherein, gas and base plate 11, polymer
Being difficult to react between layer 20, gas for example, air, nitrogen or argon gas, the kind of gas is not limited to this
Bright.Specifically, by such as one blowning installation 12, second perforate 151 is blown into gas, makes gas flow along a path A.
See also Fig. 3 G, polymeric layer 20 can be pushed down due to the first cover body 13 and make gas flow along such as X-direction, and will not
In making gas concentrate at the second port 1112, cause gas pressure excessive and cause polymeric layer 20 broken hole.On the other hand, by
It is configured at base plate 11 in the second cover body 15, and the second cover body 15 is around the first port 1111 of through hole 111, thus the second cover
Body 15 can avoid gas, and before entering through hole 111, i.e. via the gap between the second cover body 15 and base plate 11, loss goes out second
Outside cover body 15.
By blowning installation 12, second perforate 151 being blown into gas, after making gas flow along path A, gas can edge
Path A and enter second space S2 via the second perforate 151, and flow into through hole 111 via the first port 1111, then via
Second port 1112 and flow between polymeric layer 20 and base plate 11.Owing to blowning installation 12 is blown into gas to the second perforate 151
Body and make second space S2 produce malleation, make the opposite sides of polymeric layer 20 produce pressure differential, so make polymeric layer 20 with
Base plate 11 is separated.Specifically, the pressure differential that gas makes polymeric layer 20 both sides produce is the biggest, polymeric layer 20 and base plate 11
Time needed for separation is the shortest.
In order to improve the separative efficiency of polymeric layer 20 with base plate 11, in the present embodiment and other embodiments of part,
The first space S 1 also can be made to form the space of a tool negative pressure.Specifically, can be by such as one air extractor 14 from the first perforate
131 extract a gas out, make gas be pulled out along a path B from the first space S 1.Owing to the first cover body 13 is configured at polymerization
In nitride layer 20, and the first cover body 13 is around the second port 1112 of through hole 111.Therefore, gas is mainly along path B warp
It is pulled out from the first space S 1 by the first perforate 131, and makes polymeric layer 20 away from the side of base plate 11 (that is relative to poly-
Compound layer 20 is near the side of base plate 11) produce negative pressure.The effect of a separation of polymeric nitride layer 20 and base plate 11 can be further added by whereby
Power, and then improve the separative efficiency of polymeric layer 20 with base plate 11.
Additionally, due to the first cover body 13 can push down polymeric layer 20, thus enter polymeric layer at gas from through hole 111
Time between 20 and base plate 11, gas is evenly into polymeric layer 20 and base plate 11, rather than only concentrates via specific side
Flow out between auto polymerization nitride layer 20 and base plate 11 to (such as direction X).If gas is only concentrated via specific direction
Gap between auto polymerization nitride layer 20 and base plate 11 is flowed out, and this can make to only have between polymeric layer 20 and base plate 11 part point
From, that is the polymeric layer 20 of part remains adhered on base plate 11, thus separating effect is the best.In the present embodiment, due to gas
Body, evenly into the gap between polymeric layer 20 and base plate 11, therefore leaves polymeric layer 20 and base plate 11 when gas
Between gap time, polymeric layer 20 can be kept completely separate by gas equably with base plate 11.On the other hand, due to the first cover body 13
Around the second port 1112 of through hole 111, therefore flow between polymeric layer 20 and base plate 11 when gas, cause polymeric layer
20 towards the first cover body 13 heave time, the first cover body 13 also can limit the height that polymeric layer 20 is heaved, to guarantee polymeric layer 20
Quality after separating with base plate 11.Furthermore, the distance between the first cover body 13 and polymeric layer 20 can be shortened by
D1 (as illustrated in Figure 3 F) and reduce the height that polymeric layer 20 is heaved.
In the present embodiment and other embodiments of part, it is also possible to by movable mechanism 16 by polymeric layer 20 and the end
Plate 11 separates.Specifically, first remove first cover body the 13, second cover body 15, then make fixture 161 move by movable mechanism 16
Move above base plate 11, make fixture 161 clamp the edge (S107) of the polymeric layer 20 having disengaged from base plate 11 surface (such as Fig. 3 H institute
Show).Wherein, fixture 161 can be controlled by movable mechanism 16 move towards base plate 11 or make fixture 161 away from base plate 11
Speed, and then control fixture 161 make polymeric layer separate applied strength with base plate 11, to avoid polymeric layer 20 and the end
Polymeric layer 20 is destroyed because the strength applied is excessive when plate 11 separates.The automatic of fixture 161 is made by movable mechanism 16
Equalization clamps the edge of the polymeric layer 20 having disengaged from base plate 11 surface, can improve polymeric layer 20 and base plate 11 again
Separative efficiency, and then promote the efficiency manufacturing flexible substrate.
In the present embodiment, polymeric layer 20 is separated the required time less than 10 seconds with base plate 11, at section Example
In, the time needed for separation is less than 5 seconds.Further, the pressure differential between the first cover body 13 and the second cover body 15 is 0.01 torr
(torr) is between 1000 torr, and is passed through the speed of gas between 0.01 ml/min (mL/min) to 100 milli from blowning installation
Between liter/min, and needed for the gas that is passed through less than 10 milliliters.For the substrate of 65, it is only necessary to use less than 10 milliliters
Gas can make polymeric layer 20 separate with base plate 11 in 10 seconds.
Then, after polymeric layer 20 separates with base plate 11, then make fixture 161 away from base plate by movable mechanism 16
11, can complete flexible substrate prepares (as shown in fig. 31).
Next referring to Figure 1B, Fig. 4 and Fig. 5 A to Fig. 5 I, Fig. 4 is according to the system disclosed by another embodiment of the present invention
Making the flow chart of the method for flexible substrate, Fig. 5 A to Fig. 5 D is that the structure side of step S201 to S204 regards in corresponding diagram 4 respectively
Figure, Fig. 5 E is the top view of Fig. 5 D, and Fig. 5 F to Fig. 5 H is the structural side view of step S205 to S207, figure in difference corresponding diagram 4
5I is the flexible substrate that completes of the flow process according to Fig. 4 and the structural side view of base plate thereof.Due to Fig. 4 and Fig. 5 A to Fig. 5 I
Embodiment similar to the embodiment of Fig. 2, Fig. 3 A to Fig. 3 H, the most identical label represents and the reality of Fig. 2, Fig. 3 A to Fig. 3 H
Execute the same or similar element of example, therefore explain just for different places.
First, it is provided that a base plate 11, a polymeric layer 20 (S201) (as shown in Figure 5A) and is formed on base plate 11.Its
In, the flexibility of polymeric layer 20 is more than the flexibility of base plate 11.
Then, on base plate 11, formation runs through the pass through aperture 111a (S202) of base plate 11.Wherein, through hole 111a runs through
Base plate 11 and polymeric layer 20.Through hole 111a have relative to base plate 11 side one first port 1111a and relative to
One second port 1112a (as shown in Figure 5 B) of polymeric layer 20 side.It is noted that through hole 111a should avoid polymer
Layer 20 makes the viewing area after flexible substrate, after avoiding polymeric layer 20 is made flexible substrate, flexible substrate
Zhong You subregion, viewing area cannot perform the function of display.
Then, a laminating layer 40 is configured at (S203) on polymeric layer 20.Specifically, laminating layer 40 is fitted and is covered
Live in the through hole 111a the second port 1112a (as shown in Figure 5 C) relative to polymeric layer 20 side.The present embodiment and part its
In his embodiment, laminating layer 40 is an adhesive tape or a baffle plate, but is not limited to this.
Then, in the present embodiment and other embodiments of part, a line layer 30 can also be formed on polymeric layer 20
(S204) (as shown in Figure 5 D).Wherein, line layer 30 includes a transparent electrode arrays, using the circuit as flexible substrate, and
Outside through hole 111a is positioned at transparent electrode arrays (as shown in fig. 5e).The technique forming line layer 30 is thin such as but not limited to one
Film transistor technique.It is noted that form line layer 30 on polymeric layer 20 to be not limited to the present invention.
Then, one first cover body 13 is configured at polymeric layer 20 (S205).Wherein, the first cover body 13 has and runs through first
One first perforate 131 (as illustrated in figure 5f) of cover body 13.Whereby, polymeric layer 20 is clipped in the first cover body 13 and base plate 11 it
Between, and the second port 1112a of the through hole 111a covered by laminating layer 40 be positioned at first cover body 13 institute around in the range of.
It is to say, the first cover body 13 orthographic projection covers the second port 1112a of through hole 111a in the region of base plate 11.By inciting somebody to action
First cover body 13 is configured on polymeric layer 20, and makes to define one first space between polymeric layer 20 and the first cover body 13
S1 ', the first space S 1 ' is connected with the first perforate 131.
In the present embodiment and other embodiments of part, also one second cover body 15 can be configured at base plate 11 (S206).Its
In, the second cover body 15 has one second perforate 151 (as depicted in fig. 5g) running through the second cover body 15.Whereby, make base plate 11 between
Between polymeric layer 20 and the second cover body 15, and the first port 1111a of through hole 111a is positioned at the second cover body 15 and is enclosed
In the range of around.It is to say, the second cover body 15 orthographic projection covers first port of through hole 111a in the region of base plate 11
1111a.And define a second space S2 ' between base plate 11 and the second cover body 15, second space S2 ' and through hole 111a and
Second perforate 151 is connected.
It is noted that in the present embodiment and other embodiments of part, be first laminating layer 40 to be configured at polymeric layer
20, then the first cover body 13 is configured at polymeric layer 20, then the second cover body 15 is configured at base plate 11.But, by laminating layer 40
It is configured at polymeric layer 20, the second cover body 15 is configured at the sequencing of base plate 11 and the first cover body 13 is configured at polymerization
Nitride layer 20, the sequencing that the second cover body 15 is configured at base plate 11 are not limited to the present invention.It is to say, part its
In his embodiment, first the second cover body 15 can be configured at base plate 11, then laminating layer 40 is configured at polymeric layer 20, then by
One cover body 13 is configured at polymeric layer 20.
Finally, a gas (S207) (as illustrated in fig. 5h) is inputted from the first port 1111a of through hole 111a.Come in detail
Say, by such as one blowning installation 12, second perforate 151 can be blown into a gas, make gas flow along a path C.Due to
Two cover bodies 151 are configured at base plate 11, and the second cover body 15 is around the first port 1111a of through hole 111a.Whereby, the second cover
Body 15 can avoid gas i.e. different via the gap between the second cover body 15 and base plate 11 to shed the entering before through hole 111a
Outside two cover bodies 15.
Then, gas can enter second space S2 ' along path C via the second perforate 151, and via the first port
1111a flows into through hole 111a, then flows between polymeric layer 20 and base plate 11 via the second port 1112a.Due to patch
Closing layer 40 and cover the second port 1112a, therefore gas will not leave through hole 111a via the second port 1112a, thus
There is good airtight effect.Additionally, due to adhesion between laminating layer 40 and polymeric layer 20 more than polymeric layer 20 with
Adhesion between base plate 11.Therefore, when gas applies pressure to base plate 11, this pressure can make base plate 11 and polymeric layer 20
It is separated and polymeric layer 20 and the state of laminating layer 40 holding laminating.It is noted that laminating layer 40 also must have enough
Structural strength, leaves through hole 111a to avoid gas to break through laminating layer 40.
In order to improve the separative efficiency of polymeric layer 20 with base plate 11, in the present embodiment and other embodiments of part,
Again the first space S 1 ' can be applied a negative pressure.Specifically, can be extracted out from the first perforate 131 by such as one air extractor 14
One gas, makes gas be pulled out along a path D from the first space S 1 '.Owing to the first cover body 13 is configured at polymeric layer 20
On, and the second port 1112a of through hole 111a be positioned at first cover body 13 institute around in the range of.Therefore, gas is mainly
It is pulled out from the first space S 1 ' via the first perforate 131 along path D, and makes polymeric layer 20 away from the side of base plate 11
Compared to polymeric layer 20 near the side of base plate 11 generation negative pressure.A separation of polymeric nitride layer 20 and base plate 11 can be further added by whereby
Active force, and then improve the separative efficiency of polymeric layer 20 with base plate 11.
In the present embodiment, owing to the first cover body 13 is around the second port 1112a of through hole 111a, therefore when gas stream
Enter between polymeric layer 20 and base plate 11, cause polymeric layer 20 towards the first cover body 13 heave time, the first cover body 13 can limit poly-
The height that compound layer 20 is heaved, with guarantee polymeric layer 20 separate with base plate 11 after quality.Furthermore, can be shortened by
Distance D2 (as illustrated in fig. 5h) between first cover body 13 and polymeric layer 20 and reduce the height that polymeric layer 20 is heaved.
Finally, the first cover body 13 and the second cover body 15 are removed, and the laminating layer 40 on removing polymer layer 20,
Base plate 11 is separated with polymeric layer 20 and complete flexible substrate prepare (as shown in fig. 5i).
Referring to Fig. 6 A, Fig. 6 B, Fig. 6 A is according to the device making flexible substrate disclosed by one embodiment of the invention
Side view, Fig. 6 B is according to the side view of device making flexible substrate disclosed by another embodiment of the present invention.Make
The device 50 of flexible substrate, including base plate 51, blowning installation 52,1 first cover body 53, air extractor 54,1 second
Cover body 55 and at least one microscope carrier 56.
Base plate 51 has the pass through aperture 513 running through base plate 51.Through hole 513 have one first relative port 5131 with
And one second port 5132, lay respectively at the opposite sides of through hole 513.Base plate 51 has a conformable region 514.Second port
5132 are positioned at conformable region 514, and the first port 5131 is positioned at the base plate 51 side relative to conformable region 514.
Blowning installation 52 has a puff prot 521, corresponding to the first port 5131.Specifically, blowning installation 52 can wrap
A feeder containing the steel cylinder being such as filled with gas.By puff prot 521 being connected to the first port 5131, supply can be made
Gas in device sequentially flowed into for first cover body 53 and the end by puff prot the 521, first port 5131 and the second port 5132
Between plate 51, base plate 51 is made just to produce in the side of the second port 5132 relative to base plate 51 in the side of the first port 5131
Pressure, and make the opposite sides of base plate 51 produce pressure differential.
First cover body 53 is configured at conformable region 514 in a detachable fashion, and the first cover body 53 is around the second port
5132.It is to say, the first cover body 53 orthographic projection covers the second port 5132 of through hole 513 in the region of base plate 51.
Air extractor 54 has a bleeding point 541, corresponding to the second port 5132.Specifically, air extractor 54 is such as
An aspiration pump can be comprised.By bleeding point 541 being connected to the second port 5132, can be by between the first cover body 53 and base plate 51
Outside gas is drawn out of the first cover body 53 via bleeding point 541, the side making base plate 51 have the second port 5132 produces negative pressure,
And then make the opposite sides of base plate 51 produce pressure differential.
Second cover body 55 is configured at the base plate 51 side relative to the first cover body 53, and the second cover in a detachable fashion
Body 55 is around the first port 5131.It is to say, the second cover body 55 orthographic projection covers through hole 513 in the region of base plate 51
First port 5131.Wherein, the second cover body 55 has one second perforate 551 running through the second cover body 55.
Microscope carrier 56 is arranged at base plate 51 times, and microscope carrier 56 has one first thimble 561 and one second thimble 562, point
Dui Yingyu through hole 513.Specifically, can be that there is on same microscope carrier the first thimble 561 and the second thimble 562, or
It is that two microscope carriers are respectively provided with the first thimble 561 and the second thimble 562.First thimble 561 and the second thimble 562 are respectively from base plate
The cone of 51 projections.First thimble 561 or the second thimble 562 can be stretched into through hole from the first port 5131 by user respectively
513 to use.At the present embodiment with other embodiments of part, the height of the first thimble 561 is less than the second thimble 562
Highly (as shown in Figure 6A).Part other embodiments in, the first thimble 561 ' and the second thimble 562 ' also can have identical or
Close height, and the cone rate of the first thimble 561 ' is less than the cone rate (as shown in Figure 6B) of the second thimble 562 '.It is to say, the
One thimble 561 ' from close to microscope carrier side to away from microscope carrier side change than the second thimble 562 ' oneself close to microscope carrier side to far
Change from microscope carrier side is big.
Next referring to Fig. 6 A, Fig. 7 and Fig. 8 A to Fig. 8 L, Fig. 7 is according to the system disclosed by another embodiment of the present invention
Making the flow chart of the method for flexible substrate, Fig. 8 A to Fig. 8 K is that the structure side of step S301 to S311 regards in corresponding diagram 7 respectively
Figure, Fig. 8 L is the flexible substrate that completes of the flow process according to Fig. 7 and the structural side view of base plate thereof.Due to Fig. 7 and Fig. 8 A
Similar to the embodiment of Fig. 2, Fig. 3 A to Fig. 3 I to the embodiment of Fig. 8 L, the most identical label represents with Fig. 2, Fig. 3 A to figure
The same or similar element of embodiment of 3I, therefore explains just for difference.
First, it is provided that a plate body 511 (S301), plate body 511 has the first opening 5111 of consistent threading body 511 (such as figure
Shown in 8A).
In the present embodiment and other embodiments of part, a laminating layer 80 (S302) can be set on plate body 511.Come in detail
Saying, laminating layer 80 covers the plate body 511 side (as shown in Figure 8 B) relative to the first opening 5111, and laminating layer 80 is such as but not
It is limited to an adhesive tape or a baffle plate.
Then, plate body 511 is formed a release layer 512 (S303) (as shown in Figure 8 C).
Then, removing laminating layer 80 (S304), release layer 512 has one second opening 5121, and the second opening 5121 exposes
First opening 5111 and being connected (as in fig. 8d) with the first opening 5111.Wherein, plate body 511 and release layer 512 i.e. group
The base plate 51 of one-tenth Fig. 6 A, and the first opening 5111 and the second opening 5121 i.e. through hole 513 of composition diagram 6A.First opening 5111
Away from the side of release layer 512, and the first opening 5111 is first port 5131 of Fig. 6 A.Second opening 5121 is away from plate body
The side of 511, and the second opening 5121 is second port 5132 of Fig. 6 A.
In the present embodiment and other embodiments of part, it is to form release layer at plate body 511 in the way of being such as deposited with
512, and after release layer 512 contacts with another base material, be difficult to stick with another base material and there is good separating effect.In this reality
Executing in example, release layer 512 removes bond layer (Debonding Layer, DBL) as such as one.The material of release layer 512 is for example,
One polymeric silicon (for example, siloxane polymer), an organic polymer (for example, polyethylene, polyvinyl chloride, polymethyl
Acid methyl esters, polyethylene terephthalate), a metal (for example, gold, silver, copper, chromium, alloy) or above-mentioned composite.
Then, base plate 51 is positioned on microscope carrier 56, and makes the first thimble 561 stretch into through hole 513 (S305) (such as figure
Shown in 8E).
Then, release layer 512 forms a polymeric layer 60 (S306) (as shown in Figure 8 F), the material of polymeric layer 60
Such as but not limited to polyimides.Owing to the first thimble 561 is matched with through hole 513, thus the first thimble 561 can be sticked in the end
Plate 51 and can avoid polymeric layer 60 outside through hole 513 flows out base plate 51.On the other hand, due to the polymer not yet solidified
Layer 60 is liquid, thus the polymeric layer 60 of part can flow into through hole 513 and be attached to the sidewall of through hole 513.Such one
Coming, in follow-up technique, the polymeric layer 60 flowing into through hole 513 can be as the protective layer of release layer 512, so as to avoiding the end
Plate 51 in follow-up technique because contact chemical agent and suffering corrodes the most destroyed.Whereby, flexible substrate is completed
Preparation after, base plate 51 is the most reusable.
Then, in the present embodiment and other embodiments of part, a line layer 70 can also be formed on polymeric layer 60
(S307) (as shown in fig. 8g).Wherein, line layer 70 includes a transparent electrode arrays, using the circuit as flexible substrate, and
Through hole 513 is positioned at outside transparent electrode arrays.Form the technique of line layer 70 such as but not limited to a thin film transistor (TFT) technique
(Thin Film Transistors, TFT).It is not limited to it is noted that form line layer 70 on polymeric layer 60
The present invention.
Then, after liquid polymerization nitride layer 60 solidifies, stretch out the first thimble 561, make the second thimble 562 of microscope carrier 56 stretch into
Through hole 513 (S308), owing to the height of the second thimble 562 is more than the height of the first thimble 561, therefore, the second thimble 562 meeting
Protrude the second port of through hole 513, and back down the polymeric layer 60 on the second port being positioned at through hole 513, and make portion
Segregation compound layer 60 is swelled towards the direction away from base plate 51.Whereby, polymeric layer 60 and base plate 51 is made to be partially separated (such as Fig. 8 H institute
Show).Consequently, it is possible to the speed separated with base plate 51 by polymeric layer 60 can be further added by.If additionally, the making of use Fig. 6 B can
Scratch the device of formula substrate, owing to the cone rate of the second thimble 562 ' is more than the cone rate of the first thimble 561 ', thus the second thimble 562 '
Can stretch into, compared to the first thimble 561 ', the distance that through hole 513 is deeper, therefore the second thimble 562 ' also can run through in jack-up inflow
The partially polymerized nitride layer 60 in hole 513, and partially polymerized nitride layer 60 is swelled towards the direction away from base plate 51.
Then, take off base plate 51 from microscope carrier 56, and one first cover body 53 is configured at (S309) on polymeric layer 60.Its
In, the first cover body 53 has one first perforate 531 (as shown in fig. 81) running through the first cover body 53.Whereby, polymeric layer 60 is made
Be clipped between the first cover body 53 and base plate 51, and the second port 5132 be positioned at first cover body 53 institute around in the range of.Also
That is, the first cover body 53 orthographic projection covers the second port 5132 orthographic projection of through hole 513 end of in the region of base plate 51
The region of plate 51.And define one first space S 1 between polymeric layer 60 and the first cover body 53 ", the first space S 1 " with run through
Hole 513 is connected.
In the present embodiment and other embodiments of part, also one second cover body 55 can be configured at (S310) on base plate 51.
Wherein, the second cover body 55 has one second perforate 551 (as illustrated by figure 8j) running through the second cover body 55.Whereby, base plate 51 between
Between polymeric layer 60 and the second cover body 55, and the first port 5131 be positioned at second cover body 55 institute around in the range of.Also
That is, the second cover body 55 orthographic projection covers the first port 5131 orthographic projection of through hole 513 end of in the region of base plate 51
The region of plate 51.And define a second space S2 between base plate 51 and the second cover body 55 ", second space S2 " and through hole 513
And second perforate 551 be connected.It is noted that the first cover body 53 is configured at polymeric layer 60 and by the second cover body 55
The sequencing being configured at base plate 51 is not limited to the present invention.
Finally, a gas (S311) (as shown in figure 8k) is inputted from through hole 513.Wherein, gas for example, air, nitrogen
Or argon gas, the kind of gas is not limited to the present invention.Specifically, right by such as one blowning installation (not illustrating)
Second perforate 551 is blown into gas, makes gas flow along a path E.Owing to the second cover body 55 is configured at base plate 51, and second
Cover body 55 is around the first port 5131 of through hole 513, and therefore gas is along entering second via the second perforate 551 by path E
Space S 2 ", and the second cover body 55 also can avoid gas loss before polymeric layer 60 separates with base plate 51.And gas can be via
First port 5131 is from second space S2 " flow into through hole 513, then flow into poly-via first port the 5131, second port 5132
Between compound layer 60 and base plate 51.The malleation applied base plate 51 by gas, makes the opposite sides of polymeric layer 60 produce
Raw pressure differential, and polymeric layer 60 is separated with base plate 51.
In order to improve the separative efficiency of polymeric layer 60 with base plate 51, in the present embodiment and other embodiments of part,
Also can be again to the first space S 1 " apply a negative pressure.Specifically, by such as one air extractor 54, first perforate 531 can be taken out
Go out a gas, make gas along a path F from the first space S 1 " be pulled out.Owing to the first cover body 53 is configured at polymeric layer
On 60, and the second port 5132 of through hole 513 be positioned at first cover body 53 institute around in the range of.Therefore, gas is mainly
Along path F via the first perforate 531 from the first space S 1 " it is pulled out, and make polymeric layer 60 away from the side of base plate 51
Produce negative pressure.Can be further added by the active force of a separation of polymeric nitride layer 60 and base plate 51 whereby, so improve by polymeric layer 60 with
The separative efficiency of base plate 51.
In the present embodiment, owing to the first cover body 53 is around the second port 5132 of through hole 513, therefore flow into when gas
Between polymeric layer 60 and base plate 51, cause polymeric layer 60 towards the first cover body 53 heave time, the first cover body 53 also can limit poly-
The height that compound layer 60 is heaved, with guarantee polymeric layer 60 separate with base plate 51 after quality.Furthermore, can be shortened by
Distance D3 (as illustrated by figure 8j) between first cover body 53 and polymeric layer 60 and reduce the height that polymeric layer 60 is heaved.
Then, the first cover body 53 and the second cover body 55 are removed, and to polymeric layer 60 in the face of the side of base plate 51
Carry out the process of such as trimming, make polymeric layer 60 the most smooth, consequently, it is possible to i.e. complete bendable in the face of the side of base plate 51
Substrate prepare (as shown in Fig. 8 L).
It is noted that form release layer 512 after arranging laminating layer on plate body on plate body to be not limited to this
Invention.Referring to Fig. 6, Fig. 9 A to Fig. 9 C, Fig. 9 A is according to the making flexible substrate disclosed by another embodiment of the present invention
The flow chart of method, Fig. 9 B is the structural side view of step S402 in corresponding diagram 9A, and Fig. 9 C is that the flow process according to Fig. 9 A has made
The flexible substrate become and the structural side view of base plate thereof.Owing to the present embodiment is similar to Fig. 7, Fig. 8 A to Fig. 8 L, the most only pin
Different place is illustrated.
In the present embodiment, after a plate body 511 (S401) is provided, can directly plate body 511 be positioned on base station 56,
Make the first thimble 561 stretch into through hole 513, and on plate body 511, form release layer 512 (S402), in the present embodiment, can
It is not necessary on through hole 513, arrange laminating layer (as shown in Figure 9 B).But, in the present embodiment, due to release layer 512 be polymerized
Bond between nitride layer is more weak, causes poly-in order to avoid loosening between release layer 512 and polymeric layer in follow-up technique
The flaw of compound layer, so that corresponding to the region irradiation of through hole 513 or irradiate laser (S403) at release layer 512,
So as to improving corresponding to the bond ability between release layer 512 and the polymeric layer 60 in the region of through hole 513.Additionally, step
(S404) is similar to step (S310) to the step of Fig. 7 (S305) to step (S409), therefore repeats no more.Flow process according to Fig. 9 A
The flexible substrate completed and the structural side view of base plate thereof are as shown in Figure 9 C.
Summary, depends on the method making flexible substrate and device thereof provided according to embodiments of the present invention, due to
It is to flow through between polymeric layer and base plate, so that polymeric layer is separated with base plate by being passed through gas.Therefore polymer can be avoided
When layer separates with base plate, on polymeric layer, fracture or the polymer layer surface of circuit damage.Further, by adjusting polymeric layer
Size, the number of through hole and the pressure of gas, the disengaging time needed for polymeric layer and base plate can be regulated and controled.Therefore
Relatively simply polymeric layer is separated from base plate, and solve flexible substrate in prior art and be difficult to from asking that base plate is peeled off
Topic.
Additionally, in the embodiment of part, polymeric layer can be made to separate with bottom parts by the thimble of microscope carrier again.As
This one, the speed separated with base plate by polymeric layer can be promoted again.
Additionally, in the embodiment of part, owing to also arranging a release layer on base plate, and the release layer part of part
Flow into through hole and be adhered to the sidewall of through hole.Consequently, it is possible to flow into through hole release layer can as the protective layer of base plate,
Corrode the most destroyed so as to avoiding base plate to suffer because of contact chemical agent.Whereby, the preparation of flexible substrate is completed
After, base plate is the most reusable.
Additionally, in the embodiment of part, be adhered to the side of through hole owing to the polymeric layer of part flows into through hole
Wall.Consequently, it is possible to the polymeric layer flowing into through hole can be as the protective layer of base plate, so as to avoiding base plate because contacting chemical drugs
Agent and suffering is corroded the most destroyed.Whereby, after the preparation completing flexible substrate, base plate is the most reusable.
Although the present invention is disclosed above with aforesaid preferred embodiment, so it is not limited to the present invention, any ability
Field technique personnel, without departing from the spirit and scope of the present invention, when making a little change and retouching, therefore the present invention's is special
Profit protection domain is as the criterion with claims.
Claims (7)
1. the method making flexible substrate, it is characterised in that its step includes:
Thering is provided a base plate with a polymeric layer, wherein this base plate has pass through aperture, and this polymeric layer is positioned on this base plate
And cover this through hole；
One first cover body is provided to be covered on this polymeric layer；And
Thering is provided a gas, this gas flows between this polymeric layer and this base plate from this through hole, and then makes this polymeric layer
Separate with this base plate；
The step providing this gas includes:
One second cover body is configured on this base plate, so that this base plate is between this polymeric layer and this second cover body, and
This through hole is made to be positioned in the range of this second cover body covered；And
This gas is sent between this second cover body and this base plate.
2. the method making flexible substrate as claimed in claim 1, it is characterised in that further include:
Before providing this first cover body to be covered on this polymeric layer, form a line layer on this polymeric layer.
3. the method making flexible substrate as claimed in claim 1, it is characterised in that further include:
Formed this polymeric layer on this base plate after, this polymeric layer of through part, make this through hole run through this base plate with should
Polymeric layer.
4. the method making flexible substrate as claimed in claim 3, it is characterised in that further include:
After this polymeric layer of through part, it is provided that a laminating layer fits on this polymeric layer, and cover this through hole.
5. the method making flexible substrate as claimed in claim 1, it is characterised in that in forming this polymeric layer in this end
Step on plate, partly this polymeric layer inserts this through hole.
6. the method making flexible substrate as claimed in claim 5, it is characterised in that further include:
Before this gas is provided, it is provided that a microscope carrier is arranged under this base plate, and this microscope carrier has a thimble；
This thimble stretched into this through hole and withstands this polymeric layer, making this polymeric layer separate with this bottom parts；And
Remove this thimble.
7. the method making flexible substrate as claimed in claim 6, it is characterised in that further include in forming this polymeric layer
Close this through hole before.
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| CN201610075960.3A CN105575857B (en) | 2013-03-22 | 2013-06-19 | Method and device for manufacturing flexible substrate |
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| TW102110343A TWI458406B (en) | 2013-03-22 | 2013-03-22 | Method and apparatus for manufacturing flexible substrate |
| TW102110343 | 2013-03-22 |
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| CN201610075960.3A Division CN105575857B (en) | 2013-03-22 | 2013-06-19 | Method and device for manufacturing flexible substrate |
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| CN104793357A (en) * | 2014-01-17 | 2015-07-22 | 鸿富锦精密工业（深圳）有限公司 | Carrier, thin film transistor array substrate manufacturing method and liquid crystal display panel manufacturing method |
| CN106154609A (en) * | 2015-04-09 | 2016-11-23 | 鸿富锦精密工业（深圳）有限公司 | Liquid crystal display panel preparation method |
| CN106057707A (en) * | 2016-06-01 | 2016-10-26 | 上海天马微电子有限公司 | Method for separating substrate and bearing panel of electronic device and bearing panel |
| CN106379034B (en) * | 2016-10-31 | 2018-11-20 | 东莞市五株电子科技有限公司 | A kind of device of protective film layer that removing electromagnetic membrane |
| CN107742618B (en) * | 2017-10-24 | 2020-07-03 | 京东方科技集团股份有限公司 | Preparation method of flexible panel, flexible panel and display device |
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Also Published As
| Publication number | Publication date |
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| TWI458406B (en) | 2014-10-21 |
| CN105575857A (en) | 2016-05-11 |
| CN103441087A (en) | 2013-12-11 |
| TW201438531A (en) | 2014-10-01 |
| CN105575857B (en) | 2019-03-08 |
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