CN103441070B - A kind of etching device of crystal silicon chip and process for etching method - Google Patents
A kind of etching device of crystal silicon chip and process for etching method Download PDFInfo
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- CN103441070B CN103441070B CN201310369031.XA CN201310369031A CN103441070B CN 103441070 B CN103441070 B CN 103441070B CN 201310369031 A CN201310369031 A CN 201310369031A CN 103441070 B CN103441070 B CN 103441070B
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Abstract
The invention discloses a kind of etching device of crystal silicon chip, comprise major trough groove group, secondary groove groove group, drying and processing system, drive system and control system, described major trough groove group comprise set gradually nitration mixture texturing slot, shower water washing trough, alkali texturing slot, shower water washing trough, acid treatment groove, shower water washing trough, wherein: described nitration mixture texturing slot, alkali texturing slot and acid treatment groove all adopt double-slot, it comprises lower groove, is protruded upward and exceed the upper groove on its top by lower groove bottom land, and the length and width of described upper groove is all less than the length and width of lower groove.The present invention is to the heating system in etching device, fluid infusion system, drive system, major trough structure, and dash assembly in major trough and the hermetically-sealed construction between major trough have carried out particular design, process for etching method is improved simultaneously, drastically increase the conversion efficiency of polysilicon, thus improve production efficiency, reduce production cost.
Description
Technical field
The present invention relates to solar energy crystal silicon chip manufacture field, particularly relate to a kind of etching device and process for etching method of crystal silicon chip.
Background technology
Process prepared by traditional polysilicon chip antireflective matte is the making herbs into wool of polysilicon acid, it adopts nitric acid to add, and the nitration mixture of hydrofluoric acid carries out making herbs into wool, the object of making herbs into wool is that the feature be staggered according to the different crystal face of polysilicon chip carries out sour corrosion, reach the effect of surperficial crystal boundary passivation, and form depression hole with the reflectivity reducing silicon chip at silicon chip surface, but it is higher that one of the making herbs into wool of polysilicon acid maximum shortcoming is exactly reflectivity after making herbs into wool, this also have impact on the raising of polysilicon conversion efficiency greatly, only include back-etching in this process and gone PSG(phosphoric acid glass) cleaning, if need the reflectivity improving silicon chip back side significantly, the silicon chip after by cleaning is also needed to carry out polished backside process in addition, this mode adds technological process and manpower, material resources cost.Meanwhile, following defect is also had in traditional etching device:
1, for meeting the requirement in silicon chip processing time, traditional main reactor needs do very long, cause the volume of the secondary groove of supporting circulation very huge thus, the chemical liquid of each required configuration is also more, if main reactor shoaled merely, though the volume of the secondary groove that can reduce to circulate, but the comprehensive mechanical property of cell body can reduce, easy distortion, and be unfavorable for the installation of other subsystem and the maintenance of stability;
2, the major factor directly affecting the final treatment effect of silicon chip has three, i.e. time, temperature and liquid proportion concentration, and as one of three most important factors, liquid proportion concentration directly affects the treatment effect of silicon chip, thus the final conversion efficiency affected when making cell piece, traditional etching device can not accurately supplement the concentration proportioning that liquid ensures liquid in time, have impact on silicon chip treatment effect;
3, heating system adopts resistance heating tube directly to realize medicine liquid heating, and this mode heat utilization efficiency is low, and energy loss is high, and resistance heating tube spoilage is high, not only increases production cost, also increases the danger that short circuit is got an electric shock;
4, docked by a parallel construction between major trough groove group, then covered by the seal cover of a strip, affect by its structural limitations, this kind of structure is often unreliable, main reactor overflow or the liquid dropped on seal cover can be drained to outside main reactor by the joint of parallel construction, thus work the mischief;
5, in major trough, fixed head adopts the form of inlaying to install with cell body side plate, and water fender and cell body side plate are reserved fine clearance and installed.When preset clearance hour, both good seals, but can distortion be produced after expanded by heating; When preset clearance is large, both seal not good enough, liquid level be difficult to ensure or with consume more multiple-energy-source to improve liquid level.Further, the height of water fender regulates to rely in operating personnel's craft and carries or press down, and its freedom is too large, is difficult to regulating and controlling amount.
Summary of the invention
The present invention proposes a kind of etching device and process for etching method of crystal silicon chip of improvement.
The etching device of the crystal silicon chip of the present invention's design comprises: major trough groove group, secondary groove groove group, drying and processing system, drive system and control system, described major trough groove group comprise set gradually nitration mixture texturing slot, shower water washing trough, alkali texturing slot, shower water washing trough, acid treatment groove, shower water washing trough, wherein, described nitration mixture texturing slot, alkali texturing slot and acid treatment groove all adopt double-slot, it comprises lower groove, is protruded upward and exceed the upper groove on its top by lower groove bottom land, and the length and width of described upper groove is all less than the length and width of lower groove.
In one embodiment, hermetically-sealed construction is equipped with between groove adjacent in described major trough groove group.
Described nitration mixture texturing slot, alkali texturing slot and acid treatment groove are provided with automatic liquid supply system; Described alkali texturing slot is also provided with on-line heating and groove external circulating system.
Described automatic liquid supply system comprises the feed tube, fluid infusion bucket, the liquid supplementation pipe that connect successively; Enter, liquid supplementation pipe is respectively arranged be connected with described control system enter, fluid infusion control valve, be provided with ultrasonic liquid leveller in described fluid infusion bucket, its one end is stretched out and is connected with control system from fluid infusion bucket; Described fluid infusion control valve comprises the essence be in parallel for a pair and mends valve and slightly mend valve.
Described on-line heating and groove external circulating system comprise heating component, circulating pump; Described heating component comprises a magnetic conduction and corrosion resistant thermotank, be wound in the outer field induction coil of thermotank, and the electromagnetic controller be connected with induction coil termination; Described thermotank outer wall is provided with one layer of heat preservation cotton, and described induction coil is wrapped in heat-preservation cotton skin; Described thermotank, circulating pump and a secondary groove are in turn connected to form circulation circuit by pipeline.
Described on-line heating and groove external circulating system also comprise the temperature monitor be located in alkali texturing slot, this temperature monitor connects described control system, control system sends a signal to described electromagnetic controller, and electromagnetic controller receives described signal and controls described heating component and opens or cut out.
Described hermetically-sealed construction comprises the shrouding being located at top, major trough cell body two side, is located at the cover plate on adjacent two shroudings; Described shrouding tilts outside cell body, and described cover plate is inverted v-shaped; Also be provided with sealing strip between described cover plate and shrouding, described cover plate, sealing strip and shrouding form compact siro spinning technology by screw.
Be provided with dash assembly in described major trough, comprise the fixed head being fixed on cell body base plate, and be arranged on the water fender that can slide up and down on fixed head, also comprise the side plate be fixed on cell body side plate; Described fixed head and side plate, water fender are fitted and are installed, and are provided with gap between the side of described side plate and fixed head, water fender;
Described dash assembly also comprises the arrangement for adjusting height be arranged on outside described water fender, and this device upper end crosses out a fastener, and top is provided with one handle; Described water fender is provided with the adjustment hole coordinated with described fastener;
Described side plate is a right angle bending plate, and on it, a bending side and described fixed head are fitted;
Described fixed head top is provided with groove, and the length of groove is less than the length of described water fender.
The present invention also proposes a kind of process for etching method of crystal silicon chip, comprises the following steps:
Step 1: first silicon chip is placed in temperature and controls at 10 DEG C-12 DEG C, volumetric concentration soaks 1-1.5 minute in the mixed solution of the HNO3 of HF and 37-40% of 6-7%, carries out acid corrosion process, reaches the object of silicon chip back side being removed to PSG;
Step 2: the silicon chip after acid corrosion is circulated immediately and to clean in the mode of spray to 12-16M Ω cm pure water, to reduce acid solution for the purpose of the attachment of silicon chip surface as far as possible;
Step 3: again silicon chip is put into temperature and control at 70-80 DEG C, volumetric concentration carries out the caustic corrosion process of 2-3 minute in TMAH (Tetramethylammonium hydroxide) solution of 13-18%, silicon chip back side reflectivity can be brought up to more than 40% through this technique, thus reach polishing object is carried out to silicon chip back side;
Step 4: the silicon chip after caustic corrosion is also circulated immediately and to clean in the mode of spray to 12-16M Ω cm pure water, to reduce alkali lye for the purpose of the attachment of silicon chip surface as far as possible;
Step 5: then silicon chip circulation is soaked 1-1.5 minute to volumetric concentration in the HF solution of 8-10%, carry out acid corrosion process, reach the object of front side of silicon wafer being removed to PSG;
Step 6: the silicon chip after pickling is circulated immediately and to clean in the mode of spray to 12-16M Ω cm pure water, to reduce for the purpose of acid solution and silicon chip surface attachment as far as possible;
Step 7: the silicon chip processed above is carried out drying process, ensure silicon chip surface anhydrous mark, is beneficial to silicon chip and enters production procedure below.
Described automatic liquid supply system is all adopted to supplement corresponding solution, to ensure the suitable proportioning of solution in step 1,3,5; Described on-line heating and groove external circulating system is adopted to heat solution in step 3, to ensure the proper temperature of solution.
Compared with prior art, the present invention is to the heating system in etching device, fluid infusion system, drive system, major trough structure, and dash assembly in major trough and the hermetically-sealed construction between major trough have carried out particular design, process for etching method is improved simultaneously, drastically increase the conversion efficiency of polysilicon, thus improve production efficiency, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the partial schematic diagram of one embodiment of the invention;
Fig. 2 is a side schematic view embodiment illustrated in fig. 1;
Fig. 3 is another side embodiment illustrated in fig. 1 schematic diagram;
Fig. 4 is the schematic diagram of hermetically-sealed construction between middle major trough groove group embodiment illustrated in fig. 1;
Fig. 5 is the enlarged drawing of part A in Fig. 4;
Fig. 6 is the schematic front view of middle dash assembly partial structurtes embodiment illustrated in fig. 1;
Fig. 7 is the schematic top plan view of Fig. 6;
Fig. 8 for arrangement for adjusting height and water fender in the assembly of dash shown in Fig. 6 assemble after side schematic view;
Fig. 9 is the schematic diagram of middle double-slot embodiment illustrated in fig. 1;
Figure 10 is the schematic diagram of middle automatic liquid supply system embodiment illustrated in fig. 1;
Figure 11 is the partial schematic diagram of middle drive system embodiment illustrated in fig. 1;
The schematic top plan view of two adjacent cards in drive system shown in Figure 12 Figure 11;
Figure 13 is the schematic diagram of plug-in unit in drive system shown in Figure 11;
Figure 14 is middle on-line heating embodiment illustrated in fig. 1 and groove external circulating system schematic diagram;
Figure 15 is the structural representation of heating component in on-line heating shown in Figure 14 and groove external circulating system;
Figure 16 is the flow chart of the process that the present invention proposes.
Embodiment
The present invention proposes a kind of etching device and process for etching method of crystal silicon chip.
As shown in Figure 1 to Figure 3, the etching device that the present invention proposes crystal silicon chip comprises: the frame 2 of the overall skeleton of constitution equipment, be located at the feeding, discharge platform 1,6 of frame both sides, be arranged on the major trough groove group 5 of central rack and the secondary groove groove group 8 of bottom, be arranged on the drive system 9 of major trough groove group upper end, and be installed on the drying and processing system of frame tail end and the control system of control appliance operation, be provided with exhausting system 4 at the top of equipment simultaneously.In the present invention, in order to the technique of making herbs into wool needs, major trough groove group comprise set gradually nitration mixture texturing slot, shower water washing trough, alkali texturing slot, shower water washing trough, acid treatment groove, shower water washing trough.
In the major trough groove group 8 of an embodiment, be provided with the hermetically-sealed construction 81 that transition is connected between groove with groove, in each groove, be provided with dash assembly; Wherein, nitration mixture texturing slot, alkali texturing slot and acid treatment groove all adopt double-slot 83, and are equipped with automatic liquid supply system 84 in these grooves.
See Fig. 4, Fig. 5, hermetically-sealed construction 81 comprises: the shrouding 812 being fixed on top, major trough 811 two side, and this shrouding tilts outside cell body, is arranged on the cover plate 813 on adjacent two shroudings 812, this cover plate is inverted v-shaped, is provided with sealing strip 814 between cover plate and shrouding simultaneously; Shrouding, sealing strip and cover plate form compact siro spinning technology by screw 815.Sealing sealing structure area is large, structure is simple, effectively prevent because of cell body by thermal expansion, be out of shape the problem causing poor sealing.
See Fig. 6 to Fig. 8, dash assembly comprises: be fixed on the fixed head 821 on major trough base plate, and be fixed on the side plate 822 on major trough side plate, fixed head be provided with water fender 823, this water fender can slide up and down; Fixed head 821 and side plate 822, water fender 823 fits and are installed, while the side of side plate and fixed head, be provided with gap between water fender.This dash assembly ensure that the height of groove inner liquid medicine while improving cell body sealing, also ensure that water fender linearity in high temperature environments, also improves the accuracy that liquid level regulates simultaneously, improves production efficiency.
Refer to Fig. 7, water fender 823 and fixed head 821 fit together; Side plate 822 is a right angle bending plate, a bending side on it and fixed head 821 are fitted, gap is left as flexible surplus between the side that this bending side is adjacent and water fender 823, also gap is left as flexible surplus between the side of another bending side and fixed head 821, ensure that water fender is indeformable in the case of a high temperature, thus ensure that the stability of liquid level and the reliability of cell body.
Refer to Fig. 8, the arrangement for adjusting height 825 regulating water fender to slide up and down is had in the arranged outside of water fender 3, a fastener 8251 is laterally vertically stretched out to water fender in the upper end of this device, top protrudes upward one handle 8252, composition graphs 6, the lower end of water fender 823 is provided with the adjustment hole 824 with fastener 8251 corresponding matching, and fixed head 821 top is provided with the groove 8211 for overflow liquid, and the length of this groove is less than the length of water fender 823.When regulating this device, turn handle 8252, band moved fastener 8251 rises or declines, and fastener drives water fender 823 to rise or decline by adjustment hole 824; When the height on water fender top is lower than fixed head tip edge, water fender tip edge becomes the overfall of liquid with the groove type on fixed head.In the present embodiment, the height of water fender, by threaded adjusting, avoids the arbitrariness of manual lift, regulates more accurate, more convenient.
See Fig. 9, double-slot 83 comprises: be fixedly mounted on the lower groove 831 in frame 2, protrude upward in lower groove and exceed the upper groove 832 on its top, on this, the sidewall of groove stretches out a support 833 downwards, the bottom land of this support and lower groove is fixed, and the length and width of upper groove 832 is all less than the length and width of lower groove 831, designs the liquid be convenient in groove like this and overflow in lower groove, ensure that the fail safe of system.This double-slot reduces the volume of secondary groove on the basis ensureing major trough length, thus decreases liquid configuration amount, improves liquid utilance, overflows major trough when this structure also can prevent liquid from refluxing, and improves the fail safe that equipment runs.
See Fig. 2, Figure 10, automatic liquid supply system 84 comprises the feed tube 841, fluid infusion bucket 842 and the liquid supplementation pipe 843 that connect successively.Feed tube 841 and liquid supplementation pipe 843 are all arranged on the bottom of fluid infusion bucket 842, wherein feed tube 841 is provided with a liquid inlet control valve be connected with control system 8410, the liquid outlet of liquid supplementation pipe 843 is arranged in major trough 844, liquid flows through feed tube, fluid infusion bucket and liquid supplementation pipe successively and enters in major trough, for cleaning or the process use of solar silicon wafers, cell piece.
The sidewall of fluid infusion bucket 842 stretches out a liquid level detecting switch be connected with control system 846, its effect carries out limit liquid level protection to fluid infusion bucket; One ultrasonic liquid leveller be connected with control system 845 inserts into the inner from the top of fluid infusion bucket, and below the limit inferior liquid level of fluid infusion bucket is located in ultrasonic liquid leveller bottom simultaneously.
Liquid supplementation pipe 843 is provided with a hand-operated valve 847, its effect is for closing liquid supplementation pipe when equipment overhauls; Liquid supplementation pipe between hand-operated valve 847 and major trough 844 is provided with a fluid infusion control valve, this fluid infusion control valve comprises the essence be connected in parallel for a pair and mends valve 848 and thick benefit valve 849, and this essence, thick valve of mending all are connected with control system.In the utility model, essence, thick effect of mending valve be controlled by control system both opening and closing, thus control liquid and flow in reactive tank with low discharge or large discharge, and then reach accurate fluid infusion.
When automatic liquid supply system 84 works, user is first by the required liquid quantity of adding of man-machine dialog interface setting of equipment, then start fluid infusion system and start working, ultrasonic liquid leveller 845 records liquid quantity current in fluid infusion bucket 842, and the liquid quantity be left when showing that fluid infusion stops with the interpolation quantitative comparison that user sets, now control system opens thick valve 849 of mending toward fluid infusion in the major trough 844 holding liquid, liquid quantity current in ultrasonic liquid leveller real time record fluid infusion bucket, when fluid infusion bucket inner liquid medicine quantity also closes thick benefit valve 849 close to opening smart valve 848 of mending during the quantity that should be left, essence mends valve to have mended residue liquid compared with low discharge and to have quit work, this time fluid infusion has operated.When remaining liquid in fluid infusion bucket 842 and reaching limit inferior Liquid level height, liquid inlet control valve 8410 is opened and is carried out supplementing to maintain bucket inner liquid medicine quantity to the liquid in fluid infusion bucket 842.Automatic liquid supply system greatly improves fluid infusion precision, ensure that the consistency of actual amount infused and technical recipe, reduces the impact of external factor, improves the stability of system, and its structure is simple simultaneously, convenient for installation and maintenance.
See Figure 11 to Figure 13, in drive system 9, the governor motion of live-roller comprises mounting panel 911, grub screw 912, card 913, plug-in unit 914.Wherein mounting panel 911 is fixed on the base plate of major trough cell body, the top of mounting panel has groove, card 913 is fixed in this groove by CARBURIZING FURNACE FOR STAINLESS FASTENER, card is movably installed with the plug-in unit 914 for installing live-roller, between card and mounting panel, be connected with grub screw 912, the top of grub screw holds up plug-in unit simultaneously.
Refer to Figure 13, plug-in unit 914 is a U-shaped part, is provided with a movable part in the U-lag 9141 on it, and this movable part can be up and down in U-type groove, and the upper and lower side of movable part is equipped with groove, and groove and the U-lag 9141 of bottom form the installing hole 9142 installing live-roller; The both ends of the surface of plug-in unit cave inward the location notch 9144 formed for locating.
Refer to Figure 12, card 913 is interval with the mounting groove 9131 for installing plug-in unit 914, its profile is mated with plug-in unit, two medial surfaces of this mounting groove is respectively equipped with two positioning edges 9132; Adopt the mode of embedding that shape is installed between adjacent card in aggregates, gap 9133 is provided with between its edge part, this gap is that the expanded by heating of card marginal portion has reserved space, and don't as making liquid flow out the height affecting liquid level in cell body in a large number, ensure that the stability of technique and the stability of live-roller normal operation.
During assembling, first plug-in unit 914 is arranged in the mounting groove 9131 of card 913, and coordinated with the positioning edge 9132 on card by the location notch 9144 on it and realize locating, arrange grub screw 912 in the below of mounting groove by screw, grub screw holds up plug-in unit while connection card and mounting panel simultaneously.When regulating live-roller level, first live-roller is lain against on plug-in unit 914, then measure live-roller by level meter and ruler to differ with datum level, compare according to the pitch of measured numerical value and grub screw 912 again, calculate the angle that regulate, finally realize the horizontal adjustment of live-roller, then put plug-in unit and live-roller well, complete whole adjustment process.The governor motion of live-roller is the very high stability of equipment, fail safe and efficiency, its structure is simple simultaneously, easy for installation.
See Fig. 3, Figure 14, in the present embodiment, the solution in alkali texturing slot must carry out at a certain temperature, therefore is furnished with on-line heating and groove external circulating system 85 for it, and this system comprises heating component 853 and circulating pump 852; Heating component 853, circulating pump 852 are in turn connected to form groove outer circulation loop with secondary groove 851 by pipeline 854.Also be provided with a temperature monitor, this temperature monitor connection control system in secondary groove 851 simultaneously.
Refer to Figure 15, heating component 853 comprises a magnetic conduction and corrosion resistant thermotank 8531, the outer wall of this thermotank is wrapped in one deck for strengthening the heat-preservation cotton 8532 of thermotank heat-insulating property, and be wrapped induction coil 8533 at the extexine of this heat-preservation cotton, its termination is connected with an electromagnetic controller 8534.Control system sends a signal to electromagnetic controller, and this electromagnetic controller receives described signal and controls heating component and opens or cut out.The on-line heating part of native system improves electric conversion efficiency and temperature-controlled precision, it also avoid electric leakage and short circuit simultaneously, improves stability and the fail safe of equipment; Groove outer circulation part avoids liquid medicine contamination, facilitates installation and the maintenance of system simultaneously, reduces production cost.
The invention allows for a kind of process for etching method of crystal silicon chip.See Figure 16, the method comprises the following steps:
Step 1: first silicon chip is placed in temperature and controls at 10 DEG C-12 DEG C, volumetric concentration soaks 1-1.5 minute in the mixed solution of the HNO3 of HF and 37-40% of 6-7%, carries out acid corrosion process, reaches the object to silicon chip erosion.In the process according to the consumption that solution and silicon chip react, in time supplement a certain amount of HF and HNO by automatic liquid supply system
3, to ensure the suitable proportioning of solution.
Step 2: the silicon chip after acid corrosion is circulated immediately and to clean in the mode of spray to 12-16M Ω cm pure water, to reduce acid solution for the purpose of the attachment of silicon chip surface as far as possible.
Step 3: silicon chip is put into temperature and control at 70-80 DEG C, volumetric concentration carries out the caustic corrosion process of 2-3 minute in TMAH (Tetramethylammonium hydroxide) solution of 13-18%.
In the process of step 3, ensure that solution temperature controls at 70-80 DEG C by on-line heating and groove external circulating system.After step 3 processes, silicon chip back side reflectivity can be brought up to more than 40%, thus reach polishing object is carried out to silicon chip back side.In the process according to the consumption that solution and silicon chip react, by supplementary a certain amount of TMAH (Tetramethylammonium hydroxide) that automatic liquid supply system is in good time, to ensure the suitable proportioning of solution.
Step 4: the silicon chip circulation after caustic corrosion cleaned in the mode of spray to 12-16M Ω cm pure water, to reduce alkali lye for the purpose of the attachment of silicon chip surface as far as possible.
Step 5: then silicon chip circulation is soaked 1-1.5 minute to volumetric concentration in the HF solution of 8-10%, carry out acid corrosion process, PSG(phosphoric acid glass is comprised to silicon chip surface) and other oxides effectively remove, reach and remove PSG(phosphoric acid glass) and avoid oxide to affect the final mass of silicon chip.In the process according to the consumption that solution and silicon chip react, by supplementary a certain amount of HF that automatic liquid supply system is in good time, to ensure the suitable proportioning of solution.
Step 6: the silicon chip after pickling is circulated immediately and to clean in the mode of spray to 12-16M Ω cm pure water, to reduce for the purpose of acid solution and silicon chip surface attachment as far as possible.
Step 7: the silicon chip processed above is carried out drying process, ensure silicon chip surface anhydrous mark, is beneficial to silicon chip and enters production procedure below.
Compared with existing process, the process that the present invention proposes can make the light conversion efficiency of silicon chip promote 0.15%; Can implement this process after wet-method etching equipment carries out simple transformation, its transformation cycle is short, and cost is low simultaneously, is easy to realize; This process process function is concentrated, effectively by back-etching, polished backside, go PSG combine with technique to play to one, reduce and implement man power and material's cost of these techniques step by step.
Claims (6)
1. the etching device of a crystal silicon chip, comprise major trough groove group, drying and processing system, drive system and control system, described major trough groove group comprise set gradually nitration mixture texturing slot, shower water washing trough, alkali texturing slot, shower water washing trough, acid treatment groove, shower water washing trough, it is characterized in that: described nitration mixture texturing slot, alkali texturing slot and acid treatment groove all adopt double-slot, it comprises lower groove, is protruded upward and exceed the upper groove on its top by lower groove bottom land, and the length and width of described upper groove is less than the length and width of lower groove respectively;
Wherein, described nitration mixture texturing slot, alkali texturing slot and acid treatment groove are provided with automatic liquid supply system; Described alkali texturing slot is also provided with on-line heating and groove external circulating system.
2. the etching device of crystal silicon chip as claimed in claim 1, is characterized in that: be equipped with hermetically-sealed construction between groove adjacent in described major trough groove group.
3. the etching device of crystal silicon chip as claimed in claim 1, is characterized in that: described automatic liquid supply system comprises the feed tube, fluid infusion bucket, the liquid supplementation pipe that connect successively; Feed tube, liquid supplementation pipe are respectively arranged with the feed liquor, the fluid infusion control valve that are connected with described control system, are provided with ultrasonic liquid leveller in described fluid infusion bucket, its one end is stretched out and is connected with control system from fluid infusion bucket; Described fluid infusion control valve comprises the essence be in parallel for a pair and mends valve and slightly mend valve.
4. the etching device of crystal silicon chip as claimed in claim 1, is characterized in that: described on-line heating and groove external circulating system comprise heating component, circulating pump; Described heating component comprises a magnetic conduction and corrosion resistant thermotank, the electromagnetic controller that is wound in the outer field induction coil of thermotank and is connected with induction coil termination; Described thermotank outer wall is provided with one layer of heat preservation cotton, and described induction coil is wrapped in heat-preservation cotton skin; Described thermotank, circulating pump and a secondary groove are in turn connected to form circulation circuit by pipeline;
Described on-line heating and groove external circulating system also comprise the temperature monitor be located in alkali texturing slot, this temperature monitor connects described control system, control system sends a signal to described electromagnetic controller, and electromagnetic controller receives described signal and controls described heating component and opens or cut out.
5. the etching device of crystal silicon chip as claimed in claim 2, is characterized in that: described hermetically-sealed construction comprises the shrouding being located at top, major trough cell body two side, is located at the cover plate on adjacent two shroudings; Described shrouding tilts outside cell body, and described cover plate is inverted v-shaped; Also be provided with sealing strip between described cover plate and shrouding, described cover plate, sealing strip and shrouding form compact siro spinning technology by screw.
6. the etching device of crystal silicon chip as claimed in claim 1, it is characterized in that: in described major trough groove group, be provided with dash assembly, comprise the fixed head being fixed on cell body base plate, and be arranged on the water fender that can slide up and down on fixed head, also comprise the side plate be fixed on cell body side plate; Described fixed head and side plate, water fender are fitted and are installed, and are provided with gap between the side of described side plate and fixed head, water fender;
Described dash assembly also comprises the arrangement for adjusting height be arranged on outside described water fender, and this device upper end crosses out a fastener, and top is provided with one handle; Described water fender is provided with the adjustment hole coordinated with described fastener;
Described side plate is a right angle bending plate, and on it, a bending side and described fixed head are fitted;
Described fixed head top is provided with groove, and the length of groove is less than the length of described water fender.
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| CN103762280A (en) * | 2014-02-14 | 2014-04-30 | 常州捷佳创精密机械有限公司 | Multi-cavity texturing system |
| CN103861853B (en) * | 2014-03-21 | 2015-12-16 | 常州捷佳创精密机械有限公司 | A kind of accurate automatic liquid supply system of surplus-returning type and liquid replenishing method thereof |
| CN103985791B (en) * | 2014-06-04 | 2016-03-30 | 江苏汇景薄膜科技有限公司 | A kind of full-automatic immersion type nesa coating etching device |
| CN104404627B (en) * | 2014-10-24 | 2017-07-25 | 苏州阿特斯阳光电力科技有限公司 | A kind of surface pre-treating process before crystalline silicon RIE making herbs into wool |
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