CN103426854A - Heat radiation structure based on flexible substrate encapsulation and manufacturing technology thereof - Google Patents
Heat radiation structure based on flexible substrate encapsulation and manufacturing technology thereof Download PDFInfo
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- CN103426854A CN103426854A CN201210163031XA CN201210163031A CN103426854A CN 103426854 A CN103426854 A CN 103426854A CN 201210163031X A CN201210163031X A CN 201210163031XA CN 201210163031 A CN201210163031 A CN 201210163031A CN 103426854 A CN103426854 A CN 103426854A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The invention relates to a heat radiation structure based on flexible substrate encapsulation and a manufacturing technology of the heat dissipation structure. The heat radiation structure comprises a flexible substrate, a component is covered with the flexible substrate, the gap between the flexible substrate and the component is filled with pouring sealants, the flexible substrate is fixedly connected with a radiator through adhesion agents, and the flexible substrate with the radiator is formed; a plurality of encapsulation pins are arranged on the outer surface of the flexible substrate with the radiator, the encapsulation pins are electrically connected with the flexible substrate, and the flexible substrate is connected with a printed-circuit board through the encapsulation pins. The manufacturing technology of the heat radiation structure based on flexible substrate encapsulation is basically mature and beneficial to the miniaturization of an encapsulation system, enables the flexible substrate and the radiator to be fully combined, and achieves efficient heat radiation of small-size encapsulation.
Description
Technical field
The present invention relates to a kind of radiator structure and manufacture craft thereof based on flexible substrate package, relate in particular to a kind of radiator structure and manufacture craft thereof for single-chip package and system in package (SiP), belong to the microelectronic packaging technology field.
Background technology
Under many-sided demands such as miniaturization of electronic products, multi-functional, environment-friendly type, novel heterogeneous integrated technology system in package (System-in-Package, SiP) becomes one of Typical Representative of microelectronics new technique.Except take the high-performance that CPU is representative, high power consumption single-chip package, for meeting systematization, miniaturization demand, increasing integrated chip is in small-sized encapsulation, and the thermal buildup issue of system in package inside can not be ignored.Therefore, the heat dissipation problem under the system miniaturization is one of key technology of package design always.
Main employing thermal hole, fin and the good thermal interfacial material of conductive performance (TIM) for chip or system module heat radiation conducts to outside large system by the inner heat produced of system in package at present, reduce the heat accumulation of package system inside in conjunction with convection current, two kinds of radiating modes of radiation, guarantee the chip normal operation.The Nirmal K.Sharma of Intersil corporation (US006861283B2) adds thermal hole in hard substrate at " Package for integrated circuit with thermal vias and method thereof " and is dispelled the heat.The people such as the Chee Seng Foong of Free scale Semiconductor are at " Heat spreader for semiconductor package " (US 20080067645A1), the people such as the Taekeun Lee of ChipPAC are at " Plastic ball grid array package with integral heatsink " during (US20070176289A1) etc. the research of patent all concentrates on and fin is embedded to plastic packaging (molding compound), fin closely even directly contacts bare chip, reduce thermal resistance, improve radiating efficiency.Adopt the TIM material to surround the heat dissipating method that chip is connected with radiator, as the Chi-hsing Hsu of Via Technologies elaborates in " Chip Package and Manufacturing Method thereof " (US 20080093733A1).In order to reach better radiating effect, some researchs are prepared into fluid channel in the silica-based of package interior or copper base, adopt water-cooled, liquid cooling technology to reach packaging body heat radiation purpose.
In the novel encapsulated technology that the system in package of take is representative, the miniaturization that is applied as of some new materials and technology brings opportunity, becomes one of efficient implementation of system or module miniaturization.Flexible base, board is compared and is had more pliability, film with traditional hard substrate, and thermal diffusivity is characteristics preferably, and has retained the characteristics such as hard substrate insulating properties, higher-strength.Research for flexible base, board mainly concentrates in three-dimensional stacked realization encapsulation miniaturization, and the radiator structure based on flexible substrate package is very not many at present.US006121676A utilizes the three-dimension packaging that realizes of flexible base, board, and the external metallization frame in the three-dimension packaging structure, except playing fixedly packaging appearance, also played the effect of certain heat radiation, but metal outer frame and substrate contacts area is less, and radiating effect is limited.
Based on the above-mentioned discussion to heat dissipation technology and flexible base, board, for the heat dissipation problem in flexible substrate package as research direction of the present invention.
Summary of the invention
The present invention is more and more higher to the demand of miniaturization and high sensitivity module or system for meeting, and for the heat dissipation problem after the module miniaturization, the invention provides a kind of radiator structure and manufacture craft thereof based on flexible substrate package.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of radiator structure based on flexible substrate package comprises flexible base, board; Described flexible base, board is coated on components and parts, between described flexible base, board and components and parts, is filled with casting glue, and described flexible base, board and radiator are fixed by adhesive, forms the flexible base, board with radiator; The described outer surface of the flexible base, board with radiator is provided with a plurality of packaging pins, between described packaging pin and flexible base, board, has electrical connection, and described flexible base, board is by being interconnected between packaging pin and printed circuit board.
On the basis of technique scheme, the present invention can also do following improvement.
Further, when described components and parts are bare chip, between described bare chip and flexible base, board, adopt the form of flip chip bonding to be interconnected, described bare chip is fixed on flexible base, board by a plurality of flip-chip bump, is filled with underfill around described flip-chip bump; Perhaps between described bare chip and flexible base, board, adopt the form of Bonding to be interconnected, described bare chip is fixed on flexible base, board by binding agent, and described bare chip is by realizing electrical connection between Bonding line and flexible base, board;
During chip after described components and parts are passive component or encapsulation, the chip after described passive component or encapsulation adopts surface-pasted form and flexible base, board to interconnect.
Further, the mode that the described flexible base, board with radiator coats components and parts is that individual layer coats, this individual layer clad structure is by least one components and parts is arranged on flexible base, board, then after flexible base, board is folding, makes flexible base, board be coated on interior by components and parts and form.
Further, the mode that the described flexible base, board with radiator coats components and parts is multilayer coating structure, this multilayer coating structure is by a plurality of components and parts are arranged on flexible base, board, the more folding flexible base, board that repeatedly makes afterwards of flexible base, board is formed to sandwich construction and is coated on interior by components and parts and forms.
Further, be provided with at least one components and parts in every layer of structure in described multilayer coating structure, when being provided with a plurality of components and parts, a plurality of components and parts stacked on top are arranged on flexible base, board together afterwards, perhaps the left and right tiling of a plurality of components and parts is successively set on flexible base, board, between described components and parts and flexible base, board, is filled with casting glue.
Further, between described flexible base, board and components and parts, be provided with fin, and bond with adhesive is fixing.
Further, described radiator comprises radiator, copper base radiator, aluminium base radiator or the special-shaped fin with fin.
Further, be fixed on top, side, surrounding or the bottom of flexible base, board by adhesive when described radiator described radiator for the radiator of fin, copper base radiator or aluminium base radiator the time;
When described radiator is special-shaped fin, the main leaf of described radiator is fixed on the top of flexible base, board, side, surrounding or bottom, and a sheet of described radiator is embedded in the flexible base, board inside of multilayer coating structure.
Further, when the main leaf of described radiator or radiator is fixed on the top, side of flexible base, board or surrounding, described packaging pin adopts the ball grid array leg to be fixed on described flexible base, board;
When the main leaf of described radiator or radiator is fixed on the bottom of flexible base, board, what described packaging pin adopted is to open the inner pin of radiator that hole makes in radiator.
The present invention also provides a kind of technical scheme solved the problems of the technologies described above as follows: a kind of manufacture craft of the radiator structure based on flexible substrate package comprises the following steps:
Step 1: the processing flexibility substrate, and make circuit and add thermal hole on flexible base, board;
Step 2: flexible base, board is coated on components and parts, and will be interconnected between components and parts and flexible base, board;
When described components and parts are bare chip, and when described bare chip adopts the method interconnection of Bonding, by binding agent, bare chip is fitted on flexible base, board, and lead key closing process is the interconnection of bare chip and flexible base, board, lead material includes the wires such as gold, copper, aluminium, silver;
When described components and parts are bare chip, and when described bare chip adopts the method interconnection of flip chip bonding, chip bump and flexible base, board are fixed, and inserted underfill protection chip bump, according to different 3D multilayer coating structures, bare chip can be fixed on homonymy or the both sides of flexible base, board;
When described components and parts are passive component or packaged chip, and described passive component or packaged chip are fixed on passive component or packaged chip on flexible base, board while adopting surface-pasted mode and flexible base, board interconnection.
Step 3: flexible base, board is folding, make flexible base, board coat components and parts, and between the multilayer flexible substrate after being partially submerged into of special-shaped heat sink/heat spreader is folding, and by the heat conductivility fixing bonding of adhesive preferably, then casting glue is filled between flexible base, board and components and parts, plays the effect of fixing flexible molding substrate and protection components and parts;
Step 4: radiator is bonding by adhesive and flexible base, board, and adhesive plays heat conduction and the fixing effect be shaped;
Step 5: when the main leaf of described radiator or radiator is placed in to the top, side of whole encapsulating structure or surrounding, use the method for planting ball that ball grid array soldered ball packaging pin is fixed on flexible base, board; When the main leaf of described radiator or radiator is placed in to whole encapsulating structure bottom, at first radiator is positioned to hole or the groove that interconnection pin position preparation size is larger, again by the fixing bonding of filling adhesive between the radiator after perforate, groove and flexible base, board, and to being filled the packaging pin of rear formation radiator inside in the perforate of radiator or fluting.
The invention has the beneficial effects as follows:
1, the radiator structure based on flexible substrate package provided by the invention, the abundant efficiently radiates heat of realizing small-sized package that flexible base is combined with radiator;
2, the radiator structure based on flexible substrate package provided by the invention, the components and parts in radiator structure can be to encapsulate arbitrarily and modes of emplacement;
3, the radiator structure based on flexible substrate package provided by the invention, the reliability of the flexible base, board of use and mechanical performance are all better, flexible, realize three-dimension packaging;
4, the radiator structure based on flexible substrate package provided by the invention, the radiator of use can be placed in any part of whole packaging body;
5, the radiator structure based on flexible substrate package provided by the invention, the manufacturing process of using is mature on the whole, and is conducive to the miniaturization of package system.
The accompanying drawing explanation
The profile of the radiator structure based on flexible substrate package that Fig. 1 is first embodiment of the invention;
The profile of the radiator structure based on flexible substrate package that Fig. 2 is second embodiment of the invention;
The profile of the radiator structure based on flexible substrate package that Fig. 3 is third embodiment of the invention;
The profile of the radiator structure based on flexible substrate package that Fig. 4 is fourth embodiment of the invention;
The profile of the radiator structure based on flexible substrate package that Fig. 5 is fifth embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
Below to the individual layer radiator structure that the present invention is based on flexible substrate package to further detailed description.
The first embodiment
Fig. 1 is the profile of the radiator structure based on flexible substrate package of first embodiment of the invention.As shown in Figure 1, bare chip 101,102 stacked on top, adopt the mode of Bonding to be bonded on flexible base, board 106 by bonding line 104.By the folding parcel of flexible base, board 106 prolongations bare chip 101,102, and be filled between the flexible base, board 106 and bare chip 101,102 after folding with casting glues 105 such as plastic packaging glue, play the effect of fixing flexible substrate forming and protection bare chip and bonding line.Adhesive that will be good by heat conductivility with the radiator 103 of fin and flexible base, board 106 is fixed, and forms the flexible base, board with radiator structure.Flexible base, board 106 is realized being electrically connected to by packaging pin 107 and printed circuit board (PCB).
The second embodiment
Fig. 2 is the profile of the radiator structure based on flexible substrate package of second embodiment of the invention.As shown in Figure 2, bare chip 201,202 adopts the mode of flip chip bonding to be bonded in respectively the both sides of flexible base, board 206 by salient point 208.By the folding parcel bare chip 201,202 of flexible base, board 206, and fin 209 is placed between bare chip 201 and flexible base, board 206, increases radiating effect.The casting glues such as plastic packaging glue, for 205 flexible base, boards 206 and bare chip 201,202 of filling after folding, are played to the effect of fixing flexible substrate forming and protection bare chip.In order further to increase radiating effect, by the fin of high thermal conductivity 209 by heat-conducting glue be bonded to bare chip 201 above, the heat that fin 209 can produce chip is more directly led the one side of radiator 203, the adhesive good by heat conductivility with the radiator 203 of fin and flexible base, board 206 fixed, and forms the flexible base, board with radiator structure.Flexible base, board 206 is realized being electrically connected to by packaging pin 207 and printed circuit board (PCB).
The 3rd embodiment
Fig. 3 is the profile of the radiator structure based on flexible substrate package of third embodiment of the invention.As shown in Figure 3, bare chip 301,302 adopts the mode of flip chip bonding to be bonded in respectively the both sides of flexible base, board 306 by salient point 308.By the folding parcel bare chip 301,302 of flexible base, board 306, and be filled between the flexible base, board 306 and bare chip 301,302 after folding with casting glues 305 such as plastic packaging glue, play the effect of fixing flexible substrate forming and protection bare chip.Adhesive that will be good by heat conductivility with the copper base of fluid channel 312 or aluminium base radiator 310 and flexible base, board 306 is fixed, and forms the flexible base, board with radiator structure.Flexible base, board 306 is realized being electrically connected to printed circuit board (PCB) by the inside packaging pin 311 of copper base or aluminium base radiator 310.
The 4th embodiment
Fig. 4 is the profile of the radiator structure based on flexible substrate package of fourth embodiment of the invention.As shown in Figure 4, bare chip 401,402,413,414,415 adopts the mode of flip chip bonding to be bonded in the same side of flexible base, board 406 by salient point 408.By the folding parcel bare chip 401,402,413,414,415 of flexible base, board 406; and be filled between the flexible base, board 406 and bare chip 401,402,413,414,415 after folding with casting glues 405 such as plastic packaging glue, play the effect of fixing flexible substrate forming and protection bare chip.The adhesive that special-shaped fin 416 and flexible base, board 406 is good by heat conductivility is fixed, wherein the main leaf 416-1 of special-shaped fin 416 is positioned at the left side of flexible base, board 406, and a sheet 416-2 can embed the inner flexible base, board formed with radiator structure of flexible base, board 406 of multilayer coating structure.Flexible base, board 406 is realized being electrically connected to by packaging pin 407 and printed circuit board (PCB).
The 5th embodiment
Fig. 5 is the profile of the radiator structure based on flexible substrate package of fifth embodiment of the invention.As shown in Figure 5, bare chip 501,502,513,514,515 adopts the mode of flip chip bonding to be bonded in the same side of flexible base, board 506 by salient point 508.By the folding parcel bare chip 501,502,513,514,515 of flexible base, board 506; and be filled between the flexible base, board 506 and bare chip 501,502,513,514,515 after folding with casting glues 505 such as plastic packaging glue, play the effect of fixing flexible substrate forming and protection bare chip.The adhesive that the loose device 516 of abnormity and flexible base, board 506 is good by heat conductivility is fixed, wherein the main leaf 516-1 of special-shaped radiator 516 is positioned at the left side of flexible base, board 506, and a sheet 516-2 can embed the inner flexible base, board formed with radiator structure of flexible base, board 506 of multilayer coating structure.Flexible base, board 506 is realized being electrically connected to by packaging pin 507 and printed circuit board (PCB).
For outstanding the present invention is simple in structure, the characteristics of easy processing, below further introduce the manufacture craft of this radiator structure based on flexible substrate package provided by the invention, the concrete technology step is as follows:
Step 1: flexible base, board processing: use conventional flexible base, board processing technology, circuit fabrication, on flexible base, board, and is added to thermal hole according to the actual requirements in flexible base, board.
Step 2: fixedly components and parts and bonding: when described components and parts are bare chip, and when described bare chip adopts the method interconnection of Bonding, at first by eutectic and two kinds of modes of epoxy, use the binding agent with bonding effect that bare chip is fitted on flexible base, board.Use conventional lead key closing process, comprise that thermocompression bonding, ultrasonic bonding, hot ultrasonic bonding etc. complete the interconnection of bare chip and flexible base, board, lead material includes the wires such as gold, copper, aluminium, silver.When described components and parts are bare chip, and described bare chip is used reflow soldering process that chip bump and flexible base, board are fixed, and inserts underfill and protect chip bump while adopting the method interconnection of flip chip bonding.According to different 3D multilayer coating structures, bare chip can be fixed on homonymy or the both sides of substrate.When described components and parts are passive component or packaged chip, and, when described passive component or packaged chip adopt surface-pasted mode and flexible base, board interconnection, adopt reflow soldering process that passive component or packaged chip are fixed on flexible base, board.
Step 3: the fixing shaping: coat or partly coat components and parts by flexible base, board prolongation single or multiple lift is complete, and by being partially submerged between multilayer flexible substrate of special-shaped heat sink/heat spreader, and by the heat conductivility fixing bonding of adhesive preferably.Utilize special mould, the plastic package process such as employing hot pressing are filled in casting glue between the flexible base, board and bare chip after folding, and play the effect of fixing flexible substrate forming and protection bare chip.
Step 4: add radiator: fill the good adhesive of heat conductivility between radiator and flexible base, board, play heat conduction and the fixing effect be shaped.Such as the copper base, the radiator inside such as aluminium base also can select to prepare fluid channel increases radiating effect.
Step 5: add packaging pin: packaging pin is fixed on to the flexible base, board outer surface with radiator, adopts the technique of Reflow Soldering to realize the electrical interconnection between flexible base, board and printed circuit board by packaging pin.When the main leaf of described radiator or radiator is placed in the top, side of whole encapsulating structure, even during surrounding, uses the method for planting ball that the packaging pins such as ball grid array soldered ball are fixed on flexible base, board.When the main leaf of radiator or radiator is placed in whole encapsulating structure bottom, at first radiator is positioned to hole or the groove that interconnection pin position preparation size is larger, again by the fixing bonding of filling adhesive between the radiator after perforate, groove and flexible base, board, through filling holes with resin, plug groove, machine drilling, the packaging pin of formation radiator inside after the techniques such as plating.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. the radiator structure based on flexible substrate package, is characterized in that, comprising:
Flexible base, board;
Described flexible base, board is coated on components and parts, between described flexible base, board and components and parts, is filled with casting glue, and described flexible base, board and radiator are fixed by adhesive, forms the flexible base, board with radiator;
The described outer surface of the flexible base, board with radiator is provided with a plurality of packaging pins, between described packaging pin and flexible base, board, has electrical connection, and described flexible base, board is by being interconnected between packaging pin and printed circuit board.
2. the radiator structure based on flexible substrate package according to claim 1 is characterized in that:
When described components and parts are bare chip, between described bare chip and flexible base, board, adopt the form of flip chip bonding to be interconnected, described bare chip is fixed on flexible base, board by a plurality of flip-chip bump, is filled with underfill around described flip-chip bump; Perhaps between described bare chip and flexible base, board, adopt the form of Bonding to be interconnected, described bare chip is fixed on flexible base, board by binding agent, and described bare chip is by realizing electrical connection between Bonding line and flexible base, board;
During chip after described components and parts are passive component or encapsulation, the chip after described passive component or encapsulation adopts surface-pasted form and flexible base, board to interconnect.
3. the radiator structure based on flexible substrate package according to claim 2 is characterized in that:
The mode that the described flexible base, board with radiator coats components and parts is that individual layer coats, this individual layer clad structure is by least one components and parts is arranged on flexible base, board, then after flexible base, board is folding, makes flexible base, board be coated on interior by components and parts and form.
4. the radiator structure based on flexible substrate package according to claim 2 is characterized in that:
The mode that the described flexible base, board with radiator coats components and parts is multilayer coating structure, this multilayer coating structure is by a plurality of components and parts are arranged on flexible base, board, the more folding flexible base, board that repeatedly makes afterwards of flexible base, board is formed to sandwich construction and is coated on interior by components and parts and forms.
5. the radiator structure based on flexible substrate package according to claim 4 is characterized in that:
Be provided with at least one components and parts in every layer of structure in described multilayer coating structure, when being provided with a plurality of components and parts, a plurality of components and parts stacked on top are arranged on flexible base, board together afterwards, perhaps the left and right tiling of a plurality of components and parts is successively set on flexible base, board, between described components and parts and flexible base, board, is filled with casting glue.
6. the radiator structure based on flexible substrate package according to claim 5 is characterized in that:
Be provided with fin between described flexible base, board and components and parts, and bond with adhesive is fixing.
7. according to the described radiator structure based on flexible substrate package of claim 3-6 any one, it is characterized in that:
Described radiator comprises radiator, copper base radiator, aluminium base radiator or the special-shaped fin with fin.
8. the radiator structure based on flexible substrate package according to claim 7 is characterized in that:
When described radiator is radiator with fin, copper base radiator or aluminium base radiator, described radiator is fixed on top, side, surrounding or the bottom of flexible base, board by adhesive;
When described radiator is special-shaped fin, the main leaf of described radiator is fixed on the top of flexible base, board, side, surrounding or bottom, and a sheet of described radiator is embedded in the flexible base, board inside of multilayer coating structure.
9. the radiator structure based on flexible substrate package according to claim 8 is characterized in that:
When the main leaf of described radiator or radiator is fixed on the top, side of flexible base, board or surrounding, described packaging pin adopts the ball grid array leg to be fixed on described flexible base, board;
When the main leaf of described radiator or radiator is fixed on the bottom of flexible base, board, what described packaging pin adopted is to open the inner pin of radiator that hole makes in radiator.
10. the manufacture craft of the radiator structure based on flexible substrate package, is characterized in that, comprises the following steps:
Step 1: the processing flexibility substrate, and make circuit and add thermal hole on flexible base, board;
Step 2: flexible base, board is coated on components and parts, and will be interconnected between components and parts and flexible base, board;
When described components and parts are bare chip, and described bare chip by binding agent, bare chip is fitted on flexible base, board, and lead key closing process is by the interconnection of bare chip and flexible base, board while adopting the method interconnection of Bonding;
When described components and parts are bare chip, and when described bare chip adopts the method interconnection of flip chip bonding, chip bump and flexible base, board are fixed, and inserted underfill protection chip bump, according to different multilayer coating structures, bare chip can be fixed on homonymy or the both sides of flexible base, board;
When described components and parts are passive component or packaged chip, and described passive component or packaged chip are fixed on passive component or packaged chip on flexible base, board while adopting surface-pasted mode and flexible base, board interconnection;
Step 3: flexible base, board is folding, make flexible base, board coat components and parts, and special-shaped fin is embedded between the multilayer flexible substrate after folding, and by the heat conductivility fixing bonding of adhesive preferably, then casting glue is filled between flexible base, board and components and parts, plays the effect of fixing flexible molding substrate and protection components and parts;
Step 4: radiator is bonding by adhesive and flexible base, board, and adhesive plays heat conduction and the fixing effect be shaped;
Step 5: when the main leaf of described radiator or radiator is placed in to the top, side of whole encapsulating structure or surrounding, use the method for planting ball that ball grid array soldered ball packaging pin is fixed on flexible base, board; When the main leaf of described radiator or radiator is placed in to whole encapsulating structure bottom, at first radiator is positioned to hole or the groove that interconnection pin position preparation size is larger, again by the fixing bonding of filling adhesive between the radiator after perforate, groove and flexible base, board, and to being filled the packaging pin of rear formation radiator inside in the perforate of radiator or fluting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210163031XA CN103426854A (en) | 2012-05-23 | 2012-05-23 | Heat radiation structure based on flexible substrate encapsulation and manufacturing technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210163031XA CN103426854A (en) | 2012-05-23 | 2012-05-23 | Heat radiation structure based on flexible substrate encapsulation and manufacturing technology thereof |
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| CN103426854A true CN103426854A (en) | 2013-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210163031XA Pending CN103426854A (en) | 2012-05-23 | 2012-05-23 | Heat radiation structure based on flexible substrate encapsulation and manufacturing technology thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111968944A (en) * | 2020-08-24 | 2020-11-20 | 浙江集迈科微电子有限公司 | Ultrathin stacking process for radio frequency module |
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