CN103421593B - Aqueous cutting fluid and aqueous cutting pulp - Google Patents
Aqueous cutting fluid and aqueous cutting pulp Download PDFInfo
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- CN103421593B CN103421593B CN201310247603.7A CN201310247603A CN103421593B CN 103421593 B CN103421593 B CN 103421593B CN 201310247603 A CN201310247603 A CN 201310247603A CN 103421593 B CN103421593 B CN 103421593B
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Abstract
The invention provides aqueous cutting fluid which comprises the following raw materials by weight: 0.0098-16% of mixture of alkyne glycol and alkylene oxide affixture, 19-62% of alkoxy polyether, 0.0092-8% of mixture of fluorocarbon and fluorosilicone surfactants and the balance of water. The aqueous cutting fluid is combined with abrasives to form aqueous cutting pulp. The aqueous cutting pulp has the advantages of dispersion stability, viscosity stability and higher processing precision of the abrasives.
Description
Technical field
The present invention relates to cutting fluid technical field, particularly relate to a kind of aqueous cutting fluid and water-based cutting slurry.
Background technology
Cutting fluid comprises the oil base cutting fluid comprising mineral oil and additive, comprises polyoxyethylene glycol or the polypropylene glycol glycol-based cutting fluid as main component, and the aqueous cutting fluid of water phase surfactant mixture form.But these cutting fluids have shortcoming.Oil base cutting fluid is poor at cutting point cooling performance.If workpiece or instrument are polluted by oil base cutting fluid, organic solvent cleaning liquor is exactly required, and this is undesirable from environmental.The dispersion stabilization of viscosity stability in cutting operation process of glycol-based cutting fluid and aqueous cutting fluid and abrasive material is wanting in.
CN101906346A discloses a kind of aqueous cutting fluid and slurry, aqueous cutting fluid comprises alkyne diol or its alkylene oxide adduct of 0.01-20wt%, then form a kind of water-based in conjunction with abrasive material and cut slurry, this water-based cuts the advantage of the working accuracy of starching dispersion stabilization, viscosity stability and the Geng Gao with abrasive material.
CN101712907A discloses a kind of composition and application combination of water-soluble silicon material cutting fluid.This cutting fluid contains: alkoxy polyether 50.0-95.0%, solvent 5.0-20.0%, tensio-active agent 0.1-2.0%, a small amount of water 0.1-5.0% and other functional agent 0.1-1.0%.This cutting fluid has pollution-free, that metals content impurity is low feature the invention still further relates to the cutting fluid based on mentioned component application combination, suitable abrasive material is selected to combine with it according to the character of cutting material during application, the granular size of selected abrasive material should control between 0.5-50 micron, and the mixing ratio of abrasive material and cutting fluid controls at 30:100 ~ 80:100.
Silicon chip thins down in solar cell or similar field, and this just needs aqueous cutting fluid can adapt to this change on diameter and thickness.But the aqueous cutting fluid working accuracy of prior art still can not be satisfied the demand, this is just in the urgent need to a kind of aqueous cutting fluid with the working accuracy higher than prior art.
Summary of the invention
The invention provides a kind of aqueous cutting fluid and water-based cutting slurry, the dispersion stabilization of abrasive material is good, and viscosity stability is good, and working accuracy is high.
The present invention proposes a kind of aqueous cutting fluid, and it comprises the raw material according to following weight percentage proportioning: mixture 0.0092 ~ 8wt%, the surplus of mixture 0.0098 ~ 16wt%, the alkoxy polyether 19 ~ 62wt% of alkyne diol and its alkylene oxide adduct, fluorine carbon and fluoride silicon surfactant are water.
In a preferred embodiment, it comprises the raw material according to following weight percentage proportioning: mixture 0.1 ~ 2wt%, the surplus of mixture 0.1 ~ 10wt%, the alkoxy polyether 30 ~ 50wt% of alkyne diol and its alkylene oxide adduct, fluorine carbon and fluoride silicon surfactant are water.
In a further embodiment, it also comprises the raw material according to following weight percentage proportioning: hydrophilic polyol and/or its derivative 20 ~ 60wt%.
In a further embodiment, it also comprises the raw material according to following weight percentage proportioning: polymeric dispersant 0.01 ~ 20wt%.
In preferred embodiments, cutting fluid also can comprise the water of 1 ~ 20wt%, the hydrophilic polyol of 40 ~ 78wt% and/or its derivative, and the polymeric dispersant of more preferably 0.01 ~ 20wt%.Described hydrophilic polyol or derivatives thereof preferably has solubleness in the water of at least 5wt% at 20 DEG C, and is up to the vapour pressure of 0.01mmHg.Polymeric dispersant comprises the polymkeric substance of the salt of styrene-maleic anhydride copolymer.
The invention allows for a kind of water-based and cut slurry, it comprises the aqueous cutting fluid of 100 weight parts and the abrasive material of 50 ~ 200 weight parts.
Compared with prior art, the aqueous cutting fluid that the present invention proposes and water-based are cut in slurry, comprise the alkyne diol of 0.0098 ~ 16wt% and the mixture of its alkylene oxide adduct, the alkoxy polyether of 19 ~ 62wt%, the fluorine carbon of 0.0092 ~ 8wt% and the mixture of fluoride silicon surfactant, this aqueous cutting fluid has the dispersion stabilization of abrasive material, and water-based cuts the viscosity stability of slurry, and the advantage of the working accuracy higher than prior art.
Embodiment
A kind of aqueous cutting fluid that the present invention proposes, comprises following raw material according to weight percentage proportioning:
The alkoxy polyether of the alkyne diol of 0.0098 ~ 16wt% and/or its alkylene oxide adduct, 19 ~ 62wt%, the fluorine carbon of 0.0092 ~ 8wt% and the mixture of fluoride silicon surfactant, the hydrophilic polyol of 20 ~ 60wt% and/or its derivative, the polymeric dispersant of 0.01 ~ 20wt%, surplus is water.
Alkyne diol or its alkylene oxide adduct are 0.0098 ~ 16wt%wt% based on the content of aqueous cutting fluid, preferably 0.1 ~ 15wt%, more preferably 0.1-10wt%.Cause the reduction of working accuracy lower than 0.0098wt%, insolubles can be caused to generate higher than 16wt% equally.
Described alkoxy polyether can be obtained by oxyethane, propylene oxide and tetrahydrofuran by polymerization; wherein; described polymerization adopts initiator can be that primary alconol is as methyl alcohol, ethanol, propyl alcohol and ethylene glycol and propylene glycol etc.; can be secondary alcohol as Virahol, isopropylcarbinol and primary isoamyl alcohol etc., can be that the tertiary alcohol is as trimethylammonium butanols etc.; Can be monohydroxy-alcohol, dibasic alcohol, trivalent alcohol and tetravalent alcohol etc.; An acidic catalyst, basic catalyst or composite catalyst etc. can be used.
Described alkoxy polyether is preferably containing 2 ~ 100 carbon atoms.Described alkoxy polyether is 20 ~ 60wt% based on the content of aqueous cutting fluid, preferably 30 ~ 50wt%, particularly preferably 35 ~ 45wt%.
Described fluorocarbon surfactant is most important kind in special surface active agent, hydrogen atom in the hydrocarbon chain of finger hc-surfactant is all or part of to be replaced by fluorine atoms, namely fluorocarbon chain instead of hydrocarbon chain, and the nonpolar group therefore in tensio-active agent not only has the performance of hydrophobic property but also unique oleophobic.So fluorocarbon surfactant is exactly replace the tensio-active agent of hydrocarbon chain as non-polar group in molecule using fluorocarbon chain.
In the present invention in embodiment, tensio-active agent adopts the mixture of fluorine carbon and fluoride silicon surfactant, the mixture-base of described fluorine carbon and fluoride silicon surfactant is 0.0092 ~ 8wt% in the content of aqueous cutting fluid, is preferably 0.1 ~ 2wt%, is particularly preferably 0.1 ~ 1wt%.
The example of hydrophilic polyol and its derivative comprises ethylene glycol, glycol ether, triglycol, dipropylene glycol, tripropylene glycol and polyoxyethylene glycol.The preferred molecular-weight average 200 ~ 1000 of described polyoxyethylene glycol.Such as, Macrogol 200 and 400 is used.Preferably, hydrophilic polyol or derivatives thereof has solubleness in the water of at least 5 weight wt% at 20 DEG C, and is up to the vapour pressure of 0.01mmHg.If solubleness is lower than 5 weight wt% in the water of 20 DEG C, there will be must the problem of with an organic solvent clean wafer.Vapour pressure can increase risk on fire in cutting operation process higher than 0.01mmHg.
Hydrophilic polyol and/or its derivative can cause abrasive material dispersiveness to reduce lower than 20wt%, working accuracy can be caused to reduce equally more than 60wt%.
Aqueous cutting fluid comprises 0.01 ~ 20wt% further, more preferably the polymeric dispersant of 0.1 ~ 10wt%.Polymeric dispersant preferably includes the polymkeric substance of the salt of styrene-maleic anhydride copolymer.Object lesson comprises the ammonium salt of styrene-maleic anhydride copolymer alkyl ester, sylvite and sodium salt, the ammonium salt of optimization styrene-copolymer-maleic anhydride alkyl ester.The content of polymeric dispersant can cause the reduction of working accuracy lower than 0.01wt%, the viscosity of cutting fluid can be caused to raise equally more than 20wt%.
In the above-described embodiments, the content of water is 1wt% ~ 20wt%, and water-content can cause the problem of such as working accuracy step-down lower than 1wt%, and the addition of same water can cause aqueous cutting fluid to produce the problem of such as viscosity stability reduction more than 20wt%.
The embodiment of the present invention also proposed a kind of water-based and cuts slurry, comprises the aqueous cutting fluid of 100 weight parts and the abrasive material of 50 ~ 200 weight parts.Wherein, the abrasive material be applicable to comprises silicon carbide, aluminum oxide and diamond.Silicon carbide and diamond are more suitable for.
In the present embodiment, above-mentioned water-based is cut when slurry uses has outstanding advantage, and for scroll saw by the hard and such as silicon of fragility material, quartz, the ingot of crystal and compound semiconductor cuts into the form that can be used for microelectronics and optoelectronic equipment and manufacture.In the prior art, this water-based is cut and is starched and can mode same as the prior art use.
Compared with prior art, the aqueous cutting fluid that the present invention proposes and water-based are cut in slurry, comprise the alkyne diol of 0.0098 ~ 16wt% and the mixture of its alkylene oxide adduct, the alkoxy polyether of 19 ~ 62wt%, the fluorine carbon of 0.0092 ~ 8wt% and the mixture of fluoride silicon surfactant, this aqueous cutting fluid has the dispersion stabilization of abrasive material, and water-based cuts the viscosity stability of slurry, and the advantage of the working accuracy higher than prior art.
Applicant states, above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. an aqueous cutting fluid, it is characterized in that, it comprises the raw material according to following weight percentage proportioning: mixture 0.0092 ~ 8wt%, the surplus of mixture 0.0098 ~ 16wt%, the alkoxy polyether 19 ~ 50wt% of alkyne diol and its alkylene oxide adduct, fluorine carbon and fluoride silicon surfactant are water.
2. aqueous cutting fluid as claimed in claim 1, it is characterized in that, it comprises the raw material according to following weight percentage proportioning: mixture 0.1 ~ 2wt%, the surplus of mixture 0.1 ~ 10wt%, the alkoxy polyether 30 ~ 50wt% of alkyne diol and its alkylene oxide adduct, fluorine carbon and fluoride silicon surfactant are water.
3. aqueous cutting fluid as claimed in claim 1 or 2, it is characterized in that, it also comprises the raw material according to following weight percentage proportioning: hydrophilic polyol and/or its derivative 20 ~ 60wt%;
Hydrophilic polyol and/or its derivative are ethylene glycol, glycol ether, triglycol, dipropylene glycol, any one or multiple combination in tripropylene glycol and polyoxyethylene glycol.
4. the aqueous cutting fluid as described in any one of claim 1-2, is characterized in that, it also comprises the raw material according to following weight percentage proportioning: polymeric dispersant 0.01 ~ 20wt%.
5. aqueous cutting fluid as claimed in claim 3, it is characterized in that, it also comprises the raw material according to following weight percentage proportioning: polymeric dispersant 0.01 ~ 20wt%.
6. aqueous cutting fluid as claimed in claim 4, is characterized in that, polymeric dispersant is the ammonium salt of ethylene maleic acid anhydride copolymer alkyl ester, sylvite and sodium salt.
7. aqueous cutting fluid as claimed in claim 5, is characterized in that, polymeric dispersant is the ammonium salt of ethylene maleic acid anhydride copolymer alkyl ester, sylvite and sodium salt.
8. a water-based cuts slurry, and it is characterized in that, it comprises the aqueous cutting fluid described in any one of claim 1-4 of 100 weight parts and the abrasive material of 50 ~ 200 weight parts.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310247603.7A CN103421593B (en) | 2013-06-20 | 2013-06-20 | Aqueous cutting fluid and aqueous cutting pulp |
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| CN201310247603.7A CN103421593B (en) | 2013-06-20 | 2013-06-20 | Aqueous cutting fluid and aqueous cutting pulp |
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| CN103421593A CN103421593A (en) | 2013-12-04 |
| CN103421593B true CN103421593B (en) | 2015-07-22 |
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| JP6204029B2 (en) | 2013-03-06 | 2017-09-27 | 出光興産株式会社 | Aqueous processing fluid |
| CN106883921A (en) * | 2016-12-31 | 2017-06-23 | 洛科斯润滑油（上海）有限公司 | Aqueous cutting fluid |
| CN107030904A (en) * | 2017-05-11 | 2017-08-11 | 济源石晶光电频率技术有限公司 | Crystalline substance stone roller cutting method |
| CN113969207B (en) * | 2021-04-27 | 2022-12-02 | 暨南大学 | Metal hot rolling forming anti-friction, anti-wear and anti-oxidation lubricant, and preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6383991B1 (en) * | 1998-04-03 | 2002-05-07 | Kao Corporation | Cutting oil composition |
| JP5464055B2 (en) * | 2009-06-02 | 2014-04-09 | 日信化学工業株式会社 | Water-based cutting fluid and water-based cutting agent |
| CN101712907A (en) * | 2009-08-26 | 2010-05-26 | 辽阳科隆化学品有限公司 | Composition and application combination of water-soluble silicon material cutting fluid |
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