CN103421593A - Aqueous cutting fluid and aqueous cutting pulp - Google Patents
Aqueous cutting fluid and aqueous cutting pulp Download PDFInfo
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- CN103421593A CN103421593A CN2013102476037A CN201310247603A CN103421593A CN 103421593 A CN103421593 A CN 103421593A CN 2013102476037 A CN2013102476037 A CN 2013102476037A CN 201310247603 A CN201310247603 A CN 201310247603A CN 103421593 A CN103421593 A CN 103421593A
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Abstract
The invention provides aqueous cutting fluid which comprises the following raw materials by weight: 0.0098-16% of mixture of alkyne glycol and alkylene oxide affixture, 19-62% of alkoxy polyether, 0.0092-8% of mixture of fluorocarbon and fluorosilicone surfactants and the balance of water. The aqueous cutting fluid is combined with abrasives to form aqueous cutting pulp. The aqueous cutting pulp has the advantages of dispersion stability, viscosity stability and higher processing precision of the abrasives.
Description
Technical field
The present invention relates to the cutting fluid technical field, relate in particular to a kind of water-based cutting fluid and water-based cutting slurry.
Background technology
Cutting fluid comprises the oil base cutting fluid that comprises mineral oil and additive, comprises polyoxyethylene glycol or the polypropylene glycol glycol-based cutting fluid as main component, and the water-based cutting fluid of water phase surfactant mixture form.Yet these cutting fluids have shortcoming.The oil base cutting fluid is poor at the cutting point cooling performance.If workpiece or instrument are polluted by the oil base cutting fluid, the organic solvent cleaning liquor is exactly essential, and this is undesirable from environmental.Viscosity stability in the cutting operation process of glycol-based cutting fluid and water-based cutting fluid and the dispersion stabilization of abrasive material are wanting in.
CN101906346A discloses a kind of water-based cutting fluid and slurry, the alkyne diol that the water-based cutting fluid comprises 0.01-20wt% or its alkylene oxide affixture, then form a kind of water-based cutting slurry in conjunction with abrasive material, this water-based cutting slurry has advantages of the working accuracy of dispersion stabilization, viscosity stability and the Geng Gao of abrasive material.
CN101712907A discloses a kind of composition and application combination of water-soluble silicon material cutting fluid.This cutting fluid contains: alkoxy polyether 50.0-95.0%, solvent 5.0-20.0%, tensio-active agent 0.1-2.0%, a small amount of water 0.1-5.0% and other functional agent 0.1-1.0%.This cutting fluid has the application combination that the characteristics pollution-free, that metals content impurity is low the invention still further relates to the cutting fluid based on mentioned component, during application, according to the character of cutting material, select suitable abrasive material to combine with it, the granular size of selected abrasive material should be controlled between the 0.5-50 micron, and the mixing ratio of abrasive material and cutting fluid is controlled at 30:100～80:100.
Silicon chip thins down in solar cell or similar field, and this just needs the water-based cutting fluid can adapt to this variation on diameter and thickness.But the water-based cutting fluid working accuracy of prior art still can not be satisfied the demand, this is just in the urgent need to a kind of water-based cutting fluid with working accuracy higher than prior art.
Summary of the invention
The invention provides a kind of water-based cutting fluid and water-based cutting slurry, the dispersion stabilization of abrasive material is good, and viscosity stability is good, and working accuracy is high.
The present invention proposes a kind of water-based cutting fluid, and it comprises the raw material according to following weight percentage proportioning: the mixture 0.0092～8wt% of the mixture 0.0098～16wt% of alkyne diol and its alkylene oxide affixture, alkoxy polyether 19～62wt%, fluorine carbon and fluoride silicon surfactant, surplus are water.
In a preferred embodiment, it comprises the raw material according to following weight percentage proportioning: the mixture 0.1～2wt% of the mixture 0.1～10wt% of alkyne diol and its alkylene oxide affixture, alkoxy polyether 30～50wt%, fluorine carbon and fluoride silicon surfactant, surplus are water.
In further embodiment, it also comprises the raw material according to following weight percentage proportioning: wetting ability polyvalent alcohol and/or its derivative 20～60wt%.
In further embodiment, it also comprises the raw material according to following weight percentage proportioning: polymeric dispersant 0.01～20wt%.
In preferred embodiments, cutting fluid can also comprise the wetting ability polyvalent alcohol of water, 40～78wt% of 1～20wt% and/or its derivative interior, and the more preferably polymeric dispersant of 0.01～20wt%.Described wetting ability polyvalent alcohol or derivatives thereof is solubleness in 20 ℃ of water with 5wt% at least preferably, and be up to the vapour pressure of 0.01mmHg.Polymeric dispersant comprises the polymkeric substance of the salt of styrene-maleic anhydride copolymer.
The invention allows for a kind of water-based cutting slurry, it comprises the water-based cutting fluid of 100 weight parts and the abrasive material of 50～200 weight parts.
Compared with prior art, in the water-based cutting fluid that the present invention proposes and water-based cutting slurry, the mixture of the alkyne diol that comprises 0.0098～16wt% and its alkylene oxide affixture, the alkoxy polyether of 19～62wt%, 0.0092 the fluorine carbon of～8wt% and the mixture of fluoride silicon surfactant, this water-based cutting fluid has the dispersion stabilization of abrasive material, the viscosity stability of water-based cutting slurry, and than prior art the advantage of higher working accuracy.
Embodiment
A kind of water-based cutting fluid that the present invention proposes comprises following raw material according to the weight percentage proportioning:
0.0098 the alkoxy polyether of the alkyne diol of～16wt% and/or its alkylene oxide affixture, 19～62wt%, 0.0092 the fluorine carbon of～8wt% and the mixture of fluoride silicon surfactant, the wetting ability polyvalent alcohol of 20～60wt% and/or its derivative, 0.01 the polymeric dispersant of～20wt%, surplus is water.
Alkyne diol or the content of its alkylene oxide affixture based on the water-based cutting fluid are 0.0098～16wt%wt%, preferably 0.1～15wt%, more preferably 0.1-10wt%.Cause the reduction of working accuracy lower than 0.0098wt%, higher than 16wt%, can cause insolubles to generate equally.
Described alkoxy polyether can be obtained by oxyethane, propylene oxide and tetrahydrofuran by polymerization; wherein; it can be that primary alconol is as methyl alcohol, ethanol, propyl alcohol and ethylene glycol and propylene glycol etc. that described polymerization adopts initiator; can be secondary alcohol as Virahol, isopropylcarbinol and primary isoamyl alcohol etc., can be that the tertiary alcohol is as trimethylammonium butanols etc.; Can be monohydroxy-alcohol, dibasic alcohol, trivalent alcohol and tetravalent alcohol etc.; Can use an acidic catalyst, basic catalyst or composite catalyst etc.
Described alkoxy polyether preferably contains 2～100 carbon atoms.The content of described alkoxy polyether based on the water-based cutting fluid is 20～60wt%, preferably 30～50wt%, particularly preferably 35～45wt%.
Described fluorocarbon surfactant is most important kind in special surface active agent, hydrogen atom in the hydrocarbon chain of finger hc-surfactant is all or part of to be replaced by fluorine atom, be that fluorocarbon chain has replaced hydrocarbon chain, so the nonpolar group in tensio-active agent not only have the performance of hydrophobic property but also unique oleophobic.So fluorocarbon surfactant is exactly to using fluorocarbon chain to replace the tensio-active agent of hydrocarbon chain as non-polar group in molecule.
In the present invention in embodiment, tensio-active agent adopts the mixture of fluorine carbon and fluoride silicon surfactant, the mixture-base of described fluorine carbon and fluoride silicon surfactant is 0.0092～8wt% in the content of water-based cutting fluid, is preferably 0.1～2wt%, is particularly preferably 0.1～1wt%.
The example of wetting ability polyvalent alcohol and its derivative comprises ethylene glycol, glycol ether, triglycol, dipropylene glycol, tripropylene glycol and polyoxyethylene glycol.The preferred molecular-weight average 200～1000 of described polyoxyethylene glycol.For example, use Macrogol 200 and 400.Preferably, wetting ability polyvalent alcohol or derivatives thereof is solubleness in 20 ℃ of water with at least 5 weight wt%, and be up to the vapour pressure of 0.01mmHg.If solubleness is lower than 5 weight wt% in the water of 20 ℃, there will be the with an organic solvent problem of clean wafer.Vapour pressure can increase risk on fire in the cutting operation process higher than 0.01mmHg.
Wetting ability polyvalent alcohol and/or its derivative can cause the dispersed reduction of abrasive material lower than 20wt%, more than 60wt%, can cause working accuracy to reduce equally.
The water-based cutting fluid further comprises 0.01～20wt%, more preferably the polymeric dispersant of 0.1～10wt%.Polymeric dispersant preferably includes the polymkeric substance of the salt of styrene-maleic anhydride copolymer.Object lesson comprises ammonium salt, sylvite and the sodium salt of styrene-maleic anhydride copolymer alkyl ester, the ammonium salt of optimization styrene-copolymer-maleic anhydride alkyl ester.The content of polymeric dispersant can cause the reduction of working accuracy lower than 0.01wt%, more than 20wt%, can cause the viscosity of cutting fluid to raise equally.
In the above-described embodiments, the content of water is 1wt%～20wt%, and water-content can cause the problem such as the working accuracy step-down lower than 1wt%, and the addition of same water can cause the water-based cutting fluid to produce the problem reduced such as viscosity stability more than 20wt%.
The embodiment of the present invention has also proposed a kind of water-based cutting slurry, the water-based cutting fluid that comprises 100 weight parts and the abrasive material of 50～200 weight parts.Wherein, applicable abrasive material comprises silicon carbide, aluminum oxide and diamond.Silicon carbide and diamond are more suitable for.
In the present embodiment, above-mentioned water-based cutting slurry has advantages of outstanding while using, will hard and fragility material for scroll saw such as silicon, quartz, the ingot of crystal and compound semiconductor cuts into the form that can be used for microelectronics and optoelectronic equipment manufacture.In the prior art, this water-based cutting slurry can mode same as the prior art be used.
Compared with prior art, in the water-based cutting fluid that the present invention proposes and water-based cutting slurry, the mixture of the alkyne diol that comprises 0.0098～16wt% and its alkylene oxide affixture, the alkoxy polyether of 19～62wt%, 0.0092 the fluorine carbon of～8wt% and the mixture of fluoride silicon surfactant, this water-based cutting fluid has the dispersion stabilization of abrasive material, the viscosity stability of water-based cutting slurry, and than prior art the advantage of higher working accuracy.
Applicant's statement, above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (7)
1. a water-based cutting fluid, it is characterized in that, it comprises the raw material according to following weight percentage proportioning: the mixture 0.0092～8wt% of the mixture 0.0098～16wt% of alkyne diol and its alkylene oxide affixture, alkoxy polyether 19～62wt%, fluorine carbon and fluoride silicon surfactant, surplus are water.
2. water-based cutting fluid as claimed in claim 1, it is characterized in that, it comprises the raw material according to following weight percentage proportioning: the mixture 0.1～2wt% of the mixture 0.1～10wt% of alkyne diol and its alkylene oxide affixture, alkoxy polyether 30～50wt%, fluorine carbon and fluoride silicon surfactant, surplus are water.
3. water-based cutting fluid as claimed in claim 1 or 2, is characterized in that, it also comprises the raw material according to following weight percentage proportioning: wetting ability polyvalent alcohol and/or its derivative 20～60wt%.
4. water-based cutting fluid as claimed in claim 3, is characterized in that, wetting ability polyvalent alcohol and/or its derivative are ethylene glycol, glycol ether, triglycol, dipropylene glycol, any one or multiple combination in tripropylene glycol and polyoxyethylene glycol.
5. water-based cutting fluid as described as claim 1-4 any one, is characterized in that, it also comprises the raw material according to following weight percentage proportioning: polymeric dispersant 0.01～20wt%.
6. water-based cutting fluid as claimed in claim 5, is characterized in that, ammonium salt, sylvite and sodium salt that polymeric dispersant is ethene-copolymer-maleic anhydride alkyl ester.
7. a water-based cutting slurry, is characterized in that the abrasive material of the described water-based cutting fluid of the claim 1-4 any one that it comprises 100 weight parts and 50～200 weight parts.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310247603.7A CN103421593B (en) | 2013-06-20 | 2013-06-20 | Aqueous cutting fluid and aqueous cutting pulp |
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| CN201310247603.7A CN103421593B (en) | 2013-06-20 | 2013-06-20 | Aqueous cutting fluid and aqueous cutting pulp |
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| CN103421593A true CN103421593A (en) | 2013-12-04 |
| CN103421593B CN103421593B (en) | 2015-07-22 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2966156A4 (en) * | 2013-03-06 | 2016-11-16 | Idemitsu Kosan Co | Aqueous working fluid |
| CN106883921A (en) * | 2016-12-31 | 2017-06-23 | 洛科斯润滑油（上海）有限公司 | Aqueous cutting fluid |
| CN107030904A (en) * | 2017-05-11 | 2017-08-11 | 济源石晶光电频率技术有限公司 | Crystalline substance stone roller cutting method |
| CN113969207A (en) * | 2021-04-27 | 2022-01-25 | 暨南大学 | Metal hot rolling forming anti-friction, anti-wear and anti-oxidation lubricant, and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383991B1 (en) * | 1998-04-03 | 2002-05-07 | Kao Corporation | Cutting oil composition |
| CN101712907A (en) * | 2009-08-26 | 2010-05-26 | 辽阳科隆化学品有限公司 | Composition and application combination of water-soluble silicon material cutting fluid |
| CN101906346A (en) * | 2009-06-02 | 2010-12-08 | 日信化学工业株式会社 | Aqueous cutting fluid and aqueous cutting agent |
-
2013
- 2013-06-20 CN CN201310247603.7A patent/CN103421593B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383991B1 (en) * | 1998-04-03 | 2002-05-07 | Kao Corporation | Cutting oil composition |
| CN101906346A (en) * | 2009-06-02 | 2010-12-08 | 日信化学工业株式会社 | Aqueous cutting fluid and aqueous cutting agent |
| CN101712907A (en) * | 2009-08-26 | 2010-05-26 | 辽阳科隆化学品有限公司 | Composition and application combination of water-soluble silicon material cutting fluid |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2966156A4 (en) * | 2013-03-06 | 2016-11-16 | Idemitsu Kosan Co | Aqueous working fluid |
| US9850443B2 (en) | 2013-03-06 | 2017-12-26 | Idemitsu Kosan Co., Ltd. | Aqueous working fluid |
| CN106883921A (en) * | 2016-12-31 | 2017-06-23 | 洛科斯润滑油（上海）有限公司 | Aqueous cutting fluid |
| CN107030904A (en) * | 2017-05-11 | 2017-08-11 | 济源石晶光电频率技术有限公司 | Crystalline substance stone roller cutting method |
| CN113969207A (en) * | 2021-04-27 | 2022-01-25 | 暨南大学 | Metal hot rolling forming anti-friction, anti-wear and anti-oxidation lubricant, and preparation method and application thereof |
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| CN103421593B (en) | 2015-07-22 |
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Effective date of registration: 20201014 Address after: Room 302, 3rd floor, West, building 16, electronic information industrial park, heli Park, Ningguo Economic and Technological Development Zone, Xuancheng City, Anhui Province Patentee after: Ningguo long term Intellectual Property Agency Co., Ltd Address before: Dragon Tianchang 239300 Anhui city of Chuzhou province Ji Xiang Yi Dragon Street Patentee before: TIANCHANG RUNDA METAL ANTIRUST AUXILIARY Co.,Ltd. |
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Effective date of registration: 20201223 Address after: 239300 Yilong street, Longji Township, Tianchang City, Chuzhou City, Anhui Province Patentee after: TIANCHANG RUNDA METAL ANTIRUST AUXILIARY Co.,Ltd. Address before: Room 302, 3rd floor, West, building 16, electronic information industrial park, heli Park, Ningguo Economic and Technological Development Zone, Xuancheng City, Anhui Province Patentee before: Ningguo long term Intellectual Property Agency Co., Ltd |
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Granted publication date: 20150722 Termination date: 20200620 |