CN103413757B - Laser machining device and control method thereof - Google Patents
Laser machining device and control method thereof Download PDFInfo
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- CN103413757B CN103413757B CN201210557488.9A CN201210557488A CN103413757B CN 103413757 B CN103413757 B CN 103413757B CN 201210557488 A CN201210557488 A CN 201210557488A CN 103413757 B CN103413757 B CN 103413757B
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- 238000000034 method Methods 0.000 title claims abstract description 61
- 238000003754 machining Methods 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 122
- 230000003287 optical effect Effects 0.000 claims abstract description 36
- 230000000903 blocking effect Effects 0.000 claims abstract description 26
- 230000010355 oscillation Effects 0.000 claims description 45
- 238000013532 laser treatment Methods 0.000 abstract description 56
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 41
- 239000001301 oxygen Substances 0.000 description 35
- 229910052760 oxygen Inorganic materials 0.000 description 35
- 230000008569 process Effects 0.000 description 35
- 238000012545 processing Methods 0.000 description 16
- 230000011664 signaling Effects 0.000 description 9
- 238000001514 detection method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
There is provided a kind of laser machining device and control method thereof herein, it only can carry out laser treatment to the partial selective of the pending laser treatment of substrate, and can prevent the fault that causes due to the vibration wherein produced.This laser machining device comprises: reative cell, places the platform of substrate above comprising; Laser generating unit, Emission Lasers bundle also comprises laser beam blocking unit; Optical unit, by reflecting and reflecting described laser beam, introduces this reative cell by the laser beam irradiated from this laser generating unit; Vibration detecting unit, detects the vibration of this reative cell, this laser generating unit, this optical unit or this platform; And controller, determine whether to operate this blocking unit according to the vibration signal sent from this vibration detecting unit.
Description
Technical field
The present invention relates to a kind of laser machining device and control method thereof, particularly relate to a kind of laser machining device and control method thereof, this laser machining device only can carry out laser treatment to the partial selective of the pending laser treatment of substrate, and can prevent the fault that causes due to the vibration wherein occurred.
Background technology
When manufacturing semiconductor device, flat-panel monitor (FPD) device or solar cell device etc., when at high temperature deposit film, thermal chemical reaction may cause reacting furnace to pollute, or may produce undesired compound.
Thus, the plasma activated chemical vapour deposition deposit film at low temperatures of laser excitation is used.
Meanwhile, due to the increase along with substrate specifications, be difficult to uniformity when guaranteeing thin film deposition and annealing, therefore proposed the various measures comprising laser annealing process.
Reative cell is provided with air inlet/gas outlet, is supplied reacting gas or discharges reacting gas from reative cell, and reative cell upper end is provided with silica glass window by described air inlet/gas outlet.Laser aid is positioned over above this silica glass window, and passes through this silica glass window and the substrate arrived reative cell from the laser beam that this laser aid is launched.
The laser beam irradiated in heavy curtain shape tilts a little perpendicular to substrate or relative to substrate.
Substrate along moving horizontally relative to a direction of laser beam, thus makes laser beam irradiation to the whole surface of substrate.
Name is called that the Korean Patent Application No. 10-2010-0138509A(of " for the length of adjusting energy bundle and the laser machining device of intensity " is disclosed on December 31st, 2010) disclose prior art of the present invention.
But extremely whole substrate is to perform laser treatment by laser beam irradiation due to general laser processing unit, and laser beam even can irradiate the part not needing to carry out processing of substrate, thus be difficult to the time reducing laser treatment.
In addition, general laser processing unit can not detect the vibration wherein occurred, and thus can not prevent because vibrating the fault caused.
Therefore, a kind of laser machining device overcoming this kind of problem of the prior art is needed.
Summary of the invention
The object of the present invention is to provide a kind of laser machining device and control method thereof, this laser machining device only can carry out laser treatment to the partial selective of the pending laser treatment of substrate, and can prevent the fault that causes due to the vibration wherein occurred.
According to a scheme of the present invention, a kind of laser machining device comprises: reative cell, places the platform of substrate above comprising; Laser generating unit, Emission Lasers bundle also comprises laser beam blocking unit; Optical unit, by reflecting and reflecting described laser beam, introduces this reative cell by the laser beam irradiated from this laser generating unit; Vibration detecting unit, detects the vibration of this reative cell, this laser generating unit, this optical unit or this platform; And controller, determine whether to operate this blocking unit according to the vibration signal sent from this vibration detecting unit.
This vibration detecting unit can comprise: the first vibration detecting sensor, it is provided to (beprovidedto) this reative cell; Second vibration detecting sensor, it is provided to this laser generating unit; 3rd vibration detecting sensor, it is provided to this optical unit; And the 4th vibration detecting sensor, it is provided to this platform.
According to another aspect of the present invention, a kind of control method of laser machining device, comprises the following steps: whether (a) places the reative cell of the platform of substrate Oscillation Amplitude above determining to comprise is less than preset value; B (), when the Oscillation Amplitude of this reative cell is less than this preset value, determines whether the Oscillation Amplitude launching the laser generating unit to the laser beam in this reative cell to be illuminated is less than preset value; C (), when the Oscillation Amplitude of this laser generating unit is less than preset value, determines whether the Oscillation Amplitude laser beam irradiated from this laser generating unit being introduced the optical unit of this reative cell is less than preset value; And (d) is when the Oscillation Amplitude of this optical unit is less than preset value, determine whether the Oscillation Amplitude of this platform is less than preset value.
The method also can comprise: when determining that the Oscillation Amplitude of this reative cell is more than or equal to this preset value in step (a)., stops described laser beam by the operation of this blocking unit.
The method also can comprise: when determining that the Oscillation Amplitude of this laser generating unit is more than or equal to this preset value in step (b), stops described laser beam by the operation of this blocking unit.
The method also can comprise: when determining that in step (c) Oscillation Amplitude of this optical unit is more than or equal to this preset value, stops described laser beam by the operation of this blocking unit.
The method also can comprise: when determining that the Oscillation Amplitude of this platform is more than or equal to this preset value in step (d), compensates (offset) described vibration by controlling this platform.
In laser machining device according to the present invention and control method thereof, only can irradiate the part of the pending laser treatment of substrate due to laser beam, the operating time of illuminating laser beam is shortened, and thus can reduce time and the cost of laser treatment.
In addition, in laser machining device according to the present invention and control method thereof, when vibration occurs in device, this device compensates this vibration by detecting described vibration or stops laser treatment, therefore prevents because vibrating the fault caused.
Accompanying drawing explanation
According to the specific descriptions done below in conjunction with accompanying drawing, above and other object of the present invention, other advantages of characteristic sum will become and be readily clear of understanding, in the accompanying drawings:
Fig. 1 is the perspective view of laser machining device according to an embodiment of the invention;
Fig. 2 is the reative cell of laser machining device and the schematic diagram of indexing unit according to an embodiment of the invention;
Fig. 3 is the plane graph of substrate, and laser machining device produces datum mark over the substrate according to an embodiment of the invention;
Fig. 4 is the perspective view of the indexing unit of laser machining device according to an embodiment of the invention;
Fig. 5 is the perspective view removing unit of laser machining device according to an embodiment of the invention;
Fig. 6 is the perspective view of stop (blocking) unit of laser machining device according to an embodiment of the invention;
Fig. 7 is laser machining device perspective view of (uponlaserinspection) when carrying out laser inspection according to an embodiment of the invention;
Fig. 8 is the perspective view of blocking unit when operating of laser machining device according to an embodiment of the invention;
Fig. 9 is the plane graph of the platform of laser machining device according to an embodiment of the invention;
Figure 10 is the block diagram of laser machining device according to an embodiment of the invention;
Figure 11 is the flow chart of the control method of laser machining device according to an embodiment of the invention;
Figure 12 is the flow chart of the oxygen discharge process of laser machining device according to an embodiment of the invention; And
Figure 13 is the flow chart of the vibration detection process of laser machining device according to an embodiment of the invention.
Embodiment
Below with reference to accompanying drawings exemplary embodiment of the present invention is described.Must understand, accompanying drawing not in accordance with accurate scale, and only for convenience of describe and clear for the purpose of, accompanying drawing can amplify in line thickness and part dimension.Clearly declare unless there are other, the term of singulatives such as used here " one ", " one " and " being somebody's turn to do " also can be intended to comprise plural form.And term used is here limited by considering function disclosed herein, and can change according to the custom of user or operator or wish.Therefore, should determine according to full text given here the definition of term.
Fig. 1 is the perspective view of laser machining device according to an embodiment of the invention; Fig. 2 is the reative cell of laser machining device and the schematic diagram of indexing unit according to an embodiment of the invention; And Fig. 3 is the plane graph of substrate, laser machining device produces datum mark over the substrate according to an embodiment of the invention.
Fig. 4 is the perspective view of the indexing unit of laser machining device according to an embodiment of the invention, and Fig. 5 is the perspective view removing unit of laser machining device according to an embodiment of the invention.
Referring to figs. 1 through Fig. 5, laser machining device comprises according to an embodiment of the invention: reative cell 10, and it places the platform 12 of substrate 100 above comprising; Indexing unit 20, is supplied to reative cell 10 to form datum mark 102 on the substrate 100; Sensing cell 26, it detects the position of substrate 100 or the position of datum mark 102; Driver element 14, it places the platform 12 of substrate 100 above moving; Laser generating unit 50, its illuminating laser beam; Optical unit 70, the laser beam that laser generating unit 50 is irradiated is sent in reative cell 10 by it; Blocking unit 51, it stops the laser beam irradiated from laser generating unit 50; Vacuum unit 30, is supplied to platform 12, so that oxygen is outside from the space drainage between substrate 100 and platform 12 to reative cell 10; Vibration detecting unit 80, the vibration of its detection reaction room 10, laser generating unit 50, optical unit 70 or platform 12; And controller 90, its in response to the position signalling sent from sensing cell 26 transmit operation signal to indexing unit 20 or driver element 14, also when substrate 100 is placed on platform 12, transmit operation signal operates to make performing oxygen discharge to its peripheral order from the central part 12a of platform 12 to vacuum unit 30, and determines whether to operate blocking unit 51 according to the vibration signal sent from vibration detecting unit 80.
When having received substrate 100 in reative cell 10, detected the position of substrate 100 by sensing cell 26, and position signalling has been sent to controller 90.Then, drive this driver element 14 in response to the operation signal sent from controller 90, and moving substrate 100, make target location in substrate 100 towards indexing unit 20.
When the target location in substrate 100 moves to towards indexing unit 20, the target location by indexing unit 20 in substrate 100 forms datum mark 102.
After forming datum mark 102 on the substrate 100, by calculating from the datum mark 102 determined based on the position signalling sent from sensing cell 26 to treating that the Distance geometry direction of the process position 106 that will perform laser treatment is thereon determined to process position 106.
Operation driver element 14, with moving substrate 100, makes the process position 106 of substrate 100 towards the laser beam be transmitted in reative cell 10.
Then, the laser beam from laser generating unit 50 is provided in reative cell 100 while it is reflected along optical unit 70.Here, laser beam is provided in reative cell 10 by the silica glass window be placed on the upside of reative cell 10.
Now, because substrate 100 is placed on the upper surface of the platform 12 in reative cell 10, therefore by being provided to the laser beam in reative cell 10, the process position 106 of substrate 100 performs laser treatment.
Indexing unit 20 comprises: processing unit 22, is placed in reative cell 10, and this processing unit 22 by laser beam irradiation to substrate 100; And removing unit 24, it sucks (suction) when being formed datum mark 102 by processing unit 22 from the impurity (foreignmatter) that substrate 100 produces, and it is outside this impurity to be disposed to reative cell 10.
Because processing unit 22 is placed in reative cell 10, therefore do not perform separately the operation forming datum mark 102 on the substrate 100, and datum mark 102 can be received in reative cell 10 substrate 100 afterwards and formed before execution laser treatment.
When forming datum mark 102, the laser beam irradiation provided from processing unit 22 to substrate 100, and is removed unit 24 from the impurity that substrate 100 produces and sucks and to be discharged into reative cell 10 outside.
Remove unit 24 to comprise: arc (curved) portion 24a, there is the C shape around processing unit 22; And vacuum hole 24b, be formed in curved portions 24a to suck impurity.
Curved portions 24a is c-shaped in plan view, and it is formed in be formed and removes region (block) lower end of unit 24, be configured to round processing unit 22 by the part of laser beam irradiation.
Multiple vacuum hole 24b is formed on the inwall of curved portions 24a, and be connected to vacuum pump, and the laser beam launched from processing unit 22 is thus irradiated to substrate 100 through curved portions 24a, thus forms datum mark 102.
Now, the impurity produced from substrate 100 is sucked by vacuum hole 24b, and is disposed to reative cell 10 outside along removing the path limited in unit 24.
Those skilled in the art can realize the path extended to reative cell 10 and processing unit 22 outside from vacuum hole 24b easily, thus omit its specifically diagram and description.
Sensing cell 26 comprises: first sensor 26a, for detecting the bight of substrate 100; Second transducer 26b, in order to the position of detection reference 102, and the 3rd transducer 26c, in order to detect the position of the laser beam be irradiated in reative cell 10.
When having received substrate 100 and this substrate 100 is placed on the upper surface of platform 12 in reative cell 10, multiple first sensor 26a has detected the bight of substrate 100, and sends position signalling, and the position of substrate 100 determined by controller 90 thus.
When substrate 100 departs from predeterminated position, drive this driver element 14 according to the drive singal sent from controller 90, thus moving substrate 100.
Thus, substrate 100 can be placed on predetermined position, make target location in substrate 100 can towards indexing unit 20, and laser beam exposes to target location to form datum mark 102 from processing unit 22.
When datum mark 102 is formed completely, by the position of the second transducer 26b detection reference 102, position signalling is sent to controller 90 by the second transducer 26b successively.Then, controller 90 comes computing position 106 based on datum mark 102.
Because the 3rd transducer 26c detects the position being irradiated to the laser beam in reative cell 10 by optical unit 70, therefore the position of laser beam is controlled as and makes the position of laser beam irradiation towards the process position 106 of substrate 100 of initial platform being arranged in laser treatment.
Fig. 6 is the perspective view of the blocking unit of laser machining device according to an embodiment of the invention, Fig. 7 is the perspective view of laser machining device when carrying out laser inspection according to an embodiment of the invention, and Fig. 8 is the perspective view of blocking unit when operating of laser machining device according to an embodiment of the invention.
Fig. 9 is the plane graph of the platform of laser machining device according to an embodiment of the invention, and Figure 10 is the block diagram of laser machining device according to an embodiment of the invention.
With reference to Fig. 1 and Fig. 6 to Figure 10, vacuum unit 30 comprises: multiple vacuum hole 32, is provided to platform 12; And vacuum pump 34, be connected to vacuum hole 32 so that oxygen discharge is outside to reative cell 10.
The position of substrate 100 is being detected and the target location in substrate 100 to be configured to towards after indexing unit 20 by driver element 14 by sensing cell 26, operated vacuum pumps 34, is made the oxygen remained in the space between substrate 100 and platform 12 be sucked by vacuum hole 32 and is disposed to reative cell 10 outside.
Thus, can prevent oxygen from remaining between substrate 100 and platform 12, and can prevent from producing impurity on the substrate 100 during laser treatment.
Platform 12 comprises: central part 12a, and the center through platform 12 of being set to is to be divided into two symmetric parts (section) by platform 12; First sidepiece 12b, contiguous central part 12a; Second sidepiece 12c, the outside of contiguous first sidepiece 12b; 3rd sidepiece 12d, the outside of contiguous second sidepiece 12c; And multiple cross part 12e, be set to intersect with the second sidepiece 12c.
When from space drainage oxygen between substrate 100 and platform 12, in order to the central part 12a preventing oxygen from remaining in substrate 100, from the central part 12a of substrate 100 towards substrate 100, peripheral order performs the operation of discharge oxygen.
Thus, as mentioned above, the upper surface of platform 12 is divided into central part 12a, the first sidepiece 12b, the second sidepiece 12c, the 3rd sidepiece 12d and cross part 12e, and places the outside blast pipe (exhaustline) extended from each several part to reative cell 10.
Vacuum hole 32 comprises: the first vacuum hole 32a, is formed in central part 12a; Second vacuum hole 32b, is formed in the first sidepiece 12b; 3rd vacuum hole 32c, is formed in the second sidepiece 12c; 4th vacuum hole 32d, is formed in the 3rd sidepiece 12d; And the 5th vacuum hole 32e, be formed in cross part 12e.
When substrate 100 to be precisely placed on platform 12 thus to make target location in substrate 100 towards indexing unit 20, it is connected to the first vacuum hole 32a be formed in the central part 12a of platform 12 to drive the first vacuum pump 34a() discharge oxygen with the central part 12a from substrate 100.
Afterwards, order drives the second vacuum pump 34b, the 3rd vacuum pump 34c, the 4th vacuum pump 34d and the 5th vacuum pump 34e, thus sequentially discharge oxygen from the first sidepiece 12b, the second sidepiece 12c, the 3rd sidepiece 12d and cross part 12e, therefore prevent oxygen from remaining between substrate 100 and platform 12.
Cross part 12e refers to and the part that the second sidepiece 12c intersects, and arranges multiple cross part 12e at uniform intervals.
When large-sized substrate 100 is placed on platform 12, even if sequentially oxygen is disposed to outside from central part 12a, in the space between central part 12a and the 3rd sidepiece 12d, still oxygen may be retained.
Thus, from central part 12a along horizontal side to after sequentially discharging oxygen, when discharging oxygen from the cross part 12e intersected with the second sidepiece 12c, can effectively prevent oxygen from remaining between large-sized substrate 100 and platform 12.
Blocking unit 51 comprises: housing 52, and it is placed on the outlet place of laser generating unit 50 and comprises entrance 52a and outlet 52b; First stop part 54, is placed on reflection lasering beam between entrance 52a and outlet 52b, thus prevents laser beam from passing through outlet 52b irradiation; And power meter (powermeter) 58, for measuring the intensity of the laser beam reflected by the first stop part 54.
When laser beam irradiates from laser generating unit 50 substrate 100 be placed on platform 12, laser beam is introduced in housing 52 by entrance 52a, and is irradiated towards optical unit 70 by outlet 52b.
Be irradiated to the laser beam among optical unit 70 after multiple lens, described laser beam orientating reaction room 10 reflects or reflects, and exposes to the substrate 100 be placed on platform 12.
In the present embodiment, because laser beam is optionally stopped by blocking unit 51, therefore during the operation of laser generating unit 50, the laser beam be irradiated in reative cell 10 selectively stops.
Thus, laser treatment can be performed as and make continuous arrangement between the process position 106 of pending laser treatment on the substrate 100 have interval.
When in the reative cell 10 that laser beam is irradiated to the substrate 100 be placed on platform 12, laser beam is utilized to perform laser treatment to substrate 100, along with platform 12 is moved to side by driver element 14, laser beam performs laser treatment over a wide region while scanning substrate 100.
In the present embodiment, laser beam is optionally irradiated in reative cell 10 by blocking unit 51.Thus, when while the movement of platform 12 drived unit 14 with the uniform time interval by laser beam irradiation to reative cell 10 time, substrate 100 stands laser treatment, thus arranges multiple process position 106 at uniform intervals.
First stop part 54 comprises: the first reflecting plate 54a, is placed between entrance 52a and outlet 52b; First rotating shaft 54b, in order to support the first reflecting plate 54a and to be rotationally disposed in housing 52; And the first motor 54c, in order to provide power to the first rotating shaft 54b.
First rotating shaft 54b is connected to one end of the first reflecting plate 54a.Thus, when the first rotating shaft 54b is rotated by the first motor 54c, the space of the first reflecting plate 54a while rotating around rotating shaft between entrance 52a and outlet 52b.
When the first reflecting plate 54a is arranged between entrance 52a and outlet 52b, the laser beam introduced in housing 52 by entrance 52a is reflected by the first reflecting plate 54a, and is drawn towards power meter 58, instead of it is outside to be discharged into housing 52 along outlet 52b.
Thus, when in laser beam irradiation to reative cell 10, laser beam irradiated with the uniform time interval, and performed laser treatment to form gap 104 between process position 106 on the substrate 100.
Because the laser beam irradiation reflected by the first reflecting plate 54 is to power meter 58, therefore, it is possible to measure the intensity of the laser beam irradiated from laser generating unit 50.
In the present embodiment of the present invention, blocking unit 51 also comprises: the second stop part 56, and it is by the first stop part 54 reflection lasering beam; And beam dump (beamdump) 59, it compensates the laser beam that (offset) is reflected by the second stop part 56.
The laser beam reflected due to the first reflecting plate 54a is not drawn towards power meter 58 but is reflected towards beam dump 59 by the operation of the second stop part 56, and therefore laser beam is compensated by beam dump 59.
The operation utilizing power meter 58 to measure the intensity of laser beam is performed periodically, or is performed when performing test under given conditions.
Thus, as in an embodiment of the present invention, when substrate 100 stands laser treatment at process position 106 place be interrupted, first stop part 54 and the second stop part 56 are operating as simultaneously and make the laser beam be transmitted in housing 52 by entrance 52a be reflected to beam dump 59, to be compensated by the first stop part 54 and the second stop part 56.
Second stop part 56 comprises: the second reflecting plate 56a, is placed between the first reflecting plate 54a and power meter 58; Second rotating shaft 56b, in order to support the second reflecting plate 56a and to be rotationally disposed in housing 52; And the second motor 56c, for providing power to the second rotating shaft 56b.
Because the second reflecting plate 56a is arranged between the first reflecting plate 54a and power meter 58, when applying electric power to rotate the second rotating shaft 56b to the second motor 56c, therefore reflected to beam dump 59 by the second reflecting plate 56 by the laser beam that the first reflecting plate 54 reflects to power meter 58.
First motor 54c is the large-size machine of rotating speed higher than the second motor 56c, thus makes the increase of the rotating speed along with the first reflecting plate 54a, the gap smaller between the process position 106 on substrate 100, and in case of emergency can stop laser beam immediately.
Vibration detecting unit 80 comprises: the first vibration detecting sensor 82, is provided to reative cell 10; Second vibration detecting sensor 84, is provided to laser generating unit 50; 3rd vibration detecting sensor 86, is provided to optical unit 70; And the 4th vibration detecting sensor 88, be provided to platform 12.
When performing laser treatment, the vibration occurred in reative cell 10 is measured by the first vibration detecting sensor 82, the vibration occurred in laser generating unit 50 is measured by the second vibration detecting sensor 84, measured the vibration occurred in optical unit 70 by the 3rd vibration detecting sensor 86, and measured the vibration occurred in platform 12 by the 4th vibration detecting sensor 88.
When the Oscillation Amplitude measured by the first to the 3rd vibration detecting sensor 82 to 86 is more than or equal to preset value, abnormality determined by controller 90, and sends drive singal to the first motor 54c.Then, first rotating shaft 54b rotate while, the first reflecting plate 54a by laser beam reflection to power meter 58.
Consequently, the laser beam be irradiated to along optical unit 70 in reative cell 10 can be stopped, and can laser treatment be stopped.
When the Oscillation Amplitude measured by the 4th vibration detecting sensor 88 is more than or equal to preset value, abnormality determined by controller 90, and transmits control signal to platform 12, thus the vibration occurred in compensating platform 12.
In the present embodiment, platform 12 is air platforms 12, and it is filled with the gas supporting this platform 12.Those skilled in the art can realize this air platform 12 easily, thus omit its specifically diagram or description.
In an embodiment of the present invention, optical unit 70 comprises: main body 74, is placed the blocking unit 51 of contiguous laser generating unit 50; Strutting piece 72, for supportive body 74; Passage 76, extends the silica glass window to reative cell 10 from main body 74; And feeding unit 78, configure by optical lens is placed into one end of passage 76.
3rd vibration detecting sensor 86 of optical unit 70 can be provided to main body 74, can be provided to the multiple lens be placed in passage 76, or can be provided to the optical lens be placed in feeding unit 78.
Those skilled in the art can improve this configuration easily, thus omit concrete diagram or the description of other embodiments.
Reference numeral 22a represents tap 22a, is irradiated from processing unit 22 by this tap 22a laser beam.
The control method of laser machining device according to an embodiment of the invention will be described below.
Figure 11 is the flow chart of the control method of laser machining device according to an embodiment of the invention.Figure 12 is the flow chart of the oxygen discharge process of laser machining device according to an embodiment of the invention.Figure 13 is the flow chart of the vibration detection process of laser machining device according to an embodiment of the invention.
Referring to figs. 1 through Figure 13, the control method of laser machining device comprises the following steps according to an embodiment of the invention: the position (S10) detecting the substrate 100 be placed in reative cell 10; Moving substrate 100, makes indexing unit 20 towards the target location (S20) in substrate 100; Drive indexing unit 20 to form datum mark 102(S30 on the substrate 100); Oxygen (S40) is removed from the space between substrate 100 and platform 12; After starting process, determine whether that initialization performs laser treatment (S50); Calculate and store the process position 106(S60 treating to perform laser treatment relative to datum mark 102); By laser beam from reative cell 10 external irradiation to reative cell 10 to perform laser treatment (S70) to the part corresponding with the process position 106 be stored in controller 90 of substrate 100; And determine whether the quantity of the substrate after laser treatment 100 reaches preset value (S80).
When substrate 100 to be provided in reative cell 10 and to be placed on platform 12, first sensor 26a detects the bight of substrate 100, and based on the position signalling sent from first sensor 26, compared by the position of controller 90 pairs of substrates 100 and predeterminated position.
When the position deviation predeterminated position of substrate 100, the drive singal sent from controller 90 is utilized to drive this driver element 14 to rearrange this substrate 100 in predetermined position.
Here used term " predeterminated position " refers to that the target location in substrate 100 is set to towards the position of indexing unit 20.
After being arranged on predetermined position at substrate 100 from processing unit 22 illuminating laser beam to form datum mark 102 on the substrate 100 time, datum mark 102 can be formed on the same position place of each substrate 100 repeating to be provided to reative cell 10.
After formation datum mark 102, the position of the second transducer 26b detection reference 102 also sends position signalling to controller 90, and the 3rd transducer 26c detection laser beam irradiation position send position signalling to controller 90.
Based on the position signalling sent from the second transducer 26b and the 3rd transducer 26c, controller 90 calculates the process position 106 treating to perform laser treatment relative to reference position 102.
By the operation of sensing cell 26, even if when repeating laser treatment when being provided in reative cell 10 by multiple substrate 100 successively, also laser treatment can be performed in same process position 106 place on multiple substrate 100.
Be determined at start to process after whether initialization perform in the operation S50 of laser treatment, when be determined at start process after not initialization perform laser treatment time, perform by laser beam from reative cell 10 external irradiation to reative cell 10 to perform the operation S70 of laser treatment to the part corresponding with the process position 106 be stored in controller 90 of substrate 100.
Carrying out in the large-scale production process of laser treatment to multiple substrate 100, performing laser treatment according to the same partial continuous of the process position 106 be stored in when initialization performs laser treatment in controller 90 to each substrate 100.
Thus, owing to eliminating for again performing laser treatment the operation S60 calculated relative to the process position of datum mark 102, therefore, it is possible to reduce the time of laser treatment.
In aforementioned laser treatment, because laser beam is optionally provided to reative cell 10 by the first reflecting plate 54a rotated by the first motor 54c, therefore laser treatment can be performed as and make it possible to arrange multiple process position 106 at uniform intervals continuously on the substrate 100.
Thus, in the process performed after being laser treatment, process position 106 is determined based on datum mark 102, and the process position 106 only after laser treatment can perform subsequent processes.
As mentioned above, owing to not performing laser treatment or subsequent processes on the substrate 100 being not used as product, but only on process position 106, perform these process, thus can reduce production time and cost.
When repeating laser treatment and the quantity of substrate 100 after laser treatment reaches preset value, terminate laser treatment.
Whether the quantity of the substrate 100 after determining laser treatment reaches in the operation (S80) of preset value, when determining that the quantity of the substrate after laser treatment 100 does not reach preset value, perform drawing off and supplying the operation (S90) of new substrate 100 substrate 100 standing laser treatment in reative cell 10, then perform the operation (S10) of the position detecting substrate 100.
The operation (S40) removing the oxygen remained between substrate 100 and platform 12 comprising: when being placed on when substrate 100 on the platform 12 in reative cell 10, discharges oxygen (S41) from the central part 12a of platform 12; When oxygen discharges completely from central part 12a, discharge oxygen (S42) from the first sidepiece 12b of contiguous central part 12a; When oxygen discharges completely from the first sidepiece 12b, discharge oxygen (S44) from the second sidepiece 12c in the outside of contiguous first sidepiece 12b; When oxygen discharges completely from the second sidepiece 12c, discharge oxygen (S46) from the 3rd sidepiece 12d in the outside of contiguous second sidepiece 12c; And when oxygen discharges completely from the 3rd sidepiece 12d, discharge oxygen (S48) from the cross part 12e intersected with the second sidepiece 12c.
Make target location in substrate 100 towards after indexing unit 20 at moving substrate 100, oxygen, from the central part 12a initial ejection of substrate 100, then sequentially discharges from the first sidepiece 12b, the second sidepiece 12c and the 3rd sidepiece 12d.
Then, because oxygen is discharged, therefore, it is possible to effectively prevent oxygen from remaining between substrate 100 and platform 12 again from the cross part 12e intersected with the second sidepiece 12c.
Specifically, when being placed on platform 12 by large-sized substrate 100, oxygen remains between the central part 12a of substrate 100 and side possibly.
In the present embodiment, because oxygen externally sequentially discharges from central part 12a, and again discharged, therefore, it is possible to more effectively prevent oxygen from remaining between large-sized substrate 100 and platform 12 from the cross part 12e intersected with the second sidepiece 12c afterwards.
In the operation (S70) of the execution laser treatment in the control method of laser machining device, perform the operation detecting the vibration occurred in reative cell 10, laser generating unit 50, optical unit 70 and platform 12.
In the control method of laser machining device, the process of the vibration in detection laser processing unit comprises: determine whether the Oscillation Amplitude of the reative cell 10 of the platform 12 placing substrate 100 above comprising is less than preset value (S110); When the Oscillation Amplitude of reative cell 10 is less than preset value, determine that laser generating unit 50(treats to be irradiated to the laser beam in reative cell 10 for generating) Oscillation Amplitude whether be less than preset value (S120); When the Oscillation Amplitude of laser generating unit 50 is less than preset value, determine that optical unit 70(is for introducing the laser beam irradiated from laser generating unit 50 in reative cell 10) Oscillation Amplitude whether be less than preset value (S130); And when the Oscillation Amplitude of optical unit 70 is less than preset value, determine whether the Oscillation Amplitude of platform 12 is less than preset value (S140).
When performing the operation S70 of laser treatment, the vibration of reative cell 10 is measured by the first vibration measurement sensor 82, the vibration of laser generating unit 50 is measured by the second vibration detecting sensor 84, the vibration of optical unit 70 is measured by the 3rd vibration detecting sensor 86, and by the vibration of the 4th vibration detecting sensor 88 measuring table 12.
In the operation S110 of vibration measuring reative cell 10, when determining that the Oscillation Amplitude of reative cell 10 is more than or equal to preset value, perform the operation S150 being stopped laser beam by the operation of blocking unit 51.
In the operation S120 of vibration measuring laser generating unit 50, when determining that the Oscillation Amplitude of laser generating unit 50 is more than or equal to preset value, perform the operation S150 being stopped laser beam by the operation of blocking unit 51.
In the operation S130 of vibration measuring optical unit 70, when determining that the Oscillation Amplitude of optical unit 70 is more than or equal to preset value, perform the operation S150 being stopped laser beam by the operation of blocking unit 51.
As mentioned above, when any one Oscillation Amplitude of measured reative cell 10, laser generating unit 50 and optical unit 70 is more than or equal to preset value, controller 90 is to the first motor 54c transmit operation signal.
Thus, because the first motor 54c drives the first rotating shaft 54b and the first reflecting plate 54a to rotate, therefore can not can be fed in reative cell 10 by outlet 52b by stopping by the laser beam of entrance 52a introducing housing 52.
In the operation S140 of the Oscillation Amplitude of measuring table 12, when determining that the Oscillation Amplitude of platform 12 is more than or equal to preset value, perform the operation S160 of parametric controller 12 compensation vibration.
In an embodiment of the present invention, because platform 12 is the air platforms 12 supported by air pressure, when the Oscillation Amplitude of platform 12 is more than or equal to preset value, air pressure is lowered, and the vibration being transmitted to platform 12 can be compensated by using the support unit of air pressure.
Therefore, the present invention can provide a kind of laser machining device and control method thereof, this laser machining device only optionally can perform laser treatment to the part of carrying out laser treatment that needs of substrate, simplifies aligning (alignment) operation of the substrate being used for laser treatment simultaneously.
Although provided some embodiments so that the present invention to be described, should be appreciated that these embodiments are only shows in schematic form, the various modification without prejudice to the spirit and scope of the present invention and application can have been conceived.And then although given the example that namely laser machining device control the method for laser machining device, they have been only schematic, and the present invention can be applicable to other products.Therefore, scope of the present invention should be limited by claims and being equal to.
Claims (7)
1. a laser machining device, comprising:
Reative cell, places the platform of substrate above comprising;
Laser generating unit, Emission Lasers bundle also comprises laser beam blocking unit;
Optical unit, by reflecting and reflecting the laser beam irradiated from this laser generating unit, introduces this reative cell by described laser beam;
Vibration detecting unit, detects the vibration of this reative cell, this laser generating unit, this optical unit or this platform; And
Controller, determines whether to operate this blocking unit according to the vibration signal sent from this vibration detecting unit, and wherein, described controller is determined:
Whether the Oscillation Amplitude of (a) reative cell is less than preset value;
B (), when the Oscillation Amplitude of this reative cell is less than this preset value, whether the Oscillation Amplitude of laser generating unit is less than preset value;
C (), when the Oscillation Amplitude of this laser generating unit is less than preset value, whether the Oscillation Amplitude of optical unit is less than preset value; And
D (), when the Oscillation Amplitude of this optical unit is less than preset value, whether the Oscillation Amplitude of this platform is less than preset value.
2. laser machining device according to claim 1, wherein this vibration detecting unit comprises: the first vibration detecting sensor, and it is provided to this reative cell; Second vibration detecting sensor, it is provided to this laser generating unit; 3rd vibration detecting sensor, it is provided to this optical unit; And the 4th vibration detecting sensor, it is provided to this platform.
3. a control method for laser machining device, comprises the following steps:
Whether a () places the reative cell of the platform of substrate Oscillation Amplitude above determining to comprise is less than preset value;
B (), when the Oscillation Amplitude of this reative cell is less than this preset value, determines whether the Oscillation Amplitude launching the laser generating unit to the laser beam in this reative cell to be illuminated is less than preset value;
C (), when the Oscillation Amplitude of this laser generating unit is less than preset value, determines whether the Oscillation Amplitude laser beam irradiated from this laser generating unit being introduced the optical unit of this reative cell is less than preset value; And
D (), when the Oscillation Amplitude of this optical unit is less than preset value, determines whether the Oscillation Amplitude of this platform is less than preset value.
4. method according to claim 3, also comprises: when determining that in step (a) Oscillation Amplitude of this reative cell is more than or equal to this preset value, stops described laser beam by the operation of blocking unit.
5. method according to claim 3, also comprises: when determining that in step (b) Oscillation Amplitude of this laser generating unit is more than or equal to this preset value, stops described laser beam by the operation of blocking unit.
6. method according to claim 3, also comprises: when determining that in step (c) Oscillation Amplitude of this optical unit is more than or equal to this preset value, stops described laser beam by the operation of blocking unit.
7. method according to claim 3, also comprises: when determining that in step (d) Oscillation Amplitude of this platform is more than or equal to this preset value, compensates described vibration by controlling this platform.
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| KR1020110138702A KR101361206B1 (en) | 2011-12-20 | 2011-12-20 | Laser processing apparatus and control method thereof |
| KR10-2011-0138702 | 2011-12-20 |
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| JPH04216614A (en) * | 1990-12-17 | 1992-08-06 | Mitsubishi Electric Corp | Laser beam irradiation device |
| JP3451476B2 (en) * | 1999-06-07 | 2003-09-29 | 住友重機械工業株式会社 | Multi-function machine anti-vibration device |
| JP2002035967A (en) | 2000-07-19 | 2002-02-05 | Murata Mach Ltd | Laser beam machine |
| JP2002353159A (en) * | 2001-03-23 | 2002-12-06 | Sumitomo Heavy Ind Ltd | Processing apparatus and method |
| JP2002336984A (en) * | 2001-05-11 | 2002-11-26 | Sumitomo Heavy Ind Ltd | Laser beam machining device |
| US6700096B2 (en) * | 2001-10-30 | 2004-03-02 | Semiconductor Energy Laboratory Co., Ltd. | Laser apparatus, laser irradiation method, manufacturing method for semiconductor device, semiconductor device, production system for semiconductor device using the laser apparatus, and electronic equipment |
| JP2002217101A (en) * | 2001-12-06 | 2002-08-02 | Nikon Corp | Exposure method and fabrication method of circuit pattern body using the method, or aligner and circuit pattern body fabricated by the aligner |
| JP2007208110A (en) * | 2006-02-03 | 2007-08-16 | Shimadzu Corp | Crystallization device, vibration evaluation method thereof, and optical base design method of crystallization device |
| KR100769849B1 (en) * | 2006-11-06 | 2007-10-24 | 코닉시스템 주식회사 | Beam profile module |
| JP4546577B1 (en) * | 2009-12-25 | 2010-09-15 | 菱木運送株式会社 | Digital tachograph |
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| KR101361206B1 (en) | 2014-03-21 |
| TWI492308B (en) | 2015-07-11 |
| TW201334078A (en) | 2013-08-16 |
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Effective date of registration: 20171019 Address after: Gyeonggi Do city of East China South Beach east beach all 8 road 15-5 Co-patentee after: Samsung Display Co., Ltd. Patentee after: Ap Cells Inc. Address before: Gyeonggi Do, South Korea Co-patentee before: Samsung Display Co., Ltd. Patentee before: Ap Cells Inc. |