CN103413757A - Laser processing apparatus and method of controlling the same - Google Patents
Laser processing apparatus and method of controlling the same Download PDFInfo
- Publication number
- CN103413757A CN103413757A CN2012105574889A CN201210557488A CN103413757A CN 103413757 A CN103413757 A CN 103413757A CN 2012105574889 A CN2012105574889 A CN 2012105574889A CN 201210557488 A CN201210557488 A CN 201210557488A CN 103413757 A CN103413757 A CN 103413757A
- Authority
- CN
- China
- Prior art keywords
- laser
- unit
- substrate
- laser beam
- reative cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000012545 processing Methods 0.000 title abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 122
- 230000003287 optical effect Effects 0.000 claims abstract description 34
- 230000000903 blocking effect Effects 0.000 claims abstract description 25
- 238000003754 machining Methods 0.000 claims description 50
- 230000010355 oscillation Effects 0.000 claims description 38
- 238000001514 detection method Methods 0.000 abstract description 12
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 230000007257 malfunction Effects 0.000 abstract 1
- 238000013532 laser treatment Methods 0.000 description 54
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 39
- 239000001301 oxygen Substances 0.000 description 35
- 229910052760 oxygen Inorganic materials 0.000 description 35
- 230000008569 process Effects 0.000 description 11
- 230000011664 signaling Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000003760 hair shine Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
The present disclosure provides a laser processing apparatus, which can selectively laser-process only a portion of a substrate to be laser-processed and can prevent malfunction due to vibration generated therein, and a method of controlling the same. The laser processing apparatus includes a reaction chamber including a stage on which a substrate is placed, a laser generating unit emitting a laser beam and including a laser beam blocking unit, an optical unit guiding a laser beam irradiated from the laser generating unit into the reaction chamber by reflecting and refracting the laser beam, a vibration detection unit detecting vibration of the reaction chamber, the laser generating unit, the optical unit, or the stage, and a controller determining whether the blocking unit is operated according to a vibration signal sent from the vibration detection unit.
Description
Technical field
The present invention relates to a kind of laser machining device and control method thereof, relate in particular to a kind of laser machining device and control method thereof, this laser machining device can be only optionally carries out laser treatment to the part of the pending laser treatment of substrate, and can prevent the fault caused due to the vibration wherein occurred.
Background technology
When manufacturing semiconductor device, flat-panel monitor (FPD) device or solar cell device etc., when deposit film at high temperature, thermal chemical reaction may cause reacting furnace to pollute, or may produce undesired compound.
Thereby the plasma activated chemical vapour deposition of use laser excitation is deposit film at low temperatures.
Simultaneously, due to the increase along with substrate specifications, the uniformity while being difficult to guarantee thin film deposition and annealing, therefore proposed the various measures that comprise that laser annealing is processed.
Reative cell is provided with air inlet/gas outlet, by described air inlet/gas outlet, supplies reacting gas or discharges reacting gas from reative cell, and be provided with silica glass window in the reative cell upper end.Laser aid is positioned over this silica glass window top, and passes through this silica glass window and arrive the substrate reative cell from the laser beam of this laser aid emission.
The laser beam that is the irradiation of heavy curtain shape tilts a little perpendicular to substrate or with respect to substrate.
Substrate moves horizontally along a direction with respect to laser beam, thereby makes the whole surface of laser beam irradiation to substrate.
The Korean Patent Application No. 10-2010-0138509A(that name is called " for the laser machining device of length and the intensity of adjusting energy bundle " is disclosed on December 31st, 2010) prior art of the present invention disclosed.
Yet, due to the general laser processing unit by laser beam irradiation to whole substrate to carry out laser treatment, what laser beam even can irradiate substrate does not need the part of processing, thereby is difficult to reduce the time of laser treatment.
In addition, the general laser processing unit can not detect the vibration wherein occurred, thereby can not prevent the fault caused because of vibration.
Therefore, need a kind of laser machining device that overcomes this class problem of the prior art.
Summary of the invention
The object of the present invention is to provide a kind of laser machining device and control method thereof, this laser machining device can be only optionally carries out laser treatment to the part of the pending laser treatment of substrate, and can prevent the fault caused due to the vibration wherein occurred.
According to a scheme of the present invention, a kind of laser machining device comprises: reative cell, the platform of placement substrate above comprising; Laser generating unit, the Emission Lasers bundle also comprises the laser beam blocking unit; Optical unit, by reflecting and reflecting described laser beam, will introduce this reative cell from the laser beam that this laser generating unit is irradiated; Vibration detecting unit, detect the vibration of this reative cell, this laser generating unit, this optical unit or this platform; And controller, according to the vibration signal sent from this vibration detecting unit, determine whether to operate this blocking unit.
This vibration detecting unit can comprise: the first vibration detecting sensor, and it is provided for (be provided to) this reative cell; The second vibration detecting sensor, it is provided for this laser generating unit; The 3rd vibration detecting sensor, it is provided for this optical unit; And the 4th vibration detecting sensor, it is provided for this platform.
According to another aspect of the present invention, a kind of control method of laser machining device comprises the following steps: whether the Oscillation Amplitude of (a) determining above comprising the reative cell of the platform of placing substrate is less than preset value; (b), when the Oscillation Amplitude of this reative cell is less than this preset value, determine whether the Oscillation Amplitude of the laser generating unit of the emission laser beam in this reative cell to be illuminated is less than preset value; (c), when the Oscillation Amplitude of this laser generating unit is less than preset value, determines and will whether be less than preset value from the Oscillation Amplitude that the laser beam that this laser generating unit is irradiated is introduced the optical unit of this reative cell; And (d) when the Oscillation Amplitude of this optical unit is less than preset value, determine whether the Oscillation Amplitude of this platform is less than preset value.
The method also can comprise: when the Oscillation Amplitude of determining this reative cell in step (a) was more than or equal to this preset value, the operation by this blocking unit stopped described laser beam.
The method also can comprise: when the Oscillation Amplitude of determining this laser generating unit in step (b) was more than or equal to this preset value, the operation by this blocking unit stopped described laser beam.
The method also can comprise: when the Oscillation Amplitude of determining this optical unit in step (c) was more than or equal to this preset value, the operation by this blocking unit stopped described laser beam.
The method also can comprise: when the Oscillation Amplitude of determining this platform in step (d) is more than or equal to this preset value, compensate (offset) described vibration by controlling this platform.
In laser machining device according to the present invention and control method thereof, due to laser beam, can only irradiate the part of the pending laser treatment of substrate, the operating time of illuminating laser beam is shortened, thereby can reduce time and the cost of laser treatment.
In addition, in laser machining device according to the present invention and control method thereof, during vibration-generating, this device compensates this vibration or stops laser treatment by detecting described vibration in device, so and prevents the fault caused because of vibration.
The accompanying drawing explanation
According to the specific descriptions of doing below in conjunction with accompanying drawing, above and other purpose of the present invention, feature and other advantages will become and be readily clear of understanding, in the accompanying drawings:
Fig. 1 is the perspective view of laser machining device according to an embodiment of the invention;
Fig. 2 is the reative cell of laser machining device according to an embodiment of the invention and the schematic diagram of indexing unit;
Fig. 3 is the plane graph of substrate, and laser machining device produces datum mark on this substrate according to an embodiment of the invention;
Fig. 4 is the perspective view of the indexing unit of laser machining device according to an embodiment of the invention;
Fig. 5 is the perspective view that removes unit of laser machining device according to an embodiment of the invention;
Fig. 6 is the perspective view that stops (blocking) unit of laser machining device according to an embodiment of the invention;
Fig. 7 is laser machining device perspective view of (upon laser inspection) when carrying out laser inspection according to an embodiment of the invention;
Fig. 8 is the perspective view of blocking unit when operation of laser machining device according to an embodiment of the invention;
Fig. 9 is the plane graph of the platform of laser machining device according to an embodiment of the invention;
Figure 10 is the block diagram of laser machining device according to an embodiment of the invention;
Figure 11 is the flow chart of the control method of laser machining device according to an embodiment of the invention;
Figure 12 is the flow chart of the oxygen discharge process of laser machining device according to an embodiment of the invention; And
Figure 13 is the flow chart of the vibration detection process of laser machining device according to an embodiment of the invention.
Embodiment
Below with reference to accompanying drawings exemplary embodiment of the present invention is described.Must understand, accompanying drawing is also drawn not according to accurate ratio, and only for convenience of describe and clear for the purpose of, accompanying drawing can amplify aspect lines thickness and part dimension.Unless there are other clearly to declare, " one " used, " one " and the term of singulatives such as " being somebody's turn to do " also can be intended to comprise plural form here.And term used is limited by considering function disclosed herein here, and can change according to user or operator's custom or wish.Therefore, to the definition of term, should determine according to full text given here.
Fig. 1 is the perspective view of laser machining device according to an embodiment of the invention; Fig. 2 is the reative cell of laser machining device according to an embodiment of the invention and the schematic diagram of indexing unit; And Fig. 3 is the plane graph of substrate, laser machining device produces datum mark on this substrate according to an embodiment of the invention.
Fig. 4 is the perspective view of the indexing unit of laser machining device according to an embodiment of the invention, and Fig. 5 is the perspective view that removes unit of laser machining device according to an embodiment of the invention.
Referring to figs. 1 through Fig. 5, laser machining device comprises according to an embodiment of the invention: reative cell 10, and it places the platform 12 of substrate 100 above comprising; Indexing unit 20, offer reative cell 10 on substrate 100, to form datum mark 102; Sensing cell 26, it detects the position of substrate 100 or the position of datum mark 102; Driver element 14, it places the platform 12 of substrate 100 above moving; Laser generating unit 50, its illuminating laser beam; Optical unit 70, its laser beam that laser generating unit 50 is irradiated is sent in reative cell 10; Blocking unit 51, it stops the laser beam irradiated from laser generating unit 50; Vacuum unit 30, offer platform 12, with by oxygen from the space drainage between substrate 100 and platform 12 to reative cell 10 outsides; Vibration detecting unit 80, the vibration of its detection reaction chamber 10, laser generating unit 50, optical unit 70 or platform 12; And controller 90, its in response to the position signalling sent from sensing cell 26 operation signal to indexing unit 20 or driver element 14, also when substrate 100 is placed on platform 12 operation signal to vacuum unit 30 so that start to carry out the oxygen emissions operation to its peripheral order from the central part 12a of platform 12, and determine whether to operate blocking unit 51 according to the vibration signal sent from vibration detecting unit 80.
When reative cell 10 is interior while having admitted substrate 100, by sensing cell 26, detect the position of substrates 100, and position signalling is sent to controller 90.Then, drive this driver element 14 in response to the operation signal sent from controller 90, and moving substrate 100, make target location in substrate 100 towards indexing unit 20.
When the target location in substrate 100 moved to towards indexing unit 20, the target location by indexing unit 20 in substrate 100 formed datum mark 102.
After on substrate 100, forming datum mark 102, definite datum mark 102 is determined processing position 106 to distance and the direction of the processing position 106 for the treatment of to carry out laser treatment thereon by calculating from the position signalling based on sending from sensing cell 26.
Then, from the laser beam of laser generating unit 50 at it along in being provided to reative cell 100 when optical unit 70 is reflected.Here, laser beam is provided in reative cell 10 by the silica glass window that is placed on reative cell 10 upsides.
Now, due to substrate 100, be placed on the upper surface of the platform 12 in reative cell 10, therefore by being provided to the laser beam in reative cell 10, carry out laser treatment on the processing position 106 of substrate 100.
Because processing unit 22 is placed in reative cell 10, therefore do not carry out separately the operation that forms datum mark 102 on substrate 100, and datum mark 102 can reative cell 10 is interior admitted substrate 100 after and before the execution laser treatment, form.
When forming datum mark 102, the laser beam irradiation provided from processing unit 22 is to substrate 100, and from the impurity that substrate 100 produces, is removed unit 24 and sucks and be discharged into reative cell 10 outsides.
Removing unit 24 comprises: arc (curved) 24a of section has the C shape around processing unit 22; And vacuum hole 24b, be formed in curved portions 24a to suck impurity.
Curved portions 24a is c-shaped in plane graph, and it is formed on and forms the lower end, zone (block) remove unit 24, be configured to round processing unit 22 by the part of laser beam irradiation.
A plurality of vacuum hole 24b are formed on the inwall of curved portions 24a, and are connected to vacuum pump, from the laser beam of processing unit 22 emissions, pass through curved portions 24a and shine substrate 100 thus, thereby forming datum mark 102.
Now, the impurity produced from substrate 100 is sucked by vacuum hole 24b, and is disposed to reative cell 10 outsides along removing the path limited in unit 24.
Those skilled in the art can realize at an easy rate from vacuum hole 24b to reative cell 10 and the outside path of extending of processing unit 22, thereby omit its concrete diagram and describe.
When reative cell 10 is interior while having admitted on the upper surface that substrate 100 and this substrate 100 be placed on platform 12, a plurality of first sensor 26a detect the bight of substrates 100, and send position signalling, and controller 90 is determined the position of substrates 100 thus.
When substrate 100 departs from predeterminated position, according to the driving signal sent from controller 90, drive this driver element 14, thus moving substrate 100.
Thereby, substrate 100 can be placed on to predetermined position, make the target location in substrate 100 can be towards indexing unit 20, and laser beam expose to target location to form datum mark 102 from processing unit 22.
When datum mark 102 was formed fully, by the position of the second transducer 26b detection reference 102, the second transducer 26b was sent to position signalling controller 90 successively.Then, controller 90 comes computing position 106 based on datum mark 102.
Due to the 3rd transducer 26c, detect the position that shines the laser beam in reative cell 10 by optical unit 70, so the position of laser beam is controlled as the processing position 106 towards the substrate 100 of the initial platform that is arranged in laser treatment, the position that makes laser beam irradiation.
Fig. 6 is the perspective view of the blocking unit of laser machining device according to an embodiment of the invention, Fig. 7 is the perspective view of laser machining device when carrying out laser inspection according to an embodiment of the invention, and Fig. 8 is the perspective view of blocking unit when operation of laser machining device according to an embodiment of the invention.
Fig. 9 is the plane graph of the platform of laser machining device according to an embodiment of the invention, and Figure 10 is the block diagram of laser machining device according to an embodiment of the invention.
With reference to Fig. 1 and Fig. 6 to Figure 10, vacuum unit 30 comprises: a plurality of vacuum holes 32 are provided for platform 12; And vacuum pump 34, be connected to vacuum hole 32 oxygen is discharged into to reative cell 10 outsides.
In position and the target location in substrate 100 of by sensing cell 26, detecting substrate 100, be configured to after indexing unit 20 by driver element 14, operated vacuum pumps 34, make the oxygen in the space remained between substrate 100 and platform 12 suck and be disposed to reative cell 10 outsides by vacuum hole 32.
Thereby, can prevent that oxygen from remaining between substrate 100 and platform 12, and during laser treatment, can prevent producing impurity on substrate 100.
When the space drainage oxygen between substrate 100 and platform 12, in order to prevent oxygen, remain in the central part 12a of substrate 100, from the central part 12a of substrate 100, towards the peripheral order of substrate 100, carry out the operation of discharge oxygen.
Thereby as mentioned above, the upper surface of platform 12 is divided into central part 12a, the first sidepiece 12b, the second sidepiece 12c, the 3rd sidepiece 12d and cross part 12e, and place the 10 outside blast pipes (exhaust line) that extend from each several part to reative cell.
When thereby substrate 100 accurately was placed on platform 12 target location that makes in substrate 100 towards indexing unit 20, it was connected to the first vacuum hole 32a in the central part 12a that is formed at platform 12 to drive the first vacuum pump 34a() with the discharge of the central part 12a from substrate 100 oxygen.
Afterwards, order drives the second vacuum pump 34b, the 3rd vacuum pump 34c, the 4th vacuum pump 34d and the 5th vacuum pump 34e, thereby, sequentially from the first sidepiece 12b, the second sidepiece 12c, the 3rd sidepiece 12d and cross part 12e discharge oxygen, therefore prevent that oxygen from remaining between substrate 100 and platform 12.
When large-sized substrate 100 is placed on platform 12, even sequentially oxygen is disposed to outside from central part 12a, still may retain oxygen in the space between central part 12a and the 3rd sidepiece 12d.
Thereby, from central part 12a after horizontal side direction sequentially discharges oxygen, when the discharge of the cross part 12e from intersecting with the second sidepiece 12c oxygen, can prevent effectively that oxygen from remaining between large-sized substrate 100 and platform 12.
Blocking unit 51 comprises: housing 52, and it is placed on the outlet place of laser generating unit 50 and comprises entrance 52a and outlet 52b; The first stop part 54, be placed between entrance 52a and outlet 52b with reflection lasering beam, thereby prevent that laser beam from irradiating by exporting 52b; And power meter (power meter) 58, for measuring by the intensity of the laser beam of the first stop part 54 reflections.
When laser beam was placed on the substrate 100 on platform 12 from laser generating unit 50 irradiations, laser beam was introduced in housing 52 by entrance 52a, and by exporting 52b towards optical unit 70 irradiations.
Laser beam among shining optical unit 70 is through after a plurality of lens, and described laser beam orientating reaction chamber 10 reflects or reflection, and exposes to the substrate 100 be placed on platform 12.
In the present embodiment, optionally stop because laser beam is blocked unit 51, therefore the laser beam in the operating period of laser generating unit 50 shines reative cell 10 can optionally be stopped.
Thereby laser treatment can be performed as and make continuous arrangement between the processing position 106 of pending laser treatment on substrate 100 that interval be arranged.
In the time of in laser beam is irradiated to the reative cell 10 that is placed on the substrate 100 on platform 12, utilize laser beam to carry out laser treatment to substrate 100, along with platform 12 passes through driver element 14 to a side shifting, laser beam is carried out laser treatment on wide zone in scanning substrate 100.
In the present embodiment, laser beam optionally shines in reative cell 10 by blocking unit 51.Thereby, when when platform 12 drived units 14 move with the uniform time interval by laser beam irradiation in reative cell 10 time, substrate 100 stands laser treatment, thus to be spaced uniformly a plurality of processing position 106.
The first stop part 54 comprises: the first reflecting plate 54a is placed between entrance 52a and outlet 52b; The first rotating shaft 54b, in order to support the first reflecting plate 54a and to be can be rotatably set in housing 52; And the first motor 54c, in order to the first rotating shaft 54b, to provide power.
The first rotating shaft 54b is connected to the end of the first reflecting plate 54a.Thereby, as the first rotating shaft 54b by first motor 54c when rotation, the first reflecting plate 54a in around the rotating shaft rotation through entrance 52a and the space exported between 52b.
When the first reflecting plate 54a was arranged between entrance 52a and outlet 52b, the laser beam of introducing in housing 52 by entrance 52a was reflected by the first reflecting plate 54a, and is drawn towards power meter 58, rather than is discharged into housing 52 outsides along outlet 52b.
Thereby in reative cell 10 time, laser beam irradiated with the uniform time interval, and carried out laser treatment between the processing position 106 on substrate 100, to form gap 104 when laser beam irradiation.
Due to the laser beam irradiation by the first reflecting plate 54 reflections, to power meter 58, therefore can measure from the intensity of the laser beam of laser generating unit 50 irradiations.
In the present embodiment of the present invention, blocking unit 51 also comprises: the second stop part 56, and it is by the first stop part 54 reflection lasering beams; And beam dump (beam dump) 59, its compensation (offset) is by the laser beam of the second stop part 56 reflections.
Due to the laser beam of the first reflecting plate 54a reflection be not drawn towards power meter 58 but operation by the second stop part 56 towards beam dump 59 reflections, so laser beam is compensated by beam dump 59.
The operation that utilizes power meter 58 to measure the intensity of laser beam is periodically carried out, or is carried out when carrying out under given conditions test.
Thereby, as in an embodiment of the present invention, when substrate 100 stands laser treatment at 106 places, processing position that are interrupted, the first stop part 54 and the second stop part 56 are operating as simultaneously and make the laser beam be transmitted in housing 52 by entrance 52a be reflected to beam dump 59, with by the first stop part 54 and the second stop part 56 and compensated.
The second stop part 56 comprises: the second reflecting plate 56a is placed between the first reflecting plate 54a and power meter 58; The second rotating shaft 56b, in order to support the second reflecting plate 56a and to be can be rotatably set in housing 52; And the second motor 56c, for to the second rotating shaft 56b, providing power.
Because the second reflecting plate 56a is arranged between the first reflecting plate 54a and power meter 58, when applying electric power when rotating the second rotating shaft 56b for the second motor 56c, by the first reflecting plate 54 reflections to the laser beam of power meter 58 therefore by the second reflecting plate 56 reflections to beam dump 59.
The first motor 54c is the large-size machine of rotating speed higher than the second motor 56c, thereby makes the increase along with the rotating speed of the first reflecting plate 54a, the gap smaller between the processing position 106 on substrate 100, and can in case of emergency stop immediately laser beam.
When carrying out laser treatment, by the first vibration detecting sensor 82, measure the vibration occurred in reative cell 10, by the second vibration detecting sensor 84, measure the vibration occurred in laser generating unit 50, by the 3rd vibration detecting sensor 86, measure the vibration occurred in optical unit 70, and measure by the 4th vibration detecting sensor 88 vibration occurred in platform 12.
When the Oscillation Amplitude of being measured by the first to the 3rd vibration detecting sensor 82 to 86 was more than or equal to preset value, controller 90 was determined abnormality, and sent and drive signal to the first motor 54c.Then, in the first rotating shaft 54b rotation, the first reflecting plate 54a reflects laser beam to power meter 58.
Consequently, can stop along optical unit 70 and shine the laser beam in reative cell 10, and can stop laser treatment.
When the Oscillation Amplitude of being measured by the 4th vibration detecting sensor 88 was more than or equal to preset value, controller 90 was determined abnormality, and transmits control signal to platform 12, thus the vibration occurred in compensating platform 12.
In the present embodiment, platform 12 is air platforms 12, and it is filled with the gas that supports this platform 12.Those skilled in the art can realize this air platform 12 at an easy rate, thereby omit its concrete diagram or describe.
In an embodiment of the present invention, optical unit 70 comprises: main body 74 is placed the blocking unit 51 of contiguous laser generating unit 50; Strutting piece 72, for supportive body 74; Passage 76, the silica glass window from main body 74 extensions to reative cell 10; And feeding unit 78, by an end that optical lens is placed into to passage 76, configure.
The 3rd vibration detecting sensor 86 of optical unit 70 can be provided for main body 74, can be provided for a plurality of lens that are placed in passage 76, or can be provided for the optical lens be placed in feeding unit 78.
Those skilled in the art can improve this configuration at an easy rate, thereby omit concrete diagram or the description of other embodiment.
The control method of laser machining device according to an embodiment of the invention below will be described.
Figure 11 is the flow chart of the control method of laser machining device according to an embodiment of the invention.Figure 12 is the flow chart of the oxygen discharge process of laser machining device according to an embodiment of the invention.Figure 13 is the flow chart of the vibration detection process of laser machining device according to an embodiment of the invention.
Referring to figs. 1 through Figure 13, the control method of laser machining device comprises the following steps according to an embodiment of the invention: detect the position (S10) that is placed on the substrate 100 in reative cell 10; Moving substrate 100, make the target location (S20) of indexing unit 20 in substrate 100; Drive indexing unit 20 on substrate 100, to form datum mark 102(S30); From the space between substrate 100 and platform 12, remove oxygen (S40); After starting processing, determine whether initialization execution laser treatment (S50); Calculate and store the processing position 106(S60 that treats to carry out laser treatment with respect to datum mark 102); Laser beam is carried out to laser treatment (S70) with part corresponding to the processing position 106 with in being stored in controller 90 to substrate 100 from reative cell 10 external irradiations to reative cell 10; And whether the quantity of the substrate after definite laser treatment 100 reaches preset value (S80).
When substrate 100 is provided in reative cell 10 and be placed on platform 12, first sensor 26a detects the bight of substrate 100, and based on the position signalling sent from first sensor 26, position and predeterminated position by 90 pairs of substrates 100 of controller compare.
When the position deviation predeterminated position of substrate 100, utilize this driver element 14 of drive sent from controller 90 so that this substrate 100 is rearranged in predetermined position.
Here the term used " predeterminated position " refers to that the target location in substrate 100 is set to the position towards indexing unit 20.
When after substrate 100 is arranged on predetermined position from processing unit 22 illuminating laser beams with when substrate 100 forms datum mark 102, datum mark 102 can be formed on and repeat to provide the same position place to each substrate 100 of reative cell 10.
After forming datum mark 102, the position of the second transducer 26b detection reference 102 also sends position signallings to controller 90, and the 3rd transducer 26c detection laser beam irradiation position send position signallings to controller 90.
Based on the position signalling from the second transducer 26b and the 3rd transducer 26c transmission, the processing position 106 for the treatment of to carry out laser treatment that controller 90 calculates with respect to reference position 102.
By the operation of sensing cell 26, even in the situation that repeat laser treatment in successively a plurality of substrates 100 being provided to reative cell 10 time, also can carry out laser treatment in 106 places, same processing position on a plurality of substrates 100.
Be determined at after starting to process during the operation S50 of laser treatment is carried out in initialization, when be determined at start to process after not initialization while carrying out laser treatment, carry out laser beam carried out to the operation S70 of laser treatment with part corresponding to the processing position 106 with in being stored in controller 90 to substrate 100 from reative cell 10 external irradiations to reative cell 10.
In a plurality of substrates 100 are carried out to the large-scale production process of laser treatment, according to the processing position 106 be stored in controller 90 when laser treatment is carried out in initialization in, the same partial continuous of each substrate 100 is carried out to laser treatment.
Thereby, owing to for again carrying out laser treatment, having omitted the operation S60 of calculating with respect to the processing position of datum mark 102, therefore can reduce the time of laser treatment.
In aforementioned laser treatment, because laser beam optionally provides to reative cell 10 by the first reflecting plate 54a by the first motor 54c rotation, so laser treatment can be performed as and makes it possible to uniform interval, arrange continuously a plurality of processing position 106 on substrate 100.
Thereby, be to process position 106 and determined based on datum mark 102, and can only on the processing position 106 after laser treatment, carry out subsequent processes in the processing of carrying out after laser treatment.
As mentioned above, owing on the substrate 100 that is not used as product, not carrying out laser treatment or subsequent processes, but only processing these processing of execution on position 106, thereby can reduce production time and cost.
When the quantity of the substrate 100 after repeating laser treatment and laser treatment reaches preset value, finish laser treatment.
During whether the quantity of the substrate 100 after determining laser treatment reaches the operation (S80) of preset value, when the quantity of the substrate 100 after determining laser treatment does not reach preset value, the operation that draw off and supply new substrate 100 (S90) of execution to the substrate 100 that stands laser treatment in reative cell 10, then carry out the operation (S10) of the position of detecting substrate 100.
Removing the operation (S40) that remains in the oxygen between substrate 100 and platform 12 comprising: in the time of on the platform 12 in substrate 100 is placed on reative cell 10, from the central part 12a discharge oxygen (S41) of platform 12; When oxygen discharges fully from central part 12a, from the first sidepiece 12b discharge oxygen (S42) of contiguous central part 12a; When oxygen discharges fully from the first sidepiece 12b, from the second sidepiece 12c discharge oxygen (S44) in the outside of contiguous the first sidepiece 12b; When oxygen discharges fully from the second sidepiece 12c, from the 3rd sidepiece 12d discharge oxygen (S46) in the outside of contiguous the second sidepiece 12c; And when oxygen discharges fully from the 3rd sidepiece 12d, from the cross part 12e discharge oxygen (S48) intersected with the second sidepiece 12c.
At moving substrate 100 and the target location in making substrate 100 after indexing unit 20, oxygen, from the central part 12a initial ejection of substrate 100, then sequentially discharges from the first sidepiece 12b, the second sidepiece 12c and the 3rd sidepiece 12d.
Then, because oxygen is discharged again from the cross part 12e intersected with the second sidepiece 12c, therefore can prevent effectively that oxygen from remaining between substrate 100 and platform 12.
Particularly, when being placed on large-sized substrate 100 on platform 12, oxygen remains between the central part 12a and side of substrate 100 possibly.
In the present embodiment, because oxygen sequentially discharges to outside from central part 12a, and from the cross part 12e intersected with the second sidepiece 12c, again discharged afterwards, therefore can be prevented more effectively that oxygen from remaining between large-sized substrate 100 and platform 12.
In the operation (S70) of the execution laser treatment in the control method of laser machining device, carry out the operation that detects the vibration occurred in reative cell 10, laser generating unit 50, optical unit 70 and platform 12.
In the control method of laser machining device, the process of the vibration in the detection laser processing unit comprises: whether the Oscillation Amplitude of determining above comprising the reative cell 10 of the platform 12 of placing substrate 100 is less than preset value (S110); When the Oscillation Amplitude of reative cell 10 is less than preset value, determine that laser generating unit 50(treats to shine the laser beam of reative cell 10 for generation) Oscillation Amplitude whether be less than preset value (S120); When the Oscillation Amplitude of laser generating unit 50 is less than preset value, determine that optical unit 70(will be for introducing reative cell 10 from the laser beam that laser generating unit 50 is irradiated) Oscillation Amplitude whether be less than preset value (S130); And, when the Oscillation Amplitude of optical unit 70 is less than preset value, determine whether the Oscillation Amplitude of platform 12 is less than preset value (S140).
When carrying out the operation S70 of laser treatment, vibration by the first vibration measurement sensor 82 measurement reative cells 10, vibration by the second vibration detecting sensor 84 measurement laser generating unit 50, by the 3rd vibration detecting sensor 86, measured the vibration of optical units 70, and by the vibration of the 4th vibration detecting sensor 88 measuring tables 12.
In the operation S110 of the vibration of measuring reative cell 10, when the Oscillation Amplitude of determining reative cell 10 is more than or equal to preset value, carry out the operation S150 that stops laser beam by the operation of blocking unit 51.
In the operation S120 of the vibration of measuring laser generating unit 50, when the Oscillation Amplitude of determining laser generating unit 50 is more than or equal to preset value, carry out the operation S150 that stops laser beam by the operation of blocking unit 51.
In the operation S130 of the vibration of measuring optical unit 70, when the Oscillation Amplitude of determining optical unit 70 is more than or equal to preset value, carry out the operation S150 that stops laser beam by the operation of blocking unit 51.
As mentioned above, when any one Oscillation Amplitude of measured reative cell 10, laser generating unit 50 and optical unit 70 was more than or equal to preset value, controller 90 was to the first motor 54c operation signal.
Thereby because the first motor 54c drives the first rotating shaft 54b and the first reflecting plate 54a rotation, therefore the laser beam by entrance 52a introducing housing 52 can be blocked and can not be fed in reative cell 10 by outlet 52b.
In the operation S140 of the Oscillation Amplitude of measuring table 12, when the Oscillation Amplitude of determining platform 12 is more than or equal to preset value, carry out the operation S160 that controls platform 12 compensation vibrations.
In an embodiment of the present invention, due to platform 12, are the air platforms 12 that support by air pressure, when the Oscillation Amplitude of platform 12 was more than or equal to preset value, air pressure was lowered, and made the vibration that is transmitted to platform 12 to be compensated by the support unit that uses air pressure.
Therefore, the present invention can provide a kind of laser machining device and control method thereof, the part that this laser machining device can be only carries out laser treatment to the needs of substrate is optionally carried out laser treatment, simplifies simultaneously aligning (alignment) operation for the substrate of laser treatment.
Although provide some embodiment that the present invention is described, should be appreciated that these embodiment only are shows in schematic form, can conceive various modification and application without prejudice to the spirit and scope of the present invention.And then although provided the example that laser machining device is namely controlled the method for laser machining device, they are only schematically, and the present invention can be applicable to other products.Therefore, scope of the present invention should and be equal to by claims to limit.
Claims (7)
1. laser machining device comprises:
Reative cell, the platform of placement substrate above comprising;
Laser generating unit, the Emission Lasers bundle also comprises the laser beam blocking unit;
Optical unit, by the laser beam that reflection and refraction are irradiated from this laser generating unit, introduce this reative cell by described laser beam;
Vibration detecting unit, detect the vibration of this reative cell, this laser generating unit, this optical unit or this platform; And
Controller, determine whether to operate this blocking unit according to the vibration signal sent from this vibration detecting unit.
2. laser machining device according to claim 1, wherein this vibration detecting unit comprises: the first vibration detecting sensor, it is provided for this reative cell; The second vibration detecting sensor, it is provided for this laser generating unit; The 3rd vibration detecting sensor, it is provided for this optical unit; And the 4th vibration detecting sensor, it is provided for this platform.
3. the control method of a laser machining device comprises the following steps:
(a) above definite comprising, whether the Oscillation Amplitude of the reative cell of the platform of placement substrate is less than preset value;
(b), when the Oscillation Amplitude of this reative cell is less than this preset value, determine whether the Oscillation Amplitude of the laser generating unit of the emission laser beam in this reative cell to be illuminated is less than preset value;
(c), when the Oscillation Amplitude of this laser generating unit is less than preset value, determines and will whether be less than preset value from the Oscillation Amplitude that the laser beam that this laser generating unit is irradiated is introduced the optical unit of this reative cell; And
(d), when the Oscillation Amplitude of this optical unit is less than preset value, determine whether the Oscillation Amplitude of this platform is less than preset value.
4. method according to claim 3 also comprises: when the Oscillation Amplitude of determining this reative cell in step (a) was more than or equal to this preset value, the operation by this blocking unit stopped described laser beam.
5. method according to claim 3 also comprises: when the Oscillation Amplitude of determining this laser generating unit in step (b) was more than or equal to this preset value, the operation by this blocking unit stopped described laser beam.
6. method according to claim 3 also comprises: when the Oscillation Amplitude of determining this optical unit in step (c) was more than or equal to this preset value, the operation by this blocking unit stopped described laser beam.
7. method according to claim 3, also comprise: when the Oscillation Amplitude of determining this platform in step (d) is more than or equal to this preset value, compensate described vibration by controlling this platform.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110138702A KR101361206B1 (en) | 2011-12-20 | 2011-12-20 | Laser processing apparatus and control method thereof |
| KR10-2011-0138702 | 2011-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103413757A true CN103413757A (en) | 2013-11-27 |
| CN103413757B CN103413757B (en) | 2016-02-24 |
Family
ID=48865843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210557488.9A Active CN103413757B (en) | 2011-12-20 | 2012-12-20 | Laser machining device and control method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5602216B2 (en) |
| KR (1) | KR101361206B1 (en) |
| CN (1) | CN103413757B (en) |
| TW (1) | TWI492308B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI788035B (en) * | 2021-09-30 | 2022-12-21 | 天虹科技股份有限公司 | Film deposition machine for sensing shielding mechanism operated in open state and shielding state |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349040A (en) * | 1999-06-07 | 2000-12-15 | Sumitomo Heavy Ind Ltd | Vibration-absorbing device for compound machine |
| JP2002217101A (en) * | 2001-12-06 | 2002-08-02 | Nikon Corp | Exposure method and fabrication method of circuit pattern body using the method, or aligner and circuit pattern body fabricated by the aligner |
| JP2002336984A (en) * | 2001-05-11 | 2002-11-26 | Sumitomo Heavy Ind Ltd | Laser beam machining device |
| JP2002353159A (en) * | 2001-03-23 | 2002-12-06 | Sumitomo Heavy Ind Ltd | Processing apparatus and method |
| JP4546577B1 (en) * | 2009-12-25 | 2010-09-15 | 菱木運送株式会社 | Digital tachograph |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04216614A (en) * | 1990-12-17 | 1992-08-06 | Mitsubishi Electric Corp | Laser beam irradiation device |
| JP2002035967A (en) | 2000-07-19 | 2002-02-05 | Murata Mach Ltd | Laser beam machine |
| US6700096B2 (en) * | 2001-10-30 | 2004-03-02 | Semiconductor Energy Laboratory Co., Ltd. | Laser apparatus, laser irradiation method, manufacturing method for semiconductor device, semiconductor device, production system for semiconductor device using the laser apparatus, and electronic equipment |
| JP2007208110A (en) * | 2006-02-03 | 2007-08-16 | Shimadzu Corp | Crystallization device, vibration evaluation method thereof, and optical base design method of crystallization device |
| KR100769849B1 (en) * | 2006-11-06 | 2007-10-24 | 코닉시스템 주식회사 | Beam profile module |
-
2011
- 2011-12-20 KR KR1020110138702A patent/KR101361206B1/en active IP Right Grant
-
2012
- 2012-12-19 JP JP2012276996A patent/JP5602216B2/en active Active
- 2012-12-19 TW TW101148250A patent/TWI492308B/en active
- 2012-12-20 CN CN201210557488.9A patent/CN103413757B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349040A (en) * | 1999-06-07 | 2000-12-15 | Sumitomo Heavy Ind Ltd | Vibration-absorbing device for compound machine |
| JP2002353159A (en) * | 2001-03-23 | 2002-12-06 | Sumitomo Heavy Ind Ltd | Processing apparatus and method |
| JP2002336984A (en) * | 2001-05-11 | 2002-11-26 | Sumitomo Heavy Ind Ltd | Laser beam machining device |
| JP2002217101A (en) * | 2001-12-06 | 2002-08-02 | Nikon Corp | Exposure method and fabrication method of circuit pattern body using the method, or aligner and circuit pattern body fabricated by the aligner |
| JP4546577B1 (en) * | 2009-12-25 | 2010-09-15 | 菱木運送株式会社 | Digital tachograph |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013131754A (en) | 2013-07-04 |
| CN103413757B (en) | 2016-02-24 |
| KR20130071291A (en) | 2013-06-28 |
| JP5602216B2 (en) | 2014-10-08 |
| KR101361206B1 (en) | 2014-03-21 |
| TWI492308B (en) | 2015-07-11 |
| TW201334078A (en) | 2013-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101407976B1 (en) | Laser cutting equipment having the function of real time detecting a glass substrate breakage and the method for detecting a glass substrate breakage of the same | |
| CN1739865A (en) | Base plate processing device | |
| US20100147328A1 (en) | Foreign matter removal method and storage medium | |
| CN103406664A (en) | Laser processing apparatus | |
| JP2017085015A (en) | Method of manufacturing semiconductor device and semiconductor manufacturing apparatus | |
| KR20160101760A (en) | apparatus for slimming glass | |
| JP2012134419A (en) | Coating applicator and coating method | |
| JP2009222428A (en) | Glass plate thickness measuring instrument and glass plate thickness measuring method | |
| CN103409804A (en) | Laser processing apparatus and method of controlling the same | |
| CN103413757A (en) | Laser processing apparatus and method of controlling the same | |
| CN103170729B (en) | Laser machining device and control method thereof | |
| CN1589975A (en) | Base plate treater | |
| JP7012602B2 (en) | Local dry etching equipment | |
| KR20070060372A (en) | Apparatus for fabricating semiconductor device | |
| JP2013164444A (en) | Proximity exposure apparatus and method for display panel substrate | |
| KR200473165Y1 (en) | Substrate processing apparatus | |
| KR20070080767A (en) | Apparatus and method for treating a substrate | |
| TW202240953A (en) | Substrate processing apparatus | |
| KR20070033832A (en) | Character Forming System for Flat Panel Displays | |
| JP2007254840A (en) | Substrate treatment apparatus | |
| JP2006057150A (en) | Thin film depositing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171019 Address after: Gyeonggi Do city of East China South Beach east beach all 8 road 15-5 Co-patentee after: Samsung Display Co., Ltd. Patentee after: Ap Cells Inc. Address before: Gyeonggi Do, South Korea Co-patentee before: Samsung Display Co., Ltd. Patentee before: Ap Cells Inc. |