JP2002035967A - Laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a relative vibration between a laser head and works depend on a disturbance vibration and improve a working accuracy. SOLUTION: A body of a laser beam machine and a floor are installed in vibration sensors 31-33. Depending on vibration detected with the vibration sensors 31-33, a laser head 1 is installed in a vibration generating means 36 for giving the vibration in the direction to offset a relative vibration of the laser head 1 and the works W. The vibration generating means 36, for example, is comprised of a vibration generator 30 of the piezoelectric ceramics installed on the laser head 1, a wave processing device 34, and a vibration amplifier 35. The vibration generated by the vibration generator 30, for example, is a vibration in opposite phase wave motion of a vibration wave detected with the vibration sensor 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam machine for performing sheet metal working and the like.

[0002]

2. Description of the Related Art At the time of laser processing such as cutting of a sheet metal, a laser processing surface may be wavy due to disturbance vibration, resulting in a defective product. The disturbance vibration may be transmitted from another processing machine such as a punch press installed near the laser processing machine in addition to the movement of the work on the table or the movement of the laser head. For example, in the case where a plurality of laser / punch compound processing machines in which a laser head and a punch processing head are combined are arranged in parallel, when performing laser processing, if punching is performed by an adjacent compound processing machine, The vibration of the punch operation may be affected by laser processing as disturbance vibration. Conventionally, such disturbance vibrations have been dealt with by using the floor of the factory as an edge foundation, or mounting the table and press body of the multi-tasking machine on one structure and providing a foundation for vibration isolation. ing.

[0003]

The use of a foundation on the floor of a factory as an edge foundation or provision of an anti-vibration foundation requires a great deal of cost, and also imposes restrictions on later layout changes of the processing machine.

An object of the present invention is to reduce the relative vibration between a laser head and a work due to disturbance vibration and improve the processing accuracy. Another object of the present invention is to prevent the occurrence of defective machining due to disturbance vibration. Still another object of the present invention is to make it possible to easily perform appropriate vibration prevention according to the degree of vibration.

[0005]

The structure of the present invention will be described with reference to FIG. 3 corresponding to an embodiment. This laser processing machine is provided with a laser head (1), and is a laser processing machine for processing a work (W) by moving a work (W) or a laser head (1). Vibration sensors (31 to 33) are provided on the floor (S) on which the laser processing machine is installed, and the laser head (1) is provided on the laser head (1) according to the vibration detected by the vibration sensors (31 to 33). ) And the work (W) are provided with vibration generating means (36) for giving vibration in a direction to cancel the relative vibration. According to this configuration, when vibration is detected by the vibration sensors (31 to 33) during laser processing, the direction in which the relative vibration between the laser head (1) and the work (W) is canceled according to the detected vibration. Is given to the laser head (1) by the vibration generating means (36). For example, when the vibration of the laser head (1) is detected by the vibration sensor (31) provided in the laser head (1), the vibration generating means (36) gives a vibration having a phase opposite to the detected vibration. To Thereby, the vibration caused by the disturbance of the laser head (1) is canceled or weakened by the vibration applied from the vibration generating means (36). Therefore, the vibration of the laser head (1) due to disturbance vibration is reduced, and the processing accuracy is improved.

In the present invention, processing control means (38) for controlling laser processing is provided.
8) The laser processing may be stopped while the vibration detection values of the vibration sensors (31 to 33) are equal to or higher than a predetermined level (La). As described above, by stopping the processing while the vibration detection value is equal to or higher than the predetermined level (La), the occurrence of defective processing due to disturbance vibration is prevented.

In the present invention, the vibration sensor (31)
To 33), a plurality of judgment levels (L1 to Ln) for judging the magnitude of the vibration detected are provided, and the vibration generating means (31 to 3) are selected according to the corresponding judgment levels (L1 to Ln).
An applied vibration adjusting means (39) for changing the magnitude of the vibration generated in 3) may be provided. In the case of this configuration, the magnitude of the disturbance vibration is divided into a plurality of determination levels (L1 to Ln), and the vibration according to the corresponding determination levels (L1 to Ln) is given to the laser head (1). For this reason, it is possible to apply a canceling vibration according to the magnitude of the disturbance vibration, and to appropriately reduce the vibration and improve the processing accuracy. Further, since the magnitude of the disturbance vibration is distinguished stepwise at the determination levels (L1 to Ln), the control is easy.

[0008]

An embodiment of the present invention will be described with reference to the drawings. This laser processing machine includes a laser head 1,
A feed mechanism 2 for moving the work W relative to the laser head 1; In this example, the laser head 1 is fixedly installed on the frame 3, and the feed mechanism 2 moves the plate-shaped workpiece W on the table 4. Conversely, the work W may be fixedly installed on the table 4 and the feed mechanism 2 may move the laser head 1 with respect to the work W. This laser processing machine is configured as a combined laser / punch processing machine,
Is provided with a punching head 5 alongside the laser head 1. The frame 3 is divided into a frame main body 3A provided with the laser head 1 and the punching head 5, and a front frame 3B provided with the feed mechanism 2.

The laser head 1 is installed on the upper part of the frame 3 and is connected to a laser oscillator 7 via a duct 6. The punching head 5 is installed above the frame 3 and is a mechanism that drives the ram 8 up and down.
A mechanism is provided for converting the rotation of the motor 9 installed on the frame 3 into a reciprocating linear motion. The frame 3 is provided with an upper tool support 10 on which a plurality of punch tools driven up and down by the punching head 5 are mounted, and a lower tool support 11 on which a die tool corresponding to the punch tool is mounted. ing. These upper and lower tool supports 10 and 11 can be indexed so that an arbitrary tool corresponds to the punching head 5 and is formed of, for example, a turret.

As shown in FIG. 2, the feed mechanism 2 includes a carriage 14 that moves back and forth (in the Y-axis direction), and a cross slide 15 that is mounted on the carriage 14 so as to be movable left and right (in the X-axis direction). The cross slide 15 is provided with a plurality of work holders 16 capable of gripping an edge of the work W on the table 4. The forward and backward movement of the carriage 14 and the left and right movement of the cross slide 15 are performed by a Y-axis feed mechanism 21 and an X-axis feed mechanism 22 including motors 17 and 18 and ball screws 19 and 20 for each axis. The table 4 includes a central fixed table 4a and left and right movable tables 4b. The left and right movable tables 4b are moved back and forth together with the carriage 14.

As shown in FIG. 1, a laser generator 1 is provided with a vibration generator 30 and a vibration sensor 31, and another vibration sensor 3 is provided in the body of the laser processing machine and in the vicinity thereof.
2, 33 are provided. The vibration sensors 31 to 33
Among them, the vibration sensors 31 and 32 are respectively provided in the laser head 1 and the feed mechanism 2 which are part of the body of the laser processing machine, and the remaining vibration sensor 33 is provided on the floor surface S on which the laser processing machine is installed. In the vicinity of this laser processing machine. The vibration sensor 32 provided in the feed mechanism 2 includes:
It may be provided at any position in the feed mechanism 2, for example, provided at the work holder 16 or at the movable table 4b. All of the vibration sensors 31 to 33 may be provided, or one or a plurality of arbitrary ones may be provided. The vibration generator 30 is made of, for example, piezoelectric ceramics.

The outputs of the vibration sensors 31 to 33 are input to a waveform processor 34, and the output of the waveform
The signal is amplified at 5 and supplied to the vibration generator 30. The waveform processor 34 generates a vibration signal that causes the vibration generator 30 to generate a vibration in a direction to cancel the relative vibration between the laser head 1 and the work W in accordance with the vibration detected by the vibration sensors 31 to 33. It is said. These waveform processor 34, vibration amplifier 35, and vibration generator 30 provide vibration generation means 3.
6 are configured. Specifically, the waveform processor 34 is one of the following examples.

The first example of the waveform processor 34 converts a vibration wave of the vibration sensor 31 provided in the laser head 1 into an anti-phase wave. The antiphase wave output from the waveform processor 34 is amplified by the vibration amplifier 35 and supplied to the vibration generator 30. In this case, the feed mechanism 2 and the vibration sensors 32 and 33 on the floor S may be omitted. The feed mechanism 2 and the vibration sensor 32 of the floor surface S,
In the case where the vibration processor 33 is provided, the vibration detection output is used for switching the waveform processor 34 between an active state and an inactive state so that the processing of the waveform processor 34 is performed, for example, at a set vibration level or higher. Used to turn on / off the amplifier 35. The second example of the waveform processor 34 performs predetermined waveform processing on input waveforms from the vibration sensors 31 to 33 according to processing rules set for each of the vibration sensors 31 to 33 and outputs the processed waveforms. Is done. In this case, when there is an input from the plurality of vibration sensors 31 to 33, a composite waveform of the conversion processing result for each of the vibration sensors 31 to 33 is output.

The vibration generator 30 may be provided in the feed mechanism 2 instead of the laser head 1. In this case, the output of the vibration sensor 32 provided in the feed mechanism 2 is inverted by the waveform processing 34. The waveform processing may be performed, and the output may be amplified by the vibration amplifier 35 and provided to the vibration generator 30 provided in the feed mechanism 2 described above.

The operation of the above configuration will be described. When a vibration due to disturbance is detected by the vibration sensor 31 of the laser head 1 while performing laser processing by the laser head 1 (FIG. 4).
(A)), the detected vibration wave is converted into an anti-phase wave by the waveform processing means 34 (FIG. 4 (B)). This anti-phase wave is amplified by the vibration amplifier 35 and given to the vibration generator 30 of the laser head 1. Therefore, the vibration caused by the disturbance of the laser head 1 is canceled or weakened by the vibration applied from the vibration generator 30. Therefore, vibration of the laser head 1 due to disturbance vibration is reduced, and processing accuracy is improved. Therefore, as shown in FIG. 5, for example, when a cutting process is performed on the work W along a straight path a and a disturbance vibration is generated in the laser head 1, a longitudinal wave in the cutting direction, that is, a stripe pattern is generated on the laser cut surface. Such a stripe pattern is prevented by the application of the vibration of the opposite phase.

The vibration generating means 36 in FIG. 1 uses the waveform processing means 34 to output not only the above-mentioned output of the opposite phase wave but also the output of the vibration waveform in the direction of canceling the relative vibration between the laser head 1 and the work W. Then, the output is amplified and given to the vibration generator 30. For example, when a vibration is detected by the vibration sensor 32 of the feeding means 2, according to a preset processing rule regarding the relationship between the vibration of the feeding means 2 and the laser head 1,
Waveform processing is performed, and a vibration generation signal is given to the vibration generator 30. Further, in this embodiment, since the vibration sensor 33 for detecting the vibration of the floor surface is provided, the vibration can be detected quickly, and the vibration generator 30 of the laser head 1 can generate the vibration which cancels the anti-phase wave or the vibration of the workpiece. it can.

FIG. 3 shows another embodiment of the present invention. This example is similar to the embodiment shown in FIG.
8 and provided vibration adjusting means 39. The processing control means 38 is means for controlling laser processing, and has a function of stopping laser processing while the vibration detection values of the vibration sensors 31 to 33 are equal to or higher than a predetermined level La (FIG. 4). The processing control means 38 is a computer-type control means for controlling according to a processing program or the like, and includes a laser control unit 40 for controlling the laser oscillator 7 and a feed control unit 41 for controlling the feed means 2. It is. The processing control means 38 is provided with a processing stop means 42 for stopping the laser control unit 40 and the feed control unit 41 when a vibration equal to or higher than a predetermined stop determination level La is detected. Stop determination level La
Is provided corresponding to each of the vibration sensors 31 to 33, for example.

The applied vibration adjusting means 39 includes a vibration sensor 31.
A plurality of judgment levels L1 to Ln (n is an integer of 2 or more) for judging the magnitude of the vibration detected by the vibration generation means 30 to 33 are provided.
Change the magnitude of the vibration generated by. The process of changing the magnitude of the vibration is a process of changing the amplification factor of the vibration amplifier 35. Specifically, the applied vibration adjusting unit 39 includes a determining unit 44 and an adjusting unit 43. The determination unit 44 sets the above-described determination levels L1 to Ln (FIG. 4), and determines the detection signals of the vibration sensors 31 to 33 for the determination levels L1 to Ln. The determination levels L1 to Ln may be provided for each of the vibration sensors 31 to 33.
The outputs of Nos. 1-33 are amplified and subjected to the same determination levels L1-L.
The determination may be made with n. The adjusting unit 43 sets a plurality of grant levels (1) to (n), and provides grant levels corresponding to the determination levels L1 to Ln determined by the determination unit 44.
(1) Output the signals of (n). With this output, the amplification level of the vibration amplifier 35 is changed.

In the case of this embodiment, the vibration sensors 31 to 3
When the vibration detection value of No. 3 becomes equal to or higher than the predetermined level La, the laser processing is stopped by the command of the processing stop means 42 during that time. Therefore, the occurrence of defective machining due to disturbance vibration is prevented. Further, the magnitude of the disturbance vibration detected by the vibration sensors 31 to 33 is divided into a plurality of determination levels L1 to Ln by the determination unit 44 of the applied vibration adjustment unit 39,
It is determined which level corresponds. The output of the applied levels (1) to (n) according to the determination result is
5 and the cancellation vibration corresponding to the determination levels L1 to Ln is applied to the laser head 1. For this reason, the cancellation vibration according to the magnitude of the disturbance vibration can be applied to the laser head 1, and the appropriate reduction of the vibration and the improvement of the processing accuracy can be achieved.
Further, since the magnitude of the disturbance vibration is distinguished step by step at the plurality of determination levels L1 to Ln, the control is easier and more stable than the stepless control.

[0020]

The laser beam machine according to the present invention is a laser beam machine equipped with a laser head for processing a workpiece or a workpiece by moving the laser head. The laser beam machine body or the laser beam machine is installed. A vibration sensor is provided on the floor that has been set, and the laser head unit is provided with vibration generating means that applies vibration in a direction to cancel the relative vibration between the laser head and the work in accordance with the vibration detected by the vibration sensor. The relative vibration between the laser head and the work due to disturbance vibration can be reduced, and the processing accuracy can be improved. In the case where processing control means for controlling laser processing is provided and this processing control means is to stop laser processing while the vibration detection value of the vibration sensor is equal to or higher than a predetermined level,
It is possible to prevent the occurrence of defective processing due to disturbance vibration. In the case where a plurality of determination levels for determining the magnitude of vibration detected by the vibration sensor are provided, and provided vibration adjusting means for changing the magnitude of vibration generated by the vibration generating means according to the corresponding determination level is provided. Can easily perform appropriate vibration prevention according to the degree of vibration.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a front view of a laser processing machine according to an embodiment of the present invention and a block diagram of a control system thereof.

FIG. 2 is a plan view of the laser beam machine.

FIG. 3 is an explanatory diagram showing a front view of a laser processing machine according to another embodiment of the present invention and a block diagram of a control system thereof.

FIG. 4 is an explanatory diagram showing a relationship between a vibration detection signal and vibration to be applied.

FIG. 5 is an explanatory diagram of a processing example of a work.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Laser head 2 ... Feeding mechanism 3 ... Frame 4 ... Table 5 ... Processing head 7 ... Laser oscillator 30 ... Vibration generator 31-33 ... Vibration sensor 34 ... Waveform processor 35 ... Vibration amplifier 36 ... Vibration generator 38 ... Processing control means 39 Applied vibration adjusting means 42 Processing stop means S Floor surface W Work

Claims (3)

[Claims] 1. A laser beam machine having a laser head and processing a workpiece or a workpiece by moving the laser head, wherein a vibration sensor is provided on a body of the laser beam machine or a floor on which the laser beam machine is installed. A laser processing machine provided with vibration generating means for providing, in the laser head section, vibration in a direction for canceling relative vibration between the laser head and the workpiece in accordance with the vibration detected by the vibration sensor. 2. The laser according to claim 1, further comprising processing control means for controlling laser processing, wherein the processing control means stops laser processing while a vibration detection value of the vibration sensor is equal to or higher than a predetermined level. Processing machine. 3. Applied vibration adjustment for providing a plurality of determination levels for determining the magnitude of vibration detected by the vibration sensor, and changing the magnitude of vibration generated by the vibration generating means according to the corresponding determination level. 3. The laser beam machine according to claim 1, further comprising means.