CN103407254B - A kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof - Google Patents
A kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof Download PDFInfo
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- CN103407254B CN103407254B CN201310326746.7A CN201310326746A CN103407254B CN 103407254 B CN103407254 B CN 103407254B CN 201310326746 A CN201310326746 A CN 201310326746A CN 103407254 B CN103407254 B CN 103407254B
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Abstract
The present invention relates to a kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof, comprise: silica gel pad semi-finished product and surface dielectric layer material, described silica gel pad semi-finished product comprise the auxiliary agent that the resin matrix of 100 weight portions, the heat-conducting filler of 250 ~ 400 weight portions and weight are 1% ~ 10% of heat-conducting filler weight, described surface dielectric layer material comprises the one in conductive aluminum foil paper, conduction tinfoil, aluminized coating film, heat-conducting interface material prepared by the present invention had both had the intrinsic performance of heat-conducting interface material, had again the effect of abatement device electrostatic.
Description
Technical field
The present invention relates to a kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof, be applicable to electronics manufacturing area.
Background technology
Electronic devices and components operationally can produce a large amount of heat, and cannot be discharged due to heat, and at high temperature carry out work for a long time, material is easy to aging, and the life-span obviously shortens, and causes component failure to be scrapped.
And because electronic device often can produce electrostatic in running, electrostatic gathers and release, often between electronic device, electromagnetic interference occurs, thus affect the normal operation of equipment.
So developing a kind of can heat conduction but also the boundary material can eliminating surface electrostatic be not only instant.The boundary material of this specific function is different from conventional thermal conductive boundary material, only serves the effect of heat conduction, and at present in electronic application field, more and more payes attention to for the diversity of this function and particularity.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof, heat-conducting interface material prepared by the present invention had both had the intrinsic performance of heat-conducting interface material, made again a side surface have the effect of abatement device electrostatic.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of heat-conducting interface material eliminating surface electrostatic, comprising: silica gel pad semi-finished product and surface dielectric layer material, and silica gel pad semi-finished product are cream state, have mobility,
Wherein, described silica gel pad semi-finished product comprise the auxiliary agent that the resin matrix of 100 weight portions, the heat-conducting filler of 250 ~ 400 weight portions and weight are 1% ~ 10% of heat-conducting filler weight,
Described surface dielectric layer material comprises conductive aluminum foil paper, conduction tinfoil, the one in aluminized coating film.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described heat-conducting filler comprises the mixture of one or more in aluminium oxide, zinc oxide, boron nitride, aluminium nitride, titanium oxide, aluminium hydroxide.
Further, described auxiliary agent comprises the mixture of one or more in silane coupler, aluminate coupling agent, titanate coupling agent, silane crosslinker, dispersant, defoamer.
Present invention also offers a kind of preparation method eliminating the heat-conducting interface material of surface electrostatic, comprising:
1) get the side surface that surface conditioning agent is coated in surface dielectric layer material, coating thickness is 0.1 ~ 0.15mm, 100 DEG C ~ 150 DEG C bakings 5 ~ 10 minutes, until surface conditioning agent is dried completely;
2) take resin matrix and auxiliary agent, mixing, stir, to be mixed complete after, in said mixture, add heat-conducting filler, stir, obtain silica gel pad semi-finished product;
3) by 2) the silica gel pad semi-finished product that obtain are coated on 1) side surface (i.e. that face of surface media Material coating surface conditioning agent) of surface dielectric layer material that processed, coating thickness is 0.5mm ~ 10mm, use the heat-conducting interface material of the shaping desired thickness of format roll (0.5mm ~ 10mm), solidification, obtain
Wherein, described silica gel pad semi-finished product comprise the auxiliary agent that the resin matrix of 100 weight portions, the heat-conducting filler of 250 ~ 400 weight portions and weight are 1% ~ 10% of heat-conducting filler weight.
On the basis of technique scheme, the present invention can also do following improvement.
Further, in step 1), described surface conditioning agent to comprise in alcohol, acetone, toluene, natural rubber, butyl rubber, silicon rubber, ethylene propylene diene rubber one or more mixture.
The beneficial effect of this step is adopted to be strengthen surface dielectric layer material and the half-finished adhesiveness of silica gel pad.
Further, in step 2) in, described stirring technique condition is: vacuum defoamation 20 ~ 40 minutes under vacuum is-0.1MPa.
Further, in step 3), described in be cured as 130 DEG C solidification 20 ~ 40 minutes.
Adopt the beneficial effect of above-mentioned further scheme to be make material deaeration, after hot setting, product surface light is smooth, thus can ensure the heat-conducting effect of material.
The invention has the beneficial effects as follows:
The present invention is composite surface dielectric layer material while shaping heat-conducting pad, and the heat-conducting interface material prepared both had had the intrinsic performance of heat-conducting interface material, makes again a side surface have the effect of abatement device electrostatic.
Detailed description of the invention
Be described principle of the present invention and feature below, example, only for explaining the present invention, is not intended to limit scope of the present invention.
Embodiment 1
By alcohol and ethylene propylene diene rubber 1:1 mixing in mass ratio, obtain surface conditioning agent, surface conditioning agent is coated in a side surface of conductive aluminum foil paper, coating thickness is 0.1 ~ 0.15mm, toasts 10 minutes, until surface conditioning agent is dried completely at 120 DEG C.
Accurately take organic siliconresin 100 weight portion, and add the Pt catalyst of 25 weight portions, add in mixing and blending machine, stir 40 minutes under vacuum-0.1MPa, to be mixed complete after, the alumina powder of 350 weight portions is added in said mixture, discharging after 35 minutes is stirred under vacuum-0.1MPa, obtain silica gel pad semi-finished product, silica gel pad semi-finished product are coated on the side surface that conductive aluminum foil paper is surface-treated, use the heat-conducting interface material that the shaping 0.5mm ~ 10mm of format roll is thick, 130 DEG C solidify 20 minutes, the heat-conducting interface material of surface electrostatic must be eliminated.
Embodiment 2
By toluene and silicon rubber 1:1 mixing in mass ratio, obtain surface conditioning agent, be coated in a side surface of conduction tinfoil, coating thickness is 0.1 ~ 0.15mm, toasts 10 minutes, until surface conditioning agent is dried completely at the temperature of 120 DEG C.
Accurately take organic siliconresin 100 weight portion, and add the inhibitor of 25 weight portions, add in mixing and blending machine, stir 40 minutes under vacuum-0.1MPa, to be mixed complete after, the aluminium hydroxide of 350 weight portions is added in said mixture, discharging after 35 minutes is stirred under vacuum-0.1MPa, obtain silica gel pad semi-finished product, silica gel pad semi-finished product are coated on the side surface that conduction tinfoil is surface-treated, use the heat-conducting interface material that the shaping 0.5mm ~ 10mm of format roll is thick, 130 DEG C of solidifications are after 20 minutes, the heat-conducting interface material of surface electrostatic must be eliminated.
The heat-conducting interface material that the present invention is prepared embodiment 1,2 and the method according to embodiment 1,2, the heat-conducting interface material that not prepared by composite surface dielectric layer contrasts, and test surfaces resistance (ohm-cm), experimental result is as shown in table 1.
Table 1 experimental result
Can illustrate from above-described embodiment, heat-conducting interface material is after eliminating surface electrostatic process, and sheet resistance obviously reduces, thus surface electrostatic can be made relatively easily to derive, so play the effect eliminating surface electrostatic.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. eliminate a heat-conducting interface material for surface electrostatic, it is characterized in that, comprising: silica gel pad semi-finished product and surface dielectric layer material,
Wherein, described silica gel pad semi-finished product comprise the auxiliary agent that the resin matrix of 100 weight portions, the heat-conducting filler of 250 ~ 400 weight portions and weight are 1% ~ 10% of heat-conducting filler weight,
Described surface dielectric layer material comprises the one in conductive aluminum foil paper, conduction tinfoil, aluminized coating film.
2. heat-conducting interface material according to claim 1, is characterized in that, described heat-conducting filler comprises the mixture of one or more in aluminium oxide, zinc oxide, boron nitride, aluminium nitride, titanium oxide, aluminium hydroxide.
3. heat-conducting interface material according to claim 1, is characterized in that, described auxiliary agent comprises the mixture of one or more in silane coupler, aluminate coupling agent, titanate coupling agent, silane crosslinker, dispersant, defoamer.
4. eliminate a preparation method for the heat-conducting interface material of surface electrostatic, it is characterized in that, comprising:
1) get the side surface that surface conditioning agent is coated in surface dielectric layer material, coating thickness is 0.1 ~ 0.15mm, 100 DEG C ~ 150 DEG C bakings 5 ~ 10 minutes, until surface conditioning agent is dried completely;
2) take resin matrix and auxiliary agent, mixing, stir, to be mixed complete after, in said mixture, add heat-conducting filler, stir, obtain silica gel pad semi-finished product;
3) by 2) the silica gel pad semi-finished product that obtain are coated on 1) side surface of surface dielectric layer material that processed, coating thickness is 0.5mm ~ 10mm, uses the heat-conducting interface material of the shaping desired thickness of format roll, and solidification, to obtain final product,
Wherein, described silica gel pad semi-finished product comprise the auxiliary agent that the resin matrix of 100 weight portions, the heat-conducting filler of 250 ~ 400 weight portions and weight are 1% ~ 10% of heat-conducting filler weight.
5. preparation method according to claim 4, is characterized in that, in step 1), described surface conditioning agent comprises one or more mixing in alcohol, acetone, toluene, natural rubber, butyl rubber, silicon rubber, ethylene propylene diene rubber.
6. preparation method according to claim 4, is characterized in that, in step 2) in, described stirring technique condition is: vacuum defoamation 20 ~ 40 minutes under vacuum is-0.1MPa.
7. preparation method according to claim 4, is characterized in that, in step 3), described in be cured as 130 DEG C solidification 20 ~ 40 minutes.
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| CN201310326746.7A CN103407254B (en) | 2013-07-30 | 2013-07-30 | A kind of heat-conducting interface material eliminating surface electrostatic and preparation method thereof |
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| CN103407254B true CN103407254B (en) | 2015-09-23 |
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| CN105196647A (en) * | 2015-10-14 | 2015-12-30 | 文雪烽 | Interface material used for eliminating surface static electricity |
| CN105315970B (en) * | 2015-11-16 | 2019-01-22 | 华中科技大学 | A kind of thermal interfacial material and preparation method thereof for chip detection |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1495245A (en) * | 2002-09-02 | 2004-05-12 | 信越化学工业株式会社 | Heat-conducting composite sheet and preparing method thereof |
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
| CN101343402A (en) * | 2008-08-27 | 2009-01-14 | 南亚塑胶工业股份有限公司 | Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance |
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| JP2006348238A (en) * | 2005-06-20 | 2006-12-28 | Furukawa Sky Kk | Undercoating resin composition for hydrophilic coating and aluminum alloy coated plate |
| CN201690669U (en) * | 2010-05-06 | 2010-12-29 | 冠捷显示科技（厦门）有限公司 | Anti-static component for display |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1495245A (en) * | 2002-09-02 | 2004-05-12 | 信越化学工业株式会社 | Heat-conducting composite sheet and preparing method thereof |
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
| CN101343402A (en) * | 2008-08-27 | 2009-01-14 | 南亚塑胶工业股份有限公司 | Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance |
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