CN103400836B - Closely connect sensor package structure and making method thereof - Google Patents
Closely connect sensor package structure and making method thereof Download PDFInfo
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- CN103400836B CN103400836B CN201310349073.7A CN201310349073A CN103400836B CN 103400836 B CN103400836 B CN 103400836B CN 201310349073 A CN201310349073 A CN 201310349073A CN 103400836 B CN103400836 B CN 103400836B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Microelectronics & Electronic Packaging (AREA)
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- Light Receiving Elements (AREA)
Abstract
The open one of the present invention closely connects sensor package structure and making method thereof, and one closely connects sensor package structure mainly comprises a substrate, a photocell, a light receiving element, one first transparent encapsulating body, one the 2nd transparent encapsulating body and an opaque package. Described photocell and light receiving element are located on described substrate, and first and second transparent encapsulating body described encapsulates described photocell and light receiving element respectively, and its end face has a light out part and a light in part respectively; First and second transparent encapsulating body described of described opaque package packed part, exposes described light out part and light in part to the open air. The sensor package structure that closely connects of the present invention is provided with, by mould inside, the encapsulation that elastic portion carries out opaque package in the way of supporting subsides optical module transparent enclosure surface, the existing housing assembling mode with lens can be replaced, except simplifying structure and assembling mode, be also conducive to the microminiaturization of size.
Description
Technical field
The present invention relates to one and closely connects sensor (ProximitySensor) packaging structure and making method thereof, particularly relate to a kind of by mould inside be provided with elastic portion by support paste that the encapsulation carrying out opaque package in the way of optical module transparent enclosure surface formed closely connect sensor package structure and making method thereof.
Background technology
Infrared rays (IR, Infrared) it is the non-visible light of wavelength ratio ruddiness length, wavelength is between 770 nanometers (nm) to 1 millimeter (mm), it is the hertzian wave of wavelength between microwave and visible ray, has been widely used in communication, detection, medical treatment, military affairs etc. Infrared rays and visible ray have identical characteristic, such as reflectivity, and it can be generated by special bulb or photodiode, and cannot see infrared ray because of the naked eyes of people, so we can reach the specific function of some special man-machine interfaces with it, as closely connect detecting.
Whether infrared rays closely connects existence that sensor (ProximitySensor) can detect neighbouring object, and makes a response according to detecting result, and its range of application is very extensive. Such as, mobile phone can use whether mobile phone when closely connecing sensing technology to detect call closely meets the face of user. When you mobile phone when in one's ear with answering cell phone, closely connect, in mobile phone, the existence that sensor can detect user's head, thus automatically close screen to save electric energy; Or in the phone in your pocket sounds suddenly, at this time closely connect sensor and also can sense that object closely connects, thus keep screen to close. Again such as, same device can also be applied in above notes type computer, when the hand of user closely connects keyboard time, just starts the backlight of keyboard.
Moreover, closely connect detecting and realized by the photocell of specialized designs and the light receiving element of correspondence. Photocell is such as an infrared light-emitting diode; Light receiving element is such as a photorectifier, is used for detecting the infrared ray that sends of infrared light-emitting diode. Infrared light-emitting diode and photorectifier are designed to same direction and place. When without the front of object at photodiode, photorectifier can not detect any infrared ray; When the front having object at photodiode, object by infrared ray reflected light electric diode, thus can detect closely connecing of object, and the infrared ray intensity of reflected light electric diode and object to photorectifier distance inversely.
, it may also be useful to the size closely connecing sensor in portable type electronic product is minimum, in general such as length is less than 4 millimeters (mm). And the existing small-sized sensor that closely connects is by base plate carrying photocell and a light receiving element, and a housing is established to assemble in its outer cup. And need corresponding light emission and receiving element on housing to offer two windows, these windows arrange lens respectively to prevent dust enters inside, and and improve the efficiency of light emission and reception. But, the above-mentioned existing sensor arrangement that closely connects, except assembling complicated shortcoming, is also unfavorable for the microminiaturization of size.
Therefore, it is necessary to provide one closely to connect sensor package structure and making method thereof, to solve the problem existing for prior art.
Summary of the invention
The main purpose of the present invention is to provide one closely to connect sensor package structure and making method thereof, it is provided with the encapsulation that elastic portion carries out opaque package in the way of elasticity supports subsides optical module transparent enclosure surface by mould inside, the existing housing assembling mode with lens can be replaced, except simplifying structure and assembling mode, be also conducive to the microminiaturization of size.
For reaching the aforementioned object of the present invention, the present invention provides one closely to connect sensor package structure, and it comprises: a substrate, a photocell, a light receiving element, one first transparent encapsulating body, one the 2nd transparent encapsulating body and an opaque package. Described photocell and light receiving element are located on described substrate; Described first transparent encapsulating body encapsulates described photocell, and has a light out part and around the first ringwall portion of described light out part; Described 2nd transparent encapsulating body encapsulates described light receiving element, and has a light in part and around the 2nd ringwall portion of described light in part; And first and second transparent encapsulating body described of described opaque package packed part, and exposing light out part and the light in part of first and second transparent encapsulating body described to the open air, the described opaque package of part is between first and second transparent encapsulating body described.
The present invention separately provides a kind of making method closely connecing sensor package structure, it comprises following step: provide a structure, described structure comprises a substrate, a photocell, a light receiving element, one first transparent encapsulating body and one the 2nd transparent encapsulating body, and described photocell and described light receiving element are located on described base plate structure; Described first transparent encapsulating body has a light out part and around the first ringwall portion of described light out part, and described 2nd transparent encapsulating body has a light in part and around the 2nd ringwall portion of described light in part; And with first and second transparent encapsulating body described in an opaque colloid packed part, and expose light out part and the light in part of first and second transparent encapsulating body described to the open air, to form described opaque package, some of described opaque package is between first and second transparent encapsulating body described.
The present invention reoffers a kind of making method closely connecing sensor package structure, it comprises following step: provide a base plate structure, described base plate structure comprises a substrate, a photocell, a light receiving element, and described photocell and described light receiving element are located on described base plate structure; Described photocell is encapsulated and described light receiving element forms one first transparent encapsulating body and one the 2nd transparent encapsulating body respectively so that it is there is a light out part and a light in part respectively with a transparent colloid; Thering is provided an encapsulating mould, it comprises a mould cave, and described mould cave inner top surface is provided with an elastic portion, and described elastic portion is to being affixed on the light out part of described transparent encapsulating body and light in part so that described light out part and light in part are absorbed in described elastic portion; And with first and second transparent encapsulating body described in an opaque colloid packed part, and expose light out part and the light in part of described transparent encapsulating body to the open air, to form described opaque package, some of described opaque package is between first and second transparent encapsulating body described.
Accompanying drawing explanation
Figure 1A is the schematic perspective view closely connecing sensor package structure of one embodiment of the invention.
Figure 1B is the sectional view closely connecing sensor package structure of one embodiment of the invention.
Fig. 2 A-2F is the making method schematic diagram closely connecing sensor package structure of one embodiment of the invention.
Fig. 3 A is the schematic perspective view closely connecing sensor package structure of another embodiment of the present invention.
Fig. 3 B is the sectional view closely connecing sensor package structure of another embodiment of the present invention.
Fig. 4 A-4F is the making method schematic diagram closely connecing sensor package structure of another embodiment of the present invention.
Embodiment
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, the better embodiment of the present invention cited below particularly, and coordinate accompanying drawing, it is described in detail below. Moreover, the direction term that the present invention mentions, such as upper and lower, top, the end, front, rear, left and right, inside and outside, side, surrounding, central authorities, level, transverse direction, vertical, longitudinal direction, axis, radial direction, the superiors or orlop etc., be only the direction with reference to annexed drawings. Therefore, it may also be useful to direction term be in order to illustrate and understand the present invention, and be not used to restriction the present invention. In this special instruction, each object painted in figure is not the standard proportional (ratio such as substrate, chip, wire and encapsulating mould) according to each object, only as the use of signal.
Please refer to shown in Figure 1A and 1B, Figure 1A is the schematic perspective view closely connecing sensor package structure of one embodiment of the invention; And Figure 1B is the sectional view closely connecing sensor package structure of one embodiment of the invention. As illustrated by figures 1 a and 1b, one closely connect sensor package structure and 100 mainly comprise substrate 11, photocell 12, light receiving element 13,1 first transparent encapsulating body 14, the 2nd transparent encapsulating body 15 and an opaque package 16. What described photocell 12 and light receiving element 13 were separated by a distance is located on described substrate 11, described first transparent encapsulating body 14 and the 2nd transparent encapsulating body 15 encapsulate described photocell 12 and light receiving element 13 respectively, the end face of described transparent encapsulating body 14,15 has light out part 141 and a light in part 151 respectively; The described transparent encapsulating body 14 of described opaque package 16 packed part, 15, expose described transparent encapsulating body 14 to the open air, the light out part 141 of 15 and light in part 151, described opaque package 16 at least comprises a barricade 161, described barricade 161 is positioned at first and second transparent encapsulating body 14 described, between 15, the height of described barricade 161 is greater than described transparent encapsulating body 14, the light out part 141 of 15 and the height of light in part 151, that is the described opaque package 16 of part is between first and second transparent encapsulating body 14,15 described.
Described photocell 12 is such as infrared rays (IR, an Infrared) photodiode; Described light receiving element 13 is such as a photorectifier, is used for detecting the infrared ray that described photocell 12 sends. But, the present invention is not limited to this, and described photocell 12 and described light receiving element 13 can be that other have the sealed cell launched and receive light. In addition, as shown in Figure 1B, described photocell 12 and described light receiving element 13 are placed in direction, therefore when without object in its front, described light receiving element 13 can not detect any infrared ray; And when having object when its front, the infrared ray that described photocell 12 is launched can be reflected back described light receiving element 13 by object, thus detect the close of object.
In sum, the sensor package structure 100 that closely connects of the present embodiment is assembled by the mode of two colloid encapsulation, to replace the existing housing assembling mode with lens, except simplifying structure and assembling mode, is also conducive to the microminiaturization of size.
Please refer to shown in Fig. 2 A-2F, Fig. 2 A-2F is the making method schematic diagram closely connecing sensor package structure of one embodiment of the invention. The making method closely connecing sensor package structure of one embodiment of the invention comprises following step:
As shown in Figure 2 A, in a step (a), one base plate structure (sign) is first provided, described base plate structure comprises substrate 11, photocell 12, light receiving element 13, and described photocell 12 and described light receiving element 13 are located on described base plate structure;
As shown in Fig. 2 B to Fig. 2 C, in a step (b), one first encapsulating mould 200 is provided, it comprises two mould caves 210, correspond respectively to described photocell 12 and described light receiving element 13, from top to bottom cover on described substrate 11, start to inject in described mould cave 210 with a transparent colloid; In a step (c), transparent colloid encapsulates described photocell 12 and described light receiving element 13 forms one first transparent encapsulating body 14 and one the 2nd transparent encapsulating body 15 respectively, and make its end face have light out part 141 and a light in part 151 respectively, wherein, also can form the light out part 141 with lens arrangement and light in part 151 when forming the first transparent encapsulating body 14 and the 2nd transparent encapsulating body 15 simultaneously, that is light out part and light in part and lens arrangement are integrally formed, remove described first encapsulating mould 200 afterwards;
As shown in Figure 2 D, in a step (d), one the 2nd encapsulating mould 300 is provided, it comprises a mould cave 310, described mould cave 310 inner top surface is provided with an elastic portion 320, described elastic portion 320 be provided with two protrusions support subsides portion 321, corresponding described transparent encapsulating body 14 respectively, the light out part 141 of 15 and light in part 151, described 2nd encapsulating mould 300 is from top to bottom covered on described substrate 11, what make described elastic portion 320 supports subsides portion 321 elasticity to being affixed on described transparent encapsulating body 14, the light out part 141 of 15 and light in part 151, support subsides portion 321 described in now because the characteristic of material can produce elasticity distortion and described light out part 141 and light in part 151 are inwardly caved in, subsides are supported to form elasticity closely,
As shown in Fig. 2 E to 2F, in a step (e), with described first transparent encapsulating body 14 of an opaque colloid packed part and the 2nd transparent encapsulating body 15, expose described transparent encapsulating body 14 to the open air, the light out part 141 of 15 and light in part 151, form an opaque package 16, described opaque package 16 at least comprises a barricade 161, described barricade 161 is between described first transparent encapsulating body 14 and the 2nd transparent encapsulating body 15, the height of described barricade 161 is greater than the light out part 141 of described transparent encapsulating body 14,15 and the height of light in part 151; And in a step (f), remove described 2nd encapsulating mould 300, closely connect sensor package structure 100 to form one.
In the present embodiment, described elastic portion 310 is such as by made by heat-resisting rubber, the high temperature of its sealing body that can resistance to be heated molten, such as high temperature resistant reaches 175 DEG C. In addition, the material of described elastic portion 320 has good recoverable force power, and that is, subsides portion 321 elasticity of supporting of described elastic portion 320 supports generation elasticity distortion when pasting described transparent encapsulating body, and can recover original state completely after departing from described transparent encapsulating body. Therefore, the subsides portion 321 that supports of described elastic portion 320 one smooth supports subsides portion, or one inner concavity support subsides portion, its indent radian is less than or equals described transparent encapsulating body 14, the light out part 141 of 15 and the outer convex radian of light in part 151, all can make the described subsides portion 321 that supports produce the function that elasticity supports subsides.
During due to transparent colloid injection described first encapsulating mould 200, what the elastic portion 320 of described 2nd encapsulating mould 300a was protruded support subsides portion 321 can closely elasticity to being affixed on described transparent encapsulating body 14, the light out part 141 of 15 and light in part 151, therefore when opaque colloid injects described 2nd encapsulating mould 300 (Fig. 2 E), described opaque colloid can not be injected into the top of described light out part 141a and light in part 151a, and the described opaque package 16 that opaque colloid is formed is in described transparent encapsulating body 14, one is also formed higher than the barricade 161 of described light out part 141 and light in part 151 between 15, described barricade 161 upwards can play in side and intercept the effect that light is directly penetrated into described 2nd transparent encapsulating body 15 by described first transparent encapsulating body 14a.
In sum, by each step of the above-mentioned making method closely connecing sensor package structure, the sensor package that closely connects such as Figure 1A and 1B can be produced and construct 100, the present embodiment closely connect sensor package structure 100 making method by packaged type to replace the existing assembling mode with lens housing, except simplifying except assembling mode, be more conducive to the microminiaturization of size.
Shown in Fig. 3 A and 3B, Fig. 3 A is the schematic perspective view closely connecing sensor package structure of another embodiment of the present invention, and Fig. 3 B is the sectional view closely connecing sensor package structure of another embodiment of the present invention. as shown in figures 3 a and 3b, one closely connect sensor package structure 100a mainly comprise substrate 11, photocell 12, light receiving element 13, a 1 first transparent encapsulating body 14a, one a 2nd transparent encapsulating body 15a and opaque package 16a. what described photocell 12 and light receiving element 13 were separated by a distance is located on described substrate 11, described first transparent encapsulating body 14a and the 2nd transparent encapsulating body 15a encapsulates described photocell 12 and light receiving element 13 respectively, the end face of described first transparent encapsulating body 14a has a light out part 141a and one first ringwall portion 142a, the end face of described 2nd transparent encapsulating body 15a has light in part 151a and a 2nd ringwall portion 152a, wherein said light out part 141a or light in part 151a can comprise a lens arrangement (as shown in figures 3 a and 3b), described lens arrangement and described first or the 2nd transparent encapsulating body 14a, 15a is integrally formed, described first and second ringwall portion 142a, 152a are respectively around described light out part 141a and light in part 151a, and it is highly equal to or greater than the height of described light out part 141a and light in part 151a, the described first transparent encapsulating body 14a and the 2nd transparent encapsulating body 15a of described opaque package 16a packed part, expose described transparent encapsulating body 14a to the open air, the described light out part 141a of 15a and light in part 151a, and expose described first and second ringwall portion 142a to the open air, the end face of 152a, described opaque package 16a at least comprises a barricade 161a, described barricade 161a is between described first transparent encapsulating body 14a and the 2nd transparent encapsulating body 15a, the height of described barricade 161a is equal to or greater than described first and second ringwall portion 142a, the height of 152a.
Please refer to shown in Fig. 4 A-4F, Fig. 4 A-4F is the making method schematic diagram closely connecing sensor package structure of another embodiment of the present invention. The making method closely connecing sensor package structure of another embodiment of the present invention comprises following step:
As shown in Figure 4 A, in a step (a), one base plate structure (sign) is first provided, described base plate structure comprises substrate 11, photocell 12, light receiving element 13, and described photocell 12 and described light receiving element 13 are located on described base plate structure;
As shown in Fig. 4 B to 4C, in a step (b), one first encapsulating mould 200a is provided, it comprises two mould cave 210a, correspond respectively to described photocell 12 and described light receiving element 13, from top to bottom cover on described substrate 11, start to inject in described mould cave 210a with a transparent colloid, in a step (c), described photocell 12 is encapsulated and described light receiving element 13 forms one first transparent encapsulating body 14a and the 2nd transparent encapsulating body 15a respectively with transparent colloid, and make its end face have a light out part 141 respectively, one light in part 151a, one first ringwall portion 142a and the 2nd ringwall portion 152a, described first and second ringwall portion 142a, 152a is respectively around described light out part 141a and light in part 151a, described first and second ringwall portion 142a, the height of 152a can be equal to or greater than each self-corresponding described light out part 141a and light in part 151a height respectively, remove described first encapsulating mould 200,
As shown in Figure 4 D, in a step (d), one the 2nd encapsulating mould 300a is provided, it comprises a mould cave 310a, described mould cave 310a inner top surface is provided with an elastic portion 320a, described elastic portion 320a has one and smooth supports subsides portion 321a, described 2nd encapsulating mould 300a is from top to bottom covered on described substrate 11, the subsides portion 321a elasticity of supporting of described elastic portion 320a is made to support the described transparent encapsulating body 14a of subsides, first and second ringwall portion 142a of 15a, the end face of 152a, now the described subsides portion 321a of supporting is out of shape and corresponding first and second ringwall portion 142 described because the characteristic of material can produce elasticity, the shape of 152 forms elasticity closely and supports subsides,
As shown in Fig. 4 E to 4F, in a step (e), with the described first transparent encapsulating body 14a of an opaque colloid packed part and the 2nd transparent encapsulating body 15a, expose described transparent encapsulating body 14a to the open air, the light out part 141a and light in part 151a of 15a, and described first and second ringwall portion 142a, the end face of 152a, form an opaque package 16a, described opaque package 16a at least comprises a barricade 161a, described barricade 161a is between described first transparent encapsulating body 14a and the 2nd transparent encapsulating body 15a, the height of described barricade 161a is equal to or greater than described first and second ringwall portion 142a, the height of 152a, and in a step (f), remove described 2nd encapsulating mould 300a, closely meet sensor package structure 100a to form one. subsides portion 321 elasticity of supporting of described elastic portion 320 supports generation elasticity distortion when pasting described transparent encapsulating body, and can recover original state completely after departing from described transparent encapsulating body.
In the present embodiment, during due to transparent colloid injection described first encapsulating mould 200a, described transparent encapsulating body 14a, first and second ringwall portion 142a also it is formed outside the light out part 141a and light in part 151a of 15a, 152a, and described 2nd encapsulating mould 300a smooth support subsides portion 321a can closely support paste described transparent encapsulating body 14a, first and second ringwall portion 142a of 15a, the end face of 152a, therefore when opaque colloid injects described 2nd encapsulating mould 300a, described opaque colloid can not be injected in the superjacent air space of described light out part 141a and light in part 151a, and the described opaque package 16a that described opaque colloid is formed is in described transparent encapsulating body 14a, a barricade 161a is also formed between 15a, described barricade 161a upwards can play in side and intercept the effect that light is directly penetrated into described 2nd transparent encapsulating body 15a by described first transparent encapsulating body 14a. described ringwall portion 142a, the setting of 152a also can become flat condition to subsides portion 321a described in relative simplicity.
The present invention is described by above-mentioned related embodiment, but above-described embodiment is only the example implementing the present invention. Must being pointed out that, published embodiment does not limit the scope of the invention. Contrary, it is contained in the spirit of claim book and the amendment of scope and impartial setting and it is included in the scope of the present invention.
Claims (10)
1. one kind closely connects sensor package structure, it is characterised in that: the described sensor package structure that closely connects comprises:
One substrate;
One photocell, is located on described substrate;
One light receiving element, is located on described substrate;
One first transparent encapsulating body, encapsulates described photocell, and wherein said first transparent encapsulating body has a light out part and around the first ringwall portion of described light out part;
One the 2nd transparent encapsulating body, encapsulates described light receiving element, and wherein said 2nd transparent encapsulating body has a light in part and around the 2nd ringwall portion of described light in part; And
One opaque package, first and second transparent encapsulating body described of packed part, and expose light out part and the light in part of first and second transparent encapsulating body described to the open air, some of described opaque package is between first and second transparent encapsulating body described.
2. closely connect sensor package structure as claimed in claim 1, it is characterised in that: the height in first and second ringwall portion described is equal to or greater than the height of each self-corresponding described light out part or light in part respectively.
3. closely connect as claimed in claim 1 sensor package structure, it is characterised in that: described light out part or light in part comprise a lens arrangement, described lens arrangement and described first or the 2nd transparent encapsulating body be integrally formed.
4. one kind closely connects the making method of sensor package structure, it is characterised in that: described making method comprises following step:
Thering is provided a structure, described structure comprises:
One substrate;
One photocell, is located on described substrate;
One light receiving element, is located on described substrate;
One first transparent encapsulating body, encapsulates described photocell, and wherein said first transparent encapsulating body has a light out part and around the first ringwall portion of described light out part; And
One the 2nd transparent encapsulating body, encapsulates described light receiving element, and wherein said 2nd transparent encapsulating body has a light in part and around the 2nd ringwall portion of described light in part; And with first and second transparent encapsulating body described in an opaque colloid packed part, and expose light out part and the light in part of first and second transparent encapsulating body described to the open air, to form an opaque package, some of described opaque package is between first and second transparent encapsulating body described.
5. closely connect the making method of sensor package structure as claimed in claim 4, it is characterised in that: the step of described first transparent encapsulating body of described offer and the 2nd transparent encapsulating body comprises:
Thering is provided one first encapsulating mould, it comprises two mould caves, corresponds respectively to described photocell and described light receiving element; And
Described photocell and described light receiving element is encapsulated to form described first thoroughly and the 2nd transparent encapsulating body with a transparent colloid.
6. closely connect as claimed in claim 4 the making method of sensor package structure, it is characterised in that: described comprise with the step of first and second transparent encapsulating body described in opaque colloid packed part:
Thering is provided one the 2nd encapsulating mould, it comprises a mould cave, and described mould cave inner top surface is provided with an elastic portion, and described elastic portion has one and supports subsides portion;
Support the end face of the subsides portion that supports to first and second ringwall portion of first and second transparent encapsulating body described pasting described elastic portion; And
With first and second transparent encapsulating body described in described opaque colloid packed part.
7. closely connect as claimed in claim 4 the making method of sensor package structure, it is characterised in that: described light out part or light in part comprise a lens arrangement, described lens arrangement and described first or the 2nd transparent encapsulating body be integrally formed.
8. one kind closely connects the making method of sensor package structure, it is characterised in that: described making method comprises following step:
Thering is provided a substrate, described substrate has a photocell and a light receiving element is located thereon;
Described photocell is encapsulated and described light receiving element forms one first transparent encapsulating body and one the 2nd transparent encapsulating body respectively so that it is there is a light out part and a light in part respectively with a transparent colloid;
Thering is provided an encapsulating mould, it comprises a mould cave, and described mould cave inner top surface is provided with an elastic portion, and described elastic portion is to being affixed on the light out part of described transparent encapsulating body and light in part so that described light out part and light in part are absorbed in described elastic portion; And
With described first transparent encapsulating body of an opaque colloid packed part and the 2nd transparent encapsulating body, and expose light out part and the light in part of described transparent encapsulating body to the open air, to form an opaque package, described opaque package is between first and second transparent encapsulating body described.
9. closely connect the making method of sensor package structure as claimed in claim 8, it is characterised in that: described elastic portion is provided with the subsides portion that supports of two protrusions with respectively to the light out part and the light in part that are affixed on described transparent encapsulating body.
10. closely connect as claimed in claim 8 the making method of sensor package structure, it is characterised in that: the subsides portion that supports of described elastic portion one smooth supports subsides portion; Or described elastic portion support subsides portion be an inner concavity support subsides portion, its indent radian is less than or equals the light out part of described transparent encapsulating body and the outer convex radian of light in part.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310349073.7A CN103400836B (en) | 2013-08-12 | 2013-08-12 | Closely connect sensor package structure and making method thereof |
| CN201610285399.1A CN105977248B (en) | 2013-08-12 | 2013-08-12 | Proximity sense packaging structure and preparation method thereof |
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| CN201310349073.7A CN103400836B (en) | 2013-08-12 | 2013-08-12 | Closely connect sensor package structure and making method thereof |
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| CN201610285399.1A Division CN105977248B (en) | 2013-08-12 | 2013-08-12 | Proximity sense packaging structure and preparation method thereof |
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| Publication Number | Publication Date |
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| CN103400836A CN103400836A (en) | 2013-11-20 |
| CN103400836B true CN103400836B (en) | 2016-06-01 |
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| CN201610285399.1A Active CN105977248B (en) | 2013-08-12 | 2013-08-12 | Proximity sense packaging structure and preparation method thereof |
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| KR102236711B1 (en) * | 2014-04-10 | 2021-04-06 | 엘지이노텍 주식회사 | Optical element and backlight unit including the same |
| CN105006468B (en) * | 2015-06-29 | 2018-01-26 | 上海集成电路研发中心有限公司 | A kind of information carrying means in Multi-layer silicon encapsulating structure |
| EP3121853B1 (en) | 2015-07-23 | 2022-01-19 | ams AG | Method of producing an optical sensor at wafer-level and optical sensor |
| US10147834B2 (en) | 2015-10-16 | 2018-12-04 | Stmicroelectronics Pte Ltd | Overmold proximity sensor and associated methods |
| US20180017741A1 (en) * | 2016-07-15 | 2018-01-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
| CN108231744B (en) * | 2016-12-20 | 2019-11-12 | 上海新微技术研发中心有限公司 | Monolithic integrated distance sensor and manufacturing method thereof |
| CN108333639A (en) * | 2017-01-20 | 2018-07-27 | 光宝新加坡有限公司 | The structure-improved of proximity sensor |
| US10147835B2 (en) * | 2017-03-17 | 2018-12-04 | Advanced Semiconductor Engineering, Inc. | Optical device and method of manufacturing the same |
| CN109213385B (en) * | 2017-07-05 | 2021-07-20 | 光宝科技新加坡私人有限公司 | Mobile device and proximity sensing module thereof |
| US11137520B2 (en) * | 2019-02-22 | 2021-10-05 | Microsoft Technology Licensing, Llc | Integrated depth sensor window lens and method |
| CN110444608A (en) * | 2019-05-28 | 2019-11-12 | 弘凯光电(深圳)有限公司 | A kind of optical sensor of range measurement and preparation method thereof |
| FR3102886A1 (en) | 2019-10-30 | 2021-05-07 | Stmicroelectronics (Grenoble 2) Sas | Optoelectronic device |
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| US7714265B2 (en) * | 2005-09-30 | 2010-05-11 | Apple Inc. | Integrated proximity sensor and light sensor |
| SG139569A1 (en) * | 2006-07-13 | 2008-02-29 | Avago Technologies General Ip | A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same |
| JP2010034189A (en) * | 2008-07-28 | 2010-02-12 | Sharp Corp | Optical proximity sensor, method of manufacturing the same, and electronic apparatus mounted with the same |
| US8957380B2 (en) * | 2009-06-30 | 2015-02-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
| US8492720B2 (en) * | 2010-06-08 | 2013-07-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Small low-profile optical proximity sensor |
| US8841597B2 (en) * | 2010-12-27 | 2014-09-23 | Avago Technologies Ip (Singapore) Pte. Ltd. | Housing for optical proximity sensor |
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| CN103400836A (en) | 2013-11-20 |
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