CN103395571A - Packing method of thermistors chips based on tray arrangement - Google Patents

Packing method of thermistors chips based on tray arrangement Download PDF

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Publication number
CN103395571A
CN103395571A CN2013103518041A CN201310351804A CN103395571A CN 103395571 A CN103395571 A CN 103395571A CN 2013103518041 A CN2013103518041 A CN 2013103518041A CN 201310351804 A CN201310351804 A CN 201310351804A CN 103395571 A CN103395571 A CN 103395571A
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China
Prior art keywords
thermistor chip
pallet
blue film
packing method
thermistors
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CN2013103518041A
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CN103395571B (en
Inventor
汪鵾
段兆祥
杨俊�
柏琪星
唐黎民
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EXSENSE ELECTRONICS TECHNOLOGY Co Ltd
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EXSENSE ELECTRONICS TECHNOLOGY Co Ltd
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Publication of CN103395571A publication Critical patent/CN103395571A/en
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Abstract

The invention relates to a packing method of thermistors chips based on tray arrangement. The first packing method comprises the following steps: placing the thermistors chips in a tray to be arranged, and performing overall packing and transporting on the tray so as to enable customers to mechanically bind the thermistors chips through simple oriented transfer after receiving the thermistors chips. The second packing method comprises the following steps: placing the thermistors chips in a tray to be arranged, performing oriented transfer on a blue film, and finally conducting overall packing and transporting. The method has the advantages that the customer can pack the thermistors chips mechanically after receiving the thermistors chips, the time for terminal customers to re-arrange and re-align the thermistors chips is shortened, and the working efficiency is improved.

Description

The packing method of the thermistor chip of arranging based on pallet
Technical field
The present invention relates to the packed and transported field of electronic devices and components, more specifically, relate to two kinds of packing methods based on the thermistor chip of pallet arrangement.
Background technology
Along with the field of application of thermally dependent resistor, thermistor chip is more and more extensive, thermistor chip is except being used for independent electronic devices and components, single-sensor etc. now, all right nation is due to the part of pcb board or LCD formation integrated circuit modules on glass, in more complicated circuit structure, nation to thermistor chip relates to a plurality of thermistor chips surely, there is strict demand the position of these thermistor chips, needs to locate exactly before nation is fixed.
In prior art, the thermistor chip that upstream manufacturer provides for Bang Ding manufacturer is after quality inspection is qualified, usually transport by mode packed, bottled or the braid dress, wherein the packed and transported process does not guarantee putting in order of thermistor chip, after thermistor chip is received by Bang Ding manufacturer, then thermistor chip is arranged on request on pcb board or LCD glass separately, carries out finally nation and determine, above process is equivalent to thermistor chip has been carried out repeatedly arranging, and takes time and effort.
Summary of the invention
Purpose of the present invention, overcome exactly the deficiencies in the prior art, two kinds of packing methods based on the thermistor chip of pallet arrangement are provided, adopt these two kinds of methods to provide the thermistor chip of marshalling for nation determines the client, reduced nation and determined the client and re-start time and the human cost of arrangement.
In order to achieve the above object, the first adopts following technical scheme based on the packing method of the thermistor chip of pallet arrangement:
A kind of packing method of the thermistor chip based on the pallet arrangement comprises the following steps and obtains:
S11 presets pallet, is provided with some placement holes suitable with the thermistor chip size on described pallet;
S12 is positioned over thermistor chip in the placement hole of described pallet, and the electrode surface of assurance thermistor chip up;
S13 arranges one deck electrostatic prevention paper at least being equipped with on the pallet of thermistor chip;
The stacked a plurality of pallets of S14 also carry out entire package.
Further, in described step S11, the placement hole on described pallet is matrix and arranges.
The second adopts following technical scheme based on the packing method of the thermistor chip that pallet is arranged:
A kind of packing method of the thermistor chip based on the pallet arrangement comprises the following steps and obtains:
S21 presets pallet, is provided with some placement holes suitable with the thermistor chip size on described pallet;
S22 is positioned over thermistor chip in the placement hole of described pallet, and guarantees that the positive electrode of thermistor chip faces up;
S23 covers blue film being equipped with on the pallet of thermistor chip, and allows blue film and the adhesion of thermistor chip electrode surface;
S24 takes off the blue film that has adhered to thermistor chip, and multiple blue film-stack are placed, and carries out entire package.
As a kind of specific embodiment, in described step S21, the placement hole on described pallet is matrix and arranges.
As a kind of specific embodiment, described step S23 is further comprising the steps of:
S231 is fixed in blue film in preset frame, and guarantees that the blue film in preset frame is plane.
S232 just completes blue film facing to pallet one side back-off with preset frame with blue film and covers, and, with the blue film back side of the instrument with soft head, makes blue film and chip electrode face bonding.
Further, in described step S231, described preset frame is circular.
Compared with prior art, beneficial effect of the present invention is:
First method of the present invention is arranged and pallet is carried out the entire package transportation by thermistor chip is positioned in pallet, making the client can carry out mechanical nation by simple directed transfer after receiving thermistor chip determines, reduced again thermistor chip has been arranged time with contraposition, improved production efficiency.
Second method of the present invention is by being positioned over thermistor chip in pallet and completing arrangement, and logical blue toner carries out the orientation transfer, carry out finally the entire package transportation, the method makes the client can directly carry out nation calmly after receiving thermistor chip, saved again thermistor chip has been arranged time with contraposition, improved production efficiency.
Description of drawings
Fig. 1 is the schematic top plan view of embodiment 1 described pallet.
Fig. 2 is the described schematic top plan view of having placed the pallet of thermistor chip of embodiment 1.
Fig. 3 is the described blue film schematic diagram that has attached thermistor chip of embodiment 2.
The specific embodiment
Embodiment 1
Referring to figure 1 ?Fig. 2, the packing method of the thermistor chip that the first of the present invention is arranged based on pallet comprises the following steps and obtains:
S11 presets pallet 1, is provided with some placement holes 11 suitable with thermistor chip 2 sizes on described pallet 1,
For the transportation of thermistor chip 2, the purpose of pallet 1 is that thermistor chip 2 is arranged, and guarantees that finally thermistor chip 2 delivers to nation according to the order that arranges and determine customers' place.Obviously, the position of placement hole 11 should be more bigger than the size of thermistor chip 2.In the present embodiment, suppose that thermistor chip to be packaged 2 is of a size of 0.45mm*0.45mm*0.3mm, preferably placement hole 11 is of a size of 0.48mm*0.48mm*0.32mm.
Placement hole 11 on above-mentioned pallet 1 is matrix to be arranged, and certainly, putting in order of described placement hole 11 can also arrange according to the actual demand that nation determines the client.
S12 is positioned over thermistor chip 2 in the placement hole 11 of described pallet 1, and the electrode surface of assurance thermistor chip 2 up;
, through after the assay was approved, adopt tweezers or other instruments to be placed in pallet 1 by thermistor chip 2 when thermistor chip 2, and the electrode surface of assurance thermistor chip 2 up.
S13 arranges one deck electrostatic prevention paper at least on the pallet 1 that thermistor chip 2 is housed;
After pallet 1 is filled, place one deck electrostatic prevention paper on 1, pallet, erect to prevent thermistor chip 2.
The stacked a plurality of pallets 1 of S14 also carry out entire package;
Can select box-packed or other packing methods to the packing of a plurality of pallets 1, after pallet 1 integral body that thermistor chip 2 will be housed is transported to nation and determines customers' place, nation determines the client and can be attached on blue film or other adhesive films thermistor chip 2 is counter, then carries out mechanical nation fixed.
Embodiment 2
The second of the present invention, based on the packing method of the thermistor chip of pallet arrangement, comprises the following steps and obtains:
S21 presets pallet 1, is provided with some placement holes 11 suitable with thermistor chip 2 sizes on described pallet 1;
S2 is positioned over thermistor chip 2 in the placement hole 11 of described pallet 1, and the electrode surface of assurance thermistor chip 2 up;
In view of the technical scheme of describing in above-mentioned steps there is no substantive difference with the corresponding step in embodiment 1, so S21 and S22 are not done more detailed description in the present embodiment.
S23 covers blue film 3 on the pallet 1 that thermistor chip 2 is housed, and allows blue film 3 and thermistor chip 2 electrode surface adhesions, and this step can be comprised of following steps again:
S231 is fixed in blue film 3 in preset frame 4, and guarantees that the blue film 3 in preset frame 4 is plane.
Described preset frame 4 also is the customization part, and it can be teething ring, and purpose is fixing blue film 3, makes its zone in preset frame 4 be plane, the convenient thermistor chip 2 of pasting in pallet 1.Preset frame 4 is set to circle or square.The diameter of preset frame is between 4 inch-6 inch.
S232 just completes blue film 3 facing to pallet 1 one side back-offs with preset frame 4 with blue film 3 and covers, and with the instrument with soft head, presses blue film 3 back sides, makes blue film 3 bonding with thermistor chip 2 electrode surfaces.
After blue film 3 covers thermistor chip 2, gently press the back side of blue film 3 with instruments such as brushes, all with blue film 3, combine closely to guarantee the thermistor chip 2 in front tray 1.
S24 takes off the blue film 3 that has adhered to thermistor chip 2; And, with the stacked placement of multiple blue films 3, carry out entire package.
In the method, due to the support that there is no pallet 1 in transportation, therefore to the packing of the blue film 3 after stacked should reduce as far as possible blue film 3 and on thermistor chip 2 clashed into, also should be light and slow careful in transportation.
Arrive at after nation determines customers' place at the blue film 3 that has adhered to thermistor chip 2, nation determines the client, and can directly to carry out mechanical nation fixed, and production efficiency greatly improves.
Should be appreciated that; above specific embodiment just is explained in detail the preferred embodiment of the present invention; but the present invention is not limited to above-mentioned embodiment; in a word; in the cognition that one skilled in the relevant art possesses; above-described embodiment can also be made various variations under the prerequisite that does not break away from aim of the present invention, these distortion are all in the scope of the claims in the present invention protection.

Claims (6)

1. the packing method based on the thermistor chip of pallet arrangement, is characterized in that, comprises the following steps and obtain:
S11 presets pallet, is provided with some placement holes suitable with the thermistor chip size on described pallet;
S12 is positioned over thermistor chip in the placement hole of described pallet, and the electrode surface of assurance thermistor chip up;
S13 arranges one deck electrostatic prevention paper at least being equipped with on the pallet of thermistor chip;
The stacked a plurality of pallets of S14 also carry out entire package.
2. the packing method of the thermistor chip based on the pallet arrangement as claimed in claim 1, is characterized in that, in described step S11, the placement hole on described pallet is matrix and arranges.
3. the packing method based on the thermistor chip of pallet arrangement, is characterized in that, comprises the following steps and obtain:
S21 presets pallet, is provided with some placement holes suitable with the thermistor chip size on described pallet;
S22 is positioned over thermistor chip in the placement hole of described pallet, and the electrode surface of assurance thermistor chip up;
S23 covers blue film being equipped with on the pallet of thermistor chip, and allows blue film and the adhesion of thermistor chip electrode surface;
S24 takes off the blue film that has adhered to thermistor chip, and multiple blue film-stack are placed, and carries out entire package.
4. the packing method of the thermistor chip based on the pallet arrangement as claimed in claim 3, is characterized in that, in described step S21, the placement hole on described pallet is matrix and arranges.
5. the packing method of the thermistor chip based on the pallet arrangement as claimed in claim 3, is characterized in that, described step S23 is further comprising the steps of:
S231 is fixed in blue film in preset frame, and guarantees that the blue film in preset frame is plane.
S232 just completes blue film facing to pallet one side back-off with preset frame with blue film and covers, and with the instrument with soft head, presses the blue film back side, makes blue film and thermistor chip electrode surface bonding.
6. the packing method of the thermistor chip based on the pallet arrangement as claimed in claim 5, is characterized in that, in described step S231, described preset frame is circular.
CN201310351804.1A 2013-08-13 2013-08-13 The packing method of the thermistor chip of arranging based on pallet Active CN103395571B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108190157A (en) * 2018-01-04 2018-06-22 广州金陶电子有限公司 A kind of film packing method of NTC chips

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116427A (en) * 2000-01-31 2000-09-12 Silicon Integrated Systems Corp. Tray for ball grid array devices
TW503205B (en) * 2000-12-01 2002-09-21 Texchem Pack M Sdn Bhd Tray for storing semiconductor chips
CN1958404A (en) * 2005-11-03 2007-05-09 群康科技(深圳)有限公司 Apparatus for packing glass base plates
JP2010274927A (en) * 2009-05-26 2010-12-09 Toppan Printing Co Ltd Board transporting tray and board transporting method
CN102623583A (en) * 2011-01-27 2012-08-01 奇景光电股份有限公司 Packaging method of wafer level chips
JP2012153378A (en) * 2011-01-24 2012-08-16 Sekisui Plastics Co Ltd Tray for packing, packaging material and package using the same
CN202633263U (en) * 2012-06-05 2012-12-26 久元电子股份有限公司 Base material coating structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116427A (en) * 2000-01-31 2000-09-12 Silicon Integrated Systems Corp. Tray for ball grid array devices
TW503205B (en) * 2000-12-01 2002-09-21 Texchem Pack M Sdn Bhd Tray for storing semiconductor chips
CN1958404A (en) * 2005-11-03 2007-05-09 群康科技(深圳)有限公司 Apparatus for packing glass base plates
JP2010274927A (en) * 2009-05-26 2010-12-09 Toppan Printing Co Ltd Board transporting tray and board transporting method
JP2012153378A (en) * 2011-01-24 2012-08-16 Sekisui Plastics Co Ltd Tray for packing, packaging material and package using the same
CN102623583A (en) * 2011-01-27 2012-08-01 奇景光电股份有限公司 Packaging method of wafer level chips
CN202633263U (en) * 2012-06-05 2012-12-26 久元电子股份有限公司 Base material coating structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108190157A (en) * 2018-01-04 2018-06-22 广州金陶电子有限公司 A kind of film packing method of NTC chips

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