CN1958404A - Apparatus for packing glass base plates - Google Patents
Apparatus for packing glass base plates Download PDFInfo
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- CN1958404A CN1958404A CN 200510100954 CN200510100954A CN1958404A CN 1958404 A CN1958404 A CN 1958404A CN 200510100954 CN200510100954 CN 200510100954 CN 200510100954 A CN200510100954 A CN 200510100954A CN 1958404 A CN1958404 A CN 1958404A
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- packing
- base plates
- glass substrate
- glass base
- antistatic
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Abstract
A package for glass substrates is composed of a packing box, at least one isolating plate between glass substrates, and antistatic film arranged in the packing box for preventing the glass substrates from being damaged by the accumulated static electricity.
Description
[technical field]
The present invention is about a kind of apparatus for packing glass base plates, especially about a kind of apparatus for packing glass base plates that is used to transport glass substrate.
[background technology]
Along with digital development of science and technology, liquid crystal display product has been widely used in each aspect of daily life.For the liquid crystal display module, it is wafer in the semiconductor industry that glass substrate institute role cans be compared to, and therefore, the Liquid Crystal Display (LCD) industry is close to perfect to the requirement of glass substrate.
Glass is a kind of hard brittle material, when being subjected to the external force collision or dropping ground, is easy to break so that can not use.And in the process of making display panels, the problem of transporting of glass substrate is most important.Transporting in the process of glass substrate, it is subject to chemical pollution, and when producing electrostatic induction when friction takes place between the substrate, glass substrate in-to-in circuit can be damaged.
Glass substrate can show with glass substrate and general glass substrate for liquid crystal glass base, electricity slurry.It now is example with the liquid crystal glass base, the fringe region of this liquid crystal glass base is provided with critical elements such as sealing liquid crystal mouth, thin film transistor pin, IC chip and flexible circuit board usually, transport in the process at liquid crystal glass base, need avoid being subjected to external force collision and phase mutual friction and cause damage above-mentioned critical elements.
The apparatus for packing glass base plates of prior art normally is placed on glass substrate in the packing box, and separates each glass substrate to transport by dividing plate.According to the difference of glass substrate packing box material, can be divided into following two types:
A kind of glass substrate packing box adopts acrylonitrile-butadiene-styrene (AcrylonitrileButadiene Styrene, ABS) and polyvinylchloride (Poly Vinyl Chloride, PVC) make, the weight of the packing box of this kind material own is about the 5-6 kilogram, also causes simultaneously in the inconvenience that moves, piles up and carry.。
It is that 3-30 resin foamed material is doubly made that another kind of glass substrate packing box adopts expansion ratio.This packing box structure as shown in Figure 1, this packing box 10 comprises a box body 120 and a lid 110,110 mutually nested cooperations of this box body 120 and this lid, forms one in order to accommodate the accommodation space of glass substrate.These box body 120 2 relative inside faces are provided with a plurality of grooves 130 in order to the support glass substrate.Transport in the process, glass substrate is installed in the groove 130 of box body 120, cooperatively interact then nested this box body 120 and lid 110 when needs are extracted glass substrate out, make this lid 110 break away from this box body 120, take out glass substrate and get final product.
The box body 120 of this packing box is made by resin foamed material, though this material has the advantage that cushion characteristic is good, in light weight and die cost is low slightly, but still has following shortcoming:
At first, direct contact between the packing box 10 that this kind packing device adopts and this glass substrate that is used to transport is so in transportation, this packing box 10 and the fricative static of this glass substrate cause the destruction to glass substrate easily;
Secondly, antistatic material or conductive material though this packing box 10 mixes in manufacturing process are along with the period of service increase of this packing box 10, its antistatic effect can descend, shorten service life, thereby cause the waste of packing box 10, increased packing cost;
At last, this kind packing device is in packaging process, and glass substrate is along the groove setting of this packing box wall, and the operating personnel needs a slice a slice to placing by groove, causes the inconvenience of packing.
[summary of the invention]
Above-mentionedly cause problem for solving, be necessary to provide a kind of accumulation of static electricity of avoiding to cause apparatus for packing glass base plates the damage of glass substrate to the damage of glass substrate at the process accumulation of static electricity of transporting.
A kind of apparatus for packing glass base plates comprises at least one dividing plate, an antistatic diaphragm and packing box that glass substrate is placed at stacked interval that be used for, and this antistatic diaphragm is arranged on this dividing plate outside, and this dividing plate and this antistatic diaphragm are housed in this packing box.
Compared to prior art, apparatus for packing glass base plates adopts an antistatic diaphragm to be laid on the mode of this packing box inboard, relies on this antistatic diaphragm that this glass substrate and outer packaging thing are isolated, and avoids accumulation of static electricity that glass substrate is caused damage.In addition, prolong the service life of packing box, thereby reduce packing cost by the mode of changing this antistatic diaphragm; Worker needn't respective grooves insert glass substrate one by one simultaneously, only needs stacked interval to place, and is instant packed.
[description of drawings]
Fig. 1 is a kind of glass substrate packing box schematic perspective view of prior art.
The glass substrate package structure decomposing schematic representation that Fig. 2 is disclosed for a kind of better embodiment of the present invention.
Fig. 3 is the present invention's antistatic diaphragm spatial folding scheme drawing shown in Figure 2.
Fig. 4 is the solid assembling scheme drawing after the present invention's packing box packing shown in Figure 2.
The glass substrate package structure decomposing schematic representation that Fig. 5 is disclosed for the another kind of better embodiment of the present invention.
Fig. 6 is the present invention's another STRUCTURE DECOMPOSITION scheme drawing of superimposed body shown in Figure 2.
Fig. 7 is the solid assembling scheme drawing after the present invention's packing box packing shown in Figure 5.
The glass substrate package structure decomposing schematic representation that Fig. 8 is disclosed for another better embodiment of the present invention.
Fig. 9 is another angle schematic perspective view of the present invention's box body shown in Figure 8.
Figure 10 is the solid assembling scheme drawing after the present invention's packing box packing shown in Figure 8.
[specific embodiment]
See also Fig. 2, for the glass substrate package that a kind of better embodiment of the present invention is disclosed is constructed decomposing schematic representation.This packaging arrangement 2 comprises a packing box 20 (consulting Fig. 4), a superimposed body 21 and an antistatic diaphragm 23.Wherein this superimposed body 21 comprises two dividing plates 212 and a glass substrate 211 of stacked setting.This antistatic diaphragm 23 is packaged in this superimposed body 21 outsides, makes this superimposed body 21 and packing box 20 isolate.This packing box 20 comprises a box body 201 and a lid 202, this box body 201 and the 202 mutually nested cooperations of this lid, and form an accommodation space, this superimposed body 21 and this antistatic diaphragm 23 are housed in this accommodation space.
See also Fig. 3, Fig. 3 is the spatial folding scheme drawing of the antistatic diaphragm 23 that Fig. 2 disclosed.This antistatic matrix 23 has four bending zone 231, one main areas 232 and bending outline line 233, and the bottom 2012 of the profile of this main areas 232 and this box body 2013 is complementary, and this kink 231 can freely bend along bending outline line 233.Through bending, can be so that the side of these kink 231 close these superimposed bodies 21.
This antistatic diaphragm 23 adopts the high-density polyethylene resin material, adopts and contains electric conductive polymer or the doping of preventing property of static material, and making and obtaining resistance coefficient is 10
9～10
12The high-antistatic diaphragm of Ω cm, be about 2 years its service life.Glass substrate package structure 2 adopts an antistatic diaphragm 23 to be laid on the mode of these packing box 20 inboards, relies on this antistatic diaphragm 23 that this glass substrate 211 and outer packaging thing are isolated, and avoids accumulation of static electricity that glass substrate is caused damage.
This dividing plate 212 profiles size is complementary substantially with the size of this glass substrate 211, shape can be plate shaped or shaped as frame, and the surface that this dividing plate 212 contacts with this glass substrate 211 has the negotiable relief pattern of air, simultaneously, this dividing plate 212 has certain elasticity, plays the effect of buffering external force.
When glass substrate 211 and dividing plate 212 are stacked; main stress area on the glass substrate 211 is its edge; in order to reach the purpose of critical elements on safe transport and the effective cover glass substrate 211; with shaped as frame dividing plate 212 and the cross layered successively placement of this glass substrate 211, the bottom and the superiors place dividing plate 212 respectively.When glass substrate 211 sizes are big, consider itself intensity needs, adopt plate shaped dividing plate 212, to support this substrate 211.And the design that the surface that this dividing plate 212 contacts with this glass substrate 211 has a relief pattern can be avoided air to be overstock between glass substrate 211 can't getting rid of, and causes atomizating phenomenon, even broken.
This dividing plate 212 is that the high density polyethylene (HDPE) material moulded section by the higher antistatic property of a kind of tool makes, wherein this high density polyethylene (HDPE) (HDPE, (C
2H
2)
n) be to form with the cracking of polyethylene raw material, do not have toxicity, can not endanger the carrying personnel health; Have the high corrosion resistance energy, can not cause damage glass substrate 211; And light weight, density are 0.955kg/cm
3, be easy to carrying.And, compared with prior art, adopt high-density polyethylene material to replace ABS resin or pvc material, can keep the cleanliness of glass substrate 211.
Consider weight and the convenient in carrying transport counter in the process, cooperate the dividing plates 212 stacked superimposed bodies 21 that are set to ten to 30 sheet glass substrates 211 usually.The superimposed mode of this superimposed body 21 also has following situation:
If the quantity of glass substrate 211 is n (n＞2) sheet, then dividing plate quantity can be good for the n+1 sheet.
When this superimposed body 21 was housed in this packing box 20, this superimposed body 21 is positioned at the superiors and undermost dividing plate 212 is connected to the top inner surface of this lid 202 and the bottom inside face of box body 201.
Be equipped with an antistatic diaphragm 23 at these packing box 20 box bodys 201 inside faces, and make this superimposed body 21 isolate with these box body 201 inside faces.
The box body 201 of this packing box 20 is one end box body to be arranged, and this box body 201 comprises four madial walls 2011, a bottom 2012 and four lateral walls 2013.This madial wall 2011 and this lateral wall 2013 are all perpendicular to this bottom 2012, these lateral wall 2013 head and the tail connect successively, and cooperate this bottom 2012 to surround a rectangle uncovered receiving space, this madial wall 2011 is one-body molded with this lateral wall 2013, and is higher than this lateral wall 2013.Two adjacent madial wall 2021 inboard intersections, be respectively arranged with four grooves 2014.
This lid 202 is one the top cover body to be arranged, this lid 202 have one with these box body 201 madial walls 2011 corresponding madial wall 2021, one tops 2022 and lateral walls 2023.The madial wall 2011 of same this lid 202 and lateral wall 2023 thereof are all perpendicular to this top 2022, and these lateral wall 2023 head and the tail connect successively, and cooperate this top 2022 to surround a rectangle not have end receiving space.This madial wall 2021 is one with this lateral wall 2023, and this madial wall 2021 is lower than this lateral wall 2023.Two adjacent madial wall 2021 inboard intersections, be respectively arranged with four grooves 2014 equally.
See also Fig. 4 again, be the schematic perspective view after the packaging arrangement packing shown in Figure 2.It is nested to rely on this convex edge 2011 and this groove 2021 to make that this box body 201 and this lid 202 cooperatively interact, and forms one in order to accommodate the accommodation space of this superimposed body 21.At these packing box 20 outside faces, there are two continuous bundle grooves 205 to be distributed in this box body 201 and this lid 202 correspondence positions, it is used for holding two bands 204.When transporting at a distance, can also increase by two bands 204, these two bands 204 are arranged on are used for further getting one's things ready this packing box 20 in the bundle groove 205 of these packing box 20 outside faces.
This box body 201 adopts resin foamed materials to constitute, as the high density polyethylene (HDPE) of polyolefin foaming body, polypropylene, low density polyethylene (LDPE), ethane-acetic acid ethyenyl ester co-polymer etc.Resin foamed material is that polyolefin bead or its foaming body of containing foaming agent are filled in the mould, makes with the uniform temperature heating, and its expansion ratio is controlled at 3～30 times.This foaming method can adopt the low pressure foaming, so can use aluminium pattern tool cheaply.The formed each several part thickness of resin foamed material according to strength demand, serves as suitable with 15～100mm.
This box body 201 is to adopt the method that contains electric conductive polymer or antistatic behaviour material doping foaming, and obtaining resistance coefficient is 10
3～10
12The resin foamed material of Ω cm makes glass substrate 211 can not destroy glass substrate 211 in-to-in circuit because of producing static.
Because the antistatic property of packing box 20 descends gradually along with the growth of period of service, the antistatic material of the expendable of Can Zaing wherein, tenure of use, average out to was 1 year.Generally, packing box 20 loses antistatic property and will not re-use, and causes material loss bigger, and cost increases.Increase in antistatic diaphragm 23 and the packing box 20, can prolong more than 3 years, effectively reduce packaging material and repeat acquisition cost with the antistatic property that guarantees packing box 20.Can also substitute and upgrade the antistatic diaphragm 23 that loses antistatic property, needn't and can not use, further save cost because of packing box 20 antistatic effects declines own.
Adopt the step of these packing box 20 these glass substrates 211 of packing to be:
At first, provide a packing box box body 201, lay an antistatic diaphragm 22 on its bottom 2012 inside faces;
Then, this dividing plate 212 and the 212 cross layered placements of this glass substrate are obtained a superimposed body 21, wherein the superiors of this superimposed body 21 are 212 layers on dividing plate;
At last, lid 202 is covered on this box body 201, and make the superiors' dividing plate 22 of this superimposed body 21 be connected to this these body 202 top inner surface.When the discontented packing box 20 of glass substrate 211, replenish and avoid the loosening of packing box 20 by dosing other weighting material.
Owing in box body 201, increase antistatic diaphragm 23, isolate box body 201 and superimposed body 21, the dust debris influence glass substrate 211 of avoiding packing box 20 to produce.
See also the glass substrate package that another kind of better embodiment disclosed structure decomposing schematic representation shown in Figure 5 again.In this embodiment, packaging arrangement 2 differences that the keystone configuration of this packaging arrangement 3 and a last embodiment are disclosed are: in the packaging arrangement 3 that present embodiment disclosed, the inside face of this packing box 30 is provided with a plurality of concaveconvex structures, with the impact that buffering external force causes, avoid stress concentration.
This box body 301 has a bottom 3012 and four madial wall 3011 and lateral walls 3013 perpendicular to bottom 3012 equally, these lateral wall 3013 head and the tail link to each other successively, cooperate this bottom 3012 to constitute a rectangle uncovered receiving space, this madial wall 3011 and this lateral wall 3013 are one, wherein these box body 301 bottoms 3012 inside faces are provided with a plurality of concaveconvex structures, in per two adjacent madial wall 3011 intersections, be respectively arranged with four grooves 3014.
This lid 302 has a top 3022 and four lateral walls 3023 perpendicular to top 3022 equally, this lateral wall 3023 joins end to end successively, cooperating this bottom 3022 to constitute a rectangle does not have the top receiving space, is provided with a plurality of concaveconvex structures too at these top 3022 inside faces.
This concaveconvex structure that is arranged on these packing box 30 tops 3022 and bottom 3012 inside faces is the tool elastic construction that exceeds inside face or dent into inside face, and these a plurality of concaveconvex structures and this packing box 30 are one-body molded.This concaveconvex structure thickness is suitable at 0.5～1mm.Its pattern can be strip, arcuation etc.When this kind structure can effectively be buffered in external impacts, the powerful glass substrate 311 that impacts, in the time of more can avoiding packing box 30 bumps, the stress concentration that causes, effectively cover glass substrate 311.The groove 3014 in its corner can avoid the corner angle of glass substrate 311 and sidewall 3013 to rub impaired.
At this moment, glass substrate 311 and dividing plate 312 can adopt superimposed body 31 ' structure as shown in Figure 6.This superimposed body 31 ' the comprise glass substrate 311 and a dividing plate 312 of stacked setting.
Same consider this superimposed body 31 ' weight and convenient in carrying of counter in the process of transporting, cooperate dividing plates 312 stacked settings to form ten to 30 sheet glass substrates 311 usually.This superimposed body 31 ' superimposed mode also have following situation:
If the quantity of glass substrate 311 is n (n＞2) sheet, then dividing plate quantity can be good for the n-1 sheet.
The superimposed body 31 of this kind structure ' can reduce the quantity of dividing plate 312, as shown in Figure 7, for packing box pack this superimposed body 31 ' solid assembling scheme drawing at the lid 302 of this packing box 30 and box body during 301 nested cooperations, because dividing plate 312 quantity reduce, can reduce packing box 30 integral thickness, help carrying; Under the situation of the integral thickness that does not reduce packing box 30, can increase number of glass substrate, promptly each packing box 30 increases on the quantity of packing glass substrate.When remote transportation, can adopt band 304 to be arranged in the bundle groove 305 equally, further protect superimposed body 31.
See also Fig. 8, Fig. 9, wherein Fig. 8 is again the glass substrate package structure decomposing schematic representation that a better embodiment is disclosed, and Fig. 9 is box body 401 another angle schematic perspective views that Fig. 8 disclosed.This packing device 4 comprises two superimposed bodies 41, two antistatic diaphragms 43, a lid 402 and two box bodys 401.This antistatic diaphragm 43 is arranged on this superimposed body 41 outsides.Wherein this packing box 40 is with a last embodiment difference: these box body 401 bottoms 4012 outside faces are provided with a depressed part 4014, it is corresponding that this depressed part 4014 and its madial wall 4011 exceed lateral wall 4013 parts, be provided with the elastomeric concaveconvex structure of a plurality of tools equally at box body 401 bottoms, 4012 inside faces and lid 402 tops 4022 inside faces, these a plurality of concaveconvex structures and this packing box 40 are one-body molded.When two box bodys 401 are stacked, each box body 401 inside face is equipped with an antistatic diaphragm 43, the mutually nested cooperation of the raised area of the depressed part 4014 of bottom 4012 outside faces of upper strata box body 401 and lower floor's box body 401 madial walls 4011, form two accommodation spaces simultaneously, each accommodation space is accommodated a superimposed body 41 and an antistatic diaphragm 43.
See also Figure 10 again, be the solid assembling scheme drawing behind the packing box shown in Figure 8 40 packing glass substrates 411.After packing box 40 assembling was finished, packing box 40 appearances can also increase further these packing boxes 40 of constraint of the bundle groove 405 of two bands on 404 along its, were convenient to carrying and transported.
This embodiment can transport multi-disc glass substrate 411 simultaneously, and convenient a large amount of glass substrates 411 transport.
Claims (10)
1. apparatus for packing glass base plates, it comprises: at least one dividing plate, an antistatic diaphragm and packing box that is used for stacked interval placement glass substrate, this antistatic diaphragm is arranged on this dividing plate outside, and this dividing plate and this antistatic diaphragm are housed in this packing box.
2. apparatus for packing glass base plates as claimed in claim 1 is characterized in that: this antistatic diaphragm is to adopt the high-density polyethylene resin material to make.
3. apparatus for packing glass base plates as claimed in claim 1 is characterized in that: what constitute this antistatic diaphragm material dopedly has preventing property of a static material.
4. apparatus for packing glass base plates as claimed in claim 1 is characterized in that: the antistatic coefficient scope of this antistatic diaphragm is 10
9～10
12Ω cm.
5. apparatus for packing glass base plates as claimed in claim 1 is characterized in that: this antistatic diaphragm comprises a plurality of fringe regions that can freely bend.
6. apparatus for packing glass base plates as claimed in claim 1, it is characterized in that: this packing box comprises the box body of the lid at a tool top and tool bottom, and this lid and this box body be nested to be cooperated and constitute one in order to the glass substrate of accommodating the placement of stacked interval and the accommodation space of this dividing plate.
7. apparatus for packing glass base plates as claimed in claim 6 is characterized in that: this box body bottom interior surface is provided with a plurality of concaveconvex structures.
8. apparatus for packing glass base plates as claimed in claim 6 is characterized in that: this lid top inner surface is provided with a plurality of concaveconvex structures.
9. apparatus for packing glass base plates as claimed in claim 6 is characterized in that: also comprise a plurality of box bodys, the mutually nested cooperation of this box body is stacked, constitutes a plurality of in order to accommodate the glass substrate stacked interval placed and the accommodation space of this dividing plate.
10. apparatus for packing glass base plates as claimed in claim 6 is characterized in that: the madial wall intersection of this box body is provided with groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510100954 CN1958404A (en) | 2005-11-03 | 2005-11-03 | Apparatus for packing glass base plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510100954 CN1958404A (en) | 2005-11-03 | 2005-11-03 | Apparatus for packing glass base plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1958404A true CN1958404A (en) | 2007-05-09 |
Family
ID=38070286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510100954 Pending CN1958404A (en) | 2005-11-03 | 2005-11-03 | Apparatus for packing glass base plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1958404A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102502108A (en) * | 2011-11-15 | 2012-06-20 | 吴江南玻华东工程玻璃有限公司 | Packaged low-radiation film coated glass capable of being tempered |
| CN103395571A (en) * | 2013-08-13 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Packing method of thermistors chips based on tray arrangement |
| CN104760762A (en) * | 2015-01-29 | 2015-07-08 | 昆山龙腾光电有限公司 | Glass sheet package structure and glass sheet package method |
| CN106800126A (en) * | 2017-04-05 | 2017-06-06 | 武汉华星光电技术有限公司 | A kind of packing box |
| DE102020130292A1 (en) | 2020-11-17 | 2022-05-19 | Schott Ag | Process for packaging and unpacking flat substrates and packaging for flat substrates |
-
2005
- 2005-11-03 CN CN 200510100954 patent/CN1958404A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102502108A (en) * | 2011-11-15 | 2012-06-20 | 吴江南玻华东工程玻璃有限公司 | Packaged low-radiation film coated glass capable of being tempered |
| CN103395571A (en) * | 2013-08-13 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Packing method of thermistors chips based on tray arrangement |
| CN104760762A (en) * | 2015-01-29 | 2015-07-08 | 昆山龙腾光电有限公司 | Glass sheet package structure and glass sheet package method |
| CN104760762B (en) * | 2015-01-29 | 2019-08-16 | 昆山龙腾光电有限公司 | Glass sheet packaging structure and glass sheet packing method |
| CN106800126A (en) * | 2017-04-05 | 2017-06-06 | 武汉华星光电技术有限公司 | A kind of packing box |
| DE102020130292A1 (en) | 2020-11-17 | 2022-05-19 | Schott Ag | Process for packaging and unpacking flat substrates and packaging for flat substrates |
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