CN103391691A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN103391691A CN103391691A CN2012101442255A CN201210144225A CN103391691A CN 103391691 A CN103391691 A CN 103391691A CN 2012101442255 A CN2012101442255 A CN 2012101442255A CN 201210144225 A CN201210144225 A CN 201210144225A CN 103391691 A CN103391691 A CN 103391691A
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Abstract
The invention discloses a circuit board and a manufacturing method thereof. A containing cavity is formed in a device embedded layer of a circuit board, an electronic element is positioned in the containing cavity, the surface, provided with an electrode, of the electronic element is printed by photosensitive resin so that the obtuse angle can be formed by the side face of the photosensitive resin and a board surface, and a blind hole is manufactured in the photosensitive resin, wherein the blind hole corresponds to the electrode and is communicated with the electrode. A circuit pattern electrically connected with the electrode is manufactured on the surface of the circuit board by the utilization of the mobility of the resin, and the obtuse angle is formed between the side face of the photosensitive resin and the circuit board surface. In the process of manufacturing the circuit pattern, due to the fact that the included angle between the side face of the photosensitive resin and the board surface is still the obtuse angle, a sensitizing film can be fully attached to a copper surface at the obtuse angle, the circuit pattern is completely covered by the sensitizing film in the process of etching, and the occurrence that a short circuit of an electric conduction circuit is caused due to the fact that etching liquid flows into the sensitizing film can be avoided.
Description
Technical field
The present invention relates to the circuit board fabrication technical field, relate in particular to a kind of circuit board and manufacture method thereof.
Background technology
Along with the development of information-intensive society, the information processing capacity of various electronic equipments grows with each passing day, and is growing for the demand of high frequency, high speed transmission of signals.Semiconductor is imbedded base plate for packaging, can effectively shorten the distance that is connected of semiconductor and base plate for packaging, for high frequency, high speed transmission of signals provide strong assurance.The naked core buried base plate can meet the growth requirement of packaging body high integration and electronic product microminiaturization simultaneously.In research and practice process to prior art, the inventor finds that existing embedded circuit board is generally by at printing photosensitive resin 5 on electronic component 4 and make metalized blind vias being electrically connected to the electrode of realizing electronic component 4 and line pattern on photosensitive resin 5.As shown in Figure 1, side and plate face formation right angle due to photosensitive resin after exposure imaging 5, so can't make light-sensitive surface 7 fully and the laminating of the copper face at place, right angle when subsides light-sensitive surface 7, and then 10 inflows are etched into off state with line pattern, trip point as shown in Figure 2 from gap can to cause etching solution.Need to adopt the vacuum laminator to carry out pad pasting in order to address the above problem, this will cause production cost to raise, even and use the vacuum film sticking equipment, can not fundamentally solve the etched defect that opens circuit that causes of figure circuit.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, a kind of method of manufacturing circuit board is provided, and flow into and cause line pattern to open circuit from the side of photosensitive resin to avoid etching solution, and production cost is lower.
Embodiment of the present invention technical problem to be solved is, a kind of circuit board is provided, and can avoid the figure circuit to flow into from the side of photosensitive resin the open defect that etching causes because of etching solution, and production cost is lower.
In order to solve the problems of the technologies described above, the embodiment of the present invention has proposed a kind of method of manufacturing circuit board, comprising:
Preliminary step, offer a containing cavity on the device embedding layer of circuit board;
Positioning step, with electronic units fix in described containing cavity;
Print steps, have the surface printing photosensitive resin of electrode at described electronic component, make the side of described photosensitive resin and plate face in obtuse angle;
Make the blind hole step, make the blind hole that with described electrode pair, should be communicated with on described photosensitive resin;
Make the circuitous pattern step, on the surface of circuit board, make the circuitous pattern that is electrically connected to described electrode.
Correspondingly, the embodiment of the present invention also provides a kind of circuit board, comprising:
Offer the device embedding layer of containing cavity;
Be positioned the electronic component in described containing cavity, described electronic component has on the surface of electrode and is printed with photosensitive resin, the side of described photosensitive resin and circuit board plate face in obtuse angle, have the blind hole that at least one corresponding described electrode setting also is communicated with it on described photosensitive resin;
And being formed at circuitous pattern on described device embedding layer, described circuitous pattern is electrically connected to the electrode of described electronic component by described blind hole.
The beneficial effect of the embodiment of the present invention is: the method for manufacturing circuit board of the embodiment of the present invention and circuit board, utilize the mobility of resin, and the side of photosensitive resin and plate face are in obtuse angle.When making circuitous pattern, due to the angle of the side of photosensitive resin and plate face still in obtuse angle, light-sensitive surface can be fully and the laminating of the copper face at place, obtuse angle, and during etching, circuitous pattern is covered fully by light-sensitive surface, can avoid etching solution to flow in light-sensitive surface and the problem that the conducting channel that causes opens circuit.
Description of drawings
Fig. 1 is the structural representation of existing circuit board.
Fig. 2 is the schematic diagram that existing circuit board produces trip point.
Fig. 3 is the flow chart of manufacture method of the circuit board of first embodiment of the invention.
Fig. 4 a-Fig. 4 j is the manufacture process schematic diagram of the circuit board of first embodiment of the invention.
Fig. 5 is the sectional structure chart of the circuit board of third embodiment of the invention.
Fig. 6 is the sectional structure chart of the circuit board of fourth embodiment of the invention.
Embodiment
With reference to accompanying drawing, circuit board of the present invention and manufacture method thereof are described.
As shown in Figure 3, the manufacture method of the circuit board of first embodiment of the invention all has the double-face electrode element of electrode based on first surface and second surface, and surperficial set number of electrodes can be selected according to actual conditions, and said method mainly comprises the steps:
S1: preliminary step, offer a containing cavity on the device embedding layer 1 of circuit board, this containing cavity is through hole 2, need to prove, when circuit board is single layer board, device embedding layer 1 is namely this single layer board, and when circuit board was multilayer circuit board, device embedding layer 1 can be its lamina rara externa or inner plating etc.
During concrete enforcement, the substrate of foregoing circuit plate is double face copper, and S1 can further comprise the steps:
At first, the double face copper shown in Fig. 4 a is carried out two-sided etching, reservation record (Mark) point 11, obtain the plate that device embedding layer 1 and Mark point 11 are only arranged as shown in Figure 4 b.
Secondly, as shown in Fig. 4 c, offer through hole 2 on device embedding layer 1.
S2: positioning step, electronic component 4 is positioned in through hole 2, S2 can be specially:
At first, as shown in Fig. 4 d, be positioned at the aperture of this second surface at the removable material sealing of the second surface subsides through hole 2 of device embedding layer 1, particularly, removable material can be adhesive tape or UV film etc.;
Secondly, as shown in Fig. 4 e, make the first surface direction of the first surface with electrode of electronic component 4 towards device embedding layer 1, the second surface with electrode of electronic component 4 is sticked on removable material 3.
S3: first impression step, as shown in Fig. 4 f, the first surface printing photosensitive resin 5 that has electrode at electronic component 4, utilize the mobility of resin, make electronic component 4 have the side of the photosensitive resin 5 on the first surface of electrode and circuit board plate face α in obtuse angle, and make in the gap of sidewall of the side of electronic component 4 and through hole 2 and be filled with photosensitive resin.
S4: make for the first time the blind hole step, as shown in Fig. 4 g, make the blind hole 6 that with the electrode pair of first surface, should be communicated with on the photosensitive resin 5 on the first surface of electronic component 4, particularly, S4 carries out exposure imaging to this photosensitive resin 5 after can solidifying for the photosensitive resin 5 of the first surface at electronic component 4, produce the blind hole 6 of connecting electrode, the side of photosensitive resin 5 is in exposure range, like this, the side of photosensitive resin 5 and plate face α in obtuse angle still after exposure imaging; Perhaps, S4 can bore the blind hole 6 that is connected with the electrode of electronic component 4 for adopting rig on photosensitive resin 5, the electrode of electronic component 4 is exposed, equally, after producing blind hole, the side of photosensitive resin 5 and plate face be α in obtuse angle still, and rig can be machine drilling equipment or laser drill equipment etc., and corresponding bore mode can be the combination of machine drilling or laser drill or machinery and laser drill etc.
S5: second impression step, remove the removable material 3 on the second surface of electronic component 4, and on second surface printing photosensitive resin 5, same, utilize the mobility of resin, the side of the photosensitive resin 5 on this second surface and circuit board plate face be β in obtuse angle.
S6: make for the second time the blind hole step, make the blind hole that with the electrode pair of second surface, should be communicated with on the photosensitive resin 5 on the second surface of electronic component 4, particularly, S6 also can be as described in content in S4, equally, after producing blind hole, the side of photosensitive resin 5 and plate face be β in obtuse angle still.
S7: make the circuitous pattern step, on the surface of circuit board, make the circuitous pattern that is electrically connected to the electrode of second surface with electronic component 4 first surfaces.
During concrete enforcement, S7 can further comprise the steps:
At first, first surface, second surface and the blind hole of device embedding layer 1 are sunk copper and plating, the first table and second surface at device embedding layer 1 form respectively the first bronze medal layer and the second bronze medal layer, as shown in Fig. 4 h, the first bronze medal layer and the second bronze medal layer can be fully and photosensitive resin 5 laminatings at obtuse angle alpha, β place.
Secondly, paste respectively light-sensitive surface 7 on the first bronze medal layer and the second bronze medal layer, as shown in Fig. 4 i, due to the side of photosensitive resin 5 and plate face still α, β in obtuse angle, this moment light-sensitive surface 7 can be fully and obtuse angle alpha, the first bronze medal layer at β place and the copper face of the second bronze medal layer fit.
Then, by the mode of film exposure imaging, make circuitous pattern, circuitous pattern is electrically connected to electronic component 4 each surperficial electrodes by blind hole 61, and the circuitous pattern of made can be as shown in Fig. 4 j.
As shown in Fig. 4 j, the circuit board that adopts manufacture method of the present invention to make comprises: the device embedding layer 1 and the electronic component 4 that is positioned in through hole 2 that offer through hole 2.The first surface and the second surface that have electrode at electronic component 4 all are printed with photosensitive resin 5, the side of the photosensitive resin 5 on first surface and second surface respectively with circuit board plate face α, β in obtuse angle, the blind hole 61 that has some settings of electrode corresponding to electronic component 4 on photosensitive resin 5 and be communicated with it.The foregoing circuit plate also comprises the circuitous pattern that is formed on device embedding layer 1, and circuitous pattern is electrically connected to each surperficial electrode of electronic component 4 by blind hole 61.And particularly, be formed with the first circuitous pattern 8, the first circuitous patterns 8 at the first surface of the device embedding layer 1 of circuit board and be electrically connected to the electrode of the second surface of electronic component 4.Second surface at device embedding layer 1 is formed with second circuit figure 9, and second circuit figure 9 is electrically connected to the electrode of the first surface of electronic component 4 by blind hole 61.Electronic component 4 has the first surface direction of the first surface of electrode towards device embedding layer 1, the second surface that electronic component 4 has electrode flushes with the second surface of device embedding layer 1, and the first surface and the second surface that have electrode at electronic component 4 all are printed with side and circuit board plate face photosensitive resin 5 in obtuse angle.Also be filled with photosensitive resin 5 in the gap of the sidewall of the side of electronic component 4 and through hole 4.
The manufacture method of the circuit board of second embodiment of the invention still all has the double-face electrode element of electrode based on first surface and second surface, the difference of itself and above-mentioned the first embodiment mainly is:
After carrying out the described first impression step of S3, after solidifying, the photosensitive resin 5 of the first impression removes the removable material 3 that electronic component 4 first surfaces are pasted, then carry out the described second impression step of S5, after the photosensitive resin 5 of the second impression solidifies, be similar to again the making of the blind hole on described electronic component 4 first surfaces of S4 and S6 and second surface, then carry out the making circuitous pattern step of S7.
Like this, first at electronic component 4, have after the first surface of electrode and second surface all print photosensitive resin 5, then carry out its blind hole and make, can avoid cross-operation between different operations, make operation more easy to control, increase work efficiency.
Certainly, the structure of the circuit board that the second embodiment manufacture method is made as shown in Fig. 4 j, repeats no more too herein.
The manufacture method of the circuit board of third embodiment of the invention has the single-side electrode element of electrode based on first surface only, the difference of itself and above-mentioned the first embodiment mainly is:
After the step of making blind hole for the first time of S4, remove the removable material 3 on the second surface that electronic component 4 do not have electrode, carry out afterwards the S7 step.
Like this, first after electronic component 4 first surfaces printing photosensitive resins 5, then the blind hole of carrying out on this first surface makes, and electronic component 4 second surfaces are due to electrode not being set, and namely need not this second surface is carried out the processing that photosensitive resin printing and blind hole are made.
And the structure of the circuit board that the 3rd embodiment manufacture method is made as shown in Figure 5, and namely circuit board comprises: the device embedding layer 1 and the electronic component 4 that is positioned in through hole 2 that offer through hole 2.The first surface that has electrode at electronic component 4 is printed with photosensitive resin 5, and the side of the photosensitive resin 5 on first surface and circuit board plate face be α in obtuse angle, the blind hole 61 that has some settings of electrode corresponding to electronic component 4 on photosensitive resin 5 and be communicated with it.The foregoing circuit plate also comprises the circuitous pattern that is formed on device embedding layer 1, and circuitous pattern is electrically connected to the electrode on electronic component 4 first surfaces by blind hole 61.And particularly, at the second surface of the device embedding layer 1 of circuit board, be formed with second circuit figure 9.Electronic component 4 has the first surface direction of the first surface of electrode towards device embedding layer 1, the second surface that electronic component 4 does not have electrode flushes with the second surface of device embedding layer 1, and the first surface that has an electrode at electronic component 4 is printed with side and the circuit board plate face photosensitive resin 5 of α in obtuse angle.Also be filled with photosensitive resin 5 in the gap of the sidewall of the side of electronic component 4 and through hole 4.
The manufacture method of the circuit board of fourth embodiment of the invention has the single-side electrode element of electrode based on first surface only, the difference of itself and above-mentioned the first embodiment mainly is:
In S1, offer a containing cavity at the device embedding layer 1 of circuit board, this containing cavity is cell body; In S2, adopt following method to carry out the location of electronic component 4: to make first surface that electronic component 4 has an electrode be fixed in the bottom of cell body towards the opening direction of cell body and the second surface that makes electronic component 4 not have electrode; Then, after the first surface electronic component 4 has an electrode of describing as S4 is made the blind hole step, carry out the S7 step.
Like this, first after electronic component 4 first surfaces printing photosensitive resins 5, then the blind hole of carrying out on this first surface makes, and electronic component 4 second surfaces are due to electrode not being set, and namely need not this second surface is carried out the processing that photosensitive resin printing and blind hole are made.
And the structure of the circuit board that the 4th embodiment manufacture method is made as shown in Figure 6, and it comprises: the device embedding layer 1 and the electronic component 4 that is positioned in cell body that offer cell body.The first surface that has electrode at electronic component 4 is printed with photosensitive resin 5, and the side of the photosensitive resin 5 on first surface and circuit board plate face be α in obtuse angle, the blind hole 61 that has some settings of electrode corresponding to electronic component 4 on photosensitive resin 5 and be communicated with it.The foregoing circuit plate also comprises the circuitous pattern that is formed on device embedding layer 1, and circuitous pattern is electrically connected to the electrode on electronic component 4 first surfaces by blind hole 61.And particularly, at the second surface of the device embedding layer 1 of circuit board, be formed with second circuit figure 9.Electronic component 4 has the opening direction of the first surface of electrode towards cell body, the second surface that electronic component 4 does not have an electrode is fixed in the bottom 12 of cell body, and the first surface that has an electrode at electronic component 4 is printed with side and the circuit board plate face photosensitive resin 5 of α in obtuse angle.Also be filled with photosensitive resin 5 in the gap of the sidewall of the side of electronic component 4 and through hole 4.
Need to prove, above-mentioned electronic component 4 can be passive device or the active device with electrode, and wherein, passive device can be resistance, inductance or electric capacity etc., and active device can be diode, triode or logic chip etc.And blind hole 61 is for being used for the conductive blind hole of connection circuit figure and electronic component 4 electrodes.
The surface printing with electrode of the electronic component 4 of the circuit board of the embodiment of the present invention has photosensitive resin 5, utilize the mobility of resin, the side of photosensitive resin 5 and plate face in obtuse angle, can be chosen as according to the viscosity of printing ink 100 degree, 120 degree, 150 degree, 170 degree etc. such as this obtuse angle.When carrying out circuitous pattern manufacturing process, still keep the side of photosensitive resin 5 and plate face in obtuse angle, light-sensitive surface 7 can be fully and the laminating of the copper face at place, obtuse angle, during etching, circuitous pattern is covered fully by light-sensitive surface 7, can avoid etching solution to flow in light-sensitive surface 7 and the problem that the conducting channel that causes opens circuit, and production cost is lower.
The above is the specific embodiment of the present invention; should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (10)
1. a method of manufacturing circuit board, is characterized in that, comprising:
Preliminary step, offer a containing cavity on the device embedding layer of circuit board;
Positioning step, with electronic units fix in described containing cavity;
Print steps, have the surface printing photosensitive resin of electrode at described electronic component, make the side of described photosensitive resin and plate face in obtuse angle;
Make the blind hole step, make the blind hole that with described electrode pair, should be communicated with on described photosensitive resin;
Make the circuitous pattern step, on the surface of circuit board, make the circuitous pattern that is electrically connected to described electrode.
2. method of manufacturing circuit board as claimed in claim 1, is characterized in that, in described positioning step:
When electronic component is that single-side electrode element and described containing cavity are while being the through hole of device embedding layer, make surface that described electronic component has an electrode towards the first surface direction of described device embedding layer and at the second surface of described device embedding layer, paste removable material sealing through hole to be positioned at the aperture of this second surface, another surface of electronic component is sticked on described removable material;
When electronic component is that double-face electrode element and described containing cavity are while being the through hole of device embedding layer, make first surface that described electronic component has an electrode towards the first surface direction of described device embedding layer and at the second surface of described device embedding layer, paste removable material sealing through hole to be positioned at the aperture of this second surface, the second surface that makes electronic component have electrode sticks on described removable material;
, when electronic component is single-side electrode element and described containing cavity while being the cell body of device embedding layer, make surface that described electronic component has an electrode towards the opening direction of described cell body and make another surface of electronic component be fixed in the bottom of described cell body.
3. method of manufacturing circuit board as claimed in claim 2, is characterized in that, described print steps comprises:
When electronic component is the single-side electrode element, have at described electronic component on the surface of electrode and print photosensitive resin, utilize the mobility of resin, described electronic component has the side of lip-deep photosensitive resin of electrode and circuit board plate face in obtuse angle, and makes in the gap of sidewall of the side of described electronic component and described through hole and be filled with photosensitive resin;
When electronic component is the double-face electrode element, print photosensitive resin on the first surface of described electronic component, after solidifying, removes the photosensitive resin on the first surface of described electronic component the removable material of the second surface stickup of described electronic component, and print photosensitive resin on the second surface of described electronic component, utilize the mobility of resin, the first surface of described electronic component and the side of the photosensitive resin on second surface and circuit board plate face in obtuse angle, and make in the gap of sidewall of the side of described electronic component and described through hole and are filled with photosensitive resin.
4. method of manufacturing circuit board as claimed in claim 1, is characterized in that, makes the blind hole step and comprise:
Photosensitive resin is carried out exposure imaging, produce the blind hole that connects described electrode, the side of photosensitive resin is in exposure range; Perhaps,
Adopt rig to bore the blind hole that is connected with the electrode of described electronic component on described photosensitive resin, the electrode of described electronic component is exposed.
5. buried circuits board fabrication method as claimed in claim 2, is characterized in that, makes the circuitous pattern step and comprise:
First surface, second surface and the blind hole of described device embedding layer are sunk copper and plating, at first surface and the second surface of device embedding layer, form respectively the first bronze medal layer and the second bronze medal layer;
Paste respectively light-sensitive surface on described the first bronze medal layer and the second bronze medal layer;
Mode by film exposure imaging is made circuitous pattern, and described circuitous pattern is electrically connected to the electrode of described electronic component by blind hole.
6. method of manufacturing circuit board as claimed in claim 2 or claim 3, is characterized in that, described removable material is adhesive tape or UV film.
7. a circuit board, is characterized in that, comprising:
Offer the device embedding layer of containing cavity;
Be positioned the electronic component in described containing cavity, described electronic component has on the surface of electrode and is printed with photosensitive resin, the side of described photosensitive resin and circuit board plate face in obtuse angle, have the blind hole that at least one corresponding described electrode setting also is communicated with it on described photosensitive resin;
And being formed at circuitous pattern on described device embedding layer, described circuitous pattern is electrically connected to the electrode of described electronic component by described blind hole.
8. circuit board as claimed in claim 7, it is characterized in that, when described electronic component is that single-side electrode element and described containing cavity are while being the through hole of device embedding layer, described electronic component has the first surface direction of the surface of electrode towards described device embedding layer, another surface of described electronic component is towards the second surface of described device embedding layer, the surface printing that has electrode at described electronic component has side and circuit board plate face photosensitive resin in obtuse angle, and is filled with photosensitive resin in the gap of the sidewall of the side of described electronic component and described through hole.
9. circuit board as claimed in claim 7, it is characterized in that, when described electronic component is that double-face electrode element and described containing cavity are while being the through hole of device embedding layer, described electronic component has the first surface direction of the first surface of electrode towards described device embedding layer, described electronic component has the second surface of the second surface of electrode towards described device embedding layer, the first surface and the second surface that have electrode at described electronic component all are printed with side and circuit board plate face photosensitive resin in obtuse angle, and be filled with photosensitive resin in the gap of the sidewall of the side of described electronic component and described through hole.
10. circuit board as claimed in claim 7, it is characterized in that, when described electronic component is that single-side electrode element and described containing cavity are while being the cell body of device embedding layer, described electronic component has the opening direction of the surface of electrode towards described cell body, the bottom of described cell body is fixed on another surface of described electronic component, the surface printing that has electrode at described electronic component has side and circuit board plate face photosensitive resin in obtuse angle, and is filled with photosensitive resin in the gap of the sidewall of the side of described electronic component and described through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210144225.5A CN103391691B (en) | 2012-05-10 | 2012-05-10 | Circuit board and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210144225.5A CN103391691B (en) | 2012-05-10 | 2012-05-10 | Circuit board and manufacture method thereof |
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| CN103391691A true CN103391691A (en) | 2013-11-13 |
| CN103391691B CN103391691B (en) | 2016-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210144225.5A Active CN103391691B (en) | 2012-05-10 | 2012-05-10 | Circuit board and manufacture method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867277A (en) * | 2020-08-12 | 2020-10-30 | 惠州中京电子科技有限公司 | Manufacturing method of copper block-embedded power panel |
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| JPS63289989A (en) * | 1987-05-22 | 1988-11-28 | Mitsubishi Electric Corp | Formation of photosensitive resist film on printed wiring board |
| CN1444273A (en) * | 2002-03-08 | 2003-09-24 | 株式会社日立制作所 | Electronic device |
| JP2005191284A (en) * | 2003-12-25 | 2005-07-14 | Fuji Photo Film Co Ltd | Manufacturing method of printed wiring board |
| US20100067202A1 (en) * | 2006-11-07 | 2010-03-18 | Continental Automotive Gmbh | Electronics housing with standard interface |
| CN101828254A (en) * | 2007-10-03 | 2010-09-08 | 株式会社藤仓 | Module, wiring board and module manufacturing method |
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2012
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63289989A (en) * | 1987-05-22 | 1988-11-28 | Mitsubishi Electric Corp | Formation of photosensitive resist film on printed wiring board |
| CN1444273A (en) * | 2002-03-08 | 2003-09-24 | 株式会社日立制作所 | Electronic device |
| JP2005191284A (en) * | 2003-12-25 | 2005-07-14 | Fuji Photo Film Co Ltd | Manufacturing method of printed wiring board |
| US20100067202A1 (en) * | 2006-11-07 | 2010-03-18 | Continental Automotive Gmbh | Electronics housing with standard interface |
| CN101828254A (en) * | 2007-10-03 | 2010-09-08 | 株式会社藤仓 | Module, wiring board and module manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111867277A (en) * | 2020-08-12 | 2020-10-30 | 惠州中京电子科技有限公司 | Manufacturing method of copper block-embedded power panel |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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