CN103381486B - 一种表面改性的核壳结构Cu@SiO2纳米颗粒的制备方法 - Google Patents
一种表面改性的核壳结构Cu@SiO2纳米颗粒的制备方法 Download PDFInfo
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- CN103381486B CN103381486B CN201310186787.0A CN201310186787A CN103381486B CN 103381486 B CN103381486 B CN 103381486B CN 201310186787 A CN201310186787 A CN 201310186787A CN 103381486 B CN103381486 B CN 103381486B
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- 239000002105 nanoparticle Substances 0.000 title claims abstract description 39
- 238000012986 modification Methods 0.000 title claims abstract description 33
- 230000004048 modification Effects 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000000839 emulsion Substances 0.000 claims abstract description 13
- 239000000376 reactant Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 8
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 8
- -1 organic acid compound Chemical class 0.000 claims description 8
- 239000002243 precursor Substances 0.000 claims description 8
- 239000006228 supernatant Substances 0.000 claims description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 238000013517 stratification Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 claims description 4
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical group B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010277 boron hydride Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229960004643 cupric oxide Drugs 0.000 claims description 3
- 150000004760 silicates Chemical class 0.000 claims description 3
- 239000005046 Chlorosilane Substances 0.000 claims description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims description 2
- 229940116318 copper carbonate Drugs 0.000 claims description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 2
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 2
- LITQZINTSYBKIU-UHFFFAOYSA-F tetracopper;hexahydroxide;sulfate Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[O-]S([O-])(=O)=O LITQZINTSYBKIU-UHFFFAOYSA-F 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000002114 nanocomposite Substances 0.000 abstract description 2
- 238000002444 silanisation Methods 0.000 abstract description 2
- 238000003786 synthesis reaction Methods 0.000 abstract description 2
- 238000012805 post-processing Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 14
- 238000003756 stirring Methods 0.000 description 11
- 239000008367 deionised water Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000013019 agitation Methods 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000000967 suction filtration Methods 0.000 description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000012279 sodium borohydride Substances 0.000 description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- SXTLQDJHRPXDSB-UHFFFAOYSA-N copper;dinitrate;trihydrate Chemical compound O.O.O.[Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O SXTLQDJHRPXDSB-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- SNGREZUHAYWORS-UHFFFAOYSA-N perfluorooctanoic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F SNGREZUHAYWORS-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002345 surface coating layer Substances 0.000 description 1
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- Silicon Compounds (AREA)
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CN103862039B (zh) * | 2014-03-14 | 2015-12-30 | 中国科学院深圳先进技术研究院 | 核壳结构铜纳米微粒及其制备方法 |
CN103949254B (zh) * | 2014-05-06 | 2017-02-15 | 江西师范大学 | 一种用于氨硼烷和肼硼烷水解制氢的 Cu@mSiO2核壳纳米催化剂及其制备方法 |
CN105664942B (zh) * | 2016-01-23 | 2018-05-25 | 湖北工程学院 | 一种用于柴油尾气处理的微孔催化材料的制备方法 |
SG10201912814PA (en) | 2016-02-12 | 2020-02-27 | Univ Nanyang Tech | A composite material with enhanced mechanical properties and a method to fabricate the same |
CN106735181B (zh) * | 2016-12-14 | 2019-01-11 | 中国科学院深圳先进技术研究院 | SiO2@Ag核壳结构复合导电粒子及其制备方法 |
CN107639237B (zh) * | 2017-09-18 | 2020-08-11 | 广东工业大学 | Cu/SiO2复合材料、其制备方法与铜-陶瓷基板的制备方法 |
CN107936295A (zh) * | 2017-11-24 | 2018-04-20 | 广东聚航新材料研究院有限公司 | 一种改性纳米铜以及纳米铜‑环氧树脂复合材料及其制备方法 |
CN108907182B (zh) * | 2018-07-09 | 2020-06-23 | 河南大学 | 一种水溶性Cu@SiO2纳米微粒及其制备方法和应用 |
CN114985730B (zh) * | 2022-04-28 | 2024-04-30 | 中科铜都粉体新材料股份有限公司 | 一种抗氧化铜粉的制备方法 |
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CN1793047A (zh) * | 2005-11-24 | 2006-06-28 | 武汉理工大学 | 一种核壳复合陶瓷颗粒的制备方法 |
CN101100000A (zh) * | 2007-06-05 | 2008-01-09 | 暨南大学 | 一种核壳结构复合纳米材料及其制备方法 |
CN101288664A (zh) * | 2008-06-11 | 2008-10-22 | 东南大学 | 核壳结构磁性纳米微囊的制备方法 |
CN101306468A (zh) * | 2007-05-19 | 2008-11-19 | 浙江师范大学 | 导电聚吡咯包裹铜银复合纳米粒子的制备方法 |
CN102241844A (zh) * | 2010-05-11 | 2011-11-16 | 中国科学院深圳先进技术研究院 | 复合电介质材料及其制备方法 |
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CN1793047A (zh) * | 2005-11-24 | 2006-06-28 | 武汉理工大学 | 一种核壳复合陶瓷颗粒的制备方法 |
CN101306468A (zh) * | 2007-05-19 | 2008-11-19 | 浙江师范大学 | 导电聚吡咯包裹铜银复合纳米粒子的制备方法 |
CN101100000A (zh) * | 2007-06-05 | 2008-01-09 | 暨南大学 | 一种核壳结构复合纳米材料及其制备方法 |
CN101288664A (zh) * | 2008-06-11 | 2008-10-22 | 东南大学 | 核壳结构磁性纳米微囊的制备方法 |
CN102241844A (zh) * | 2010-05-11 | 2011-11-16 | 中国科学院深圳先进技术研究院 | 复合电介质材料及其制备方法 |
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