CN103377863B - Surface plate unit - Google Patents

Surface plate unit Download PDF

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Publication number
CN103377863B
CN103377863B CN201310049359.3A CN201310049359A CN103377863B CN 103377863 B CN103377863 B CN 103377863B CN 201310049359 A CN201310049359 A CN 201310049359A CN 103377863 B CN103377863 B CN 103377863B
Authority
CN
China
Prior art keywords
alignment pin
platform
glass substrate
coupling member
lateral direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310049359.3A
Other languages
Chinese (zh)
Other versions
CN103377863A (en
Inventor
金子保
田岛康崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chugai Ro Co Ltd
Original Assignee
Chugai Ro Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chugai Ro Co Ltd filed Critical Chugai Ro Co Ltd
Publication of CN103377863A publication Critical patent/CN103377863A/en
Application granted granted Critical
Publication of CN103377863B publication Critical patent/CN103377863B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/04Transporting of hot hollow or semi-hollow glass products
    • C03B35/06Feeding of hot hollow glass products into annealing or heating kilns
    • C03B35/12Feeding of hot hollow glass products into annealing or heating kilns by picking-up and depositing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16MFRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00Stands or trestles as supports for apparatus or articles placed thereon Stands for scientific apparatus such as gravitational force meters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Abstract

The invention provides for a surface plate unit capable of locating a glass panel being heat treated on a ceramic surface plate through metal pins and capable of producing easily and in a low cost. A surface plate unit includes a ceramic surface plate 3 on which a glass plate 2 being heat treated is placed, a plurality of loosen holes 4 penetrating the surface plate vertically, the loosen holes being arranged at positions where a periphery of the glass plate is located, a plurality of metal pins 5 loosely inserted into the loosen holes respectively, and connecting members 6 connecting each of two adjacent pins on the surface plate so as to maintain a protruding condition that the pins protrude over the surface plate from the loosen holes.

Description

Platform unit
Technical field
The present invention relates to the structure of making by simply and at an easy rate, and utilize metal alignment pin the glass substrate that carries out heat treated can be positioned to the platform unit on the platform of pottery system.
Background technology
In the past, when laminal workpiece is implemented to process, as workpiece being carried out to the technology of position maintenance, known had a for example patent documentation 1~3." lowering or hoisting gear of workpiece " of patent documentation 1 be with respect to absorption keep the workpiece of thin sheet form and workpiece is implemented regulation processing goods and make the lowering or hoisting gear of the workpiece that workpiece lifting uses, possess for making the lifter pin of workpiece lifting and for lifter pin being carried out to the working cylinder of lifting driving, the power that workpiece has been pressed of lifter pin is set as below 10 times of weight of workpiece.
" substrate carrier " of patent documentation 2 possesses supporting member for substrate, compress pin and pushpin, elongated support plate, lowering or hoisting gear, this supporting member for substrate loads the circumference of the glass substrate of transparent rectangular shape and is formed with the opening that transmission illumination is used, describedly compress the location that pin and pushpin are arranged on described supporting member for substrate and carry out described glass substrate to surround the mode of described opening, this support plate configures a plurality of and outstanding fulcrum post that is provided with in the mode of opening described in crosscut, this fulcrum post supports being positioned in the back side of the described glass substrate on described supporting member for substrate, this lowering or hoisting gear is arranged on described supporting member for substrate, make described support plate increase and the back side butt of described fulcrum post and described glass substrate is supported described glass substrate, and, described support plate is declined and make described fulcrum post remove the supporting to described glass substrate from the back side separation of described glass substrate, described lowering or hoisting gear makes described support plate rise and by described fulcrum post, described glass substrate is supported after described glass substrate is positioned to described supporting member for substrate.
In " manufacture method of glass locator, alignment pin and plasma display device " of patent documentation 3, glass locator is in mounting, to have in order to carry out the heat treatment of glass substrate the glass locator being handled upside down under the state of glass substrate in heat-treatment furnace, at a plurality of positions of periphery in the substrate-placing region of mounting glass substrate, is formed with the pin installation portion that alignment pin is installed.
Patent documentation 1 possesses absorption of workpieces maintenance device onboard.Patent documentation 2 possesses and glass substrate absorption is held in to substrate carrier and by pushpin with compress the device of pin clamping.In patent documentation 3, when laminal glass substrate is heat-treated, the locator (pallet) that glass substrate is positioned in to the pottery system of excellent heat resistance is upper, and alignment pin is set on locator for glass substrate on locator is not moved in carrying.Alignment pin and locator are chimeric or screw togather by screw.
[formerly technical literature]
[patent documentation]
[patent documentation 1] TOHKEMY 2002-313893 communique
No. 3636235 specification of [patent documentation 2] Japan Patent
[patent documentation 3] TOHKEMY 2005-174669 communique
[summary of invention]
[inventing problem to be solved]
The attenuation year by year of the display floater of liquid crystal etc. or touch panel, as the also attenuation of glass substrate of its base material, it is difficult that operation during manufacture becomes.This glass substrate is added to man-hour, require high accuracy, therefore when glass substrate is carried out to heat treated, preferably under the state of platform, carry being positioned.
Now, as platform unit, if platform and alignment pin use the pottery of excellent heat resistance, cost is surging.And if the platform of the metal alignment pin of cheapness and pottery system is chimeric or screw togather by screw, different due to the coefficient of thermal expansion of pottery and metal, may make the platform breakage of pottery system.Therefore the cheap platform unit that, requires a kind of glass substrate to heat treated to position, keep.
Summary of the invention
The present invention proposes in view of above-mentioned problem in the past, and it is a kind of by simply and the structure of making at an easy rate that object is to provide, and utilizes metal alignment pin the glass substrate that carries out heat treated can be positioned to the platform unit on the platform of pottery system.
[for solving the means of problem]
Platform of the present invention unit is characterised in that to possess: the platform of pottery system, and it is uploaded and is equipped with the glass substrate that carries out heat treated; A plurality of porosities, it be arranged in the position that glass substrate is positioned, and direction is formed through up and down on this platform; A plurality of metal alignment pins, it is inserted in described porosity loosely; Coupling member, it is connected to each other by above-mentioned alignment pin on above-mentioned platform, and keep this alignment pin from above-mentioned porosity to this platform outstanding projected state, at described alignment pin, be formed with lateral direction penetrating hole, described coupling member penetrates in described lateral direction penetrating hole loosely through described lateral direction penetrating hole.
Platform of the present invention unit is characterised in that, described coupling member is by the bight for Locating Glass substrate and the described alignment pin of arranging across this bight links to avoid the mode in this bight each other.
Platform of the present invention unit is characterised in that, described coupling member has fastener, and this fastener is limited to this alignment pin in the position of blocking from glass substrate by described alignment pin.
Platform of the present invention unit is characterised in that, the described fastener of above-mentioned coupling member is formed by the bend turning back along the outer ring of above-mentioned alignment pin from above-mentioned lateral direction penetrating hole, this bend is in order to limit the interference of itself and glass substrate, the rotation corresponding to above-mentioned coupling member in above-mentioned lateral direction penetrating hole and with above-mentioned alignment pin butt.
[invention effect]
In platform of the present invention unit, by the structure of making simply and at an easy rate, and utilize metal alignment pin the glass substrate that carries out heat treated can be positioned on the platform of pottery system.
Accompanying drawing explanation
Fig. 1 is the key diagram of structure of the first execution mode of explanation platform of the present invention unit.
Fig. 2 is the stereogram that is applied to the alignment pin of the platform unit shown in Fig. 1.
Fig. 3 means the stereogram of state platform unit, that the bight of glass substrate is positioned of Fig. 1.
Fig. 4 is the key diagram of structure of the second execution mode of explanation platform of the present invention unit.
Fig. 5 means the stereogram platform unit shown in Fig. 4, that make the state of coupling member perforation alignment pin.
Fig. 6 is the key diagram of the fastener of the coupling member shown in key diagram 5.
Fig. 7 is the key diagram of the unfavorable condition of explanation supposition.
[symbol description]
1 platform unit
2 glass substrates
The bight of 2a glass substrate
The limit of 2b, 2c glass substrate
3 platforms
4 porosities
5 alignment pins
5a sells top
5b sells bottom
6 coupling members
6a bending part
6b fastener
7 lateral direction penetrating holes
R loads region
H alignment pin is from the platform height at outstanding position upward
R fastener and the distance that connects the position of alignment pin
Embodiment
Below, with reference to accompanying drawing, describe platform of the present invention unit in detail preferred embodiment.The platform unit 1 of the first execution mode shown in Figure 1.For example, in the situation that the laminal glass substrate 2 being used in below the about 1mm of the portable thickness with communication equipment is carried out to heat treated, glass substrate 2 is positioned on platform 3 and uses the platform unit 1 of present embodiment when carrying in heating furnace.In the present embodiment, the platform unit 1 of enumerating the glass substrate 2 of mounting rectangular shape describes for example.
As shown in Figure 1, platform unit 1 possesses: the platform 3 of pottery system, and it is uploaded and is equipped with the glass substrate 2 that carries out heat treated; A plurality of porosities 4, it,, on this platform 3, be arranged in the position that glass substrate 2 is positioned, and direction is formed through up and down; A plurality of metal alignment pins 5, it is inserted into these a plurality of porosities 4 interior side separately loosely; Coupling member 6, it is connected to each other by alignment pin 5 on platform 3, and by be inserted into alignment pin 5 in porosity 4 remain from porosity 4 to platform 3 outstanding state.
As shown in Figure 1, the platform 3 of pottery system has than the large area of glass substrate 2 of mounting.On platform 3, in the mode that the mounting region R that locates and load glass substrate 2 is surrounded, on the position that glass substrate 2 is positioned, arrange eight porosities 4.Eight porosities 4 position for four bight 2a that glass substrate 2 is had, and respectively arrange two on the position across these four bight 2a.
Shown in Fig. 2, form the alignment pin 5 of platform unit 1.The top of alignment pin 5 forms round table-like.The bottom of alignment pin 5 forms the cylindric of the diameter identical with the bottom surface of the round platform on top.Below, by being round table-like position, being called pin top 5a and cylindrical position is called to pin bottom 5b and describe.
The diameter of the lower end of pin top 5a forms littlely than the diameter that is arranged on the porosity 4 on platform 3.The mode that the diameter of pin 5aYi horizontal cross-section, top reduces towards upper end from lower end forms.Therefore, in alignment pin 5, the diameter of the diameter of the lower end of pin top 5a and pin bottom 5b is maximum outside diameter, and this maximum outside diameter is set littlely than the diameter of porosity 4.
At alignment pin 5, be formed with lateral direction penetrating hole 7, this lateral direction penetrating hole 7 is positioned at pin bottom 5b and connects along the diametric(al) of this alignment pin 5.Coupling member 6 is through in lateral direction penetrating hole 7.The diameter in lateral direction penetrating hole 7 forms much smaller than the maximum outside diameter of alignment pin 5.
The platform unit 1 of the first execution mode is used in heat treated, therefore consider the difference of platform 3 with the coefficient of thermal expansion of the metal alignment pin 5 inserting to porosity 4 of the pottery system that forms porosity 4, for fear of 5 pairs of platforms 3 of alignment pin that thermal expansion occurs because of heat treated, cause damage, and the internal diameter of porosity 4 is formed much larger than the external diameter of alignment pin 5.Therefore, when only alignment pin 5 being inserted to porosity 4, the projected state of the alignment pin 5 cannot keeping from porosity 4 to platform 3.Therefore,, in the platform unit 1 of present embodiment, possess on platform 3 alignment pin 5 coupling member 6 connected to each other.
Coupling member 6 is for example metal wire rod, by the much smaller diameter of diameter than being located at the lateral direction penetrating hole 7 of alignment pin 5, is formed.Therefore, coupling member 6 penetrates in lateral direction penetrating hole 7 loosely.
The state that the bight 2a of glass substrate 2 is positioned shown in Figure 3.Coupling member 6 connects the lateral direction penetrating hole 7 of alignment pin 5 and avoids bight 2a and these two alignment pins 5 are connected to each other, and this alignment pin 5 is inserted in two porosities 4 in eight porosities 4 being located at platform 3, that arrange across this bight 2a for each bight 2a to glass substrate 2 positions.
That is, coupling member 6 with the both sides 2b of glass substrate 2 that forms bight 2a, the mode of 2c butt, avoid bight 2a and two alignment pins arranging across bight 2a 5 linked.Therefore, the length setting of coupling member 6 be roughly at right angles bending then from the outstanding length of each alignment pin 5.By the formation of this bending part 6a, prevent the deviating from from alignment pin 5 of coupling member 6.
While loading glass substrate 2 on platform unit 1, use eight alignment pins 5, first, utilize coupling member 6 that each two alignment pins 5 are linked.Now, make the end of coupling member 6 outstanding from the lateral direction penetrating hole 7 of each alignment pin 5.And, to avoid the mode of bight 2a, by bending part 6a, coupling member 6 is bent into for example approximate right angle.
Next, corresponding in eight porosities 4 that are arranged on platform 3, across each two porosities 4 of the position relationship of each bight of glass substrate 2 2a, adjust the interval of two alignment pins 5 that linked by coupling member 6.Next, to two porosities 4, insert respectively alignment pin 5.Now, by the coupling member 6 of 5 of alignment pins is positioned on platform 3, and keep alignment pin 5 from porosity 4 to platform 3 outstanding projected state.
Then, from platform 3 tops, move into glass substrate 2, be positioned on mounting region R.Now, because the pin top 5a of each alignment pin 5 forms truncated conical shape, therefore utilize the inclination of pin top 5a, can be easily and swimmingly glass substrate 2 locate and is configured in and load on the R of region.
According to the platform unit 1 of the first execution mode, glass substrate 2 is positioned to alignment pin 5 on platform 3 by the lateral direction penetrating hole 7 through two alignment pins 5 is bonded by coupling member 6, and is inserted in the porosity 4 of being located at platform 3 and outstanding projected state keeping from porosity 4 to platform 3.
Thus, at alignment pin 5, self stopper etc. need not be set, just alignment pin 5 can be held in to outstanding state on platform 3.Therefore, on platform 3, be only provided with porosity 4, so do not need the complicated processing to platform 3.Alignment pin 5 and coupling member 6, owing to being simple shape, therefore can easily be processed.
Alignment pin 5 is only inserted into loosely in porosity 4 and is not pressed into etc., therefore between porosity 4 and alignment pin 5, the gap of playing the effect of leading to can be set.Thus, in being used in the platform unit 1 of heat treated, even if alignment pin 5 is different from the coefficient of thermal expansion of platform 3, there is no bad influence, without utilizing the pottery of high price to form alignment pin 5 yet.Therefore, can suppress material cost and processing cost, thereby make at an easy rate platform unit 1.
Owing to making coupling member 6 connect the lateral direction penetrating hole 7 of two alignment pins 5, alignment pin 5 is connected to each other, therefore alignment pin 5 is being inserted under the state of porosities 4, coupling member 6 can not come off from alignment pin 5.Like this, only make coupling member 6 connect lateral direction penetrating hole 7, just can alignment pin 5 is connected to each other, therefore can guarantee excellent workability and productivity.
At this, two alignment pins 5 coupling member 6 connected to each other of each bight 2a configuration across glass substrate 2 may not be leaveed no choice but bend to approximate right angle, as long as at least avoid bight 2a and connect the lateral direction penetrating hole 7 of alignment pin 5 and two alignment pins 5 are connected to each other.
In the situation that do not use coupling member 6, the different alignment pin 5 of coefficient of thermal expansion is held in to platform 3, also the method that has the diameter of the lower end of the pin top 5a that makes alignment pin 5 to be greater than the diameter etc. of pin bottom 5b and avoid falling from porosity 4, but because glass substrate 2 is thin and alignment pin 5 is light, therefore to platform unit when 1 mounting moving glass substrate 2, due to its vibration, and hypothesis glass substrate 2 as the A portion of Fig. 7 slips into and is clamped between pin top 5a and platform 3.Like this, when lifting glass substrate 2, the edge of glass substrate 2 may be blocked and is hung on alignment pin 5 and makes glass substrate 2 breakages.
With respect to this, owing to there is not platform 3 and alignment pin completely, 5 Shang Xia overlapping position in the platform unit 1 of present embodiment, therefore can prevent that alignment pin 5 cards are hung on the situation appearance that glass substrate 2 grades make glass substrate 2 breakages.
When to platform 3 assembling and positioning pin 5, only from platform 3, direction porosity 4 inserts alignment pin 5, for platform 3, only by the operation from top, just can install alignment pin 5.That is, not to use screw or nut to be fixed alignment pin 5 from the lower face side of platform 3, therefore operation simply at short notice.
In addition, at platform 3, occurred when stained, can easily dismantle that alignment pin 5 and coupling member 6 clean or these alignment pins 5 etc. are changed.Thus, can guarantee excellent workability and maintainability, can produce cheapness and manufacture the high platform unit 1 of efficiency.
Fig. 4 illustrates the platform unit 1 of the second execution mode.In the above-described first embodiment, alignment pin 5 situation connected to each other that each bight 2a across glass substrate 2 is arranged has been described, but in the platform unit 1 of the second execution mode, connected to each other by the alignment pin 5 that each limit along glass substrate 2 is arranged, and keep alignment pin 5 from porosity 4 to platform 3 outstanding projected state.
Platform 3 and the alignment pin 5 of platform unit 1 that forms the second execution mode is identical with the platform unit 1 of the first execution mode.In the second execution mode, coupling member 6 forms roughly linearity, and connects alignment pin 5 under this state.
The coupling member 6 that the second execution mode is used also with the coupling member 6 of the first execution mode similarly, be the metal wire rod that is set as the diameter more much smaller than the diameter in lateral direction penetrating hole 7 of being located at alignment pin 5, and connect loosely.The length of coupling member 6 is set to connect the outstanding mode in end of alignment pin 5 and coupling member 6, and this alignment pin 5 is inserted in each two porosities 4 of arranging on each limit along the glass substrate 2 of locating in eight porosities 4 being located at platform 3.
Fig. 5 illustrates the alignment pin being linked by coupling member 65 is inserted into the state in the porosity 4 of platform 3.Before platform unit 1 mounting glass substrate 2, for alignment pin 5, connect their lateral direction penetrating hole 7 and coupling member 6 is set, and the end that makes coupling member 6 is 7 outstanding from lateral direction penetrating hole, alignment pin 5 is inserted in porosity 4 when Locating Glass substrate 2, and porosity 4 is formed on along the position on each limit of glass substrate 2 (with reference to Fig. 4).
Coupling member 6 is roughly linearly, therefore may dismantle simply from the lateral direction penetrating hole 7 of two alignment pins 5.In the platform unit 1 of the second execution mode, on the coupling member 6 connecting at two alignment pins 5, form the fastener 6b that is limited to each alignment pin 5.
Particularly, each two porosities 4 that are arranged side by side abreast corresponding to each limit with glass substrate 2, adjust the interval of two alignment pins 5 that coupling member 6 connects, and then, alignment pin 5 are inserted in porosity 4.
Next, for fear of two alignment pins 5, from coupling member 6, come off, and as shown in Figure 5, will turn back from the end of the outstanding coupling member 6 of alignment pin 5, on coupling member 6, form the fastener 6b that is limited to alignment pin 5.That is, using the lateral direction penetrating hole 7 from alignment pin 5, turn back along the outer ring of alignment pin 5 and crooked bend forms as fastener 6b in the end of outstanding coupling member 6.
The end that Fig. 6 illustrates the coupling member 6 that connects alignment pin 5 and turn back is fastener 6b, and Fig. 6 (a) illustrates its vertical view, and Fig. 6 (b) illustrates its longitudinal sectional view.The fastener 6b turning back of coupling member 6 is as shown in Fig. 6 (a), when alignment pin 5 is inserted to porosity 4, to be positioned at the mode of the position of blocking from glass substrate 2 by alignment pin 5,, to be positioned at the mode of the opposition side with respect to alignment pin 5 of the mounting region R that loads glass substrate 2, two fastener 6b are all turned back to homonymy with respect to alignment pin 5.
In addition, in the coupling member 6 as wire rod, as shown in Fig. 6 (b), the inner edge of fastener 6b and the distance r in axle center that connects the position of alignment pin 5 are set as being less than alignment pin 5 from the platform 3 height h at outstanding position (roughly selling top 5a) upward.
Vibrations while having considered due to carrying platform unit 1 etc. and coupling member 6 are in the situation of through hole 7 interior rotations, thus, corresponding to coupling member 6 in the situation of lateral direction penetrating hole 7 interior rotations and fastener 6b and alignment pin 5 butts, therefore the fastener 6b of coupling member 6 can not cross alignment pin 5 and to mounting region R side shifting, thereby the situation that restriction fastener 6b and glass substrate 2 interfere, can prevent the damage of glass substrate 2.
The coupling member 6 of the second execution mode is because fastener 6b is limited to alignment pin 5, and is prevented from, from the coming off of alignment pin 5, therefore can stably keeping with simple operation the projected state of alignment pin 5.
Especially the platform unit 1 of the second execution mode is using the fastener 6b of coupling member 6 as the bend turning back along the outer ring of alignment pin 5, in the position of blocking from glass substrate 2 by alignment pin 5 and alignment pin 5, lock, and, even if coupling member 6 is in the interior rotation in lateral direction penetrating hole 7, fastener 6b can be to glass substrate 2 side shiftings with alignment pin 5 butts yet, therefore can limit fastener 6b and glass substrate 2 interferes, thereby prevent from being reliably positioned in the damage being caused by coupling member 6 of the glass substrate 2 on platform unit 1.
In the above-described embodiment, glass substrate 2 be shaped as rectangular shape, but be not limited to this.And, in the above-described embodiment, the situation that the lateral direction penetrating hole 7 of alignment pin 5 is arranged on to pin bottom 5b has been described, but also can be arranged on pin top 5a.Coupling member 6 is not only wire rod, also can adopt other variety of ways such as band.
The bight 2a that coupling member 6 is avoided glass substrate 2 refers to and does not come in contact interference, under this meaning, is not limited to bending, can certainly be other form.About fastener 6b, be not limited to bend, certainly can adopt hook-shaped or other mode.
In the second execution mode, certainly also play the action effect same with the first execution mode.And, on the coupling member 6 of the first execution mode, can certainly form fastener 6b.

Claims (4)

1. a platform unit, is characterized in that, possesses:
The platform of pottery system, on it, mounting is carried out the glass substrate of heat treated;
A plurality of porosities, it is arranged in the position that glass substrate is positioned on this platform, and direction is formed through up and down;
A plurality of metal alignment pins, it is inserted in described porosity loosely;
Coupling member, it is connected to each other by described alignment pin on described platform, and keep this alignment pin from described porosity to this platform outstanding projected state,
At described alignment pin, be formed with lateral direction penetrating hole, described coupling member penetrates in described lateral direction penetrating hole loosely through described lateral direction penetrating hole.
2. platform according to claim 1 unit, is characterized in that,
Described coupling member is by the bight for Locating Glass substrate and the described alignment pin of arranging across this bight links to avoid the mode in this bight each other.
3. platform according to claim 1 and 2 unit, is characterized in that,
Described coupling member has fastener, and this fastener is limited to this alignment pin in the position of being blocked from glass substrate by described alignment pin.
4. platform according to claim 3 unit, is characterized in that,
The described fastener of described coupling member is formed by the bend turning back along the outer ring of described alignment pin from described lateral direction penetrating hole, this bend is in order to limit the interference of itself and glass substrate, the rotation corresponding to described coupling member in described lateral direction penetrating hole and with described alignment pin butt.
CN201310049359.3A 2012-04-26 2013-02-07 Surface plate unit Expired - Fee Related CN103377863B (en)

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JP2012101882A JP5069382B1 (en) 2012-04-26 2012-04-26 Surface plate unit
JP2012-101882 2012-04-26

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CN103377863B true CN103377863B (en) 2014-10-15

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KR (1) KR101301326B1 (en)
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Publication number Priority date Publication date Assignee Title
JP5724014B1 (en) * 2014-04-22 2015-05-27 株式会社幸和 Substrate support apparatus and substrate processing apparatus
JP5701436B1 (en) * 2014-07-24 2015-04-15 中外炉工業株式会社 Surface plate unit
CN109309041B (en) * 2018-09-14 2020-12-11 惠科股份有限公司 Substrate processing apparatus and method for adjusting substrate processing apparatus

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JPH0614899U (en) * 1991-01-31 1994-02-25 中小企業事業団 Ceramic Product Pallets
JPH0970953A (en) * 1995-09-04 1997-03-18 Toshiba Electron Eng Corp Printer
JP3636235B2 (en) * 1996-01-08 2005-04-06 オリンパス株式会社 Board holder
JP2003068620A (en) * 2001-08-28 2003-03-07 Sendai Nikon:Kk Aligner
JP2005174669A (en) * 2003-12-09 2005-06-30 Pioneer Electronic Corp Setter glass, positioning pin, and manufacturing method of plasma display panel
JP2005249372A (en) * 2004-02-02 2005-09-15 Pioneer Electronic Corp Firing setter, plasma display panel manufacturing method and plasma display device manufacturing method
JP2005353811A (en) * 2004-06-10 2005-12-22 Dainippon Printing Co Ltd Mounting device and mounting pedestal

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CN2725934Y (en) * 2004-07-07 2005-09-14 和鑫光电股份有限公司 Glass base plate carrier

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TWI435405B (en) 2014-04-21
JP5069382B1 (en) 2012-11-07
KR101301326B1 (en) 2013-08-29
TW201330165A (en) 2013-07-16
CN103377863A (en) 2013-10-30
JP2013228170A (en) 2013-11-07

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