CN103374205A - Epoxy resin composite material and preparation method thereof - Google Patents
Epoxy resin composite material and preparation method thereof Download PDFInfo
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- CN103374205A CN103374205A CN2012101257540A CN201210125754A CN103374205A CN 103374205 A CN103374205 A CN 103374205A CN 2012101257540 A CN2012101257540 A CN 2012101257540A CN 201210125754 A CN201210125754 A CN 201210125754A CN 103374205 A CN103374205 A CN 103374205A
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Abstract
The invention relates to an epoxy resin composite material. The epoxy resin composite material comprises epoxy resin, gas-phase silicon dioxide and barium titanate, wherein the barium titanate is 30.681%-37.499% (in percentage by mass) of the epoxy resin composite material; the dielectric constant of the epoxy resin composite material is 20.0-25.0; the viscosity of the epoxy resin composite material is 35000 centipoises to 80000 centipoises. The epoxy resin composite material provided by the invention has higher dielectric constant and good softness, and can be used as a soft hole-plugging resin material with high dielectric constant of the flexible circuit board. The invention further provides a preparation method of the epoxy resin composite material.
Description
Technical field
The present invention relates to technical field of composite materials, relate in particular to and a kind ofly have flexibility and have epoxy resin composite material of high-k and preparation method thereof.
Background technology
Along with the development of science and technology, microminiature mobile phone, hand-held calculator and electronic vehicle product etc. are all had higher requirement to miniaturization, the lightness of product.In order to adapt to this demand, the circuit level in the electronic product improves constantly, and the pattern of printed wiring is increasingly densification also, and the conductor width of circuit, conductor separation, clear size of opening etc. are also thereupon increasingly tiny.Therefore, flexible printed circuit board (Flexible Printed Circuit, write a Chinese character in simplified form FPC, also claim soft board, flexible circuit board or flexible electric circuit board), toughness frivolous with it and pliability, circuit can fine property etc. premium properties and substitute gradually rigid circuit board or circuit card module, be applied to more and more be electrically connected between all kinds of electronic components.
At present, the specific inductivity of the common resin that is used for consent is lower, thereby so that the specific inductivity of plug socket resin is also lower, the insulativity of plug socket resin is also relatively poor.Along with the constantly attenuation of flexibility seal circuit card, the relatively poor plug socket resin of insulativity easily forms path between two line layers that need not to be communicated with of circuit card, thereby the electronic component that easily will need not to be communicated with is communicated with, and then has influence on the normal operation of each electronic component on the circuit card.In addition, high molecular polymer mostly is mechanically resistant material, easily embrittlement, and difficulty is applicable to flexible printed circuit board.
Summary of the invention
Therefore, be necessary to provide a kind of and have flexibility and have epoxy resin composite material of high-k and preparation method thereof, can playing preferably, insulation effect also can be conveniently used in the flexible printed circuit board product.
Below will a kind of epoxy resin composite material and preparation method thereof be described with embodiment.
A kind of epoxy resin composite material, it comprises Resins, epoxy, meteorological silicon-dioxide, reaches barium titanate.Described barium titanate shared quality percentage composition in described epoxy resin composite material is 30.681% to 37.499%.The specific inductivity of described epoxy resin composite material is 20.0 to 25.0.The viscosity of described epoxy resin composite material is 35000 centipoise to 80000 centipoises.
A kind of epoxy resin composite material, it is comprised of Resins, epoxy, polypropylene glycol ether glycidyl ether, meteorological silicon-dioxide, barium titanate, barium sulfate, stiffening agent, additive, catalyzer and defoamer.Described Resins, epoxy shared quality percentage composition in described epoxy resin composite material is 15.345% to 18.755%.Described meteorological silicon-dioxide shared quality percentage composition in described epoxy resin composite material is 0.081% to 0.099%.Described barium titanate shared quality percentage composition in described epoxy resin composite material is 30.681% to 37.499%.The specific inductivity of described epoxy resin composite material is 20.0 to 25.0.The viscosity of described epoxy resin composite material is 35000 centipoise to 80000 centipoises.
A kind of making method of epoxy resin composite material comprises step: blending epoxy, polypropylene glycol ether glycidyl ether and silane coupling agent obtain the first colloid; Barium titanate and meteorological silicon-dioxide are mixed also grinding distribution with described the first colloid, to obtain epoxy resin composite material.The specific inductivity of described epoxy resin composite material is 20.0 to 25.0.The viscosity of described epoxy resin composite material is 35000 centipoise to 80000 centipoises.Described barium titanate shared quality percentage composition in described epoxy resin composite material is 30.681% to 37.499%.
Than prior art, Uniform Dispersion has barium titanate in the middle of the epoxy resin composite material that the technical program provides, and has high-k.The described Resins, epoxy and the propylene glycol glycidyl ether that comprise in the described epoxy resin composite material have good flexibility.Thereby the plug socket resin material of high-k that described epoxy resin composite material can be used as the flexibility of flexible PCB uses.
Description of drawings
Fig. 1 is the schema of the epoxy resin composite material making method that provides of the technical program embodiment.
The main element nomenclature
Nothing
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Epoxy resin composite material that the technical program is provided below in conjunction with embodiment and preparation method thereof is described in further detail.
The technical program provides a kind of epoxy resin composite material.The specific inductivity of described epoxy resin composite material is 20.0 to 25.0.The viscosity of described epoxy resin composite material is 35000 centipoise to 80000 centipoises.The change constant that shakes of described epoxy resin composite material is 1.4 to 1.6.Described epoxy resin composite material mainly is comprised of colloid, barium titanate, barium sulfate, meteorological silicon-dioxide, stiffening agent, defoamer and catalyzer.
Described colloid comprises Resins, epoxy, monomer and additive.
Described Resins, epoxy can be bisphenol A type epoxy resin.In the present embodiment, in the present embodiment, the epoxy equivalent (weight) of the Resins, epoxy of employing is 185 to 192, is preferably 188, and the quality percentage composition of described Resins, epoxy in described epoxy resin composite material is about 15.345% to 18.755%, is preferably 17.05%.
Described monomer is the polypropylene glycol ether glycidyl ether.In the present embodiment, the content of described monomer in described epoxy resin composite material is about 26.838% to 32.802%, is preferably 29.82%.
The wire drawing phenomenon of generation when mixing with described monomer that described additive is used for alleviating described Resins, epoxy.In the present embodiment, the quality percentage composition of described additive in described epoxy resin composite material is about 0.459% to 0.561%, is preferably 0.51%.Described additive can be commercially available silane coupling agent A-187.
Described barium titanate is the inorganics with high-k, and it is used for improving the specific inductivity of described epoxy resin composite material.In the present embodiment, the quality percentage composition of described barium titanate in described epoxy resin composite material is about 30.681% to 37.499%, is preferably 34.09%.How many dielectric properties that can obtain according to actual needs matrix material of the content of metatitanic acid quilt are determined in the described matrix material.
Described barium sulfate is preferably inorganics of insulativity, and it is used for improving the insulativity of described epoxy resin composite material.In addition, the cost of the more described barium titanate of cost of described barium sulfate is low, so, can reduce the cost of described epoxy resin composite material.In the present embodiment, the quality percentage composition of described barium sulfate in described epoxy resin composite material is about 1.53% to 1.87%, is preferably 1.7%.How many insulating property that can obtain according to actual needs matrix material of the content of barium sulfate are determined in the described matrix material.
What described meteorological silicon-dioxide (R972) was used for controlling described epoxy resin composite material shakes the change constant, so that described epoxy resin composite material can more easily be printed on the flexible PCB.In the present embodiment, the quality percentage composition of described meteorological silicon-dioxide in described epoxy resin composite material is about 0.081% to 0.099%, is preferably 0.09%.
Described stiffening agent is used for described matrix material is played sclerization.In the present embodiment, the stiffening agent of employing is Ancamide 2842.Described stiffening agent is about 13.914% to 17.006% at the shared quality percentage composition of described epoxy resin composite material, is preferably 15.46%.
Described defoamer is used for eliminating the foam of described epoxy resin composite material.In the present embodiment, the quality percentage composition of described defoamer in epoxy resin composite material is about 0.765% to 0.935%, is preferably 0.85%.Described defoamer can be commercially available CoatOsil3505 defoamer.
Described catalyzer is the 2-undecyl imidazole.Described catalyzer shared quality percentage composition in described epoxy resin composite material is about 0.387% to 0.473%, is preferably 0.43%.
In the epoxy resin composite material of the preferred embodiment that the technical program provides, the quality percentage composition of described Resins, epoxy is about 17.05%, the quality percentage composition of described monomer is about 29.82%, the content of described additive is about 0.51%, the quality percentage composition of described barium titanate is about 34.09%, the quality percentage composition of described barium sulfate is about 1.7%, the quality percentage composition of described meteorological silicon-dioxide is 0.09%, the quality percentage composition of described stiffening agent is about 15.46%, the quality percentage composition of described defoamer is about 0.85%, and the quality percentage composition of described catalyzer is about 0.43%.
See also Fig. 1, the making method of described epoxy resin composite material comprises the steps:
The first step, blending epoxy, monomer and additive are to obtain the first colloid.Particularly, at first, Resins, epoxy is mixed with monomer at normal temperatures, polypropylene glycol ether glycidyl ether for example is to obtain mixture; Secondly, additive A-187 is added described mixture, and stir about 40 minutes to 80 minutes, be preferably 60 minutes, the wire drawing phenomenon that produces when mixing to alleviate the molten and described monomer of described Resins, epoxy, and so that described Resins, epoxy, monomer and additive fully mix, thereby obtain described the first colloid.In the present embodiment, the Resins, epoxy of employing is bisphenol A type epoxy resin.Certainly, the Resins, epoxy of employing is not limited to the bisphenol A type epoxy resin that present embodiment provides, and it also can be the Resins, epoxy of other types.
Second step adds barium titanate, barium sulfate and meteorological silicon-dioxide in described the first colloid and stirs, to obtain the second colloid.Particularly, barium titanate, barium sulfate and meteorological silicon-dioxide added in described the first colloid and stir about 120 minutes to 170 minutes, be preferably 150 minutes, to obtain the second colloid.
The 3rd goes on foot, and stiffening agent, defoamer, catalyzer is added mix in described the second colloid and grinding distribution, thereby obtain epoxy resin composite material.
In the present embodiment, adopt three drum-type grinding distribution machines that described the second colloid, stiffening agent, defoamer and catalyzer are carried out grinding distribution.Described the second colloid, stiffening agent, defoamer and catalyzer are devoted in the three drum-type grinding distribution machines according to above-mentioned content separately, start three drum-type grinding distribution machines to carry out grinding distribution, thereby so that the solid uniform ingredients is scattered in the liquid parts in above-mentioned each composition, thereby form finely dispersed epoxy resin composite material.In the present embodiment, in above-mentioned each composition, the quality percentage composition of described Resins, epoxy is about 17.05%, the quality percentage composition of described monomer is about 29.82%, the content of described additive is about 0.51%, the quality percentage composition of described barium titanate is about 34.09%, the quality percentage composition of described barium sulfate is about 1.7%, the quality percentage composition of described meteorological silicon-dioxide is 0.09%, the quality percentage composition of described stiffening agent is about 15.46%, the quality percentage composition of described defoamer is about 0.85%, and the quality percentage composition of described catalyzer is about 0.43%.
In order to obtain the epoxy resin composite material of different high-ks, the consumption of barium titanate is controlled in the time of can feeding intake by change.The quality percentage composition that accounts for epoxy resin composite material when barium titanate is between 30.681% to 37.499%, and the specific inductivity of epoxy resin composite material is 20.0 to 25.0.Wherein, the content of barium titanate is larger in the epoxy resin composite material, and the specific inductivity of epoxy resin composite material is higher.
Epoxy resin composite material by described method making, its specific inductivity is between 20.0 to 25.0, for having the epoxy resin composite material of high-k, and barium titanate is scattered in described Resins, epoxy and the polypropylene glycol ether glycidyl ether, thereby be 35000 centipoise to 80000 centipoises so that have the viscosity of the described epoxy resin composite material of barium titanate, that is, described epoxy resin composite material not only has higher specific inductivity, but also has flexible preferably.
Uniform Dispersion has barium titanate in the middle of the epoxy resin composite material that the technical program provides, and has high-k.Described Resins, epoxy and polypropylene glycol ether glycidyl ether that described epoxy resin composite material comprises have good flexibility.Thereby the plug socket resin material of high-k that described epoxy resin composite material can be used as the flexibility of flexible PCB uses.The epoxy resin composite material making method that the technical program provides can be scattered in barium titanate described Resins, epoxy and polypropylene glycol ether glycidyl ether uniformly, and have simple to operate, the advantage that is easy to realize.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (12)
1. epoxy resin composite material, it comprises Resins, epoxy, meteorological silicon-dioxide and barium titanate, described barium titanate shared quality percentage composition in described epoxy resin composite material is 30.681% to 37.499%, the specific inductivity of described epoxy resin composite material is 20.0 to 25.0, and the viscosity of described epoxy resin composite material is 35000 centipoise to 80000 centipoises.
2. epoxy resin composite material as claimed in claim 1 is characterized in that, described Resins, epoxy shared quality percentage composition in described epoxy resin composite material is 15.345% to 18.755%.
3. epoxy resin composite material as claimed in claim 1 is characterized in that, described meteorological silicon-dioxide shared quality percentage composition in described epoxy resin composite material is 0.081% to 0.099%.
4. epoxy resin composite material as claimed in claim 1, it is characterized in that, described epoxy resin composite material also comprises stiffening agent, additive, catalyzer and defoamer, described stiffening agent shared quality percentage composition in described epoxy resin composite material is 13.914% to 17.006%, described additive shared quality percentage composition in described epoxy resin composite material is 0.459% to 0.561%, described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.387% to 0.473%, and described defoamer shared quality percentage composition in described epoxy resin composite material is 0.765% to 0.935%.
5. epoxy resin composite material as claimed in claim 4 is characterized in that, described additive is silane coupling agent, and described catalyzer is the 2-undecyl imidazole.
6. epoxy resin composite material, it is by Resins, epoxy, the polypropylene glycol ether glycidyl ether, meteorological silicon-dioxide, barium titanate, barium sulfate, stiffening agent, additive, catalyzer and defoamer form, described Resins, epoxy shared quality percentage composition in described epoxy resin composite material is 15.345% to 18.755%, described meteorological silicon-dioxide shared quality percentage composition in described epoxy resin composite material is 0.081% to 0.099%, described barium titanate shared quality percentage composition in described epoxy resin composite material is 30.681% to 37.499%, the specific inductivity of described epoxy resin composite material is 20.0 to 25.0, the viscosity of described epoxy resin composite material is 35000 centipoise to 80000 centipoises, and the change constant that shakes of described epoxy resin composite material is 1.4 to 1.6.
7. epoxy resin composite material as claimed in claim 6, it is characterized in that, described stiffening agent shared quality percentage composition in described epoxy resin composite material is 13.914% to 17.006%, described additive is silane coupling agent, described additive shared quality percentage composition in described epoxy resin composite material is 0.459% to 0.561%, described catalyzer is the 2-undecyl imidazole, described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.387% to 0.473%, and described defoamer shared quality percentage composition in described epoxy resin composite material is 0.765% to 0.935%.
8. the making method of an epoxy resin composite material comprises step:
Blending epoxy, polypropylene glycol ether glycidyl ether and silane coupling agent obtain the first colloid; And
Barium titanate and meteorological silicon-dioxide are mixed also grinding distribution with described the first colloid, to obtain epoxy resin composite material, the specific inductivity of described epoxy resin composite material is 20.0 to 25.0, the viscosity of described epoxy resin composite material is 35000 centipoise to 80000 centipoises, and described barium titanate shared quality percentage composition in described epoxy resin composite material is 30.681% to 37.499%.
9. the making method of epoxy resin composite material as claimed in claim 8 is characterized in that, blending epoxy, polypropylene glycol ether glycidyl ether and silane coupling agent obtain the first colloid and comprise step:
Resins, epoxy is mixed to obtain mixture with the polypropylene glycol ether glycidyl ether at normal temperatures; And
Silane coupling agent is added in the described mixture, and stirred 40 minutes to 80 minutes, the wire drawing phenomenon that produces when mixing with described polypropylene glycol ether glycidyl ether to alleviate described Resins, epoxy, and so that described Resins, epoxy, polypropylene glycol ether glycidyl ether and silane coupling agent fully mix, thereby obtain described the first colloid.
10. the making method of epoxy resin composite material as claimed in claim 9 is characterized in that, barium titanate and meteorological silicon-dioxide is mixed with described the first colloid and grinding distribution comprises step:
Barium titanate and meteorological silicon-dioxide are added in described the first colloid, and stir 120 minutes to 170 minutes to obtain the second colloid; And
In described the second colloid, add stiffening agent, catalyzer and defoamer and mix together also grinding distribution, thereby obtain described epoxy resin composite material.
11. the making method of epoxy resin composite material as claimed in claim 10, it is characterized in that, described stiffening agent shared quality percentage composition in described epoxy resin composite material is 13.914% to 17.006%, described catalyzer is the 2-undecyl imidazole, described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.387% to 0.473%, and described defoamer shared quality percentage composition in described epoxy resin composite material is 0.765% to 0.935%.
12. the making method of epoxy resin composite material as claimed in claim 8, described meteorological silicon-dioxide shared quality percentage composition in described epoxy resin composite material is 0.081% to 0.099%.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101257540A CN103374205A (en) | 2012-04-26 | 2012-04-26 | Epoxy resin composite material and preparation method thereof |
| TW101115491A TW201343771A (en) | 2012-04-26 | 2012-05-02 | Epoxy resin composite material and method for making same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101257540A CN103374205A (en) | 2012-04-26 | 2012-04-26 | Epoxy resin composite material and preparation method thereof |
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| CN103374205A true CN103374205A (en) | 2013-10-30 |
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| CN2012101257540A Pending CN103374205A (en) | 2012-04-26 | 2012-04-26 | Epoxy resin composite material and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN108659463A (en) * | 2018-04-24 | 2018-10-16 | 珠海元盛电子科技股份有限公司 | A kind of photocuring high heat-conductivity conducting consent material used for printed circuit board and preparation method thereof |
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| CN1548470A (en) * | 2003-05-15 | 2004-11-24 | 长兴化学工业股份有限公司 | Resin composition with high dielectric constant and its usage |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN102404934A (en) * | 2010-09-09 | 2012-04-04 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacturing method thereof |
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2012
- 2012-04-26 CN CN2012101257540A patent/CN103374205A/en active Pending
- 2012-05-02 TW TW101115491A patent/TW201343771A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1548470A (en) * | 2003-05-15 | 2004-11-24 | 长兴化学工业股份有限公司 | Resin composition with high dielectric constant and its usage |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN102404934A (en) * | 2010-09-09 | 2012-04-04 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
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| KUO-CHUNG CHENG: "Dielectric properties of epoxy resin–barium titanate composites at high frequency", 《MATERIALS LETTERS》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN103709605B (en) * | 2013-12-30 | 2016-04-20 | 景旺电子科技(龙川)有限公司 | A kind of composition epoxy resin, preparation method and consent aluminium base |
| CN108659463A (en) * | 2018-04-24 | 2018-10-16 | 珠海元盛电子科技股份有限公司 | A kind of photocuring high heat-conductivity conducting consent material used for printed circuit board and preparation method thereof |
| CN108659463B (en) * | 2018-04-24 | 2020-06-02 | 珠海元盛电子科技股份有限公司 | Photocuring high-thermal-conductivity and electric-conductivity hole plugging material for printed circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201343771A (en) | 2013-11-01 |
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Application publication date: 20131030 |