CN103387736A - Epoxy resin composite material and preparation method thereof - Google Patents
Epoxy resin composite material and preparation method thereof Download PDFInfo
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- CN103387736A CN103387736A CN2012101448410A CN201210144841A CN103387736A CN 103387736 A CN103387736 A CN 103387736A CN 2012101448410 A CN2012101448410 A CN 2012101448410A CN 201210144841 A CN201210144841 A CN 201210144841A CN 103387736 A CN103387736 A CN 103387736A
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Abstract
The invention relates to an epoxy resin composite material. The epoxy resin composite material comprises an epoxy resin, ethylene glycol ethyl ether acetate and barium titanate. The mass percentage content of the barium titanate in the epoxy resin composite material is 22.41-27.39%. The dielectric constant of the epoxy resin composite material is 22.0-25.0. The viscosity of the epoxy resin composite material is 20000-25000 centipoises. The epoxy resin composite material has a high dielectric constant and a good flexibility, and can be used as a flexible hole-plugged resin material having a high dielectric constant of a flexible circuit board. The invention also provides a preparation method of the epoxy resin composite material.
Description
Technical field
The present invention relates to technical field of composite materials, relate in particular to and a kind ofly have flexibility and have epoxy resin composite material of high-k and preparation method thereof.
Background technology
Along with the development of science and technology, microminiature mobile phone, hand-held calculator and electronic vehicle product etc. are all had higher requirement to miniaturization, the lightness of product.In order to adapt to this demand, the circuit level in electronic product improves constantly, and the pattern of printed wiring is densification increasingly also, and the conductor width of circuit, conductor separation, clear size of opening etc. are also thereupon increasingly tiny.Therefore, flexible printed circuit board (Flexible Printed Circuit, write a Chinese character in simplified form FPC, also claim soft board, flexible circuit board or flexible electric circuit board), toughness frivolous with it and pliability, circuit can fine property etc. premium properties and substitute gradually rigid circuit board or circuit card module, be applied to more and more be electrically connected between all kinds of electronic components.
At present, the specific inductivity of the common resin that is used for consent is lower, thereby makes the specific inductivity of plug socket resin also lower, and the insulativity of plug socket resin is also poor.Along with flexibility prints constantly attenuation of circuit card, the poor plug socket resin of insulativity easily forms path between two line layers that need not to be communicated with of circuit card, thereby easily will need not the electronic component electric connection of electric connection, and then have influence on the normal operation of each electronic component on circuit card.In addition, high molecular polymer mostly is mechanically resistant material, easily embrittlement, the more difficult flexible printed circuit board that is applicable to.
Summary of the invention
Therefore, be necessary to provide a kind of and have flexibility and have epoxy resin composite material of high-k and preparation method thereof, can play insulation effect preferably and also can be conveniently used in the flexible printed circuit board product.
Below will a kind of epoxy resin composite material and preparation method thereof be described with embodiment.
A kind of epoxy resin composite material, it comprises epoxy resin, ethylene glycol ether acetate and barium titanate, described barium titanate shared quality percentage composition in described epoxy resin composite material is 22.41% to 27.39%, the specific inductivity of described epoxy resin composite material is 22.0 to 25.0, and the viscosity of described epoxy resin composite material is 20000 centipoise to 25000 centipoises.
A kind of epoxy resin composite material, its dimer acid modified polyester by epoxy resin, ethylene glycol ether acetate, acidic group end-blocking, barium titanate, barium sulfate, meteorological silicon-dioxide, additive, stiffening agent, defoamer and catalyzer form.Described epoxy resin shared quality percentage composition in described epoxy resin composite material is 12.447% to 15.213%.Described ethylene glycol ether acetate shared quality percentage composition in described epoxy resin composite material is 37.359% to 45.661%.The dimer acid modified polyester of described acidic group end-blocking shared quality percentage composition in described epoxy resin composite material is 9.333% to 11.407%.Described barium titanate shared quality percentage composition in described epoxy resin composite material is 22.41% to 27.39%.Described barium sulfate shared quality percentage composition in described epoxy resin composite material is 1.242% to 1.518%.Described meteorological silicon-dioxide shared quality percentage composition in described epoxy resin composite material is 0.063% to 0.077%.The specific inductivity of described epoxy resin composite material is 22.0 to 25.0.The viscosity of described epoxy resin composite material is 20000 centipoise to 25000 centipoises.The variable coefficient that shakes of described epoxy resin composite material is 1.5 to 1.7.
A kind of making method of epoxy resin composite material comprises step: blending epoxy, ethylene glycol ether acetate and silane coupling agent obtain the first colloid; Barium titanate and barium sulfate are added in the dimer acid modified polyester of acidic group end-blocking and stir, to obtain the second colloid; And meteorological silicon-dioxide is mixed with described the first colloid and the second colloid and grinding distribution, to obtain epoxy resin composite material, the specific inductivity of described epoxy resin composite material is 22.0 to 25.0, the viscosity of described epoxy resin composite material is 20000 centipoise to 25000 centipoises, and described barium titanate shared quality percentage composition in described epoxy resin composite material is 22.41% to 27.39%.
Than prior art, the middle dispersed barium titanate that has of the epoxy resin composite material that the technical program provides, have high-k.The dimer acid modified polyester of the described epoxy resin that comprises in described epoxy resin composite material, ethylene glycol ether acetate and acidic group end-blocking has good flexibility.Thereby the plug socket resin material of high-k that described epoxy resin composite material can be used as the flexibility of flexible PCB uses.
Description of drawings
Fig. 1 is the schema of the epoxy resin composite material making method that provides of the technical program embodiment.
The main element nomenclature
Nothing
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Epoxy resin composite material that the technical program is provided below in conjunction with embodiment and preparation method thereof is described in further detail.
The technical program provides a kind of epoxy resin composite material.Described epoxy resin composite material mainly is comprised of the first colloid, the second colloid, stiffening agent, defoamer, meteorological silicon-dioxide and catalyzer.
Described the first colloid comprises epoxy resin, solvent and additive.Described epoxy resin can be bisphenol A type epoxy resin.The quality percentage composition of described epoxy resin in described epoxy resin composite material is about 12.447% to 15.213%, is preferably 13.83%.Described solvent is ethylene glycol ether acetate (Ethylene glycol monoethyl ether acetate), and the content of described solvent in described epoxy resin composite material is about 37.359% to 45.661%, is preferably 41.51%.This solvent is used for dissolving described epoxy resin, to form uniform liquid dispersed system, ie in solution.Described additive is used for eliminating the foam of above-mentioned liquid dispersed system, and the wire drawing phenomenon that produces while alleviating described epoxy resin and described solvent.In present embodiment, the quality percentage composition of described additive in described epoxy resin composite material is about 0.621% to 0.759%, is preferably 0.69%.Described additive can be commercially available silane coupling agent A-187.
Described the second colloid comprises the dimer acid modified polyester of barium titanate, barium sulfate and acidic group end-blocking.Described barium titanate is the inorganics with high-k, and it is used for improving the specific inductivity of described epoxy resin composite material.The quality percentage composition of described barium titanate in described epoxy resin composite material is about 22.41% to 27.39%, is preferably 24.9%.In described matrix material, how many dielectric properties that can obtain according to actual needs matrix material of the content of metatitanic acid quilt are determined.Described barium sulfate is insulativity inorganics preferably, and it is used for improving the insulativity of described epoxy resin composite material.In addition, the cost of the more described barium titanate of cost of described barium sulfate is low, therefore, can reduce the cost of described epoxy resin composite material.In present embodiment, the quality percentage composition of described barium sulfate in described epoxy resin composite material is about 1.242% to 1.518%, is preferably 1.38%.In described matrix material, how many insulating property that can obtain according to actual needs matrix material of the content of barium sulfate are determined.The dimer acid modified polyester of described acidic group end-blocking is provided by UNIQEMA company, and its quality percentage composition in described epoxy resin composite material is about 9.333% to 11.407%, is preferably 10.37%.In present embodiment, the UCN06.001 of dimer acid modified polyester for by UNIQEMA company, being provided of described acidic group end-blocking.
Described stiffening agent is used for described matrix material is played sclerization.In present embodiment, the stiffening agent of employing is polyamino compound (Polyamine), and for example: Ancamine 910.Described stiffening agent is about 5.724% to 6.996% at the shared quality percentage composition of described epoxy resin composite material, is preferably 6.36%.
Described defoamer is used for eliminating the foam of described epoxy resin composite material.In present embodiment, the quality percentage composition of described defoamer in epoxy resin composite material is about 0.621% to 0.759%, is preferably 0.69%.Described defoamer can be commercially available CoatOsil3505 defoamer.
Described meteorological silicon-dioxide (R972) is used for controlling the variable coefficient that shakes of described epoxy resin composite material, so that described epoxy resin composite material can more easily be printed on flexible PCB.In present embodiment, the quality percentage composition of described meteorological silicon-dioxide in described epoxy resin composite material is about 0.063% to 0.077%, is preferably 0.07%.
Described catalyzer is 2-undecyl imidazole (2-undecylimidazole).Described catalyzer shared quality percentage composition in described epoxy resin composite material is about 0.18% to 0.22%, is preferably 0.2%.
in the epoxy resin composite material of the preferred embodiment that the technical program provides, the quality percentage composition of described epoxy resin is about 13.83%, the quality percentage composition of described solvent is about 41.51%, the content of described additive is about 0.69%, the quality percentage composition of described barium titanate is about 24.9%, the quality percentage composition of described barium sulfate is about 1.38%, the quality percentage composition of the dimer acid modified polyester of described acidic group end-blocking in described epoxy resin composite material is 10.37%, the quality percentage composition of described stiffening agent is about 6.36%, the quality percentage composition of described defoamer is about 0.69%, the quality percentage composition of described meteorological silicon-dioxide is 0.07%, the quality percentage composition of described catalyzer is about 0.2%.
The epoxy resin composite material of the technical program has higher specific inductivity and good flexibility.Concrete, the specific inductivity of described epoxy resin composite material is 22.0 to 25.0.The viscosity of described epoxy resin composite material is 20000 centipoise to 25000 centipoises.The variable coefficient that shakes of described epoxy resin composite material is 1.5 to 1.7.
See also Fig. 1, the making method of described epoxy resin composite material comprises the steps:
The first step, blending epoxy, solvent and additive are to obtain the first colloid.Particularly, at first, epoxy resin is dissolved in solvent at normal temperatures, ethylene glycol ether acetate for example, to obtain solution; Secondly, additive (for example silane coupling agent A-187) is added described solution, and stir about 3.5 hours to 4.5 hours, be preferably 4 hours, the wire drawing phenomenon that produces when eliminating the bubble in described solution and alleviating described epoxy resin and described solvent, and make described epoxy resin, solvent and additive dissolve fully, thereby obtain described the first colloid.In present embodiment, the epoxy resin of employing is bisphenol A type epoxy resin.Certainly, the epoxy resin of employing is not limited to the bisphenol A type epoxy resin that the present embodiment provides, and it also can be the epoxy resin of other types.
Second step, add barium titanate and barium sulfate in the dimer acid modified polyester of acidic group end-blocking and stir, to obtain the second colloid.Particularly, barium titanate and barium sulfate are added in the dimer acid modified polyester of acidic group end-blocking and stir about 3.5 hours to 4.5 hours, be preferably 4 hours, to obtain the second colloid.
In the 3rd step, stiffening agent, defoamer, meteorological silicon-dioxide, catalyzer, the first colloid and the second colloid are mixed and grinding distribution, thereby obtain epoxy resin composite material.
In the present embodiment, the three drum-type grinding distribution machines of employing carry out grinding distribution to described the first colloid, the second colloid, stiffening agent, defoamer, meteorological silicon-dioxide and catalyzer.Above-mentioned the first colloid, the second colloid, stiffening agent, defoamer, meteorological silicon-dioxide and catalyzer are devoted in three drum-type grinding distribution machines according to above-mentioned content separately, start three drum-type grinding distribution machines to carry out grinding distribution, thereby make solid uniform ingredients in above-mentioned each composition be scattered in liquid component, thereby form finely dispersed epoxy resin composite material.in the present embodiment, in above-mentioned each composition, the quality percentage composition of described epoxy resin is about 13.83%, the quality percentage composition of described solvent is about 41.51%, the content of described additive is about 0.69%, the quality percentage composition of described barium titanate is about 24.9%, the quality percentage composition of described barium sulfate is about 1.38%, the quality percentage composition of the dimer acid modified polyester of described acidic group end-blocking in described epoxy resin composite material is 10.37%, the quality percentage composition of described stiffening agent is about 6.36%, the quality percentage composition of described defoamer is about 0.69%, the quality percentage composition of described meteorological silicon-dioxide is 0.07%, the quality percentage composition of described catalyzer is about 0.2%.
In order to obtain the epoxy resin composite material of different high-ks, in the time of can feeding intake by change, the consumption of barium titanate is controlled.The quality percentage composition that accounts for epoxy resin composite material when barium titanate is between 22.41% to 27.39%, and the specific inductivity of epoxy resin composite material is 22.0 to 25.0.Wherein, in epoxy resin composite material, the content of barium titanate is larger, and the specific inductivity of epoxy resin composite material is higher.
Epoxy resin composite material by described method making, its specific inductivity is between 22.0 to 25.0, for having the epoxy resin composite material of high-k, and barium titanate is scattered in the dimer acid modified polyester of described epoxy resin, ethylene glycol ether acetate and acidic group end-blocking, thereby the viscosity that makes the described epoxy resin composite material with barium titanate is 20000 centipoise to 25000 centipoises, namely, described epoxy resin composite material not only has higher specific inductivity, but also has flexible preferably.
The middle dispersed barium titanate that has of the epoxy resin composite material that the technical program provides, have high-k.The dimer acid modified polyester of the described epoxy resin that described epoxy resin composite material comprises, ethylene glycol ether acetate and acidic group end-blocking has good flexibility.Thereby the plug socket resin material of high-k that described epoxy resin composite material can be used as the flexibility of flexible PCB uses.The epoxy resin composite material making method that the technical program provides can be scattered in barium titanate the dimer acid modified polyester of described epoxy resin, ethylene glycol ether acetate and acidic group end-blocking equably, and have simple to operate, the advantage that is easy to realize.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection domain of the claims in the present invention.
Claims (12)
1. epoxy resin composite material, it comprises epoxy resin, ethylene glycol ether acetate and barium titanate, described barium titanate shared quality percentage composition in described epoxy resin composite material is 22.41% to 27.39%, the specific inductivity of described epoxy resin composite material is 22.0 to 25.0, and the viscosity of described epoxy resin composite material is 20000 centipoise to 25000 centipoises.
2. epoxy resin composite material as claimed in claim 1, is characterized in that, described epoxy resin shared quality percentage composition in described epoxy resin composite material is 12.447% to 15.213%.
3. epoxy resin composite material as claimed in claim 1, is characterized in that, described ethylene glycol ether acetate shared quality percentage composition in described epoxy resin composite material is 37.359% to 45.661%.
4. epoxy resin composite material as claimed in claim 1, is characterized in that, described epoxy resin composite material also comprises additive, stiffening agent, defoamer, meteorological silicon-dioxide and catalyzer.
5. epoxy resin composite material as claimed in claim 4, it is characterized in that, described additive is silane coupling agent, described additive shared quality percentage composition in described epoxy resin composite material is 0.621% to 0.759%, described stiffening agent is polyamino compound, described stiffening agent is 5.724% to 6.996% at the shared quality percentage composition of described epoxy resin composite material, the quality percentage composition of described defoamer in described epoxy resin composite material is 0.621% to 0.759%, the quality percentage composition of described meteorological silicon-dioxide in described epoxy resin composite material is 0.063% to 0.077%, described catalyzer is the 2-undecyl imidazole, described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.18% to 0.22%.
6. epoxy resin composite material, it is by epoxy resin, ethylene glycol ether acetate, the dimer acid modified polyester of acidic group end-blocking, barium titanate, barium sulfate, meteorological silicon-dioxide, additive, stiffening agent, defoamer and catalyzer form, described epoxy resin shared quality percentage composition in described epoxy resin composite material is 12.447% to 15.213%, described ethylene glycol ether acetate shared quality percentage composition in described epoxy resin composite material is 37.359% to 45.661%, the dimer acid modified polyester of described acidic group end-blocking shared quality percentage composition in described epoxy resin composite material is 9.333% to 11.407%, described barium titanate shared quality percentage composition in described epoxy resin composite material is 22.41% to 27.39%, described barium sulfate shared quality percentage composition in described epoxy resin composite material is 1.242% to 1.518%, described meteorological silicon-dioxide shared quality percentage composition in described epoxy resin composite material is 0.063% to 0.077%, the specific inductivity of described epoxy resin composite material is 22.0 to 25.0, the viscosity of described epoxy resin composite material is 20000 centipoise to 25000 centipoises, the variable coefficient that shakes of described epoxy resin composite material is 1.5 to 1.7.
7. epoxy resin composite material as claimed in claim 6, it is characterized in that, described additive is silane coupling agent, described additive shared quality percentage composition in described epoxy resin composite material is 0.621% to 0.759%, described stiffening agent is polyamino compound, described stiffening agent is 5.724% to 6.996% at the shared quality percentage composition of described epoxy resin composite material, the quality percentage composition of described defoamer in described epoxy resin composite material is 0.621% to 0.759%, described catalyzer is the 2-undecyl imidazole, described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.18% to 0.22%.
8. the making method of an epoxy resin composite material comprises step:
Blending epoxy, ethylene glycol ether acetate and silane coupling agent obtain the first colloid;
Barium titanate and barium sulfate are added in the dimer acid modified polyester of acidic group end-blocking and stir, to obtain the second colloid, and
Meteorological silicon-dioxide is mixed with described the first colloid and the second colloid and grinding distribution, to obtain epoxy resin composite material, the specific inductivity of described epoxy resin composite material is 22.0 to 25.0, the viscosity of described epoxy resin composite material is 20000 centipoise to 25000 centipoises, and described barium titanate shared quality percentage composition in described epoxy resin composite material is 22.41% to 27.39%.
9. the making method of epoxy resin composite material as claimed in claim 8, is characterized in that, blending epoxy, ethylene glycol ether acetate and silane coupling agent obtain the first colloid and comprise step:
Epoxy resin is mixed to obtain solution at normal temperatures with ethylene glycol ether acetate; And
Silane coupling agent is added in described solution, and stirred 3.5 hours to 4.5 hours, alleviate when described epoxy resin is dissolved in described ethylene glycol ether acetate with full the reaching of gas of eliminating in described solution the wire drawing phenomenon that produces, and make described epoxy resin, ethylene glycol ether acetate and silane coupling agent fully mix, thereby obtain described the first colloid.
10. the making method of epoxy resin composite material as claimed in claim 9, it is characterized in that, meteorological silicon-dioxide is mixed with described the first colloid and the second colloid and during grinding distribution, also add stiffening agent, defoamer and catalyzer to mix together and grinding distribution, thereby obtain described epoxy resin composite material.
11. the making method of epoxy resin composite material as claimed in claim 10, it is characterized in that, described stiffening agent is polyamino compound, described stiffening agent is 5.724% to 6.996% at the shared quality percentage composition of described epoxy resin composite material, the quality percentage composition of described defoamer in described epoxy resin composite material is 0.621% to 0.759%, described catalyzer is the 2-undecyl imidazole, and described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.18% to 0.22%.
12. the making method of epoxy resin composite material as claimed in claim 8, is characterized in that, the quality percentage composition of described meteorological silicon-dioxide in described epoxy resin composite material is 0.063% to 0.077%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101448410A CN103387736A (en) | 2012-05-11 | 2012-05-11 | Epoxy resin composite material and preparation method thereof |
| TW101117070A TW201345969A (en) | 2012-05-11 | 2012-05-14 | Epoxy resin composite material and method for making same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101448410A CN103387736A (en) | 2012-05-11 | 2012-05-11 | Epoxy resin composite material and preparation method thereof |
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| CN2012101448410A Pending CN103387736A (en) | 2012-05-11 | 2012-05-11 | Epoxy resin composite material and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| CN105440584A (en) * | 2015-12-10 | 2016-03-30 | 上海复合材料科技有限公司 | Low-shrinkage epoxy resin system and preparation method thereof |
| CN110684222A (en) * | 2019-10-14 | 2020-01-14 | 深圳市峰泳科技有限公司 | Polymer-based composite dielectric material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1908063A (en) * | 2005-08-01 | 2007-02-07 | 财团法人工业技术研究院 | High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof |
| TW200927806A (en) * | 2007-12-28 | 2009-07-01 | Ind Tech Res Inst | Flexible, low dielectric loss composition and manufacture method thereof |
| CN102371739A (en) * | 2010-08-26 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Film and manufacturing method thereof |
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2012
- 2012-05-11 CN CN2012101448410A patent/CN103387736A/en active Pending
- 2012-05-14 TW TW101117070A patent/TW201345969A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1908063A (en) * | 2005-08-01 | 2007-02-07 | 财团法人工业技术研究院 | High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof |
| TW200927806A (en) * | 2007-12-28 | 2009-07-01 | Ind Tech Res Inst | Flexible, low dielectric loss composition and manufacture method thereof |
| CN102371739A (en) * | 2010-08-26 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Film and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| CN105440584A (en) * | 2015-12-10 | 2016-03-30 | 上海复合材料科技有限公司 | Low-shrinkage epoxy resin system and preparation method thereof |
| CN110684222A (en) * | 2019-10-14 | 2020-01-14 | 深圳市峰泳科技有限公司 | Polymer-based composite dielectric material and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| TW201345969A (en) | 2013-11-16 |
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Application publication date: 20131113 |