CN103364706B - Acceptance Test device and the acceptance testing method of disposal programmable device - Google Patents
Acceptance Test device and the acceptance testing method of disposal programmable device Download PDFInfo
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- CN103364706B CN103364706B CN201310321124.5A CN201310321124A CN103364706B CN 103364706 B CN103364706 B CN 103364706B CN 201310321124 A CN201310321124 A CN 201310321124A CN 103364706 B CN103364706 B CN 103364706B
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Abstract
The present invention provides in a kind of Acceptance Test device and the acceptance testing method of disposal programmable device, employ the Acceptance Test device with scratching area, described scratching area can carry out ultraviolet erasing to the wafer to be measured after the test of platform after tested, so avoid the need for for wafer being transported to special ultraviolet region, thus improve greatly improving work efficiency, the impurity that it also avoid may leading to due to carrying produces this problem, indirectly improves yield.
Description
Technical field
The present invention relates to semiconductor fabrication process, it is more particularly related to a kind of Acceptance Test device and once
The acceptance testing method of property programming device.
Background technology
At present, more and more extensive with semiconductor product application, the safety of product also seems more and more important.On the one hand
It is to protect hardware designs, still further aspect, also for the safety of product itself, prevents from being cracked.
For example in the middle of embedded system, all of code and system data are all stored within FLASH chip.
The feature of FLASH chip is can be repeatedly erasable, and power failure data will not be lost.In order to protect the data in FLASH, increasingly
Many FLASH manufacturers provide a kind of special depositor inside FLASH：OTP（One Time Programmable）Deposit
Device.The meaning is this depositor is One Time Programmable, so just can effectively improve protection.
But during manufacturing, One Time Programmable（OTP）Device obviously can not only carry out one-time programming, because
At least need can dispatch from the factory through detection side for it.In existing process, when generally disposal programmable device being detected it is
Need to adopt ultraviolet（UV）Irradiate, for example, described disposal programmable device is burnt till " 0 " from data " 1 ", need to irradiate ultraviolet
Light is allowed to revert to " 1 ".
But, in prior art, usual ultra-vioket radiation has a special region, needs technical staff（Or machinery passes
Pass facility）After wafer to be measured is detected, it is carried to UV-illuminated region and is irradiated；And, ordinary circumstance next detected
Journey is to need to be related to multiple ultra-vioket radiation, and the method adopting existing process, just there is inconvenience, frequently carrying itself
Being exactly a problem, additionally, being also easy to lead to contaminant particles to fall on wafer, and causing unnecessary loss.
Content of the invention
The technical problem to be solved is that there is drawbacks described above in prior art, provides one kind can solve the problem that
The not convenient and easy Acceptance Test device producing this problem of extraneoas loss and One Time Programmable device in OTP detection process
The acceptance testing method of part.
In order to realize above-mentioned technical purpose, the present invention provides a kind of Acceptance Test device, for surveying to wafer to be measured
Examination, including：
SMIF, for receiving described wafer to be measured；
At least one mechanical arm, for transmitting described wafer to be measured；
Testboard, for testing to described wafer to be measured；And
Scratching area, described scratching area is used for carrying out ultraviolet erasing to the wafer described to be measured after the test of platform after tested；Wherein,
Described mechanical arm can carry described wafer to be measured and move in described SMIF, described testboard and described scratching area.
Optionally, for described Acceptance Test device, described scratching area is provided with ultraviolet source, described ultraviolet source bag
Include at least one ultraviolet lamp tube.
Optionally, for described Acceptance Test device, the specification of described ultraviolet lamp tube is：100mw/cm2～200mw/
cm2.
Optionally, for described Acceptance Test device, described Acceptance Test device also includes operating board and display screen, uses
In entering the operating instructions and show test case.
Optionally, for described Acceptance Test device, described mechanical arm includes first mechanical arm and second mechanical arm, institute
State first mechanical arm and second mechanical arm all can extract wafer to be measured to described test successively at described SMIF
Then wafer described to be measured after the test of platform after tested is transferred to scratching area from testboard, afterwards by described wafer to be measured by platform
It is transferred to described SMIF from described scratching area, the quantity of described wafer to be measured is more than or equal to 2.
Accordingly, the present invention provides a kind of acceptance testing method of disposal programmable device, for entering to wafer to be measured
Row test, is tested using Acceptance Test device as above, including：Described mechanical arm is from described SMIF
Extract a wafer to be measured, and be transferred to described testboard and tested, to be tested after the completion of, described mechanical arm is by described crystalline substance to be measured
Circle is transferred to scratching area and carries out ultraviolet erasing.
Optionally, for the acceptance testing method of described disposal programmable device, described wafer memory ultraviolet to be measured
After erasing, described SMIF is sent back by described mechanical arm.
Optionally, for the acceptance testing method of described disposal programmable device, described mechanical arm includes the first machine
Tool arm and second mechanical arm, described first mechanical arm and second mechanical arm transmit described wafer to be measured, described wafer to be measured successively
Quantity be more than or equal to 2.
Optionally, for the acceptance testing method of described disposal programmable device, including：
Carry out step S1 first, first piece wafer to be measured is extracted from SMIF by described first mechanical arm, pass
Be handed to testboard to be tested, to be tested after the completion of, by described first mechanical arm by wafer to be measured for first piece from testboard transmit
Carry out ultraviolet erasing to scratching area；
When wafer to be measured for first piece is transferred to scratching area from testboard by described first mechanical arm, carry out step simultaneously
S2, extracts second wafer to be measured from SMIF by described second mechanical arm, is transferred to testboard and is tested；
After described second wafer sort to be measured finishes, carry out step S3, by described first mechanical arm by described first
Piece wafer to be measured is transferred to described SMIF so that described first piece wafer to be measured playbacks from scratching area；Carry out simultaneously
Step S4, described second mechanical arm described second wafer to be measured of carrying is transferred to scratching area from testboard and carries out ultraviolet erasing,
After the described second wafer to be measured ultraviolet erasing finish after, SMIF is passed back to by described second mechanical arm 32 so that
Described second wafer playback to be measured.
Optionally, for the acceptance testing method of described disposal programmable device, the described ultraviolet that carries out is erased to adopt
With ultraviolet source irradiation 600s～650s.
In the Acceptance Test device of the present invention and the acceptance testing method of disposal programmable device, employ with wiping
Except the Acceptance Test device in area, described scratching area can carry out ultraviolet erasing to the wafer to be measured after the test of platform after tested, so
Avoid the need for for wafer being transported to special ultraviolet region, thus improve greatly improve work efficiency, it also avoid due to
The impurity carried and may lead to produces this problem, indirectly improves yield.
Brief description
The structural representation of the Acceptance Test device of Fig. 1 embodiment of the present invention；
Fig. 2 is the acceptance testing method carrying out disposal programmable device using the Acceptance Test device of the embodiment of the present invention
Process schematic.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the forming method of the semiconductor structure that the present invention provides is made detailed further
Describe in detail bright.According to following explanation and claims, advantages and features of the invention will become apparent from.It should be noted that, accompanying drawing is equal
In the form of very simplification, only in order to purpose that is convenient, lucidly aiding in illustrating the embodiment of the present invention.
As shown in figure 1, the Acceptance Test device 1 of the embodiment of the present invention includes：SMIF（SMIF）2, it is used for connecing
Receive described wafer to be measured, generally, described SMIF 2 is 1～2 or other quantity, e.g. 4 etc., this
Acceptance Test device 1 shown in embodiment has 1 SMIF 2；So can reduce occupied by Acceptance Test device 1
Space, and generally, 1 SMIF 2 also disclosure satisfy that production needs.At least one mechanical arm 3, for passing
Defeated described wafer to be measured, described mechanical arm 3 can be collapsible, so as to the adjustment length required when arrived at it
Degree, is easy to the transmission of wafer, and in the present embodiment, described mechanical arm 3 is 2, then can transmit wafer to be measured successively, thus
Improve detection efficiency.Also include testboard 4, for testing to described wafer to be measured, described testboard 4 mainly includes being aligned
Device and detection means, described alignment device is used for, after testboard 4 receives the wafer to be measured being passed over by mechanical arm 3, making
Obtain described wafer alignment to be measured, be easy to described detection means and detected.
Acceptance Test device 1 shown in the present invention, also includes a scratching area 5, and described scratching area 5 is used for platform 4 after tested
Wafer described to be measured after test carries out ultraviolet erasing.Specifically, described scratching area 5 is provided with ultraviolet source, described ultraviolet light
Source can be including at least one ultraviolet lamp tube.Preferably, described ultraviolet lamp tube is 2, and the specification of described ultraviolet lamp tube is permissible
It is 100mw/cm2～200mw/cm2It is preferred that taking specification to be 108mw/cm2Ultraviolet lamp tube.
So, after platform 4 test after tested of described wafer to be measured, described scratching area can be sent to by described mechanical arm 3
5, it is irradiated using ultraviolet source, to recover the parameter of disposal programmable device.And, the examination of the embodiment of the present invention is surveyed
Trial assembly puts 1, can directly be improved using existing Acceptance Test device, centers described scratching area in Acceptance Test dress
5, so can either effectively using existing resource additionally it is possible to make wafer to be measured need not carry out longer-distance transfer, thus
Improve testing efficiency it is also possible to ensure test quality, prevent due to introduced other factors example when wafer distance transmits
Impact as contaminant particles etc..Furthermore, it is provided with scratching area 5 in described Acceptance Test device 1 it becomes possible to closing or removing
Existing UV-illuminated region, this just can save maintenance cost for existing UV-illuminated region it is also possible to vacate factory
Area's area, with used for other purposes.
Please continue to refer to Fig. 1, for the Acceptance Test device 1 of the embodiment of the present invention, also include operating board and display screen 6,
Described operating board and display screen 6 are used for entering the operating instructions and showing test case, and carry out the transmission of data etc., in order to
Technical staff grasps analytical data in time.
Turn next to Fig. 2, so that disposal programmable device is carried out to the Acceptance Test device 1 of the embodiment of the present invention
Operation during Acceptance Test elaborates.
When being tested, carry out step S1 first, setting is extracted from SMIF 2 by first mechanical arm 31
Wafer to be measured, is transferred to testboard 4 and is tested, and after the completion of test, is still transmitted from testboard 4 by described first mechanical arm 31
Carry out ultra-vioket radiation to scratching area 5, in the present embodiment, the time carrying out ultra-vioket radiation is 600s～650s；In the first machinery
Arm 31, when testboard 4 is transferred to scratching area 5, carries out step S2 simultaneously, and second mechanical arm 32 extracts from SMIF 2
The wafer another to be measured setting, is transferred to testboard 4 and is tested, so so that test wafer cassette ultra-vioket radiation to be measured is same
Shi Jinhang is it is possible to pass through optimizing detection program, or changes the relevant parameter of scratching area 5 so that testing and ultra-vioket radiation
Time is as identical as possible, to improve efficiency；When described another wafer sort to be measured finishes（Namely it is to be measured at scratching area 5
Wafer ultra-vioket radiation finishes）Afterwards, carry out step S3, described wafer to be measured is transferred to by described first mechanical arm 31 from scratching area 5
Described SMIF 2 is so that described wafer to be measured playbacks；Carry out step S4, described second mechanical arm 32 carries institute simultaneously
State another wafer to be measured and be transferred to scratching area 5 from testboard 4 and carry out ultra-vioket radiation, if wafer to be measured amounts to 2, treat described another
After the ultra-vioket radiation of one wafer to be measured finishes, SMIF 2 is passed back to by described second mechanical arm 32, and is allowed to playback be
Can.If also having other wafers to be measured, carry described another crystalline substance to be measured when described step S4 carries out described second mechanical arm 32
Circle, when testboard 4 is transferred to scratching area 5 and carries out ultra-vioket radiation, also includes in described step S3, described first mechanical arm 31 continues
Continue and extract a piece of wafer to be measured from described SMIF 2, be transferred to testboard 4, the like, until completing all of
The test of wafer to be measured.
In the acceptance testing method of the Acceptance Test device of present invention offer and disposal programmable device, employ and have
The Acceptance Test device of scratching area, described scratching area can carry out ultraviolet erasing to the wafer to be measured after the test of platform after tested, such as
This avoids the need for for wafer being transported to special ultraviolet region, thus improve greatly improve work efficiency, it also avoid by
Produce this problem in the impurity that carrying may lead to, indirectly improve yield.
Although it is understood that the present invention is disclosed as above with preferred embodiment, but above-described embodiment being not used to
Limit the present invention.For any those of ordinary skill in the art, without departing under technical solution of the present invention ambit,
The technology contents that the disclosure above all can be utilized are made many possible variations and modification, or are revised as to technical solution of the present invention
Equivalent embodiments with change.Therefore, every content without departing from technical solution of the present invention, according to the technical spirit pair of the present invention
Any simple modification made for any of the above embodiments, equivalent variations and modification, all still fall within the scope of technical solution of the present invention protection
Interior.
Claims (2)
1. a kind of acceptance testing method of disposal programmable device, for wafer to be measured is tested it is characterised in that profit
Tested with a kind of Acceptance Test device, described Acceptance Test device includes：SMIF, described to be measured for receiving
Wafer；At least one mechanical arm, for transmitting described wafer to be measured；Testboard, for testing to described wafer to be measured；And
Scratching area, described scratching area is used for carrying out ultraviolet erasing to the wafer described to be measured after the test of platform after tested；Wherein, described machinery
Arm can carry described wafer to be measured and move in described SMIF, described testboard and described scratching area；
The acceptance testing method of described disposal programmable device includes：Described mechanical arm extracts from described SMIF
One wafer to be measured, and be transferred to described testboard and tested, to be tested after the completion of, described wafer to be measured is passed by described mechanical arm
It is handed to scratching area and carries out ultraviolet erasing, after described wafer to be measured carries out ultraviolet erasing, described standard is sent back by described mechanical arm
Mechanical interface；Described mechanical arm includes first mechanical arm and second mechanical arm, and described first mechanical arm and second mechanical arm are successively
Transmit described wafer to be measured, the quantity of described wafer to be measured is more than or equal to 2；
Carry out step S1 first, first piece wafer to be measured is extracted from SMIF by described first mechanical arm, is transferred to
Testboard is tested, to be tested after the completion of, by described first mechanical arm by wafer to be measured for first piece from testboard be transferred to wipe
Except area carries out ultraviolet erasing；
When wafer to be measured for first piece is transferred to scratching area from testboard by described first mechanical arm, carry out step S2 simultaneously, by
Described second mechanical arm extracts second wafer to be measured from SMIF, is transferred to testboard and is tested；
After described second wafer sort to be measured finishes, carry out step S3, by described first mechanical arm, described first piece is treated
Survey wafer and be transferred to described SMIF so that described first piece wafer to be measured playbacks from scratching area；Carry out step simultaneously
S4, described second mechanical arm described second wafer to be measured of carrying is transferred to scratching area from testboard and carries out ultraviolet erasing, treats institute
State second wafer to be measured ultraviolet erasing finish after, SMIF is passed back to by described second mechanical arm so that described
Second wafer playback to be measured.
2. the acceptance testing method of disposal programmable device as claimed in claim 1 is it is characterised in that described carry out ultraviolet
It is erased to using ultraviolet source irradiation 600s～650s.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310321124.5A CN103364706B (en) | 2013-07-26 | 2013-07-26 | Acceptance Test device and the acceptance testing method of disposal programmable device |
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| CN201310321124.5A CN103364706B (en) | 2013-07-26 | 2013-07-26 | Acceptance Test device and the acceptance testing method of disposal programmable device |
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| CN103364706A CN103364706A (en) | 2013-10-23 |
| CN103364706B true CN103364706B (en) | 2017-03-08 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103869232B (en) * | 2014-03-06 | 2016-09-14 | 上海华虹宏力半导体制造有限公司 | Test device and method of testing |
| CN107179493A (en) * | 2017-03-22 | 2017-09-19 | 无锡圆方半导体测试有限公司 | Test erasable all-in-one |
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| JPS6050700A (en) * | 1983-08-30 | 1985-03-20 | Toshiba Corp | Testing method of hybrid memory module and its testing device |
| JPS60145667A (en) * | 1984-01-09 | 1985-08-01 | Mitsubishi Electric Corp | Testing method for ultraviolet ray irradiation erase type nonvolatile memory |
| JPS61112339A (en) * | 1984-11-07 | 1986-05-30 | Nec Corp | Prober |
| JP3844912B2 (en) * | 1999-06-10 | 2006-11-15 | 富士通株式会社 | Semiconductor memory device test method, test device, and semiconductor memory device |
| IL147692A0 (en) * | 2002-01-17 | 2002-08-14 | Innersense Ltd | Machine and environment analyzer |
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|---|---|---|---|---|
| US5673228A (en) * | 1994-04-16 | 1997-09-30 | U.S. Philips Corporation | Integrated circuit having an EEPROM, semiconductor wafer provided with such integrated circuits, and method of testing such a semiconductor wafer |
| CN1233841A (en) * | 1998-04-30 | 1999-11-03 | 西门子公司 | Device for testing multiple memory chips of one crystal plate |
| US6091652A (en) * | 1998-12-11 | 2000-07-18 | Lsi Logic Corporation | Testing semiconductor devices for data retention |
| CN1359524A (en) * | 1999-06-30 | 2002-07-17 | 因芬尼昂技术股份公司 | Test device for testing a memory |
| CN101145520A (en) * | 2001-11-30 | 2008-03-19 | 艾克塞利斯技术公司 | Process for optically erasing charge buildup during fabrication of an integrated circuit |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140509 |
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Effective date of registration: 20140509 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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