CN103361509A - Rolled copper foil, copper-clad laminated board, flexible printed wiring board and manufacturing method thereof - Google Patents
Rolled copper foil, copper-clad laminated board, flexible printed wiring board and manufacturing method thereof Download PDFInfo
- Publication number
- CN103361509A CN103361509A CN2013101225281A CN201310122528A CN103361509A CN 103361509 A CN103361509 A CN 103361509A CN 2013101225281 A CN2013101225281 A CN 2013101225281A CN 201310122528 A CN201310122528 A CN 201310122528A CN 103361509 A CN103361509 A CN 103361509A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- copper
- intermittence
- tolerance
- ingot casting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a rolled copper foil, a copper-clad laminated board, a flexible printed circuit and a manufacturing method thereof. The object of the present invention is to provide a rolled copper foil, a copper-clad laminated board and a flexible printed circuit (FPC) which has better durability with respect to bending. The solution is that an intermittent durable copper foil which reduces stress buffering in bending is provided.
Description
Technical field
The present invention relates to rolled copper foil, copper-clad laminated board, flexible printing wiring board and manufacture method thereof.
Background technology
Electronics consists of with a plurality of electric substrates usually, and the flexible printing wiring board (the following FPC that sometimes is recited as) that these electric substrates are electrically connected each other is arranged between the electric substrate.The copper wiring that flexible printing wiring board usually possesses insulated substrate and forms at this substrate surface.For connecting electronic substrate flexible printing wiring board each other, require good bendability etc.
Particularly in recent years, owing to possess folded part, rotating part or the miniaturized electronics of the portable phone of the movable part of pulling out part etc. of sliding, digital camera, pick up camera etc. is popularized, constantly miniaturization, slimming, densification are so the bendability that the flexible printing wiring board that uses in moving part is required becomes higher.
As the characteristic that such flexible printing wiring board is required, good warpage take the MIT bendability as representative is arranged, and the high reversed bending take the IPC bendability as representative, in the past, developed the Copper Foil, the copper-resin substrate duplexer (patent documentation 1 ~ 2) that possess such characteristic.
For example, in slip pliability test (IPC), the use-testing device can tolerate goods of number of bends more than 100,000 times flexible printing wiring board such, can tolerate the number of bends that generally can not have in reality.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2010-100887 communique;
Patent documentation 2: TOHKEMY 2009-111203 communique.
The problem that invention will solve
; even use miniaturized electronics, for example folder-type portable telephone, the sliding-type portable phone of the flexible printing wiring board that in slip pliability test (IPC), can tolerate the number of bends (for example 100,000 times) that generally in reality, can not have; in the goods of reality, the fault of flexible printing wiring board fracture does not disappear.Even as using the FPC that can tolerate huge number of bends but in the goods of reality, still to produce the reason of such fault, the countless reason such as deteriorated of the outer heating of be full of cracks, the design that the contact, miscellaneous part of having discussed the parts that densification causes causes the top of the sandwiching of FPC, sharp-pointed parts, insulating material that chemical reaction causes, and applied countermeasure.
The present inventor considers not seek in addition the reason of these faults in view of the fault of the fracture of flexible printing wiring board in the goods of reality does not have situation about disappearing, and can solve this problem by the Copper Foil of improvement FPC itself, and researchs and develops.
Summary of the invention
Therefore, the object of the present invention is to provide in a kind of situation about in the goods of reality, in FPC, using, have rolled copper foil, copper-clad laminated board, the flexible printing wiring board (FPC) of higher weather resistance for bending.
Be used for solving the scheme of problem
Under such situation, the present inventor has considered can to tolerate the number of bends (for example 100,000 times) that generally can not have in reality in slip pliability test (IPC) flexible printing wiring board situation of the fault of fracture in fact still in the goods (for example folder-type portable telephone, sliding-type portable phone) of reality, think even so, further improvement by FPC, or can avoid these fractures, and carry out with keen determination research.
And, the present inventor conceives the environment for use that the present slip pliability test (IPC) that has become the test method of standard does not have the slice-of-life goods, and reduce on the contrary the number of bends (time per unit) in the pliability test and carried out various experimental investigations, shockingly found by giving off and on bending, thereby produced easily the phenomenon of fracture.
On this basis, the present inventor has found that this phenomenon beyong contemplation is to produce owing to the stress of Copper Foil relaxes phenomenon, exactly because found to pursue the Copper Foil of the FPC of slimming, cause it is generally acknowledged that the stress that only has theoretic possibility relaxes phenomenon the fracture of the goods of reality is caused large impact, found in the manufacturing of Copper Foil, by being relaxed, stress do not produce, thereby the tolerance to bending under the condition that the goods that make reality run into significantly improves, and has realized thus the present invention.
Namely, according to the present invention, come manufacturing copper foil and FPC by the mode that relaxes the condition that reduces with the stress that satisfies the Copper Foil make FPC, thereby can improve the weather resistance to bending intermittently, can reduce the fracture of the FPC under the condition that the goods of reality run into.Therefore, reduce stress and relax, make FPC and the Copper Foil of crooked tolerance raising intermittently and do not rely on the means that its concrete minimizing stress relaxes, within the scope of the present invention.
Therefore, the invention reside in following (1) ~.
（1）
Crooked tolerance Copper Foil reduced the stress in the bending and relaxed a kind of intermittence.
（2）
A kind of (1) described intermittence crooked tolerance Copper Foil, with respect to 0.2% distortion in 25 ℃, the condition of the formula I below satisfying:
(T
0-T
5)/T
0≤ 25(%) (formula I)
(wherein, T
0The expression initial stress, T
5Represent the stress after 5 hours).
（3）
A kind of intermittence, crooked tolerance Copper Foil was observed every observation sectional area 1000 μ m from rolling parallel sections
2The length of crystal grain boundary be below the 200 μ m.
（4）
According to crooked tolerance Copper Foil at (1) or (2) described intermittence, observe every observation sectional area 1000 μ m from rolling parallel sections
2The length of crystal grain boundary be below the 200 μ m.
（5）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (4), has the Young's modulus of the scope of 60 ~ 105GPa.
（6）
According to each of (1) ~ (5) crooked tolerance Copper Foil at described intermittence, Copper Foil is to contain copper and can not keep away impurity and the Copper Foil that forms.
（7）
According to each of (1) ~ (5) crooked tolerance Copper Foil at described intermittence, Copper Foil is to contain copper and can not keep away Copper Foil impurity, that also form with the element more than a kind that adds up to 20 ~ 500 quality ppm to contain to select from the group that is made of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V.
（8）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (5), Copper Foil is the Copper Foil that is made of oxygen free copper or tough pitch copper.
（9）
According to each of (1) ~ (5) crooked tolerance Copper Foil at described intermittence, Copper Foil is the Copper Foil that also forms with the element more than a kind that adds up to 20 ~ 500 quality ppm to be added with to select from the group that is made of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V outside oxygen free copper or tough pitch copper.
（10）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (9), Copper Foil is rolled copper foil.
（11）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (10), Copper Foil is to be rolled the rolled copper foil that forms more than 96% with degree of finish.
（12）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (11), Copper Foil is the Copper Foil that flexible printing wiring board is used.
（13）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (11), copper foil layer is stacked in the flexible printing wiring board.
（14）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (11), Copper Foil is the Copper Foil that copper-clad laminated board is used.
（15）
According to the crooked tolerance Copper Foil at each described intermittence of (1) ~ (11), copper foil layer is stacked in the copper-clad laminated board.
And then, the invention reside in following (21) ~.
（21）
A kind of Copper Foil carry out the heat treated of 1 second ~ 1 hour with 160 ~ 400 ℃ after, becomes (1) ~ the crooked tolerance Copper Foil at each described intermittence of (14).
（22）
A kind of Copper Foil in the heat treated of carrying out 30 minutes with 200 ℃, or with after 350 ℃ of heat treated of carrying out for 1 second, becomes (1) ~ the crooked tolerance Copper Foil at each described intermittence of (14).
（23）
A kind of flexible printing wiring board, be laminated with (1) ~ crooked tolerance Copper Foils at each described intermittence of (10), (11), (12) forms.
（24）
A kind of copper-clad laminated board, be laminated with (1) ~ crooked tolerance Copper Foils at each described intermittence of (10), (13), (14) forms.
And then, the invention reside in following (31) ~.
（31）
A kind of manufacture method of rolled copper foil comprises:
The operation of the ingot casting of casting copper;
The ingot casting of copper is carried out the operation of hot rolling;
To hot rolling the ingot casting of the copper operation of carrying out the cold rolling and annealing more than 1 time; And
Carry out be used to the last cold rolling operation of making finished product thickness.
（32）
According to (31) described manufacture method, carrying out for the last cold rolling operation of making finished product thickness,
Being used in last cold rolling total degree of finish (final rolling degree of finish) of making finished product thickness is more than 96%.
（33）
According to each described manufacture method of (31) ~ (32), to hot rolling the ingot casting of copper carry out in the operation of the cold rolling and annealing more than 1 time,
The annealing of carrying out is at last carried out with the heat-up rate below 40 ℃/second more than 5 ℃/second.
（34）
According to each described manufacture method of (31) ~ (33), to hot rolling the ingot casting of copper carry out in the operation of the cold rolling and annealing more than 1 time,
The cold rolling degree of finish (total degree of finish) with 60% ~ 90% that slightly before carries out of the annealing of carrying out at last carries out.
（35）
According to each described manufacture method of (31) ~ (34), the ingot casting of copper is to contain copper and can not keep away impurity and the ingot casting of the copper that forms.
（36）
According to each described manufacture method of (31) ~ (35), the ingot casting of copper be contain copper and can not keep away impurity, also with the element more than a kind that adds up to 20 ~ 500 quality ppm to contain from the group that is consisted of by Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V, to select and the ingot casting of the copper that forms.
（37）
According to each described manufacture method of (31) ~ (34), the ingot casting of copper is the ingot casting of the copper that is made of oxygen free copper or tough pitch copper.
（38）
According to each described manufacture method of (31) ~ (34), (37), the ingot casting of copper is also with the element more than a kind that adds up to 20 ~ 500 quality ppm to be added with to select from the group that is made of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V and the ingot casting of the copper that forms outside oxygen free copper or tough pitch copper.
And then, the invention reside in following (41) ~.
（41）
A kind of intermittence crooked tolerance Copper Foil manufacture method, comprise: to each the rolled copper foil of manufacture method manufacturing by (31) ~ (36) with 160 ~ 400 ℃ of operations of carrying out the heat treated of 1 second ~ 1 hour.
（42）
A kind of manufacture method of bending at intermittence tolerance flexible printing wiring board comprises:
The operation that the rolled copper foil that will make by each manufacture method of (31) ~ (36) and matrix resin are stacked; And
To with the stacked rolled copper foil of matrix resin with 160 ~ 400 ℃ of operations of carrying out the heat treated of 1 second ~ 1 hour.
（43）
A kind of manufacture method of copper-clad laminated board comprises:
The operation that the rolled copper foil that will make by each manufacture method of (31) ~ (36) and matrix resin are stacked; And
To with the stacked rolled copper foil of matrix resin with 160 ~ 400 ℃ of operations of carrying out the heat treated of 1 second ~ 1 hour.
And then, the invention reside in following (51) ~.
（51）
A kind of rolled copper foil is by each manufacture method manufacturing of (31) ~ (36).
（52）
A kind of bending at intermittence tolerance Copper Foil is by the manufacture method manufacturing of (41).
（53）
A kind of bending at intermittence tolerance flexible printing wiring board is by the manufacture method manufacturing of (42).
（54）
A kind of copper-clad laminated board is by the manufacture method manufacturing of (43).
The effect of invention
According to the present invention, can obtain intermittently crooked tolerance Copper Foil, in the situation that can obtain in the goods of reality, in FPC, to use, have rolled copper foil, copper-clad laminated board, the flexible printing wiring board (FPC) of higher weather resistance for bending.Possess in the electronics of flexible printing wiring board (FPC) of crooked tolerance Copper Foil at intermittence of the present invention in use, because the FPC that becomes its movable part possesses the crooked tolerance of the behaviour in service that has reflected in the real goods, so compare with only having considered the existing goods to the tolerance of continuous bending, weather resistance, reliability are superior.
Description of drawings
Fig. 1 is the explanatory view of the state of the internal surface of bending of expression Copper Foil and outside surface.
Fig. 2 is the explanatory view of the skew of explanation Narrow Hystersis.
Fig. 3 is the electron micrograph for the rolling parallel sections of observing crystal grain boundary.
Embodiment
Below, enumerate preferred embodiment, explain the present invention.
As mentioned above, in the past, utilized continuous bending motion to carry out the bendability evaluation of Copper Foil., the present inventor finds, compares with continuous bending, has situation about just rupturing with less number of bends Copper Foil in bending intermittently.And the variation of finding this rupture life results from the stress of Copper Foil and relaxes phenomenon, thereby has arrived the present invention.
According to present inventor's investigation, when making the Copper Foil alternating bending, at copper foil surface, tensile stress and stress under compression alternately work.If continuous bending, no matter repeatedly carry out several times bending, the stretching/compressing stress that works also is same degree.The pliability test of carrying out under this state is the pliability test of in the past carrying out., in the situation of bending intermittently, produce stress and relax between bending and bending, Narrow Hystersis (hysteresis loop) moves to the low-stress lateral deviation, and therefore the hysteresis loop line is from original skew when beginning bending again, and stress amplitude becomes large as a result.It is to cause the become conclusion of short reason of life-span of bending ratio continuous bending intermittently that the present inventor has drawn this.
The explanatory view of this phenomenon of explanation shown in Fig. 1.Fig. 1 is inboard and the outside of bending that is illustrated in the imagination Copper Foil, is divided in the situation of outside surface (outside surface) and internal surface (inner surface), and outside surface becomes the explanatory view that stretched state, internal surface become compressed state.Such as shown, because outer surface is in stretched state, so if keep this state, the stress that then can produce soon under this stretched state relaxes, the result becomes Narrow Hystersis to the state of compressed side skew about outside surface.On the other hand, such as shown, because internal surface is in compressed state, so if keep this state, the stress that then can produce soon under this compressed state relaxes, the result becomes Narrow Hystersis to the state of tensile side skew about internal surface.
Fig. 2 illustrates the explanatory view of the skew of the such Narrow Hystersis of explanation.The transverse axis of Fig. 2 represents distortion, and the longitudinal axis represents stress.In Fig. 2,3 Narrow Hystersiss of top, central part, bottom are shown.The Narrow Hystersis of central part is at the Narrow Hystersis that carries out continuously in the crooked situation.Do not relax the skew that causes if produce stress, then Narrow Hystersis was positioned at the position as the Narrow Hystersis of this central part originally.In the continuous pliability test of in the past carrying out, can say the pliability test of for example carrying out 100,000 times along this Narrow Hystersis.Therefore, if the use of FBC in the miniaturized electronics of reality carried out along such Narrow Hystersis, FBC should all tolerate and for example surpass 100,000 times bending, and such endurance quality of each manufacturer's expectation is shown.
The Narrow Hystersis on the top of Fig. 2 be make Copper Foil crooked and follow the time through generation stress relax after inner surface side that observe, Copper Foil because the Narrow Hystersis of stress mitigation after being offset.The Narrow Hystersis of the bottom of Fig. 2 be make Copper Foil crooked and follow the time through generation stress relax after outside surface side that observe, Copper Foil because the Narrow Hystersis of stress mitigation after being offset.Like this, make Copper Foil crooked and keep, producing along with the process of time in the situation that stress relaxes, same Copper Foil, outside surface side and inner surface side, have like this different Narrow Hystersiss.
And then after this, make Copper Foil crooked to opposition side, namely, the mode that the outside before making it becomes the inboard specifically, the inboard before making it becomes the outside is specifically carried out in the crooked situation, Narrow Hystersis from from the Narrow Hystersis on the top of Fig. 2 to the bottom, the Narrow Hystersis from the Narrow Hystersis of bottom to top simultaneously applies large amplitude above each Narrow Hystersis to the two sides of Copper Foil.And then after, if again make Copper Foil crooked and keep to opposition side, then again the two sides of Copper Foil is applied large amplitude above each Narrow Hystersis, the result, if continue like this to carry out bending intermittently, then alternately produce stress on the two sides and relax, stress, distortion amplitude increase.The arrow of Fig. 2 represents to produce the situation of the skew (amplitude) of such Narrow Hystersis.When continuing like this to carry out intermittently crooked, carry out like that the situation of continuous bending compares with the Narrow Hystersis circulation that only makes central part, Copper Foil is applied harsh distortion, and the result is not reaching if Copper Foil is just damaged in the situation of the number of bends that continuous bending just can tolerate.
Therefore, for fear of such breakage, the present inventor has expected improving the idea of the stress relaxation properties of Copper Foil.Therefore, the invention reside in, by the mitigation of minimizing stress, prevent that perhaps stress from relaxing generation, thereby the bendability at the intermittence of Copper Foil is improved, and then be the thus Copper Foil (comprising the Copper Foil among the FPC) of the bendability raising at intermittence.In this manual, enumerate the concrete embodiment that improves be used to the bendability at the intermittence that makes Copper Foil and come that the present invention will be described, but the concrete embodiment that the present invention is not enumerated like this limits.
And then for fear of such breakage, thereby the present inventor has expected can reducing idea with respect to the STRESS VARIATION of deflection by the Young's modulus that reduces Copper Foil.Thus, if even in the situation that the stress mitigation has occured, also can suppress the increase of stress, distortion amplitude.Therefore, the present invention also is, thereby improves the bendability at the intermittence of Copper Foil by the Young's modulus that reduces Copper Foil, and then is to have improved by it Copper Foil (comprising the Copper Foil among the FPC) of bendability intermittently.About this point, in this manual, enumerate the concrete embodiment that improves be used to the bendability at the intermittence that makes Copper Foil and come that the present invention will be described, but the concrete embodiment that the present invention is not enumerated like this limits.
[stress mitigation]
It is under the condition of fixing temperature, fixing distortion that stress relaxes, the phenomenon that reduces along with the time at the stress of metal load.
It is the phenomenon that the movement by the dislocation in the material produces that stress relaxes at microcosmic.The movement of such dislocation produces in crystal grain boundary easily.Therefore, the present invention reduces the length of the crystal grain boundary of Copper Foil and is used as realizing that stress relaxes the means that reduce, has realized thus the raising with respect to the tolerance of bending intermittently.
[crystal boundary length]
The length of crystal grain boundary (crystal boundary length) for example can be asked for as follows, namely, use CP(Cross section polisher to carrying out 30 minutes Copper Foils after the annealing with 200 ℃, the section polishing) forms rolling parallel sections, use EBSD(Electron Back Scattering Diffraction, EBSD, the JXA8500F processed of Jeol Ltd.), with step-length 0.5 μ m, acceleration voltage 15kV, WD23mm, electric current 5 * 10
-8A is to range of observation 1000 μ m
2Crystalline orientation measure, will be poor with the crystalline orientation of the measuring point of adjacency be that the above situation of 15 degree is regarded crystal grain boundary as, be determined at the crystal grain boundary length that comprises in the range of observation.
In preferred embodiment, the every observation sectional area 1000 μ m that see from rolling parallel sections
2The length of crystal grain boundary for example can be made as below the 200 μ m, preferably be made as below the 100 μ m, further preferably be made as below the 90 μ m, more preferably be made as below the 70 μ m, further preferably be made as below the 50 μ m.The viewpoint that relaxes from reducing stress, the length of crystal grain boundary is the smaller the better.On the other hand, in preferred embodiment, for example the length of crystal grain boundary can be made as more than the 0.1 μ m, for example more than the 1.0 μ m, for example more than the 5.0 μ m.From the viewpoint of the intensity of Copper Foil, the length of preferred crystal grain boundary is the value more than this value.
In order to represent the length of crystal grain boundary, Fig. 3 illustrates an example of the electron micrograph of the rolling parallel sections of observing.In Fig. 3,3 cross sectional photograph of upper, middle and lower are shown as the photo of growing crosswise.In the cross sectional photograph on the top of Fig. 3, almost can't see crystal grain boundary.This sample strip of almost can't see crystal grain boundary shows crooked tolerance (very) at good intermittence.Have, because Copper Foil is extremely thin, observe so for the electron gain microphotograph supporting mass is connected to Copper Foil, the black part of the topmost of the cross sectional photograph on top is the gap of this supporting mass and Copper Foil, and its white part under just is supporting mass.In the cross sectional photograph below Fig. 3, observe many crystal grain boundaries.This sample strip that is observed many crystal grain boundaries is the poor sample (bad) of crooked tolerance at intermittence.In the cross sectional photograph at the middle part of Fig. 3, observe moderate crystal grain boundary.This sample strip sample than the cross sectional photograph of above-mentioned bottom aspect crooked tolerance intermittently is outstanding, but poorer than the sample of the cross sectional photograph on above-mentioned top.
[stress mitigation rate]
Stress mitigation rate is asked for as follows, namely, for example will carry out 30 minutes Copper Foils after the annealing with 200 ℃, use precision cutting tool to cut out the strip of width 12.7mm, use tensile testing machine (AGS-X processed of Shimadzu Scisakusho Ltd), to be fixed apart from 50mm between chuck, distance between chuck to be stretched to 50.1mm to measure the stress T that will after t hour, obtain in the variation of 25 ℃ of counter stresses
tStress T with initial (after 0 hour)
0Difference divided by initial stress T
0After value { (T
0-T
t)/T
0As the stress mitigation rate (%) after t hour.
In preferred embodiment, intermittence of the present invention, the stress mitigation rate (%) of crooked tolerance Copper Foil was established in t=5 hour the situation, with respect to being 0.2% distortion at 25 ℃, can satisfy the condition of following formula I:
(T
0-T
5)/T
0≤ 25(%) (formula I)
(wherein, T
0The expression initial stress, T
5Represent the stress after 5 hours),
And then preferably can satisfy the condition of Formula Il:
(T
0-T
5)/T
0≤ 20(%) (formula II)
Condition.More preferably can be with (T
0-T
5)/T
0Value be made as below 19%.
[Young's modulus]
Young's modulus for example can use resonant mode tester (the Japanese technoplas TE-RT processed of Co., Ltd.) to measure.Of the present invention preferred embodiment in, intermittently the Young's modulus of crooked tolerance Copper Foil for example can be made as 60 ~ 105GPa, preferably is made as 70 ~ 105GPa, further preferably is made as 70 ~ 100GPa, more preferably be made as 70 ~ 90GPa, further preferably be made as the scope of 75 ~ 85GPa.
[component]
The component of Copper Foil of the present invention is so long as can reduce the component that stress relaxes and just can use.For example, can use the fine copper that comprises copper and can not keep away impurity.In preferred embodiment, as the component of Copper Foil, can will meet the tough pitch copper of specification of alloy number C1100 of JIS-H3100 or the oxygen free copper of specification of alloy number C1020 that meets JIS-H3100 as component.When adopting such component close to fine copper, the electric conductivity of Copper Foil can not reduce, and is suitable for FPC, COF.Usually, the oxygen concn that comprises in the rolled copper foil is 0.01 ~ 0.05 quality % in the situation of tough pitch copper, is being below the 0.001 quality % in the situation of oxygen free copper.In addition, can use the oxygen free copper of the specification of the alloy number C1011 that meets JIS-H3510 as oxygen free copper.
In preferred embodiment, as the component of Copper Foil, also can to above-mentioned component close to fine copper further with add up to contain below the 500 quality ppm from the group of Ag and Sn, select more than a kind.Wherein, the amount of preferred Sn is below the 300ppm.When Ag or Sn surpassed 500 quality ppm to the total addition of rolled copper foil, electric conductivity reduced and recrystallization temperature rises, and had in final annealing the growth of recrystal grain suppressed, the situation that crystal boundary length is elongated.Although the lower limit of the total addition of Ag and Sn does not have special stipulation, normally add up to more than the 20 quality ppm.
In preferred embodiment, in the copper of above-mentioned component close to fine copper, for example in above-mentioned tough pitch copper or above-mentioned oxygen free copper, also can with the element more than a kind that adds up to 20 ~ 500 quality ppm to contain from the group of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V, to select.
Have again, also can be added with the element more than a kind of from the group of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V, selecting more than the 500 quality ppm to add up to the copper of above-mentioned component close to fine copper, thereby for example make the recrystal grain growth by the thermal treatment that applies at the high temperature more than 600 ℃ more than 30 minutes, also can improve the stress relaxation properties., in this operation, must be with not favourable aspect the soft Copper Foil behind the recrystallize and the laminated resin in order to make copper-clad laminated board.
[manufacturing of Copper Foil]
The manufacturing of Copper Foil of the present invention (intermittently crooked tolerance Copper Foil) so long as can make the method that has reduced the Copper Foil that stress relaxes, then can be not particularly limited and carries out as described above.In preferred embodiment, by comprise operation that the copper (copper alloy) that uses said components casts the ingot casting of copper, to the ingot casting of copper carry out hot rolling operation, to the ingot casting of the copper after the hot rolling carry out the cold rolling and annealing more than 1 time operation, carry out making rolled copper foil be used to the manufacture method of the last cold rolling operation of making finished product thickness, by the operation of this rolled copper foil being carried out carry out 1 second ~ 1 hour heat treated with 160 ~ 400 ℃, thereby can make intermittently crooked tolerance Copper Foil.In addition, above-mentioned with 160 ~ 400 ℃ of heat treated of carrying out 1 second ~ 1 hour, also can double as and be the thermal treatment in the manufacturing process that makes the copper-clad laminated board that Copper Foil engages with resin layer.
Carry out repeatedly to carry out aptly cold rolling and annealing in the operation of the cold rolling and annealing more than 1 time at the ingot casting to the copper after this hot rolling, make desirable thickness.In a preferred embodiment, the annealing of preferably carrying out at last in this annealing, namely in the annealing of carrying out slightly before carrying out for the last cold rolling operation of making finished product thickness is made as heat-up rate more than 5 ℃/second below 40 ℃/second.Under heat-up rate is situation below 5 ℃/second, thickization of crystal grain occurs, it is inhomogeneous that recrystallized structure becomes.On the other hand in the situation more than 40 ℃/second, because fine recrystal grain grows respectively, so that recrystallized structure becomes is inhomogeneous.
In preferred embodiment, the above-mentioned annealing of carrying out at last slightly before carry out rolling in, can for example be made as below 90% with degree of finish (total degree of finish), preferably be made as below 89%, more preferably be made as below 88%, for example can be made as more than 60%, preferably be made as more than 65%, more preferably be made as more than 67%.By adopting such scope, can after this annealing operation, realize uniform recrystallized structure, in final rolling process, can make suitable rolling structure.When total degree of finish of the rolling process that slightly before carries out of the annealing of in the end carrying out surpassed 90%, the set excessive tissue was flourishing, easy thickization of the crystal grain after the annealing operation.
In a preferred embodiment, carrying out for the last cold rolling operation of making finished product thickness, cold rolling total degree of finish that can this is last (final rolling degree of finish) is made as more than 96%, preferably is made as more than 97%, more preferably is made as more than 97.5%.
Have, those skilled in the art understand again, and in each rolling process of the present invention, a rolling process also can make material Multiple through then out (repeatedly passing through) Rolling roller implement.Therefore, in present specification, the degree of finish of certain rolling process, mean by so repeatedly being rolled through coming in the situation of operation, by repeatedly passing through and the degree of finish of implementation trade-off, be not the degree of finish (1 time through degree of finish) of arbitrary time process of comprising in this rolling process, clearer and more definite in order to make it, the degree of finish with certain rolling process is recited as total degree of finish sometimes.
In a preferred embodiment, carrying out in the operation of 1 second ~ 1 hour heat treated with 160 ~ 400 ℃ to rolled copper foil, for example can be with 200 ~ 400 ℃ of heat treated of carrying out 1 second ~ 30 minute, for example can be with 200 ℃ of heat treated of carrying out 30 minutes, for example can be with 350 ℃ of heat treated of carrying out for 1 second.Have, also can shorter than 1 second, for example be 0.1 second ~ 1 second heat-up time again.By this heat treated, above-mentionedly be subject to last cold rolling rolled copper foil and become stress and relax the intermittence of the present invention crooked tolerance Copper Foil reduced.This heat treated is as the independently operation of rolled copper foil is carried out also can, but for example at the stacked resin in order to make copper-clad laminated board, when membranaceous resin is carried out thermo-compressed, carrying out heat treated in the mode that becomes this heat treated condition also can, perhaps for example at the stacked resin in order to make copper-clad laminated board, the coated with resins material makes its thermofixation and when forming rete, carries out heat treated in the mode that becomes this heat treated condition and also can.
[flexible printing wiring board]
Copper Foil of the present invention (intermittently crooked tolerance Copper Foil) has crooked tolerance at superior intermittence as described above, can use aptly as the wiring portion of the electroconductibility of flexible printing wiring board.Therefore, the present invention also is stacked and possesses the flexible printing wiring board of above-mentioned Copper Foil.
Flexible printing wiring board usually by electroconductibility wiring laminated in insulativity resin and form, be flexible and have bendability.Wiring is laminated in the resin layer of the base material of insulativity as required via adhesive linkage.Copper Foil of the present invention all illustrates crooked tolerance at outstanding intermittence in any stacked mode, therefore flexible printing wiring board of the present invention just can adopt various concrete modes so long as stacked and possess the flexible printing wiring board of Copper Foil of the present invention.In a preferred embodiment, for example be bonded with Copper Foil of the present invention at membranaceous resin layer flexible printing wiring board also can, be at Copper Foil coated with resins material of the present invention and film forming is membranaceous flexible printing wiring board also can.For resin layer, be not particularly limited and can use the resin that can in flexible printing wiring board, use.In a preferred embodiment, for example can use polyimide resin.
Flexible printing wiring board of the present invention for example can be made as follows.Single face at rolled copper foil applies the polyimide precursor of polyamic acid as main body, carry out drying and curing, be processed into the copper-clad laminated board of polyimide resin layer and copper foil layer, form the circuit of regulation by photoetching, and then at the bonding polyimide film of face of the wiring side of copper foil layer, can make flexible printing wiring board.In above-mentioned copper-clad laminated board, as long as the layer of Copper Foil is crooked tolerance Copper Foil at intermittence, therefore, as the rolling Copper Foil, use the heat treated by the formation that is used for polyimide resin layer, for example be subject to 200 ℃ 30 minutes heat treated and the Copper Foil that becomes crooked tolerance Copper Foil at intermittence of the present invention gets final product.In addition, for example at the bonding polyimide film of the single face of rolled copper foil, be processed into the copper-clad laminated board of polyimide resin layer and copper foil layer, the later operation of photoetching after carrying out is made flexible printing wiring board and also can.In this case, in above-mentioned copper-clad laminated board, as long as the layer of Copper Foil is crooked tolerance Copper Foil at intermittence, therefore, use as the rolling Copper Foil, by being used for the bonding heat treated of polyimide film, for example be subject to 200 ℃ 30 minutes heat treated and the Copper Foil that becomes crooked tolerance Copper Foil at intermittence of the present invention gets final product.
Intermittence of the present invention crooked tolerance Copper Foil and use its flexible printing wiring board in the movable part of the electronics of the Wiring member of the lens barrel section of portable phone, notebook computer, photographic camera, HDD etc., machine for automatic working, robots arm's etc. industrial machinery, to use aptly.
[embodiment]
Below, embodiments of the invention and comparative example are shown together, these embodiment provide in order to understand better the present invention and advantage thereof, do not limit the present invention.
[manufacturing of Copper Foil]
Dissolving oxygen free copper (JIS alloy number C1020) (OFC:Oxygen-Free Copper) or tough pitch copper (JIS alloy number C1100) (TPC:Tough-Pitch Copper), element shown in the interpolation table 1 is cast as required, makes the ingot casting of thickness 200mm, width 600mm.After slab hot-rolling is arrived thickness 10mm, repeatedly carry out cold rolling and annealing, be used in the last cold rolling degree of finish (final rolling degree of finish) of making finished product thickness and be respectively the such of table 1 record, made rolled copper foil.At this moment final rolling degree of finish and paper tinsel are thick to be respectively the such of record in the table 1.
In addition, the heat-up rate in total degree of finish of the rolling process that slightly before carries out of final cold rolling annealing operation before slightly and final cold rolling annealing operation before slightly is as shown in table 1 like that.Have, " zero " of heat-up rate means that heat-up rate is more than 5 ℃/second below 40 ℃/second again.In addition, " * " of comparative example 7 means with the heat-up rate that surpasses 40 ℃/second and anneals.
[evaluation]
The rolled copper foil that obtains is carried out perhaps making to estimate and use FPC after 30 minutes the annealing with 200 ℃, in the evaluation of Young's modulus described later, crystal boundary length, stress mitigation rate, bendability (continuous bend, intermittently bending).In table 1 and table 2, gathered the result who obtains.But about embodiment 2 and comparative example 2, not stacked polyimide and tectum (cover lay) and make it by roll temperature being adjusted into 350 ℃ lamination process machine, anneal thus, carry out the thermal treatment same with the thermal treatment of the situation of making evaluation usefulness FPC described later.At this moment heat treatment time was made as for 1 second.
[Young's modulus]
Young's modulus uses resonant mode tester (the Japanese technoplas TE-RT processed of Co., Ltd.) to measure.
[crystal boundary length]
To using CP(Cross section polisher with the Copper Foil after above-mentioned condition (200 ℃ or the 350 ℃) annealing, the section polishing) forms rolling parallel sections, use EBSD(Electron Back Scattering Diffraction, EBSD, the JXA8500F processed of Jeol Ltd.), with step-length 0.5 μ m, acceleration voltage 15kV, WD23mm, electric current 5 * 10
-8A is to range of observation 1000 μ m
2Crystalline orientation measure.Will be poor with the crystalline orientation of the measuring point of adjacency be that the above situation of 15 degree is regarded crystal grain boundary as, be determined at the crystal grain boundary length that comprises in the range of observation.
[stress mitigation rate]
Use precision cutting tool that the rolled copper foil that obtains is cut into the strip of width 12.7mm, anneal with above-mentioned condition (200 ℃ or 350 ℃), use tensile testing machine (AGS-X processed of Shimadzu Scisakusho Ltd) to be fixed apart from 50mm between chuck.Afterwards, distance between chuck is stretched to 50.1mm(is equivalent to 0.2% distortion), 25 ℃ of variations of measuring load.As stress mitigation rate (%), the stress T that acquisition will obtain after t hour
tStress T with initial (after 0 hour)
0Difference divided by initial stress T
0After value { (T
0-T
t)/T
0.Stress mitigation rate (%) in t=5 shown in the table 2 hour situation.
[bendability evaluation]
Copper Foil and the polyimide film (NIKAFLEX processed of nikkan Industrial Co., Ltd: polyimide thickness 12.5 μ m, caking agent thickness 15 μ m) that obtains with rolling processing carried out thermo-compressed (200 ℃, 30 minutes), obtain copper-clad laminated board.The copper-clad laminated board that obtains is carried out etching, make the FPC of circuit width 100 μ m, afterwards with (200 ℃ of tectum (NIKAFLEX processed of nikkan Industrial Co., Ltd: polyimide thickness 12.5 μ m, caking agent thickness 15 μ m) thermo-compressed, 30 minutes) to circuit face, made to estimate and used FPC.But about embodiment 2 and comparative example 2, use is adjusted into the lamination process machine of 350 ℃ of roll temperatures, to make copper-clad laminated board with Copper Foil and above-mentioned polyimide film that rolling processing obtains, use with above-mentioned same gimmick and make after the FPC, use is adjusted into the lamination process machine of 350 ℃ of roll temperatures above-mentioned overlaminate is received circuit face, has made to estimate and has used FPC.Have, add up to heat-up time at this moment was 1 second again.
Pliability test is made as per minute 120 times with sliding velocity, carries out in room temperature environment.The distortion that Copper Foil is applied when making bending is consistent, bending radius is to be made as 1.5mm in the situation of 18 μ m at copper thickness, in the situation of 12 μ m, be made as 1.0mm, in the situation of 9 μ m, be made as 0.75mm, estimate with the number of times till fracture respectively.To the test portion energising, cut off to detect fracture by conducting.In continuous bend, if established the breaks less than 100,000 times for *, if less than then is for 300,000 times zero more than 100,000 times, if more than 300,000 times then be ◎.In this external bending at intermittence, carry out continuously 1000 bendings with 5 hours intervals, if established the breaks less than 50,000 times for *, if less than then is for 100,000 times zero more than 50,000 times, if more than 100,000 times then be ◎.
[table 1]
[table 2]
Utilize possibility on the industry
According to the present invention, can obtain intermittently crooked tolerance Copper Foil, the situation that can obtain in the goods of reality, in FPC, to use of rolled copper foil, copper-clad laminated board, flexible printing wiring board (FPC) have higher weather resistance in to(for) bending.Possess in the electronics of flexible printing wiring board (FPC) of crooked tolerance Copper Foil at intermittence of the present invention in use, because the FPC that becomes its movable part possesses the crooked tolerance of the behaviour in service that has reflected in the real goods, so compare with only having considered the existing goods to the tolerance of continuous bending, weather resistance, reliability are superior.The present invention is invention useful on the industry.
Claims (23)
- One kind intermittence crooked tolerance Copper Foil, the stress that has reduced in the bending relaxes.
- Intermittence according to claim 1 crooked tolerance Copper Foil, with respect to 0.2% distortion in 25 ℃, the condition of the formula I below satisfying:(T 0-T 5)/T 0≤ 25(%) (formula I)(wherein, T 0The expression initial stress, T 5Represent the stress after 5 hours).
- One kind intermittence crooked tolerance Copper Foil, observe every observation sectional area 1000 μ m from rolling parallel sections 2The length of crystal grain boundary be below the 200 μ m.
- 4. bending at intermittence tolerance Copper Foil according to claim 1 is observed every observation sectional area 1000 μ m from rolling parallel sections 2The length of crystal grain boundary be below the 200 μ m.
- Intermittence according to claim 1 crooked tolerance Copper Foil, have the Young's modulus of the scope of 60 ~ 105GPa.
- Intermittence according to claim 1 crooked tolerance Copper Foil, Copper Foil is to contain copper and can not keep away impurity and the Copper Foil that forms.
- Intermittence according to claim 1 crooked tolerance Copper Foil, Copper Foil is the Copper Foil that contains copper and can not keep away impurity, also form with the element more than a kind that adds up to 20 ~ 500 quality ppm to contain to select from the group that is made of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V.
- Intermittence according to claim 1 crooked tolerance Copper Foil, Copper Foil is the Copper Foil that is made of oxygen free copper or tough pitch copper.
- Intermittence according to claim 1 crooked tolerance Copper Foil, Copper Foil is the Copper Foil that also forms with the element more than a kind that adds up to 20 ~ 500 quality ppm to be added with to select from the group that is made of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V outside oxygen free copper or tough pitch copper.
- Intermittence according to claim 1 crooked tolerance Copper Foil, Copper Foil is rolled copper foil.
- 11. bending at intermittence tolerance Copper Foil according to claim 1, Copper Foil is to be rolled the rolled copper foil that forms more than 96% with degree of finish.
- 12. intermittence according to claim 1, crooked tolerance Copper Foil was layered in the flexible printing wiring board.
- 13. a Copper Foil carry out the heat treated of 1 second ~ 1 hour with 160 ~ 400 ℃ after, becomes crooked tolerance Copper Foil at each described intermittence of claim 1 ~ 12.
- 14. a Copper Foil in the heat treated of carrying out 30 minutes with 200 ℃, or with after 350 ℃ of heat treated of carrying out for 1 second, becomes crooked tolerance Copper Foil at each described intermittence of claim 1 ~ 12.
- 15. a flexible printing wiring board, the crooked tolerance Copper Foil at each described intermittence that is laminated with claim 1 ~ 12 forms.
- 16. the manufacture method of a rolled copper foil comprises:The operation of the ingot casting of casting copper;The ingot casting of copper is carried out the operation of hot rolling;To hot rolling the ingot casting of the copper operation of carrying out the cold rolling and annealing more than 1 time; AndCarry out be used to the last cold rolling operation of making finished product thickness take total degree of finish (final rolling degree of finish) as the mode more than 96%.
- 17. manufacture method according to claim 16, to hot rolling the ingot casting of copper carry out in the operation of the cold rolling and annealing more than 1 time,The annealing of carrying out is at last carried out with the heat-up rate below 40 ℃/second more than 5 ℃/second.
- 18. manufacture method according to claim 16, to hot rolling the ingot casting of copper carry out in the operation of the cold rolling and annealing more than 1 time,The cold rolling degree of finish (total degree of finish) with 60% ~ 90% that slightly before carries out of the annealing of carrying out at last carries out.
- 19. manufacture method according to claim 16, the ingot casting of copper are to contain copper and can not keep away impurity and the ingot casting of the copper that forms.
- 20. manufacture method according to claim 16, the ingot casting of copper be contain copper and can not keep away impurity, also with the element more than a kind that adds up to 20 ~ 500 quality ppm to contain from the group that is consisted of by Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V, to select and the ingot casting of the copper that forms.
- 21. manufacture method according to claim 16, the ingot casting of copper are the ingot castings of the copper that is made of oxygen free copper or tough pitch copper.
- 22. manufacture method according to claim 16, the ingot casting of copper are also with the element more than a kind that adds up to 20 ~ 500 quality ppm to be added with to select from the group that is made of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, B and V and the ingot casting of the copper that forms outside oxygen free copper or tough pitch copper.
- 23. one kind intermittence crooked tolerance Copper Foil manufacture method, comprise: to the rolled copper foil made by the described manufacture method of each of claim 16 ~ 22 with 160 ~ 400 ℃ of operations of carrying out the heat treated of 1 second ~ 1 hour.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012089363 | 2012-04-10 | ||
| JP2012-089363 | 2012-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103361509A true CN103361509A (en) | 2013-10-23 |
| CN103361509B CN103361509B (en) | 2015-10-28 |
Family
ID=49363761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310122528.1A Active CN103361509B (en) | 2012-04-10 | 2013-04-10 | Rolled copper foil, copper-clad laminated board, flexible printing wiring board and manufacture method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP5826160B2 (en) |
| KR (1) | KR20130115140A (en) |
| CN (1) | CN103361509B (en) |
| TW (1) | TWI491325B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011525A (en) * | 2015-03-30 | 2016-10-12 | Ｊｘ金属株式会社 | Copper alloy foil for flexible printed wiring board, copper-clad laminate using same, flexible printed wiring board and electronic device |
| CN106304689A (en) * | 2015-06-05 | 2017-01-04 | Jx日矿日石金属株式会社 | Rolled copper foil, copper-clad laminated board and flexible printed board and electronic equipment |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5826160B2 (en) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | Rolled copper foil, copper-clad laminate, flexible printed wiring board and manufacturing method thereof |
| KR101721314B1 (en) * | 2015-05-21 | 2017-03-29 | 제이엑스금속주식회사 | Rolled copper foil, copper clad laminate, and flexible printed board and electronic device |
| JP7016605B2 (en) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | Laminated body for touch panel and foldable image display device |
| JP6578780B2 (en) * | 2015-07-17 | 2019-09-25 | 大日本印刷株式会社 | Laminate for touch panel and foldable image display device |
| JP7016602B2 (en) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | Hard-coated film for touch panels and foldable image display device |
| TWI702415B (en) | 2015-07-17 | 2020-08-21 | 日商大日本印刷股份有限公司 | Laminated body for optical component and image display device |
| JP7016603B2 (en) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | Hard-coated film for touch panels and foldable image display device |
| JP7016604B2 (en) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | Laminated body for touch panel, foldable image display device |
| JP6294376B2 (en) * | 2016-02-05 | 2018-03-14 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| JP6392268B2 (en) * | 2016-02-05 | 2018-09-19 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| JP6328679B2 (en) * | 2016-03-28 | 2018-05-23 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| JP6617313B2 (en) * | 2017-08-03 | 2019-12-11 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| JP6774457B2 (en) * | 2018-05-16 | 2020-10-21 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices |
| JP6827022B2 (en) * | 2018-10-03 | 2021-02-10 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices |
| JP7212700B2 (en) * | 2018-12-28 | 2023-01-25 | デンカ株式会社 | CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND CERAMIC-COPPER COMPOSITE MANUFACTURING METHOD |
| KR20220068985A (en) * | 2019-09-27 | 2022-05-26 | 미쓰비시 마테리알 가부시키가이샤 | pure copper plate |
| JP7238869B2 (en) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | Laminate for touch panel, foldable image display device |
| JP7238871B2 (en) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | HARD COAT FILM FOR TOUCH PANEL AND FOLDABLE IMAGE DISPLAY DEVICE |
| JP7238870B2 (en) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | LAMINATED BODY FOR TOUCH PANEL AND FOLDABLE IMAGE DISPLAY DEVICE |
| JP7238872B2 (en) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | HARD COAT FILM FOR TOUCH PANEL AND FOLDABLE IMAGE DISPLAY DEVICE |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1237489A (en) * | 1998-03-31 | 1999-12-08 | 日矿金属株式会社 | Rolled copper foil and method of manufacturing the same |
| CN101932194A (en) * | 2009-06-22 | 2010-12-29 | 日立电线株式会社 | Rolled copper foil |
| WO2011052556A1 (en) * | 2009-10-30 | 2011-05-05 | Jx日鉱日石金属株式会社 | Copper or copper-alloy foil and method of manufacturing double-sided copper-clad laminate using same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100792653B1 (en) * | 2005-07-15 | 2008-01-09 | 닛코킨조쿠 가부시키가이샤 | Copper alloy for electronic and electric machinery and tools, and manufacturing method thereof |
| JP4916206B2 (en) * | 2006-03-31 | 2012-04-11 | Ｊｘ日鉱日石金属株式会社 | Cu-Cr-Si alloy and Cu-Cr-Si alloy foil for electric and electronic parts |
| JP5057932B2 (en) * | 2007-10-31 | 2012-10-24 | Ｊｘ日鉱日石金属株式会社 | Rolled copper foil and flexible printed wiring board |
| JP4972115B2 (en) * | 2009-03-27 | 2012-07-11 | Ｊｘ日鉱日石金属株式会社 | Rolled copper foil |
| JP5094834B2 (en) * | 2009-12-28 | 2012-12-12 | Ｊｘ日鉱日石金属株式会社 | Copper foil manufacturing method, copper foil and copper clad laminate |
| CN103080347A (en) * | 2010-08-27 | 2013-05-01 | 古河电气工业株式会社 | Copper alloy sheet and method for producing same |
| JP5261582B2 (en) * | 2010-08-31 | 2013-08-14 | 古河電気工業株式会社 | Copper alloy sheet and manufacturing method thereof |
| JP5826160B2 (en) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | Rolled copper foil, copper-clad laminate, flexible printed wiring board and manufacturing method thereof |
-
2012
- 2012-12-27 JP JP2012286124A patent/JP5826160B2/en active Active
-
2013
- 2013-01-30 TW TW102103460A patent/TWI491325B/en active
- 2013-04-05 KR KR1020130037696A patent/KR20130115140A/en not_active Application Discontinuation
- 2013-04-10 CN CN201310122528.1A patent/CN103361509B/en active Active
-
2014
- 2014-10-28 JP JP2014219690A patent/JP2015061950A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1237489A (en) * | 1998-03-31 | 1999-12-08 | 日矿金属株式会社 | Rolled copper foil and method of manufacturing the same |
| CN101932194A (en) * | 2009-06-22 | 2010-12-29 | 日立电线株式会社 | Rolled copper foil |
| WO2011052556A1 (en) * | 2009-10-30 | 2011-05-05 | Jx日鉱日石金属株式会社 | Copper or copper-alloy foil and method of manufacturing double-sided copper-clad laminate using same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011525A (en) * | 2015-03-30 | 2016-10-12 | Ｊｘ金属株式会社 | Copper alloy foil for flexible printed wiring board, copper-clad laminate using same, flexible printed wiring board and electronic device |
| CN106304689A (en) * | 2015-06-05 | 2017-01-04 | Jx日矿日石金属株式会社 | Rolled copper foil, copper-clad laminated board and flexible printed board and electronic equipment |
| CN111526674A (en) * | 2015-06-05 | 2020-08-11 | Jx日矿日石金属株式会社 | Rolled copper foil, copper-clad laminate, flexible printed board, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103361509B (en) | 2015-10-28 |
| JP5826160B2 (en) | 2015-12-02 |
| TWI491325B (en) | 2015-07-01 |
| JP2013234383A (en) | 2013-11-21 |
| TW201343014A (en) | 2013-10-16 |
| KR20130115140A (en) | 2013-10-21 |
| JP2015061950A (en) | 2015-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103361509B (en) | Rolled copper foil, copper-clad laminated board, flexible printing wiring board and manufacture method thereof | |
| KR101632515B1 (en) | Rolled copper foil | |
| WO2012128099A1 (en) | Copper foil and copper-clad laminate obtained using same | |
| KR102098479B1 (en) | Copper foil for flexible printed circuit, copper clad laminate using the same, flexible printed circuit and electronic device | |
| TWI582248B (en) | Oriented copper plate, copper clad laminate, flexible circuit substrate and electronic equipment | |
| JP6663712B2 (en) | Rolled copper foil, copper-clad laminate using the same, flexible printed circuit board, and electronic device | |
| JP6643287B2 (en) | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device | |
| JP6348621B1 (en) | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device | |
| JP5865759B2 (en) | Copper foil, copper-clad laminate, flexible circuit board, and method for producing copper-clad laminate | |
| CN103766010A (en) | Copper foil for flexible printed wiring board, copper-clad laminate, flexible printed wiring board and electronic device | |
| JP2008038170A (en) | Rolled copper foil | |
| JP4749780B2 (en) | Copper alloy rolled foil | |
| JP2001144391A (en) | Rolled copper foil for printed circuit board and manufacturing method therefor | |
| JP6774457B2 (en) | Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices | |
| US20110311836A1 (en) | Rolled copper foil | |
| JP6647253B2 (en) | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device | |
| JP6712561B2 (en) | Rolled copper foil for flexible printed circuit board, copper clad laminate using the same, flexible printed circuit board, and electronic device | |
| JP2000192172A (en) | Rolled copper foil flexible printed circuit board and its production | |
| JP2010121154A (en) | Method for producing rolled copper foil and rolled copper foil | |
| JP2008038169A (en) | Rolled copper foil | |
| JP2001168480A (en) | Flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |