CN103346145B - A kind of flexible substrate package structure - Google Patents
A kind of flexible substrate package structure Download PDFInfo
- Publication number
- CN103346145B CN103346145B CN201310313613.6A CN201310313613A CN103346145B CN 103346145 B CN103346145 B CN 103346145B CN 201310313613 A CN201310313613 A CN 201310313613A CN 103346145 B CN103346145 B CN 103346145B
- Authority
- CN
- China
- Prior art keywords
- encapsulation unit
- flexible
- encapsulated
- resin
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of flexible substrate package structure, comprise flexible base, board plate and somely establish encapsulation unit on flexible substrates by resin-encapsulated structure, described encapsulation unit draws flexible connection line.Make encapsulation unit and extraneous connecting line can high density interconnect.Solve in prior art, after having encapsulated, then pick out connecting line, easily produce electromagnetic interference, be difficult to the technical problem of high-density wiring.The present invention is applicable to Electronic Packaging field.
Description
[technical field]
The present invention relates to a kind of flexible substrate package structure.
[background technology]
In current Electronic Packaging engineering, there is the implementation method that multiple electronics resins encapsulates.Such as popular at present DIP (dual in-line package, DualIn-linePackage), SOP (little outline packages, SmallOut-LinePackage), (Quad Flat formula encapsulates QFP, PlasticQuadFlatPackage), (ball-like pins grid array seals BGA, BallGridArray), CSP (wafer-level package, ChipScalePackage), MCM (multi-chip module encapsulation multi-chipmodule), SIP (system in package, SystemInaPackage), SOP encapsulation etc. that latest developments are got up.Especially MCM and SIP encapsulation is suitable for high-speed figure and high frequency analog circuits, has been widely used in the various system regions of communication, radar, navigation and household electrical appliances.Especially MCM encapsulation integrated circuit bare chip and other minisize component interconnected set is contained in same is high to be conspired on high-rise substrate, and be encapsulated in same resin or shell and form multiple functional reliable in quality, standalone feature, the electronic building brick that flexibly connects.MCM realizes that electronics miniaturized lightweight high speed is highly reliable, the integrated indispensable key technology of low cost circuit.
But MCM and SIP encapsulation is at present for many employings ceramic substrate during high frequency.Adopt ceramic substrate to be packaged with the feature that frequency is high, high temperature is not yielding, performance is good, but adopt on the other hand that the cost of ceramic substrate encapsulation is high, complex manufacturing technology, processing is more complicated.Organic substrate, flexible base, board and organic-inorganic material have had significant progress in conjunction with the performance such as high frequency characteristics of composite base plate in recent years, in prior art, often after sensor package completes, then pick out connecting line, easily produce electromagnetic interference, be difficult to high-density wiring.
[summary of the invention]
Problem to be solved by this invention is just to provide integrated a kind of flexible substrate package structure of encapsulation unit and flexible lead wire.
For solving the problems of the technologies described above, the present invention adopts following technical scheme, a kind of flexible substrate package structure, comprise flexible base, board and somely arrange encapsulation unit on flexible substrates separately through resin-encapsulated construction packages, described encapsulation unit draws flexible connection line.
Further, gap is provided with between described encapsulation unit.
Further, described gap is 5mm-10mm.
Further, the corresponding interstitial site place of described flexible base, board is non-metallic layer.
Further, described encapsulation unit is multi-chip module encapsulation unit.
Further, described flexible base, board is multilayer flexible substrate.
Further, described resin-encapsulated structure is encapsulated by die package, drip irrigation or is adsorbed encapsulation and formed.
Beneficial effect of the present invention:
Flexible substrate package structure of the present invention, described encapsulation unit draws flexible connection line.Make encapsulation unit and extraneous connecting line can high density interconnect.These features of the present invention and advantage will embodiment below, exposure detailed in accompanying drawing.
[accompanying drawing explanation]
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is a kind of flexible substrate package structural representation of the present invention;
Fig. 2 is the cutaway view in Fig. 1;
Fig. 3 is that resin-encapsulated structure forms schematic diagram by die package;
Fig. 4 is that resin-encapsulated structure forms schematic diagram by drip irrigation encapsulation;
Fig. 5 is that resin-encapsulated structure forms schematic diagram by adsorbing encapsulation.
[embodiment]
The invention provides a kind of flexible substrate package structure, comprise flexible base, board and somely establish encapsulation unit on flexible substrates by resin-encapsulated structure, described encapsulation unit draws flexible connection line.The junction of connecting line and encapsulation unit is encapsulated in resin, is not easy to produce electromagnetic interference, can high-density wiring, and encapsulation unit and extraneous connecting line can be interconnected by high density flexible.
The technical scheme of accompanying drawing to the embodiment of the present invention below in conjunction with the embodiment of the present invention is explained and illustrated, but following embodiment is only the preferred embodiments of the present invention, and not all.Based on the embodiment in execution mode, those skilled in the art under the prerequisite not making creative work obtain other embodiments, all belong to protection scope of the present invention.
Embodiment one:
As shown in Figure 1 to Figure 2, for a kind of flexible substrate package structure of the present invention, comprise flexible base, board 1 plate and somely establish encapsulation unit 2 on flexible substrates by resin-encapsulated structure, described flexible base, board is multilayer flexible substrate, namely flexible base, board 1 is metal and macromolecular material, utilizes the sandwich construction that the technology such as thick film, film is made.Described encapsulation unit 2 draws flexible connection line 4.Concrete, multiple encapsulation unit 2 is carried out insulation package by full wafer flexible base, board 1, and namely each encapsulation unit 2 is carried out injected resin encapsulation separately.
Gap d is provided with, 5mm≤d≤10mm between described encapsulation unit 2.Flexible base, board hot thermal coefficient of expansion is in the X, Y, Z direction different from the thermal coefficient of expansion of resin in X, Y, Z axis, and large-area flexible base, board 1 easily Local Cracking and stripping occurs with encapsulation unit 2.When this programme encapsulates encapsulation unit 2, interval 3 is provided with between encapsulation unit 2, interval 3 is of a size of d, the corresponding gap d place of described flexible base, board 1 is non-metallic layer, i.e. the existence in the flexible material of the flexible base, board 1 at interval d (in Fig. 2 region 5) place or containing metal material on flexible material.Ensure that in interval 3 place encapsulation process, the flexible degree of freedom is large.When resin injection high-temperature molding, the absolute displacement of the flexible base, board 1 of potting resin and different heat expansion coefficient just becomes less, and single package unit 2 displacement stress on flexible base, board 1 is less than adhesion strength.After high-temperature heating is shaping, the resin-encapsulated structure of encapsulation unit 2 and the flexible base, board 1 of different heat expansion coefficient can not be peeled off, and can closely combine.
As can be seen from Fig. 1 and Fig. 2, after high-temperature heating is shaping, in figure, full wafer flexible base, board 1 occurs bending, departs from horizontal line A3-A4.By experiment and calculate, 1 keep being provided with interval 3 between each encapsulation unit 2 consciously on entire substrate, interval 3 is of a size of d, and the corresponding interstitial site d place of described flexible base, board 1 be non-metallic layer, and the degree of freedom of stretching in guarantee encapsulation process is large.Encapsulation unit 2 is multi-chip module encapsulation unit, namely can be the combination of multiple packed device in described encapsulation unit 2.
Be embodied as example with MCM encapsulation on flexible organic media substrate, we adopt the high frequency flexible substrate material generally adopted at present in mobile phone.The IC peripheral components implementing the composition such as IC nude film and surface-mount resistor, electric capacity, inductance is on a flexible substrate 1 encapsulated in a unit.Organic flexible substrate at thermal coefficient of expansion (CTE, the Coefficientexpansion) representative value of X, Y-direction about at about 30 ~ 95ppm/ DEG C.But lower will expand as 55 ~ 110ppm/ DEG C in Z-direction (vertical direction) unconstrained.Epoxy resin X, Y, Z tri-the unconstrained lower thermal coefficient of expansion in direction be about 70ppm/ DEG C.Due to the existence of certain spacing distance d, when resin injection high-temperature molding, the absolute displacement of the resin of encapsulation unit 2 and the substrate of different heat expansion coefficient just becomes less, and displacement stress is less than adhesion strength.Encapsulation unit 2, after high-temperature heating is shaping, can not to ftracture, peeling, and the resin-encapsulated structure of encapsulation unit 2 is closely combined with flexible base, board 1.
As shown in Figures 3 to 5, be respectively encapsulation unit 2 to be formed by die package, drip irrigation encapsulation or absorption encapsulation.
The present invention can be used as and a kind ofly can be suitable for extensive, low cost, raising rate of finished products a kind of flexible substrate package structure, at complication system electromechanical structure, especially passes and can be widely used in sensor application aspect.
By above-described embodiment, object of the present invention is reached by fully effective.The personage being familiar with this skill should be understood that and the present invention includes but the content being not limited to accompanying drawing and describing in embodiment above.Any amendment not departing from function and structure principle of the present invention all will comprise within the scope of the appended claims.
Claims (1)
1. a flexible substrate package structure, comprises flexible base, board and somely arranges encapsulation unit on flexible substrates separately through resin-encapsulated construction packages, it is characterized in that: described encapsulation unit draws flexible connection line; Be provided with gap between described encapsulation unit, the junction of connecting line and encapsulation unit is encapsulated in resin; Described gap is 5mm-10mm; The corresponding interstitial site place of described flexible base, board is non-metallic layer; Described encapsulation unit is multi-chip module encapsulation unit; Described flexible base, board is multilayer flexible substrate; Described resin-encapsulated structure is encapsulated by die package, drip irrigation or absorption encapsulation is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310313613.6A CN103346145B (en) | 2013-07-23 | 2013-07-23 | A kind of flexible substrate package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310313613.6A CN103346145B (en) | 2013-07-23 | 2013-07-23 | A kind of flexible substrate package structure |
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| Publication Number | Publication Date |
|---|---|
| CN103346145A CN103346145A (en) | 2013-10-09 |
| CN103346145B true CN103346145B (en) | 2016-01-27 |
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|---|---|---|---|
| CN201310313613.6A Expired - Fee Related CN103346145B (en) | 2013-07-23 | 2013-07-23 | A kind of flexible substrate package structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3083590A1 (en) * | 2018-07-09 | 2020-01-10 | Linxens Holding | FLEXIBLE LIGHT DEVICE |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6084294A (en) * | 1998-08-26 | 2000-07-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device comprising stacked semiconductor elements |
| CN201259194Y (en) * | 2008-10-08 | 2009-06-17 | 史杰 | LED packaged illumination circuit board of high thermal conductivity |
| CN203351591U (en) * | 2013-07-23 | 2013-12-18 | 长兴芯亿微电子科技有限公司 | Flexible substrate packaging structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2755508A1 (en) * | 2009-03-17 | 2010-09-23 | Koninklijke Philips Electronics N.V. | Led strip for small channel letters |
-
2013
- 2013-07-23 CN CN201310313613.6A patent/CN103346145B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6084294A (en) * | 1998-08-26 | 2000-07-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device comprising stacked semiconductor elements |
| CN201259194Y (en) * | 2008-10-08 | 2009-06-17 | 史杰 | LED packaged illumination circuit board of high thermal conductivity |
| CN203351591U (en) * | 2013-07-23 | 2013-12-18 | 长兴芯亿微电子科技有限公司 | Flexible substrate packaging structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3083590A1 (en) * | 2018-07-09 | 2020-01-10 | Linxens Holding | FLEXIBLE LIGHT DEVICE |
| WO2020012117A1 (en) * | 2018-07-09 | 2020-01-16 | Linxens Holding | Flexible luminous device |
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| Publication number | Publication date |
|---|---|
| CN103346145A (en) | 2013-10-09 |
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Effective date of registration: 20160304 Address after: Tianning District Hehai road 213000 Jiangsu city of Changzhou province No. 9 Patentee after: CHANGZHOU RODEK ELECTRONIC TECHNOLOGY CO., LTD. Address before: 313100 processing and packing area No. 3, Changxin comprehensive logistics park, Huzhou, Zhejiang, Changxing County Patentee before: Changxing Xinyi Microelectronic Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 Termination date: 20170723 |
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| CF01 | Termination of patent right due to non-payment of annual fee |