CN103342335A - System and method for aerating and plugging alkali metal steam chamber of mini type CPT atomic clock - Google Patents
System and method for aerating and plugging alkali metal steam chamber of mini type CPT atomic clock Download PDFInfo
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- CN103342335A CN103342335A CN2013102504696A CN201310250469A CN103342335A CN 103342335 A CN103342335 A CN 103342335A CN 2013102504696 A CN2013102504696 A CN 2013102504696A CN 201310250469 A CN201310250469 A CN 201310250469A CN 103342335 A CN103342335 A CN 103342335A
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Abstract
The invention relates to a system and a method for aerating and plugging an alkali metal steam chamber of a mini type CPT atomic clock. The system mainly comprises a buffer gas storing bottle, an alkali metal steam gas storing bottle, a vacuum chamber, an MEMS (micro-electromechanical systems) wafer supporting table, a vacuum pump and a laser plugging device. A manufacture method of an MEMS wafer of the alkali metal steam chamber comprises the following steps of: manufacturing an on-silicon alkali metal steam chamber on a silicon wafer, simultaneously forming an in-silicon vent groove in the silicon wafer by means of dry etching or wet etching, forming in-glass aerating holes in a glass material by means of mechanical holing or laser holing and the like, manufacturing on-glass aerating micro-channels on the glass material by means of the wet etching, and manufacturing the alkali metal steam chamber of the mini type CPT atomic clock by means of anodic bonding. The CO2 laser beam penetrates through an optical window of a vacuum chamber to melt alkali metal steam chamber chips on the MEMS wafer one by one to plug the glass aerating holes or aerating micro-channels. According to the system and the method provided by the invention, the alkali metal steam chamber of the mini type CPT atomic clock has the advantages that the alkali metal steam chamber is simply operated, impurities are hardly introduced, the alkali metal steam chamber is conveniently manufactured in batches, and the like.
Description
Technical field
The present invention relates to miniature CPT atomic clock field, be specifically related to inflation and method for blocking and the system in miniature CPT atomic clock vapour of an alkali metal chamber.
Background technology
Atomic clock is the most accurate current timing tool, at aspects such as astronomy, Aero-Space, satellite navigation location, punctual time service and physicses important function is arranged.Yet because its huge volume and fancy price have limited further expanding of its range of application, the microminiaturization of atomic clock will be expanded its range of application greatly, to produce far-reaching influence to fields such as communication, electronics, Aeronautics and Astronautics, national defence, and the installation atomic clock will make also measurement more accurately reliable in various measuring instruments.The tradition atomic clock is owing to the existence of microwave cavity causes volume to be difficult to further reduce, the coherent layout number imprison (CPT that found in 1976, Coherent Population Trapping) principle brings hope for the microminiaturization of atomic clock, owing to no longer containing microwave cavity in the CPT atomic clock system and become the main object of atomic clock microminiaturization, the CPT atomic clock also is uniquely on the principle at present to realize microminiaturized atomic clock.
The core component of chip-scale atomic clock just provides the vapour of an alkali metal chamber of hunting of frequency benchmark, and producing the vapour of an alkali metal chamber that volume is little, reliability is high is the key that realizes the work of chip-scale atomic clock.At present, the main preparation method in atomic clock vapour of an alkali metal chamber has glass blowing method, in-situ chemical reaction method, paraffin pack, light decomposition method etc.Wherein glass blowing method is the main preparation method in traditional atomic clock vapour of an alkali metal chamber, and volume is very big and be difficult to produce the vapour of an alkali metal chamber that volume further reduces, thereby unfavorable and realize that the microminiaturization of vapor chamber and mass make.The preparation method in current chip atomic clock vapour of an alkali metal chamber mainly is in-situ reaction.
The existing method of utilizing the in-situ reaction legal system to do atomic clock vapour of an alkali metal chamber mainly is to utilize chemical reaction to generate the alkali metal legal system to do the vapour of an alkali metal chamber now, this method is to utilize the mixture of the compound that has mixed up in proportion at vapor chamber the inside good seal, generate needed alkali metal by heating then, basic process is shown in accompanying drawing 6a-6d, at first with twin polishing silicon chip 61 after photoetching, produce a square through hole with KOH corrosion or deep reaction ion etching, then itself and Pyrex7740 sheet glass 62 bondings are obtained semi-finished product; RbCl salt 65 is added to contains BaN
6Be in 15% the aqueous solution, to form colourless liquid 64, with micro pipette 63 liquid dripped in half-finished areola then, semi-finished product are put in the bonding machine that has heater, at the UHV(ultrahigh vacuum) carry out bonding under the environment, in the bonding process, RbCl and BaN
6Because heating, reacting generates BaCl
2With required Rb element 66, total reaction is as follows:
Extract the N that generates again
2, instead finish bonding after filling required buffer gas, thereby make the vapour of an alkali metal chamber that obtains sealing.This method has following several shortcoming:
(1) because alkali metal simple substance has very active chemical property, very easily oxidized, so this method needs high vacuum environment or anaerobic environment, this antianode bonding machine has high requirement.
(2) disadvantage that obtains alkali metal by chemical reaction in the cavity is that impurity such as barium, chloride are contained in the vapor chamber the inside, the existence of impurity can stop that thereby light path influences signal strength signal intensity, the collision of alkali metal atom and impurity simultaneously may influence the energy level of alkali metal atom, thereby causes frequency drift.
(3) this kind method requires highly to operation, need operate in glove box, need draw compound solution with micro pipette, and drop in the very little cavity, and operation easier is very big.
(4) because each chip must be hand-manipulated, so can only singlely make, be difficult for carrying out mass making etc.
Paraffin pack and light decomposition method are the manufacture crafts that laboratory stage proposes.The paraffin pack is to form the wax bag among at first with MEMS technology alkali metal atom being wrapped in paraffin, producing one side with wet etching and anode linkage technology then is that glass simultaneously is the Si chamber of SiN rete, the wax bag is sticked to below the SiN rete, seeing through the glass irradiation with laser melts the decomposition of SiN rete, the wax portion of wrapping, evaporation enters in the Si chamber on the alkali metal atom thereby laser has shone directly into, the paraffin that the another side in Si chamber is not melted seals, and forms the alkali metal atom chamber of a sealing.This method exist complex manufacturing technology, paraffin sealing poor, be difficult for shortcomings such as mass making; The light decomposition method is at first to etch the Si hole array that penetrates at two-sided precise polished silicon chip, carries out anode linkage and forms semi-finished product, deposits cesium azide (CsN at semi-finished product then
3) film, under ultra-high vacuum environment, carry out second bonding, make CsN by the ultraviolet ray irradiation at last
3Be decomposed into caesium (Cs) simple substance and nitrogen (N
2), scribing obtains the vapour of an alkali metal chamber of good seal.The technology of light decomposition method all is wafer level technology, be very easy to realize the mass making, but there is the deposition CsN that needs exploitation special-purpose in this method
3The equipment of film, and buffer gas can only be generally higher for nitrogen and nitrogen pressure, thus make the CPT live width broadening of the chip-scale atomic clock that this vapour of an alkali metal chamber makes, and single buffer gas also makes chip frequency stability of atomic clock variation.
Summary of the invention
Thereby the present invention is directed to environmental requirement height in the preparation method of current atom clock vapour of an alkali metal chamber, introduce impurity and cause frequency drift, complicated operation, be difficult for problem such as mass making, proposed inflation and method for blocking and the system in a kind of miniature CPT atomic clock vapour of an alkali metal chamber, can make the making in atomic clock vapour of an alkali metal chamber overcome the problems referred to above.
In order to achieve the above object, the present invention adopts following technical scheme: inflation and the plugging system in a kind of miniature CPT atomic clock vapour of an alkali metal chamber, and this system comprises the primary heater that is positioned on the workbench;
Be positioned over the vacuum chamber on the described primary heater;
Described vacuum chamber top is provided with for the optical window that sees through laser beam;
Described vacuum chamber one end is provided with first valve, and the other end of described first valve is communicated with the buffer gas gas bomb that is provided with the 3rd valve, the vapour of an alkali metal gas bomb that is provided with second valve and first vacuum meter successively by stainless steel pipes; Described vapour of an alkali metal gas bomb below is provided with secondary heater;
The described vacuum chamber other end is provided with the 4th valve, and the other end of described the 4th valve is communicated with vavuum pump and second vacuum meter successively by stainless steel pipes;
Described vacuum chamber is interior, the optical window below is provided with the heat that comprises stationary fixture and isolates platform for placing vapour of an alkali metal chamber MEMS disk; Described vapour of an alkali metal chamber MEMS disk comprises some vapour of an alkali metal cavity chips.
The present invention also provides a kind of inflation in miniature CPT atomic clock vapour of an alkali metal chamber and method of shutoff of realizing, this method may further comprise the steps:
At first open vacuum chamber, put into vapour of an alkali metal chamber MEMS disk, and by stationary fixture with MEMS disk fixed-site, described second, third valve is closed condition, open described the first, the 4th valve, and open primary heater and the vavuum pump of vacuum chamber below, be pumped into low vacuum with fore pump earlier, again with the higher vacuum of back level pump degree of being evacuated; When treating the numerical value basically identical that two vacuum meters show and reaching desirable value, close vavuum pump, open the secondary heater and the heating tape that is enclosed within on the stainless steel pipes of vapour of an alkali metal gas bomb below, open described second, third valve more simultaneously, vapour of an alkali metal and buffer gas are arrived in the vapour of an alkali metal chamber MEMS disk of vacuum chamber, kept a period of time in buffer gas and vapour of an alkali metal fully fill into several vapour of an alkali metal cavity chips in the MEMS disk of vapour of an alkali metal chamber; Close all valves then, begin to shine described vapour of an alkali metal cavity chip respectively with the CO2 laser beam, make its melting sealed realization shutoff, after shutoff finishes, open described the first, the 4th valve, unlatching primary heater and vavuum pump extract totally reaching vapour of an alkali metal chamber MEMS disk surfaces however, residual base metallic vapour in the vacuum chamber, thereby obtain the vapour of an alkali metal chamber of miniature CPT atomic clock level Hermetic Package.
As can be seen from the above technical solutions, the present invention can make the making in atomic clock vapour of an alkali metal chamber compare with existing preparation method, has the following advantages:
(1) be difficult for to introduce impurity and cause frequency drift in the atomic clock vapour of an alkali metal chamber.Owing to need in vapor chamber, the method by reaction not obtain alkali metal, the vapour of an alkali metal that comes out at the vapour of an alkali metal storage device is very pure alkali metal simple substance steam, thereby in vapor chamber, be difficult for to introduce impurity, the frequency drift phenomenon that causes owing to impurity and buffer gas consumption can not appear.
(2) the method to operation require relatively low, only need be according to the switch of the indication operated valve of flowmeter and vacuum meter, CO computerizeds control
2The fusion shutoff process of laser instrument need be in glove box be dripped the highly difficult operations such as the aqueous solution of compound in the little cavity with micro pipette, does not also need to develop complicated special equipment simultaneously.
(3) the method can be carried out the mass making, can reduce cost of manufacture greatly, also has very high reliability simultaneously.
Description of drawings
Fig. 1 is the inflation of the miniature CPT atomic clock of the present invention vapour of an alkali metal chamber and plugging system schematic diagram.
Fig. 2 a-2b is the miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of the two-layer bonding structure of air-filled pore for filling channel of the present invention.
Fig. 3 a-3b is the miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of filling channel of the present invention for the two-layer bonding structure of inflation microchannel.
Fig. 4 a-4b is the miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of three layers of bonding structure of air-filled pore for filling channel of the present invention.
Fig. 5 a-5b is the miniature CPT atomic clock vapour of an alkali metal cavity chip cell schematics of filling channel of the present invention for three layers of bonding structure of inflation microchannel.
Fig. 6 a-6d is based on the atomic clock vapour of an alkali metal chamber preparation method schematic diagram of in-situ reaction in the prior art.
Number in the figure:
1 buffer gas gas bomb, 2 vapour of an alkali metal gas bombs
5 stainless steel pipes, 6 first, second vacuum meters
7 optical windows, 8 vacuum chambers
9 stationary fixtures, 10 vapour of an alkali metal chamber MEMS disks
11 heat are isolated platform 12 workbench
13 vavuum pumps, 14 CO
2Laser beam
31 secondary heaters, 32 primary heaters
41 the 3rd valves, 42 second valves
43 first valves 44 the 4th valve
26 silicon oxide layers, 21 air channels
22 vapour of an alkali metal chambeies, 23 air-filled pores
24 inflation microchannels, 25 laser irradiation area signs
61 twin polishing silicon chips, 62 Pyrex, 7740 sheet glass
63 micro pipettes, 64 RbCl and BaN
6The aqueous solution
The BaCl that 66 reactions of 65 alkali metals generate
2Deng impurity
The specific embodiment
Below in conjunction with accompanying drawing, by specific embodiment certain applications of the present invention are described, further set forth substantive distinguishing features of the present invention and progressive significantly, but the present invention only limits to the description of embodiment absolutely not.
See also shown in Figure 1, inflation and the plugging system in a kind of miniature CPT atomic clock vapour of an alkali metal chamber, this system comprises the primary heater 32 that is arranged on the workbench 12; Be positioned over the vacuum chamber 8 on the described primary heater 32; Described vacuum chamber 8 tops are provided with for seeing through CO
2The optical window 7 of laser beam 14; Described vacuum chamber 8 one ends are provided with first valve 43, and the other end of described first valve 43 is communicated with the buffer gas gas bomb 1 that is provided with the 3rd valve 41, the vapour of an alkali metal gas bomb 2 that is provided with second valve 42 and first vacuum meter 6 successively by stainless steel pipes 5; Described vapour of an alkali metal gas bomb 2 belows are provided with secondary heater 31; Described vacuum chamber 8 other ends are provided with the 4th valve 44, and the other end of described the 4th valve 44 is communicated with vavuum pump 13 and second vacuum meter 6 successively by stainless steel pipes; In the described vacuum chamber 8, optical window 7 belows are provided with the heat that comprises stationary fixture 9 and isolate platform 11 and be used for placing vapour of an alkali metal chamber MEMS disk 10; Described vapour of an alkali metal chamber MEMS disk 10 comprises some vapour of an alkali metal cavity chips.
The material of described optical window 7 adopts the zinc selenide material.Described primary heater 32 is provided with the Temperature numerical display module.Described vavuum pump 13 comprise fore pump and with the back level pump of this fore pump cascade.Be with the heating tape above the described stainless steel pipes.
The present invention also provides a kind of inflation in miniature CPT atomic clock vapour of an alkali metal chamber and method of shutoff of realizing, this method may further comprise the steps: at first open vacuum chamber 8, put into vapour of an alkali metal chamber MEMS disk 10, and by stationary fixture with MEMS disk fixed-site, described second, third valve is closed condition, open described the first, the 4th valve, and open primary heater 32 and the vavuum pump 13 of vacuum chamber 8 belows, earlier be pumped into low vacuum with fore pump, again with the higher vacuum of back level pump degree of being evacuated; When treating the numerical value basically identical that two vacuum meters 6 show and reaching desirable value, close vavuum pump 13, open the secondary heater 31 and the heating tape that is enclosed within on the stainless steel pipes of vapour of an alkali metal gas bomb 2 belows, open described second, third valve more simultaneously, vapour of an alkali metal and buffer gas are arrived in the vapour of an alkali metal chamber MEMS disk 10 of vacuum chamber, kept a period of time in buffer gas and vapour of an alkali metal fully fill into several vapour of an alkali metal cavity chips in the MEMS disk of vapour of an alkali metal chamber; Close all valves then, begin to use CO
2Laser beam 14 shines described vapour of an alkali metal cavity chip respectively, make its melting sealed realization shutoff, after shutoff finishes, open described the first, the 4th valve, open primary heater 31 and vavuum pump 13, with in the vacuum chamber and vapour of an alkali metal chamber MEMS disk surfaces however, residual base metallic vapour extract totally, thereby obtain the vapour of an alkali metal chamber of miniature CPT atomic clock level Hermetic Package.
Shown in accompanying drawing 2a-2b, wherein 2a is the vertical view of 2b.The two-layer anode linkage structure of Si-Glass is adopted in atomic clock vapour of an alkali metal chamber, and lower floor is silicon chip, adopts common N-type＜100〉two-sided precise polished silicon chip, the upper strata is sheet glass, adopts Pyrex7740 glass, inflation and shutoff passage are air-filled pore 23 on glass.At first utilize wet etching to produce on the silicon vapour of an alkali metal chamber 22 on the air channel 21 and silicon at semiconductor silicon material, utilize methods such as mechanical punching or laser boring to produce the air-filled pore on glass 23 of vapour of an alkali metal then at glass material, air channel is made the very thin SiO of one deck on silicon corresponding under the air-filled pore
2Layer 26 carries out the Si-Glass anode linkage at last, makes the vapour of an alkali metal chamber obtain waiting the miniature CPT atomic clock inflating and seal.
Then the disk in miniature CPT atomic clock vapour of an alkali metal chamber is put into inflation and plugging system, inflation and plugging system are as shown in Figure 1, mainly comprise buffer gas gas bomb 1, vapour of an alkali metal gas bomb 2, vacuum chamber 8, vapour of an alkali metal chamber MEMS disk 10, parts such as vavuum pump 13 and laser plugging device 14, vapour of an alkali metal gas bomb 2 places on the heater 31, buffer gas gas bomb 1, vapour of an alkali metal gas bomb 2 connects valve 41 respectively, 42 its switches of control, the vacuum chamber upper end is optical window 7, two ends connect valve 43 respectively by stainless steel pipes 5,44 and vacuum meter 6, and vacuum chamber 8 places on the heater 32 that has the Temperature numerical demonstration, vavuum pump 13 parts adopt the two-level concatenation mode, fore pump is slightly taken out, be pumped into black vacuum, and then with the higher vacuum of back level pump degree of being evacuated, each several part links together by stainless steel pipes 5, be with the heating tape above the stainless steel pipes 5, that the laser plugging device adopts is CO
2Laser beam 14.
Inflation and shutoff process are at first opening vacuum chamber 8, put into vapour of an alkali metal chamber MEMS disk 10, and pass through stationary fixture 9 MEMS disk fixed-site is isolated on the platform 11 in heat, close gas bomb valve 41,42, open vacuum chamber valve 43,44, and open the heater 32 of vacuum chamber, open vavuum pump 13, earlier be pumped into low vacuum with fore pump, again with the higher vacuum of back level pump degree of being evacuated, and remove assorted gas in the MEMS disk, when treating the numerical value basically identical that two vacuum meters show and reaching desirable value, close vavuum pump 13, open the heater 31 and the heating tape that is enclosed within on the stainless steel pipes of vapour of an alkali metal gas bomb, open the valve 41 of two gas bombs more simultaneously, 42, buffer gas and vapour of an alkali metal are arrived in the vapour of an alkali metal chamber MEMS disk of vacuum chamber 8, kept a period of time, make buffer gas and vapour of an alkali metal fully fill into little chip unit in the MEMS disk, close all valves then, begin to use CO
2The glass pipe of the medium and small chip unit of laser beam 14 irradiation MEMS disks makes it melting sealed, accurately controls CO by computer then
2The position of laser beam 14, little chip on the disk is realized the lf shutoff one by one, after shutoff finishes, open vacuum chamber valve 43,44, open primary heater 31, unlatching vavuum pump 13 extracts totally reaching MEMS disk surfaces however, residual base metallic vapours in the vacuum chamber 8, thereby obtains the vapour of an alkali metal chamber of miniature CPT atomic clock air-tight packaging.
Embodiment 2
The disk in miniature CPT atomic clock vapour of an alkali metal chamber puts into inflation and plugging system is consistent with embodiment 1, difference is, in the present embodiment, the two-layer anode linkage structure of Si-Glass is adopted in atomic clock vapour of an alkali metal chamber, and lower floor is silicon chip, adopt common N-type＜100〉two-sided precise polished silicon chip, the upper strata is sheet glass, adopts Pyrex 7740 glass, and inflation and shutoff passage are little filling channel 24 on glass, shown in accompanying drawing 3a-3b, wherein 3a is the vertical view of 3b.At first utilize wet etching to produce on the silicon vapour of an alkali metal chamber 22 on the air channel 21 and silicon at semiconductor silicon material, utilize the air-filled pore on glass 23 of producing vapour of an alkali metal on glass of methods such as mechanical punching or laser boring correspondence directly over air channel on the silicon then at glass material, utilize wet etching to produce inflation on glass microchannel 24 at glass material, silicon corresponding below the inflation microchannel is made the very thin SiO of one deck
2Layer 26 carries out the Si-Glass anode linkage at last, makes the vapour of an alkali metal chamber obtain waiting the miniature CPT atomic clock inflating and seal.Inflate afterwards and the shutoff process, inflation and plugging system, inflation method for blocking that the vapour of an alkali metal cavity chip preparation method in the present embodiment is mentioned in embodiment 1 constitute embodiment 2.
Embodiment 3
The disk in miniature CPT atomic clock vapour of an alkali metal chamber puts into inflation and plugging system is consistent with embodiment 1, difference is, in the present embodiment, three layers of anode linkage structure of Glass-Si-Glass are adopted in atomic clock vapour of an alkali metal chamber, and the intermediate layer is silicon chip, adopt N-type＜100〉two-sided precise polished silicon chip, upper and lower layer is sheet glass, adopts Pyrex 7740 glass, and inflation and shutoff passage are air-filled pore 23 on glass, shown in accompanying drawing 4a-4b, wherein 4a is the vertical view of 4b.At first utilize wet etching to produce on the silicon vapour of an alkali metal chamber 22 on air channel 21 and the through silicon of corrosion at semiconductor silicon material, then glass is carried out anode linkage with the silicon chip back side, utilize methods such as mechanical punching or laser boring to produce the air-filled pore on glass 23 of vapour of an alkali metal then at glass material, air channel is made the very thin SiO of one deck on silicon corresponding under the air-filled pore
2Layer 26, the glass that will punch at last with before the Si-Glass bonding pad carry out the front anode linkage, making obtains waiting the vapour of an alkali metal chamber of the miniature CPT atomic clock inflating and seal.Inflate afterwards and the shutoff process, inflation and plugging system, inflation method for blocking that the vapour of an alkali metal cavity chip preparation method in the present embodiment is mentioned in embodiment 1 constitute embodiment 3.
Embodiment 4
The disk in miniature CPT atomic clock vapour of an alkali metal chamber puts into inflation and plugging system is consistent with embodiment 1, difference is, in the present embodiment, three layers of anode linkage structure of Glass-Si-Glass are adopted in atomic clock vapour of an alkali metal chamber, and the intermediate layer is silicon chip, adopt N-type＜100〉two-sided precise polished silicon chip, upper and lower layer is sheet glass, adopts Pyrex 7740 glass, and inflation and shutoff passage are little filling channel 24 on glass, shown in accompanying drawing 5a-5b, wherein 5a is the vertical view of 5b.At first utilize wet etching to produce on the silicon vapour of an alkali metal chamber 22 on the air channel 21 and silicon at semiconductor silicon material, then glass is carried out anode linkage with the silicon chip back side, utilize methods such as mechanical punching or laser boring at the air-filled pore on glass 23 of producing vapour of an alkali metal on glass then at glass material, utilize wet etching to produce inflation on glass microchannel 24 at glass material, silicon corresponding under filling channel 24 is made the very thin SiO of one deck
2Layer 26, the glass that will punch at last with before the Si-Glass bonding pad carry out the front anode linkage, making obtains waiting the vapour of an alkali metal chamber of the miniature CPT atomic clock inflating and seal.Inflate afterwards and the shutoff process, inflation and plugging system, inflation method for blocking that the vapour of an alkali metal cavity chip preparation method in the present embodiment is mentioned in embodiment 1 constitute embodiment 4.
As can be seen from the above technical solutions, the present invention can make the making in atomic clock vapour of an alkali metal chamber compare with existing preparation method, has the following advantages:
(4) be difficult for to introduce impurity and cause frequency drift in the atomic clock vapour of an alkali metal chamber.Owing to need in vapor chamber, the method by reaction not obtain alkali metal, the vapour of an alkali metal that comes out at the vapour of an alkali metal storage device is very pure alkali metal simple substance steam, thereby in vapor chamber, be difficult for introducing impurity, the frequency drift phenomenon that causes owing to buffer gas consumption can not appear.
(5) the method to operation require relatively low, only need be according to the switch of the indication operated valve of flowmeter and vacuum meter, CO computerizeds control
2The fusion shutoff process of laser instrument need be in glove box be dripped the highly difficult operations such as the aqueous solution of compound in the little cavity with micro pipette, does not also need to develop complicated special equipment simultaneously.
(6) the method can be carried out the mass making, can reduce cost of manufacture greatly, also has very high reliability simultaneously.
The inflation in vapour of an alkali metal chamber proposed by the invention and method for blocking and system are applicable to the mass manufacturing of miniature CPT atomic clock, but are not limited in this.Fields such as miniature atomic magnetometer of the present invention, miniature atomic gyroscope also have wide practical use.
The present invention can be used for the mass of miniature atomic magnetometer and make.Advantages such as that the high-sensitivity miniature atom magnetometer that utilization charges into the mm size magnitude that the vapour of an alkali metal chamber of vapour of an alkali metal and buffer gas makes has is highly sensitive, size is little, low in energy consumption.The CPT atom magnetometer is based on full photoresonance, and its magnetic probe does not need radio-frequency coil, thereby can make the very little raising of the size spatial resolution of magnetic probe in conjunction with the MEMS manufacture craft; According to the relation of CPT signal center frequency and magnetic field intensity, can be used for differentiating the faint variation in magnetic field.Scully etc. once foretold, utilized the magnetometer of this principle, and the limit resolution capability of its magnetic-field measurement can reach the 0.1fT level; Because the CPT magnetometer does not exist radio-frequency coil to produce the problem of extra magnetic noise, can make the measurement in external magnetic field more accurate simultaneously.
The present invention can be used for the mass of miniature atomic gyroscope and make.The miniature atomic gyroscope that utilizes the vapour of an alkali metal chamber to make, utilize the Sagnac effect in the similar optical gyroscope, in the atomic interferometer loop, atom is experienced Coriolis acceleration, the phase shift that the utilization rotation causes and the relation of rotary speed are extracted the speed of rotation, its precision and resolution ratio all are improved largely with respect to present gyro, are follow-on high accuracy gyroscopes.Make miniature atomic gyroscope based on the present invention and have precision height, little, low in energy consumption, the low all advantages of cost of volume, have a good application prospect.
Above-mentioned description to embodiment is can understand and apply the invention for ease of those skilled in the art.The person skilled in the art obviously can easily make various modifications to these embodiment, and needn't pass through performing creative labour being applied in the General Principle of this explanation among other embodiment.Therefore, the invention is not restricted to the embodiment here, those skilled in the art should be within protection scope of the present invention for improvement and modification that the present invention makes according to announcement of the present invention.
Claims (14)
1. inflation and the plugging system in a miniature CPT atomic clock vapour of an alkali metal chamber, it is characterized in that: this system comprises the primary heater that is positioned on the workbench;
Be positioned over the vacuum chamber on the described primary heater;
Described vacuum chamber top is provided with for the optical window that sees through laser beam;
Described vacuum chamber one end is provided with first valve, and the other end of described first valve is communicated with the buffer gas gas bomb that is provided with the 3rd valve, the vapour of an alkali metal gas bomb that is provided with second valve and first vacuum meter successively by stainless steel pipes; Described vapour of an alkali metal gas bomb below is provided with secondary heater;
The described vacuum chamber other end is provided with the 4th valve, and the other end of described the 4th valve is communicated with vavuum pump and second vacuum meter successively by stainless steel pipes;
Described vacuum chamber is interior, the optical window below is provided with the heat that comprises stationary fixture and isolates platform for placing vapour of an alkali metal chamber MEMS disk; Described vapour of an alkali metal chamber MEMS disk comprises some vapour of an alkali metal cavity chips.
2. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber, it is characterized in that: the material of described optical window adopts the zinc selenide material.
3. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber, it is characterized in that: described primary heater is provided with the Temperature numerical display module.
4. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber is characterized in that: described vavuum pump comprise fore pump and with the back level pump of this fore pump cascade.
5. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber is characterized in that: be with the heating tape above the described stainless steel pipes.
6. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber is characterized in that: described vapour of an alkali metal cavity chip comprises the silicon substrate that is provided with air channel and vapour of an alkali metal chamber, with this silicon substrate bonding and be provided with the sheet glass of air-filled pore; Air channel corresponding under the described air-filled pore is provided with silicon oxide layer.
7. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber is characterized in that: described vapour of an alkali metal cavity chip comprises the silicon substrate that is provided with air channel and vapour of an alkali metal chamber, with this silicon substrate bonding and be provided with air-filled pore and the sheet glass of inflation microchannel; Silicon substrate corresponding under the described inflation microchannel is provided with silicon oxide layer.
8. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber is characterized in that: described vapour of an alkali metal cavity chip comprises first sheet glass, be bonded in above first sheet glass and be provided with air channel and the silicon substrate in vapour of an alkali metal chamber, be bonded in this above silicon substrate and be provided with second sheet glass of air-filled pore; Air channel corresponding under the described air-filled pore is provided with silicon oxide layer.
9. inflation and the plugging system in miniature CPT atomic clock vapour of an alkali metal according to claim 1 chamber is characterized in that: described vapour of an alkali metal cavity chip comprises first sheet glass, be bonded in above first sheet glass and be provided with air channel and the silicon substrate in vapour of an alkali metal chamber, be bonded in this above silicon substrate and be provided with second sheet glass of air-filled pore and inflation microchannel; Silicon substrate corresponding under the described inflation microchannel is provided with silicon oxide layer.
10. one kind is adopted inflation that any system of claim 1 to 9 realizes miniature CPT atomic clock vapour of an alkali metal chamber and the method for shutoff, and this method may further comprise the steps:
At first open vacuum chamber, put into vapour of an alkali metal chamber MEMS disk, and by stationary fixture with MEMS disk fixed-site, described second, third valve is closed condition, open described the first, the 4th valve, and open primary heater and the vavuum pump of vacuum chamber below, be pumped into low vacuum with fore pump earlier, again with the higher vacuum of back level pump degree of being evacuated; When treating the numerical value basically identical that two vacuum meters show and reaching desirable value, close vavuum pump, open the secondary heater and the heating tape that is enclosed within on the stainless steel pipes of vapour of an alkali metal gas bomb below, open described second, third valve more simultaneously, vapour of an alkali metal and buffer gas are arrived in the vapour of an alkali metal chamber MEMS disk of vacuum chamber, kept a period of time in buffer gas and vapour of an alkali metal fully fill into several vapour of an alkali metal cavity chips in the MEMS disk of vapour of an alkali metal chamber; Close all valves then, begin to shine described vapour of an alkali metal cavity chip respectively with the CO2 laser beam, make its melting sealed realization shutoff, after shutoff finishes, open described the first, the 4th valve, unlatching primary heater and vavuum pump extract totally reaching vapour of an alkali metal chamber MEMS disk surfaces however, residual base metallic vapour in the vacuum chamber, thereby obtain the vapour of an alkali metal chamber of miniature CPT atomic clock level Hermetic Package.
11. inflation and method for blocking according to right 10 described miniature CPT atomic clock vapour of an alkali metal chambeies, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to make, at first utilize dry etching or wet etching to produce air channel and vapour of an alkali metal chamber at semiconductor silicon material, utilize methods such as mechanical punching or laser boring to produce air-filled pore then at glass material, carry out the MEMS disk that anode linkage obtains waiting to inflate and seal the vapour of an alkali metal chamber at last.
12. inflation and method for blocking according to right 10 described miniature CPT atomic clock vapour of an alkali metal chambeies, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to make, at first utilize dry etching or wet etching to produce air channel and vapour of an alkali metal chamber at semiconductor silicon material, utilize methods such as mechanical punching or laser boring to produce air-filled pore and utilize wet etching to produce inflation on glass microchannel at glass material then at glass material, carry out the MEMS disk that anode linkage obtains waiting to inflate and seal the vapour of an alkali metal chamber at last.
13. inflation and method for blocking according to right 10 described miniature CPT atomic clock vapour of an alkali metal chambeies, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to make, at first utilize wet etching to produce air channel and the through vapour of an alkali metal of corrosion chamber at semiconductor silicon material, then a sheet glass and the silicon chip back side are carried out anode linkage, form bonding pad, make air-filled pore at another sheet glass then, sheet glass and the described bonding pad that will be manufactured with air-filled pore at last carry out the front anode linkage, make the vapour of an alkali metal chamber obtain waiting the miniature CPT atomic clock inflating and seal.
14. inflation and method for blocking according to right 10 described miniature CPT atomic clock vapour of an alkali metal chambeies, it is characterized in that: described vapour of an alkali metal chamber MEMS disk adopts bonding method to make, at first utilize wet etching to produce air channel and vapour of an alkali metal chamber at semiconductor silicon material, then a sheet glass and the silicon chip back side are carried out anode linkage, form bonding pad, make air-filled pore at another sheet glass then, produce the inflation microchannel being manufactured with on the sheet glass of air-filled pore with wet etching, sheet glass and the described bonding pad that will be manufactured with air-filled pore and inflation microchannel at last carry out the front anode linkage, and making obtains waiting the vapour of an alkali metal chamber of the miniature CPT atomic clock inflating and seal.
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