CN103323152A - Bionic skin three-dimensional force touch perception device and measuring method thereof - Google Patents
Bionic skin three-dimensional force touch perception device and measuring method thereof Download PDFInfo
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Abstract
The invention relates to a bionic skin three-dimensional force touch perception device and a measuring method of the bionic skin three-dimensional force touch perception device. The bionic skin three-dimensional force touch perception device comprises a shell, a unit upper layer, a unit basic level and a circuit module. The measuring method comprises the following steps that dynamic data signals are collected to an MCP3208 chip; analog signals are converted into digital signals after entering the MCP 3208 chip; the digital signals enter an EP10K250A chip and are output after being calculated and analyzed; the output signals enter a CY7C68013 chip and then are sent to an upper PC through a USB interface, and LabView virtual instrument software is operated to calculate the forced magnitude and the forced direction of each sensitive unit; eventually the forced situation is stacked to a skin model. The bionic skin three-dimensional force touch perception device and the measuring method of the bionic skin three-dimensional force touch perception device stimulate the multilayer structure of the real skin, and conducting square blocks are arranged annularly referring to a clock, so that accuracy of direction representation is improved. Besides, an electromagnetic shielding layer is imported, so that electromagnetic insulation protection is formed, and measuring efficiency and accuracy are effectively improved.
Description
Technical field
The present invention relates to a kind of bionical touch sensor, especially can simulate true skin texture, possess bionics skin three-dimensional force tactile sensor and the measuring method thereof of three-dimensional force perceptional function simultaneously.
Background technology
At present, in traditional man-machine interaction mode, vision and the sense of hearing are most important interactive mode in the field of human-computer interaction alternately always, and in the last few years, along with the significantly lifting of computing power, many sensory patterns merge became possibility.Because haptic interaction can make the user produce more real feeling of immersion, haptic interaction becomes the state-of-the-art technology of field of human-computer interaction, and the three-dimensional force tactile sensor is one of importance of haptic interaction research.The bionics skin that development simultaneously has flexible characteristic and three-dimensional force tactilely-perceptible ability has robot and has the skin of sense of touch and possess " unconscious avoidance " function, has great importance to realizing the human peopleization of machine and intellectuality.
In view of the vital role that bionics skin is risen in man-machine exchange and Research on Intelligent Robots, the researchist has carried out relevant research work to it both at home and abroad.Engel utilizes the MEMS manufacture craft, and the standalone sensor of identifying temperature and hardness is distributed in polymkeric substance inside, prepares the flexible multi-functional sense of touch skin of recognizable object performance.Scheiber puts into the rubber inside that the surface is shaped on similar fingerprint with micro pressure sensor, has made bionic finger.Murakami and Hasegawa utilize silicon rubber as the surface in contact of soft skin, and six-axis force sensor is placed on the soft skin inside of being made up of silicon rubber, work out the responsive sense of touch skin of novel flexible.Associating HeFei University of Technology of Hefei research institute of Chinese Academy of Sciences intelligence institute has developed for the manufacture of the quick compound substance of carbon nanometer tube/silicon glue laminated of intelligent robot skin and the flexible 3 D force sensor that is applied to robot skin.
From available research achievements, mainly concentrate in the research to the sensor sensing element at the research of bionics skin at present, shortage is in conjunction with the structural design of human body real skin structure at bionics skin, for example the three-dimensional force sensor of the flexible intelligent skin detection of Hefei research institute development is selected for use in material and has been realized breakthrough, right its structural design is simple, can not satisfy high-precision measurement requirement.
Summary of the invention
In order to solve the existing inaccurate problem of three-dimensional force sensor measurement result that intelligent skin is detected; the invention provides a kind of bionics skin three-dimensional force tactile sensor and measuring method thereof; the sandwich construction that this bionics skin three-dimensional force tactile sensor and measuring method thereof have been simulated real skin; outward appearance adopts the monoblock integrated design; convenient normalization preparation; be easy to preserve and use; its top layer adopts high-quality artificial bionic skin to make; the arrangement mode of conduction square is circular layout with reference to clock-type; improved the accuracy that direction characterizes; when making, introduce the gas blanket design; also introduce electro-magnetic screen layer; the protection of formation electromagnetic isolation has effectively improved measurement efficient and precision.
The technical solution adopted for the present invention to solve the technical problems is: this bionics skin three-dimensional force tactile sensor comprises shell, upper strata, unit, unit basic unit and circuit module; The periphery of this shell is provided with the setting framework, and the below, side of shell is provided with the usb signal output port, and the middle part is provided with aerating device, and power pack is fixedly arranged at the bottom of shell, is provided with button cell in the power pack; Upper strata, described unit outermost is provided with the bionics skin top layer, its elasticity and toughness and human body skin approach, the bionics skin top layer on all upper stratas, unit is with a kind of colloidal materials, the outside on upper strata, unit is provided with the electromagnetic isolation layer, electromagnetic interference (EMI) in the maskable space, the electromagnetic isolation layer of all unit is commaterial, inboard, upper strata, unit is provided with pit, embedded conducting strip in the pit, conducting strip has long-pending than large contact surface, and it is that semicircle and arc surface are towards the conducting ring in the outside that the inside side walls on upper strata, unit is provided with the cross section; Described unit basic unit top is provided with cylindrical voltage dependent resistor (VDR) II, the size of voltage dependent resistor (VDR) II is less than the size of the conducting strip in the pit, six the block voltage dependent resistor (VDR) I of arranging are close in the outside by unit basic unit, the voltage dependent resistor (VDR) I is evenly arranged ringwise, the angle that distributes about axis on cylinder is 40 ° to 50 °, basic unit's base and unit link base layer are crossed limited block and are fixed together, basic unit base below is provided with elastic caoutchouc, this elastic caoutchouc is used for connecting sensor base, basic unit's base becomes the core circuit plate by matrix-like, the hole that perforation is arranged on this plate does not directly contact between upper strata, unit and the unit basic unit, is filled by inert non-polar gas; The voltage dependent resistor (VDR) I of described circuit module and voltage dependent resistor (VDR) II are in series with fixed resistance I and fixed resistance II respectively, voltage dependent resistor (VDR) I and voltage dependent resistor (VDR) II link to each other with conductive foil I and conductive foil II by lead respectively, and the conductive ring of base bottom is provided+the 3.3V level by button cell; Concrete circuit connecting mode is, each independent sensing unit is drawn 7 voltage signal lines, numbers V0-V7 respectively, and each bar voltage signal line all passes through corresponding preamplifying circuit, and amplifying circuit all adopts accurate amplifier OP07; Treated 7 road voltage signals enter No. 1 to No. 7 pin of MCP3208 digital-to-analog conversion A/D chip via CH0-CH6 passage, realize the collection input of simulating signal; No. 16 pins of MCP3208 chip meet VDD, are used for providing the operating voltage of chip; No. 9 pin meets DGND, is used for digitally being connected with the internal digital circuit; No. 10 pins connect No. 4 pins of EP10K250A chip, are used for the model selection CS/SHDN of sheet choosing/shutoff; No. 11 pins connect No. 3 pins of EP10K250A chip, are used for serial data input DIN; No. 12 pins connect No. 2 pins of EP10K250A chip, are used for serial data output DOUT; No. 13 pins connect No. 1 pin of EP10K250A chip, are used for the synchronous CLK of serial clock signal; No. 14 pin meets AGND, is used for simulation ground and is connected with the internal simulation circuit; The EP10K250A chip is field programmable logic device FPGA, add up to 470 pins, because the EP10K250A chip can be CS/SHDN, DIN, DOUT and CLK by 4 function I/O passages, control 1 MCP3208 analog-digital chip, thereby on principle, an EP10K250A chip can be controlled the data collection task of more than 100 tactile sensing unit; No. 5 pins of EP10K250A chip meet VDD, are used for providing the operating voltage of chip; No. 6 pin meets GND, is used for digitally being connected with the internal digital circuit; No. 17 pin connects the 50MHz crystal oscillator, is used for providing the clock signal of chip; No. 25 pins connect No. 77 pins of CY7C68013 chip, are used for realizing chip low level active homing RESET#; No. 32 pins connect No. 72 pins of CY7C68013 chip, are used for realizing first in first out data buffer memory FIFOADR1; No. 33 pins connect No. 71 pins of CY7C68013 chip, are used for realizing first in first out data buffer memory FIFOADR0; No. 37 pins connect No. 67 pins of CY7C68013 chip, are used for realizing interrupt request input Into; No. 86 pins connect No. 56 pins of CY7C68013 chip, are used for realizing output state marking signal FLAGB; No. 87 pins connect No. 55 pins of CY7C68013 chip, are used for realizing output state marking signal FLAGA; No. 98 pins connect No. 4 pins of CY7C68013 chip, are used for realizing that input writes strobe pulse SLWR; No. 99 pins connect No. 3 pins of CY7C68013 chip, are used for realizing importing reading strobe pulse SLRD; The 40-55 pin connects the 34-98 pin of CY7C68013 chip respectively, is used for realizing 16 circuit-switched data bus FD; The CY7C68013 chip is the USB control chip, is responsible for the bottom layer signal modulation and by USB serial ports line output packet on the PC, simultaneously with the descending bottom floor units that is sent to of the control signal of PC; No. 1 pin of CY7C68013 chip meets VDD, is used for providing the operating voltage of chip; No. 99 pin meets GND, is used for digitally being connected with the internal digital circuit; No. 11 pin connects crystal output, is used for realizing the parallel resonance of 24MHz, the clock frequency that obtains calibrating; No. 12 pin connects the crystal input, is used for realizing the parallel resonance of 24MHz, the clock frequency that obtains calibrating; No. 17 pin meets USB D+, is used for realizing being connected with the signal of USB D+; No. 18 pin meets USB D-, is used for realizing being connected with the signal of USB D-.
The step of this its method of testing of bionics skin three-dimensional force tactile sensor is:
(1) dynamic data-signal is collected into the MCP3208 chip through 7 voltage signal lines and preamplifying circuit;
(2) after simulating signal enters the MCP3208 chip, carry out the digital-to-analog conversion process, finally be converted into digital signal;
(3) digital signal enters the EP10K250A chip, stores the program of processing signals in this chip, and signal is carried out exporting after the computational analysis;
(4) signal from the output of EP10K250A chip enters the CY7C68013 chip, the CY7C68013 chip carries out buffer memory to data, be sent to upper PC via USB port then, by operation LabView virtual instrument software, according to predetermined algorithm, parse signal, calculate the stressed size and Orientation of each sensing unit;
(5) in conjunction with the simulation figure Interface Design, stressing conditions is superimposed on the skin model, just can intuitively reflect the stressed distribution of object.
The invention has the beneficial effects as follows; the sandwich construction that this bionics skin three-dimensional force tactile sensor and measuring method thereof have been simulated real skin; outward appearance adopts the monoblock integrated design; convenient normalization preparation; be easy to preserve and use; its top layer adopts high-quality artificial bionic skin to make; the arrangement mode of conduction square is circular layout with reference to clock-type; improved the accuracy that direction characterizes; when making, introduce the gas blanket design; also introduce electro-magnetic screen layer, form the electromagnetic isolation protection, effectively improved measurement efficient and precision.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is shell side view of the present invention.
Fig. 2 is unit of the present invention upper layer side view.
Fig. 3 is upper strata, unit of the present invention vertical view.
Fig. 4 is unit of the present invention basic unit side view.
Fig. 5 is unit of the present invention basic unit vertical view.
Fig. 6 is basic unit of the present invention circuit module vertical view.
Fig. 7 is basic unit of the present invention circuit module side view.
Fig. 8 is circuit catenation principle synoptic diagram of the present invention.
Among the figure, 1.USB signal output port, 2. aerating device, 3. sensors sides, 4. setting framework, 5. sensor base, 6. power pack, 7. button cell, 8. conducting strip, 9. conducting ring, 10. bionics skin top layer, 11. electromagnetic isolation layers, 12. the upper strata, unit, 13. basic unit's bases, 14. limited blocks, 15. unit basic unit, 16. the voltage dependent resistor (VDR) I, 17. voltage dependent resistor (VDR) II, 18. elastic caoutchoucs, 19. conductive foil I, 20. the conductive foil II, 21. fixed resistance I, 22. fixed resistance II, 23. lead, 24. conductive rings
Embodiment
In the drawings, this bionics skin three-dimensional force tactile sensor comprises shell, upper strata, unit 12, unit basic unit 15 and circuit module; The periphery of this shell is provided with setting framework 4, and the below, side of shell is provided with usb signal output port 1, and the middle part is provided with aerating device 2, and power pack 6 is fixedly arranged at the bottom of shell, is provided with button cell 7 in the power pack 6; Upper strata, described unit 12 outermost are provided with bionics skin top layer 10, its elasticity and toughness and human body skin approach, the bionics skin top layer 10 on all upper stratas, unit 12 is with a kind of colloidal materials, the outside on upper strata, unit 12 is provided with electromagnetic isolation layer 11, electromagnetic interference (EMI) in the maskable space, the electromagnetic isolation layer 11 of all unit is commaterial, 12 inboards, upper strata, unit are provided with pit, embedded conducting strip 8 in the pit, conducting strip 8 has long-pending than large contact surface, and it is that semicircle and arc surface are towards the conducting ring 9 in the outside that the inside side walls on upper strata, unit 12 is provided with the cross section; Described unit basic unit 15 tops are provided with cylindrical voltage dependent resistor (VDR) II 17, the size of voltage dependent resistor (VDR) II 17 is less than the size of the conducting strip 8 in the pit, six the block voltage dependent resistor (VDR) I 16 of arranging are close in 15 outsides by unit basic unit, voltage dependent resistor (VDR) I 16 is evenly arranged ringwise, the angle that distributes about axis on cylinder is 40 ° to 50 °, basic unit's base 13 is fixed together by limited block 14 with unit basic unit 15, basic unit's base 13 belows are provided with elastic caoutchouc 18, this elastic caoutchouc 18 is used for connecting sensor base 5, basic unit's base 13 becomes the core circuit plate by matrix-like, the hole that perforation is arranged on this plate, directly do not contact between upper strata, unit 12 and the unit basic unit 15, filled by inert non-polar gas; The voltage dependent resistor (VDR) I 16 of described circuit module and voltage dependent resistor (VDR) II 17 are in series with fixed resistance I 21 and fixed resistance II 22 respectively, voltage dependent resistor (VDR) I 16 and voltage dependent resistor (VDR) II 17 link to each other with conductive foil I 19 and conductive foil II 20 by lead 23 respectively, and the conductive ring 24 of base bottom is provided+the 3.3V level by button cell 7; Concrete circuit connecting mode is, each independent sensing unit is drawn 7 voltage signal lines, numbers V0-V7 respectively, and each bar voltage signal line all passes through corresponding preamplifying circuit, and amplifying circuit all adopts accurate amplifier OP07; Treated 7 road voltage signals enter No. 1 to No. 7 pin of MCP3208 digital-to-analog conversion A/D chip via CH0-CH6 passage, realize the collection input of simulating signal; No. 16 pins of MCP3208 chip meet VDD, are used for providing the operating voltage of chip; No. 9 pin meets DGND, is used for digitally being connected with the internal digital circuit; No. 10 pins connect No. 4 pins of EP10K250A chip, are used for the model selection CS/SHDN of sheet choosing/shutoff; No. 11 pins connect No. 3 pins of EP10K250A chip, are used for serial data input DIN; No. 12 pins connect No. 2 pins of EP10K250A chip, are used for serial data output DOUT; No. 13 pins connect No. 1 pin of EP10K250A chip, are used for the synchronous CLK of serial clock signal; No. 14 pin meets AGND, is used for simulation ground and is connected with the internal simulation circuit; The EP10K250A chip is field programmable logic device FPGA, add up to 470 pins, because the EP10K250A chip can be CS/SHDN, DIN, DOUT and CLK by 4 function I/O passages, control 1 MCP3208 analog-digital chip, thereby on principle, an EP10K250A chip can be controlled the data collection task of more than 100 tactile sensing unit; No. 5 pins of EP10K250A chip meet VDD, are used for providing the operating voltage of chip; No. 6 pin meets GND, is used for digitally being connected with the internal digital circuit; No. 17 pin connects the 50MHz crystal oscillator, is used for providing the clock signal of chip; No. 25 pins connect No. 77 pins of CY7C68013 chip, are used for realizing chip low level active homing RESET#; No. 32 pins connect No. 72 pins of CY7C68013 chip, are used for realizing first in first out data buffer memory FIFOADR1; No. 33 pins connect No. 71 pins of CY7C68013 chip, are used for realizing first in first out data buffer memory FIFOADR0; No. 37 pins connect No. 67 pins of CY7C68013 chip, are used for realizing interrupt request input Into; No. 86 pins connect No. 56 pins of CY7C68013 chip, are used for realizing output state marking signal FLAGB; No. 87 pins connect No. 55 pins of CY7C68013 chip, are used for realizing output state marking signal FLAGA; No. 98 pins connect No. 4 pins of CY7C68013 chip, are used for realizing that input writes strobe pulse SLWR; No. 99 pins connect No. 3 pins of CY7C68013 chip, are used for realizing importing reading strobe pulse SLRD; The 40-55 pin connects the 34-98 pin of CY7C68013 chip respectively, is used for realizing 16 circuit-switched data bus FD; The CY7C68013 chip is the USB control chip, is responsible for the bottom layer signal modulation and by USB serial ports line output packet on the PC, simultaneously with the descending bottom floor units that is sent to of the control signal of PC; No. 1 pin of CY7C68013 chip meets VDD, is used for providing the operating voltage of chip; No. 99 pin meets GND, is used for digitally being connected with the internal digital circuit; No. 11 pin connects crystal output, is used for realizing the parallel resonance of 24MHz, the clock frequency that obtains calibrating; No. 12 pin connects the crystal input, is used for realizing the parallel resonance of 24MHz, the clock frequency that obtains calibrating; No. 17 pin meets USB D+, is used for realizing being connected with the signal of USB D+; No. 18 pin meets USB D-, is used for realizing being connected with the signal of USB D-.
The step of this its method of testing of bionics skin three-dimensional force tactile sensor is:
(1) dynamic data-signal is collected into the MCP3208 chip through 7 voltage signal lines and preamplifying circuit;
(2) after simulating signal enters the MCP3208 chip, carry out the digital-to-analog conversion process, finally be converted into digital signal;
(3) digital signal enters the EP10K250A chip, stores the program of processing signals in this chip, and signal is carried out exporting after the computational analysis;
(4) signal from the output of EP10K250A chip enters the CY7C68013 chip, the CY7C68013 chip carries out buffer memory to data, be sent to upper PC via USB port then, by operation LabView virtual instrument software, according to predetermined algorithm, parse signal, calculate the stressed size and Orientation of each sensing unit;
(5) in conjunction with the simulation figure Interface Design, stressing conditions is superimposed on the skin model, just can intuitively reflect the stressed distribution of object.
Claims (3)
1. bionics skin three-dimensional force tactile sensor and measuring method thereof, this bionics skin three-dimensional force tactile sensor comprises shell, upper strata, unit (12), unit basic unit (15) and circuit module, it is characterized in that, the periphery of this shell is provided with setting framework (4), the below, side of shell is provided with usb signal output port (1), the middle part is provided with aerating device (2), and power pack (6) is fixedly arranged at the bottom of shell, is provided with button cell (7) in the power pack (6); Upper strata, described unit (12) outermost is provided with bionics skin top layer (10), its elasticity and toughness and human body skin approach, the bionics skin top layer (10) on all upper stratas, unit (12) is with a kind of colloidal materials, the outside on upper strata, unit (12) is provided with electromagnetic isolation layer (11), the electromagnetic isolation layer (11) of all unit is commaterial, inboard, upper strata, unit (12) is provided with pit, embedded conducting strip (8) in the pit, conducting strip (8) has long-pending than large contact surface, and it is that semicircle and arc surface are towards the conducting ring (9) in the outside that the inside side walls of upper strata, unit (12) is provided with the cross section; Described unit basic unit (15) top is provided with cylindrical voltage dependent resistor (VDR) II (17), the size of voltage dependent resistor (VDR) II (17) is less than the size of the conducting strip in the pit (8), six the block voltage dependent resistor (VDR) I (16) of arranging are close in the outside by unit basic unit (15), voltage dependent resistor (VDR) I (16) is evenly arranged ringwise, the angle that distributes about axis on cylinder is 40 ° to 50 °, basic unit's base (13) is fixed together by limited block (14) with unit basic unit (15), basic unit's base (13) below is provided with elastic caoutchouc (18), this elastic caoutchouc (18) is used for connecting sensor base (5), basic unit's base (13) becomes the core circuit plate by matrix-like, the hole that perforation is arranged on this plate, directly do not contact between upper strata, unit (12) and the unit basic unit (15), filled by inert non-polar gas; The voltage dependent resistor (VDR) I (16) of described circuit module and voltage dependent resistor (VDR) II (17) are in series with fixed resistance I (21) and fixed resistance II (22) respectively, voltage dependent resistor (VDR) I (16) and voltage dependent resistor (VDR) II (17) link to each other with conductive foil I (19) and conductive foil II (20) by lead (23) respectively, and the conductive ring of base bottom (24) is provided+the 3.3V level by button cell (7).
2. bionics skin three-dimensional force tactile sensor and measuring method thereof, it is characterized in that, concrete circuit connecting mode is, each independent sensing unit is drawn 7 voltage signal lines, number V0-V7 respectively, each bar voltage signal line all passes through corresponding preamplifying circuit, and amplifying circuit all adopts accurate amplifier OP07; Treated 7 road voltage signals enter No. 1 to No. 7 pin of MCP3208 digital-to-analog conversion A/D chip via CH0-CH6 passage, realize the collection input of simulating signal; No. 16 pins of MCP3208 chip meet VDD, are used for providing the operating voltage of chip; No. 9 pin meets DGND, is used for digitally being connected with the internal digital circuit; No. 10 pins connect No. 4 pins of EP10K250A chip, are used for the model selection CS/SHDN of sheet choosing/shutoff; No. 11 pins connect No. 3 pins of EP10K250A chip, are used for serial data input DIN; No. 12 pins connect No. 2 pins of EP10K250A chip, are used for serial data output DOUT; No. 13 pins connect No. 1 pin of EP10K250A chip, are used for the synchronous CLK of serial clock signal; No. 14 pin meets AGND, is used for simulation ground and is connected with the internal simulation circuit; The EP10K250A chip is field programmable logic device FPGA, add up to 470 pins, because the EP10K250A chip can be CS/SHDN, DIN, DOUT and CLK by 4 function I/O passages, control 1 MCP3208 analog-digital chip, thereby on principle, an EP10K250A chip can be controlled the data collection task of more than 100 tactile sensing unit; No. 5 pins of EP10K250A chip meet VDD, are used for providing the operating voltage of chip; No. 6 pin meets GND, is used for digitally being connected with the internal digital circuit; No. 17 pin connects the 50MHz crystal oscillator, is used for providing the clock signal of chip; No. 25 pins connect No. 77 pins of CY7C68013 chip, are used for realizing chip low level active homing RESET#; No. 32 pins connect No. 72 pins of CY7C68013 chip, are used for realizing first in first out data buffer memory FIFOADR1; No. 33 pins connect No. 71 pins of CY7C68013 chip, are used for realizing first in first out data buffer memory FIFOADR0; No. 37 pins connect No. 67 pins of CY7C68013 chip, are used for realizing interrupt request input Into; No. 86 pins connect No. 56 pins of CY7C68013 chip, are used for realizing output state marking signal FLAGB; No. 87 pins connect No. 55 pins of CY7C68013 chip, are used for realizing output state marking signal FLAGA; No. 98 pins connect No. 4 pins of CY7C68013 chip, are used for realizing that input writes strobe pulse SLWR; No. 99 pins connect No. 3 pins of CY7C68013 chip, are used for realizing importing reading strobe pulse SLRD; The 40-55 pin connects the 34-98 pin of CY7C68013 chip respectively, is used for realizing 16 circuit-switched data bus FD; The CY7C68013 chip is the USB control chip, is responsible for the bottom layer signal modulation and by USB serial ports line output packet on the PC, simultaneously with the descending bottom floor units that is sent to of the control signal of PC; No. 1 pin of CY7C68013 chip meets VDD, is used for providing the operating voltage of chip; No. 99 pin meets GND, is used for digitally being connected with the internal digital circuit; No. 11 pin connects crystal output, is used for realizing the parallel resonance of 24MHz, the clock frequency that obtains calibrating; No. 12 pin connects the crystal input, is used for realizing the parallel resonance of 24MHz, the clock frequency that obtains calibrating; No. 17 pin meets USB D+, is used for realizing being connected with the signal of USB D+; No. 18 pin meets USB D-, is used for realizing being connected with the signal of USB D-.
3. bionics skin three-dimensional force tactile sensor and measuring method thereof is characterized in that, testing procedure is that dynamic data-signal is collected into the MCP3208 chip through 7 voltage signal lines and preamplifying circuit; After simulating signal enters the MCP3208 chip, carry out the digital-to-analog conversion process, finally be converted into digital signal; Digital signal enters the EP10K250A chip, stores the program of processing signals in this chip, and signal is carried out exporting after the computational analysis; Enter the CY7C68013 chip from the signal of EP10K250A chip output, the CY7C68013 chip carries out buffer memory to data, be sent to upper PC via USB port then, by operation LabView virtual instrument software, according to predetermined algorithm, parse signal, calculate the stressed size and Orientation of each sensing unit; In conjunction with the simulation figure Interface Design, stressing conditions is superimposed on the skin model, just can intuitively reflect the stressed distribution of object.
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| CN105160976A (en) * | 2015-09-02 | 2015-12-16 | 中山市易比斯传感技术有限公司 | Novel intelligent simulated skin |
| CN105318996A (en) * | 2015-04-23 | 2016-02-10 | 中国矿业大学 | Bionics finger capable of synchronization test of frictional contact area |
| CN105651442A (en) * | 2016-01-07 | 2016-06-08 | 武汉理工大学 | Tactile sensing system capable of recognizing information in three-dimensional direction and design method thereof |
| CN107478268A (en) * | 2017-07-26 | 2017-12-15 | 华中科技大学 | A kind of electronic skin comprehensive performance testing system |
| CN108362410A (en) * | 2018-04-26 | 2018-08-03 | 中国科学院合肥物质科学研究院 | A kind of three-dimensional force flexible sensor |
| CN108444617A (en) * | 2018-02-08 | 2018-08-24 | 浙江大学 | A kind of digital bionical hair sensing arrangement |
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| CN110584833A (en) * | 2019-10-17 | 2019-12-20 | 中国科学院长春光学精密机械与物理研究所 | Intelligent skin with touch sense and temperature sense |
| CN110712224A (en) * | 2019-10-17 | 2020-01-21 | 中国科学院长春光学精密机械与物理研究所 | Intelligent skin with temperature sensation |
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