CN103313537A - Plate used for electronic device casing, preparation method thereof and electronic device using plate - Google Patents
Plate used for electronic device casing, preparation method thereof and electronic device using plate Download PDFInfo
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- CN103313537A CN103313537A CN2012100623003A CN201210062300A CN103313537A CN 103313537 A CN103313537 A CN 103313537A CN 2012100623003 A CN2012100623003 A CN 2012100623003A CN 201210062300 A CN201210062300 A CN 201210062300A CN 103313537 A CN103313537 A CN 103313537A
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- electronic equipment
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- housing
- accommodation space
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Abstract
The invention discloses a plate used for an electronic device casing. The plate comprises a first part of a first material and a second part of a second material. The first part is provided with an accommodation space, and the second part is located in the accommodation space. The thermal conductivity coefficient of the second material is greater than the thermal conductivity coefficient of the first material. The rigidity of the second material is greater than the rigidity of the first material. According to the invention, the two aspects of structure and material selection are novelly optimized, so that a reliable guarantee is provided for the design trend of an ultrathin and ultralight electronic device on the basis that a good heat radiating performance is realized; the thickness size can be effectively controlled; and a good customer experience is brought. On the basis, the invention further provides a plate preparation method and the electronic device using the plate.
Description
Technical field
The present invention relates to electronic technology field, be specifically related to a kind of electronic equipment casing with sheet material, preparation method and use the electronic equipment of this sheet material.
Background technology
As everyone knows, good heat radiation can guarantee the job stability of each parts of electronic product system, needs to guarantee the good heat radiating of all parts.Yet, be accompanied by the raising of the development and application demand of science and technology, the performance of the electronic product such as smart mobile phone, panel computer is also in continuous lifting, cause the power consumption of product constantly to rise, in the use procedure, the surface temperature of smart mobile phone, panel computer is more and more higher, has had a strong impact on user's use impression.
In addition, increasingly miniaturization of existing electronic product, integrated, because the raising of electronic component integration degree, the heat radiation power of unit are is also inevitable to be increased thereupon, and therefore highly integrated electronic component is when work, and its surface temperature can rise rapidly.Thus, there is the mutually contradiction of restriction between heat dispersion and the product miniaturization.For example, panel computer main brand manufacturer is by attenuate back cover thickness reduction product thickness, pursuing more frivolous design, yet, along with the continuous attenuate of the thickness of back cover, the intensity of its complete machine more and more a little less than, surface temperature is also more and more higher.
The material of conditional electronic equipment is selected main two large classes: a class is to utilize fine aluminium or magnadure as rear shell material, and another kind of is to utilize plastics as rear shell material; Based on the restriction of two class material self performance, all there is corresponding problem in the shell that above-mentioned two kinds of materials are made.
Wherein, utilize fine aluminium or magnadure to be specially as the defective of rear shell material:
1) material cost and processing cost increase considerably;
2) owing to being that metal material can be influential to FR (radiofrequency signal), thus antenna part also with injected plastic;
3) identical temperature, the surface of metal material can make the people feel hotter, and be uncomfortable;
4) metal surface is processed more difficult;
5) weight ratio is large.
Wherein, utilize the larger plastics of Thickness Ratio to be specially as the defective of rear shell material:
1) thickness of complete machine increases;
2) pure plastic material poor radiation;
3) intensity is low.
In view of this, demand urgently being optimized design for the back cover material of existing kind of class of electronic devices, on the basis of taking into account excellent heat dispersion performance and reliable control gauge, can effectively solve the existing the problems referred to above of prior art.
Summary of the invention
For defects, the technical problem that the present invention solves is, the electronic equipment casing sheet material of structure optimization is provided, and uses this sheet material and is satisfying on the basis of excellent heat dispersion performance as the electronic equipment of shell, can effectively control gauge, also can bring simultaneously good client's impression.On this basis, the present invention also provides a kind of sheet material preparation method and uses the electronic equipment of this sheet material.
Electronic equipment casing sheet material provided by the invention comprises the first of the first material and the second portion of the second material; Described first has accommodation space, and described second portion is positioned at described accommodation space; And the thermal conductivity coefficient of described the second material is greater than the thermal conductivity coefficient of described the first material, and the rigidity of described the second material is greater than the rigidity of described the first material.
Preferably, described second portion is metal substrate, and described first is plastic clad; And the periphery of described plastic clad stretches out from the outer rim of described metal substrate and forms outer without metal.
Preferably, described plastic clad adopts Shooting Technique to form.
Preferably, offer the Shooting Technique through hole on the described metal substrate.
Electronic equipment casing provided by the invention preparation of plates method, carry out according to following step:
A. prepare injection mold according to described sheet material;
B. the second portion with the second material is built in the die cavity of described injection mold;
In the die cavity that c. can extend out to described injection mold with respect to slide block and the injection made showerhead of described injection mold slip, carry out the first of injecting the formation part first time of melt and dissolved the first material;
D. carry out the centre cooling;
E. described injection made showerhead and slide block are retracted to its inwall in the die cavity of described injection mold and flush, inject and form complete first the second time of carrying out melt and dissolved the first material;
F. after finally cooling off, die sinking.
Preferably, described second portion is metal substrate, and described the first material is plastics; Among the step b, the metal substrate that has the Shooting Technique through hole is built in the die cavity of described injection mold; Among the step c, described injection made showerhead is stretched in the described Shooting Technique through hole, and the lower surface that described injection moulding slide block extend out to described metal substrate offsets.
Preferably, among the step c, described injection made showerhead is extend out in described Shooting Technique through hole in the die cavity of described injection mold of described metal substrate top.
A kind of electronic equipment provided by the invention comprises: have first's housing of the first reservation shape and have the second portion housing of the second reservation shape, and be arranged on the electronic devices and components in the housing; Described second portion housing is made of the first of the first material and the second portion of the second material; Described first has accommodation space, and described second portion is positioned at described accommodation space; Wherein, described first housing and described second portion housing consist of the housing of described electronic equipment, the combination that is shaped as described the first reservation shape and described the second reservation shape of described housing; The thermal conductivity coefficient of described the second material is greater than the thermal conductivity of described the first material, and the rigidity of described the second material is greater than the rigidity of described the first material.
Preferably, described accommodation space is positioned at the body interior of described first.
Preferably, described accommodation space is opened in the inner surface of described first.
Preferably, described the first material is lower than described the second material to the impact of radiofrequency signal to the impact of radiofrequency signal; And the antenna element in the described electronic devices and components is arranged on the outer of described first.
Preferably, described second portion housing is formed in one, and is formed for arranging the mounting structure of described antenna element in the described first.
Preferably, the described second portion of the main heater element in the described electronic devices and components and described the second material is oppositely arranged.
Preferably, the described second portion of described main heater element and described the second material offsets.
Preferably, described the first material is plastics, and described the second material is metal.
Electronic equipment casing provided by the invention has carried out structure optimization with sheet material, and this sheet material is made of two parts of unlike material; Wherein, the first of the first material has accommodation space, and the second portion of the second material places in this accommodation space.Compared with prior art, the present invention has effectively utilized the characteristics such as the thermal conductivity of different materials and rigidity.At first, place the material thermal conductivity coefficient of first in the outside relatively low, so that can not concentrate overheatedly with the surface of shell of user direct contact, the user can perceive relatively low surface temperature, has preferably comfort level.Secondly, the material thermal conductivity coefficient of built-in second portion is relatively high, can be with electronic equipment internal heat reliable delivery, thus acted on excellent heat radiation performance characteristic with metal shell.Again, the outside first of this sheet material adopts the first lower material of rigidity, middle second portion adopts preferably the second material of rigidity, the shell of pure plastic material in the prior art, the sheet metal thickness of this programme can be relatively thin, for the ultrathin design of electronic equipment provides reliable guarantee; With respect to the shell of simple metal material in the prior art, this programme is on the basis of the effective material cost of control product, for the ultralight design of electronic equipment provides further reliable guarantee.
In preferred version of the present invention, second portion is metal substrate, and first is plastic clad; And the periphery of this plastic clad stretches out from the outer rim of metal substrate and forms outer without metal.So arrange, have preferably manufacturing cost and process costs; Particularly, the communication devices such as the antenna of electronic equipment can arrange arbitrarily at the place, outer all around without metal substrate, are convenient to carry out the general arrangement of electronic equipment internal electronic devices and components, and then can reduce the overall design difficulty.
Shell provided by the invention is applicable to any type of electronic equipment with sheet material, for example, and the electronic equipments such as PAD panel computer, notebook computer, mobile phone and e-book.
Description of drawings
Fig. 1 is the overall structure schematic diagram of the described panel computer of embodiment;
Fig. 2 is the sheet material vertical view of the described manufacturing of the first execution mode panel computer back cover shown in Figure 1;
Fig. 3 is the A-A profile of Fig. 2;
Fig. 4 and Fig. 5 are the operation schematic diagram of the first embodiment of sheet material preparation method shown in Figure 2;
Fig. 6 and Fig. 7 are the operation schematic diagram of the second embodiment of sheet material preparation method shown in Figure 2;
Fig. 8 is the profile of the described sheet material of the second execution mode;
Fig. 9 and Figure 10 are sheet material preparation method's shown in Figure 8 operation schematic diagram;
Figure 11 is the profile of the described sheet material of the 3rd execution mode.
Among the figure:
First 1, accommodation space 11, outer 12, second portion 2, Shooting Technique through hole 21, metal bump 22, injection mold 31, slide block 32, injection made showerhead 33.
Embodiment
Core of the present invention provides a kind of electronic equipment casing sheet material, this sheet material looks for another way and has carried out the optimization of structure and two aspects of material selection, thereby satisfying on the basis of excellent heat dispersion performance, for ultra-thin, the ultralight designer trends of electronic equipment provide reliable guarantee, can effectively control gauge, also can bring simultaneously good client's impression.Specify present embodiment below in conjunction with Figure of description.
Be without loss of generality, present embodiment describes as main body with the PAD panel computer.
See also Fig. 1, this figure is the overall structure schematic diagram of the described panel computer of present embodiment.As shown in Figure 1, this panel computer has fore shell (first's shell) and back cover (second portion shell), wherein, first's shell roughly is tabular (the first reservation shape), and the second portion shell is external convex arc shape (the second reservation shape); This fore shell and back cover consist of the housing of panel computer, that is, and and the combination that is shaped as the first reservation shape and the second reservation shape of housing; And the respective electronic components and parts are arranged in the housing, to realize corresponding function.Same as the prior art, the main heater element in the internal electronic component is the function element such as CPU, video card, and is not limited to above-mentioned heater element.
Need to prove, the agent structure of this panel computer except back cover all can adopt existing techniques in realizing, therefore it will not go into details for this paper.For describing the application's core design in detail, please in the lump referring to Fig. 2 and Fig. 3, wherein, Fig. 2 is the sheet material vertical view of making this shell in the first execution mode, and Fig. 3 is the A-A profile of Fig. 2.
Based on prior art, this programme has carried out the improvement of structure and two aspects of material selection for back cover (second portion shell).In conjunction with Fig. 2 and shown in Figure 3, back cover is made of the first 1 of the first material and 2 two major parts of second portion of the second material; First 1 has accommodation space 11, and second portion 2 is positioned at this accommodation space 11; Wherein, the thermal conductivity coefficient of the second material is greater than the thermal conductivity of the first material, and the rigidity of the second material is greater than the rigidity of the first material.
In the use procedure, place the material thermal conductivity coefficient of first in the outside relatively low, so that can not concentrate overheatedly with the back cover surface of user direct contact, perceive relatively low surface temperature.Simultaneously, the material thermal conductivity coefficient of built-in second portion is relatively high, can with the heat reliable delivery that produces in the heater element course of work, have the characteristic of excellent heat radiation performance.In addition, because this shell effectively utilized two kinds of different materials of rigidity with sheet material, the shell of pure plastic material in the prior art, the sheet metal thickness of this programme can be relatively thin; And with respect to the shell of simple metal material in the prior art, this programme can effectively be controlled the material cost of product.
In addition, the selection of the first material and the second material in this programme can be determined according to the actual conditions of the aspects such as the complete machine work caloric value of specific product and intensity.With the thermal conductivity coefficient of the second material thermal conductivity greater than the first material, the rigidity of the second material is selection principle greater than the rigidity of the first material, and this first material can be plastics, such as: PET plastics or PC plastics etc.; The second material can be metal, for example, and fine aluminium or aluminium alloy etc.Obviously, placing the material of the first in the outside is plastics, and for identical surface temperature, plastics then can perceive relatively lower surface temperature with respect to metal material.
Occur in the actual use procedure first 1 with respect to second portion 2 relative displacements may, can do further to optimize for matching relationship between the two, fit tightly between the two guaranteeing.Preferably, second portion 2 is metal substrate, and first 1 is plastic clad, and adopts Shooting Technique to form, and like this, the melting plastics immerse the plate face microstructure of metal substrate fully, forms between the two reliably matching relationship after the cooling.Further, plastics (the first material) are lower than metal (the second material) to the impact of radiofrequency signal to the impact of radiofrequency signal; As shown in Figure 3, first's 1 periphery of this plastic clad can stretch out from the outer rim of metal substrate and form outer 12 without metal, thus, the communication devices such as the built-in aerial of panel computer can arrange arbitrarily at the place, outer all around without metal substrate, are convenient to carry out the general arrangement of electronic equipment internal electronic devices and components.
As shown in Figure 3, accommodation space 11 is opened in the inner surface of first 1, namely places the metal substrate in this accommodation space 11 to expose to inner surface.Obviously, the main heater element in the panel computer (CPU or video card etc.) is oppositely arranged with metal substrate (second portion of the second material), and heat-transfer effect is even more ideal; In addition, corresponding main heater element preferably offsets with metal substrate, to improve to greatest extent heat transfer efficiency, guarantees the safe working temperature of heater element.
Below specify the aforementioned back cover of preparation two processes of sheet material, please in the lump referring to Fig. 4 and Fig. 5, two figure are the operation schematic diagram of the first embodiment of this preparation method, and arrow is depicted as the flow direction of melting plastics among the figure.
This preparation of plates method, carry out according to following step:
A. prepare injection mold according to sheet material; The die cavity of this injection mold is identical with the shape of sheet material.
B. as shown in Figure 4, metal substrate (i.e. the second portion 2 of the second material) is built in the die cavity of injection mold 31;
C. as shown in Figure 4, slide block 32 and the injection made showerhead 33 that can slide with respect to the housing of injection mold 31 extend out in the die cavity of injection mold 31, carry out the first 1 (Fig. 5 beats the section part) of injecting the formation part first time of melt and dissolved plastics (the first material);
D. carry out the centre cooling;
E. injection made showerhead 33 and slide block 32 are retracted to its inwall in the die cavity of injection mold 31 and flush, inject and form complete first the second time of carrying out melt and dissolved plastics, that is to say, among the step c not the zone of injection moulding carry out injection moulding;
F. after finally cooling off, die sinking; So far, obtain aforementioned sheet material.Next, can do further processing according to the back cover concrete shape of panel computer, for example, strike out the back cover of outer convex.
Certainly, for the assembly structure of the communication devices such as built-in aerial is provided, can be formed for arranging at the plastic clad (first 1) that injection moulding forms the mounting structure (not shown) of antenna element upper now, with the assembly process process of further raising complete machine.
As shown in Figure 4 and Figure 5, slide block 32 and injection made showerhead 33 are positioned at the top of die cavity, can certainly be positioned at the below of die cavity, inject so that realize the melting plastics.This mode should be offered Shooting Technique through hole 21 at the second portion 2 of metal substrate.Please in the lump referring to Fig. 6 and Fig. 7, two figure are the operation schematic diagram of the second embodiment of this preparation method.
The difference of the described sheet material preparation method of the present embodiment and the first embodiment only is: among the step b, the metal substrate that has Shooting Technique through hole 21 is built in the die cavity of injection mold 31; Among the step c, injection made showerhead 33 is extend out in Shooting Technique through hole 21 in the die cavity of injection mold 31 of metal substrate top, and the lower surface that injection moulding slide block 32 extend out to metal substrate offsets.Perhaps, among the step c, injection made showerhead 33 is only stretched in the Shooting Technique through hole 21, also can realize below die cavity, carrying out the injection of melting plastics.
In addition, the accommodation space 11 in the first 1 also can be positioned at its body interior.Specifically please in the lump referring to Fig. 8, the figure shows the sheet material profile of the second execution mode, its slice location can be referring to dissecing symbol A-A shown in Fig. 2.
The described sheet material of present embodiment is identical with main body formation and the material selection relation of the first execution mode, and difference only is: accommodation space 11 is positioned at the body interior of plastic clad (first 1), and namely metal substrate is coated fully by this plastic clad.Adopt Shooting Technique to form first 1, then must offer injection molding technical holes 21 on the metal substrate (second portion 2), with the requirement of simplifying working process.Please in the lump referring to Fig. 9 and Figure 10, two figure are sheet material preparation method's shown in Figure 8 operation schematic diagram.
The described preparation method of the second embodiment of this method and sheet material shown in Figure 2 is basic identical, difference is that slide block 32 can only extend out to mould intracavity wall among the step c of aforementioned the second embodiment and flushes, and slide block 32 must extend out in the die cavity of injection mold 31 and offsets with metal substrate among the step c of this method, as shown in Figure 9, to guarantee the position of the metal substrate in the middle cooling procedure; And slide block 32 is retracted to synchronously with the inwall of injection mold 31 with injection made showerhead 33 and flushes in the step e of this method.
What specify is, is clear difference and the contact that illustrates between each embodiment, and the member of identical function all indicates with identical Reference numeral among each figure.
In addition, the metal substrate of the described sheet material of the second execution mode is coated on plastic clad inside, obviously can't bring into play to greatest extent the heat conductivility of metal substrate, the inboard of metal substrate can be extended to form metal bump 22 for this reason, after injection moulding is finished, this metal bump 22 exposes to inner surface, and then can directly offset with main heater element and contact, to improve heat conduction velocity.Specifically see also shown in Figure 11ly, this figure is the profile of the described sheet material of the 3rd execution mode.
Should be appreciated that aforementioned back cover not only is applied to the shell of panel computer with sheet material, also can be applied to the shell of the electronic equipments such as notebook computer and electronic dictionary; For example, this sheet material is applicable to A shell and/or the D shell of notebook computer.
The above only is preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (15)
1. an electronic equipment casing sheet material is characterized in that, comprising:
The first of the first material; With
The second portion of the second material;
Described first has accommodation space, and described second portion is positioned at described accommodation space; And the thermal conductivity coefficient of described the second material is greater than the thermal conductivity coefficient of described the first material, and the rigidity of described the second material is greater than the rigidity of described the first material.
2. electronic equipment casing sheet material according to claim 1 is characterized in that, described second portion is metal substrate, and described first is plastic clad; And the periphery of described plastic clad stretches out from the outer rim of described metal substrate and forms outer without metal.
3. electronic equipment casing sheet material according to claim 2 is characterized in that, described plastic clad adopts Shooting Technique to form.
4. electronic equipment casing sheet material according to claim 3 is characterized in that, offers the Shooting Technique through hole on the described metal substrate.
5. electronic equipment casing preparation of plates method is characterized in that, carries out according to following step:
A. prepare injection mold according to described sheet material;
B. the second portion with the second material is built in the die cavity of described injection mold;
In the die cavity that c. can extend out to described injection mold with respect to slide block and the injection made showerhead of described injection mold slip, carry out the first of injecting the formation part first time of melt and dissolved the first material;
D. carry out the centre cooling;
E. described injection made showerhead and slide block are retracted to its inwall in the die cavity of described injection mold and flush, inject and form complete first the second time of carrying out melt and dissolved the first material;
F. after finally cooling off, die sinking.
6. electronic equipment casing according to claim 5 preparation of plates method is characterized in that, described second portion is metal substrate, and described the first material is plastics; Among the step b, the metal substrate that has the Shooting Technique through hole is built in the die cavity of described injection mold; Among the step c, described injection made showerhead is stretched in the described Shooting Technique through hole, and the lower surface that described injection moulding slide block extend out to described metal substrate offsets.
7. electronic equipment casing according to claim 6 preparation of plates method is characterized in that, among the step c, described injection made showerhead is extend out in described Shooting Technique through hole in the die cavity of described injection mold of described metal substrate top.
8. an electronic equipment is characterized in that, comprising:
First's housing has the first reservation shape;
The second portion housing has the second reservation shape, and described second portion housing is made of the first of the first material and the second portion of the second material; Described first has accommodation space, and described second portion is positioned at described accommodation space; Wherein, described first housing and described second portion housing consist of the housing of described electronic equipment, the combination that is shaped as described the first reservation shape and described the second reservation shape of described housing; The thermal conductivity coefficient of described the second material is greater than the thermal conductivity of described the first material, and the rigidity of described the second material is greater than the rigidity of described the first material; With
Electronic devices and components are arranged in the described housing.
9. electronic equipment according to claim 8 is characterized in that, described accommodation space is positioned at the body interior of described first.
10. electronic equipment according to claim 8 is characterized in that, described accommodation space is opened in the inner surface of described first.
11. each described electronic equipment in 10 is characterized in that according to claim 8, described the first material is lower than described the second material to the impact of radiofrequency signal to the impact of radiofrequency signal; And the antenna element in the described electronic devices and components is arranged on the outer of described first.
12. electronic equipment according to claim 11 is characterized in that, described second portion housing is formed in one, and is formed for arranging the mounting structure of described antenna element in the described first.
13. electronic equipment according to claim 12 is characterized in that, the main heater element in the described electronic devices and components and the second portion of described the second material are oppositely arranged.
14. electronic equipment according to claim 13 is characterized in that, the described second portion of described main heater element and described the second material offsets.
15. electronic equipment according to claim 8 is characterized in that, described the first material is plastics, and described the second material is metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210062300.3A CN103313537B (en) | 2012-03-09 | 2012-03-09 | A kind of electronic equipment casing sheet material, preparation method apply the electronic equipment of this sheet material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210062300.3A CN103313537B (en) | 2012-03-09 | 2012-03-09 | A kind of electronic equipment casing sheet material, preparation method apply the electronic equipment of this sheet material |
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| CN103313537A true CN103313537A (en) | 2013-09-18 |
| CN103313537B CN103313537B (en) | 2016-04-27 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104661471A (en) * | 2013-11-25 | 2015-05-27 | 摩托罗拉解决方案公司 | Apparatus and method for providing a seal around a perimeter of a bi-material enclosure |
| CN107708341A (en) * | 2016-08-09 | 2018-02-16 | 富泰华工业（深圳）有限公司 | Housing and preparation method thereof |
| CN109405904A (en) * | 2017-08-17 | 2019-03-01 | 兰吉尔有限公司 | The sonic probe with stiffening plate for flowmeter |
| WO2019041640A1 (en) * | 2017-08-31 | 2019-03-07 | 广州视源电子科技股份有限公司 | Display device and extruded frame section structure thereof |
| CN111186191A (en) * | 2019-12-09 | 2020-05-22 | 上海传英信息技术有限公司 | Electronic equipment shell and manufacturing method thereof |
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| CN1992741A (en) * | 2005-12-29 | 2007-07-04 | 三星电子株式会社 | Metal case for portabel terminal and method for manufacturing the same |
| CN101659101A (en) * | 2008-08-29 | 2010-03-03 | 深圳富泰宏精密工业有限公司 | Manufacturing method of insert molding |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1992741A (en) * | 2005-12-29 | 2007-07-04 | 三星电子株式会社 | Metal case for portabel terminal and method for manufacturing the same |
| CN101659101A (en) * | 2008-08-29 | 2010-03-03 | 深圳富泰宏精密工业有限公司 | Manufacturing method of insert molding |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661471A (en) * | 2013-11-25 | 2015-05-27 | 摩托罗拉解决方案公司 | Apparatus and method for providing a seal around a perimeter of a bi-material enclosure |
| CN107708341A (en) * | 2016-08-09 | 2018-02-16 | 富泰华工业（深圳）有限公司 | Housing and preparation method thereof |
| CN109405904A (en) * | 2017-08-17 | 2019-03-01 | 兰吉尔有限公司 | The sonic probe with stiffening plate for flowmeter |
| CN109405904B (en) * | 2017-08-17 | 2021-12-24 | 兰吉尔有限公司 | Acoustic probe with stiffening plate for a flow meter |
| WO2019041640A1 (en) * | 2017-08-31 | 2019-03-07 | 广州视源电子科技股份有限公司 | Display device and extruded frame section structure thereof |
| CN111186191A (en) * | 2019-12-09 | 2020-05-22 | 上海传英信息技术有限公司 | Electronic equipment shell and manufacturing method thereof |
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|---|---|
| CN103313537B (en) | 2016-04-27 |
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