CN102623788A - Method for manufacturing antenna by applying IMF and laser engraving - Google Patents
Method for manufacturing antenna by applying IMF and laser engraving Download PDFInfo
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- CN102623788A CN102623788A CN2011100340781A CN201110034078A CN102623788A CN 102623788 A CN102623788 A CN 102623788A CN 2011100340781 A CN2011100340781 A CN 2011100340781A CN 201110034078 A CN201110034078 A CN 201110034078A CN 102623788 A CN102623788 A CN 102623788A
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Abstract
The invention provides a method for manufacturing an antenna by IMF and laser engraving. The whole manufacturing process comprises the following steps that: a film substrate utilized as a film substrate of a printed antenna is taken; with utilization of conducting materials, the map of the antenna is printed on the film substrate by screen printing so as to be utilized for transmission or receiving of a wireless signal by an electronic device; mould pressing is carried out on the film substrate to form a three-dimensional shape and trimming is carried out on the film substrate having been processed by the mould pressing according to a required appearance; and the film having been processed by the trimming is placed into a die to carry out ejection. According to the invention, laser engraving is applied; engraving and mould pressing are carried out on the antenna map on the formed film substrate; before casting, a conductive pin and a grounding pin of the antenna are adhered to the printed antenna or another half module in advance, so that installation of the conductive pin and the grounding pin can be completed during the casing process without the need to wait for completion of the finished product to carry out additionally installation. Therefore, the working hours can be shortened; a qualified rate is improved; and manufacturing cost is reduced.
Description
Technical field
The field of the invention relates to the antenna making technology of mobile communication device, and especially a kind of application in-mold decoration (IMF) and laser engraving are made the method for antenna.
Background technology
Because Information of Science and Technology is flourish, has driven the progress of wireless communication technology, mobile communication device becomes the indispensable tool of communications of modern.Therefore, the Mobile Communications functional requirement is also increased day by day.Because the necessary raising frequency of the electric wave of wireless telecommunications, carrier wave just can be effective multiplex (MUX) and transmit, so must just can carry out these actions by antenna.Therefore antenna is a considerable element in the wireless telecommunications system.Traditional antenna mainly is the antenna of external, as adopting the antenna of helical antenna or dipole pattern.Only the antenna of these styles is exposed at the outside of casing outward, thus be easy to lose, moreover also can make the volume of body increase.The antenna of recent use internally-arranged type slowly replaces traditional external antenna.Traditional built-in antenna mainly is the pattern of patch antenna, normally is made up of RF component and matrix fixed support thereof.RF component is metalwork or the flexible printed circuit board or the printed circuit board of definite shape.At present existing utilization IMF technology is as the technological concept of configuration antenna on the casing of communication device in action.
Use the IMF manufacture craft on casing, to make antenna, its method is summarized as follows: at first get a film substrate, as the film substrate of printed antenna, this base material of preferably is a plastic film.Be printed onto with electric conducting material on this base material with usefulness with the collection of illustrative plates of screen painting above the film substrate at this as electronic installation emission or reception wireless signal with antenna; Film substrate after then will printing is sent into the baking box oven dry to solidify this printing material; On this film substrate, punch then, with hole as this film substrate location.Afterwards this film substrate is positioned over thermoplastic on the hot pressing die, and pressurization or vacuumize and form three dimensional shapes (forming), this three dimensional shapes is the external form of casing.Plastic film after will being shaped is again done the whole edge processing of profile (trimming) with instrument, and the casing profile that cutting should three-dimensional is to remove unwanted casing external form skirt materials.Three-dimension film base material with the tool antenna pattern after the cutting is fitted in the mould.With the plastics injection mould of desiring to process electronic device housing.This plastics solidification postforming is a casing, and this film substrate has been attached on this casing outer surface, and printed antenna also has been covered by between casing plastics and this film.Just the operation of (forming) will make the antenna collection of illustrative plates that originally was printed on the film substrate be out of shape because heating and pressurizing is shaped in this manufacture craft, and cause the error on the size.
Because antenna must have the pin of pin and ground connection of feed-in electric current with the usefulness as current feed and signal conduction, notion in the past be in the die casting process in lead pin position first preformed hole position, and after casting, manage the electric conducting material in the intercommunicating pore position again.Just this mode will make the complicated and quality of manufacture craft be difficult for controlling.
Summary of the invention
The object of the invention is made the method for antenna for proposing a kind of application in-mold decoration (IMF) and laser engraving; After the technology of wherein using laser engraving can guarantee that film is through the step that is shaped; Antenna size of printing still can reach needed accuracy on it, it is hereby ensured the good signal quality.Moreover; Antenna conductive connecting pin and ground connection pin in advance glutinous (attaching) on the printed antenna or be seated on another half module before the mold; So can in the mold process, promptly accomplish the installation exercise of antenna conductive connecting pin and ground connection pin, install separately after needn't waiting finished product to accomplish, therefore can save man-hour; Improve qualification rate, reduce manufacturing cost.
For achieving the above object, the present invention provides a kind of application in-mold decoration (IMF) and laser engraving to make the method for antenna, comprises the following step: get the film substrate of a film substrate as printed antenna; Be printed onto with electric conducting material on this base material with usefulness with the collection of illustrative plates of screen painting above the film substrate at this as electronic installation emission or reception wireless signal with antenna; Film substrate after will printing is again sent into the baking box oven dry to solidify this printing material; Then on this film substrate, punch, as the film location hole; Afterwards with this film substrate with mold heated extrusion forming (forming), form three-dimensional casing shape; Film substrate after will being shaped is again done the whole edge processing of profile (trimming) with instrument; Because in the hot-forming process of plastic film; Extensional can be produced, printing antenna collection of illustrative plates distortion on it can be caused simultaneously, for making the size conforms design accuracy of antenna; The present invention uses laser engraving, and the antenna collection of illustrative plates on the film substrate behind the die forming is carved; Again film substrate is inserted afterwards and penetrate in the mould in addition injection molding.
Description of drawings
Fig. 1 shows film substrate sketch map of the present invention.
Fig. 2 shows that the present invention prints the sketch map to the film substrate with the antenna collection of illustrative plates.
Fig. 3 shows the sketch map that the present invention punches on film substrate.
Fig. 4 shows the position placement corresponding diagram of film substrate and hot pressing die.
Fig. 5 shows that the hot forming mould carries out the sketch map that heating and pressurizing is shaped to film substrate among the present invention.
Fig. 6 shows the sketch map of the whole edge processing mold of film substrate.
Fig. 7 shows step key diagram of the present invention.
The main element symbol description:
10 film substrates
Hole, 15 location
16 reference columns
20 antenna collection of illustrative plates
30 hot pressing dies
40 heaters
50 whole edge processing moulds.
Embodiment
Now sincerely form with regard to structure of the present invention, and the effect and the advantage that can produce, conjunction with figs. is lifted a preferred embodiment of the present invention and is described in detail as follows.
Must understand description and be only applicable to an example of the present invention, not be used to limit scope of the present invention.Protection scope of the present invention claims are confirmed.
Manufacture craft of the present invention mainly is that an antenna is printed on the plastic film with the mode of screen painting earlier; In being shaped this plastic film also after whole edge processing; Use the size that laser engraving is further portrayed this antenna that progresses greatly; Then plastic film is inserted and penetrated the injection molding that carries out casing of electronic apparatus in the mould, make antenna can be coated between casing and the plastic film.Explain that at present manufacture craft of the present invention is following:
At first get a film substrate 10, as the film substrate of printed antenna, this base material of preferably is a plastic film (step 101), can be film substrate sketch map of the present invention with reference to figure 1.
Film substrate is printed onto with electric conducting material on this base material 10 with the usefulness (step 102) as electronic installation emission or reception wireless signal with the collection of illustrative plates 20 of screen painting with antenna above the film substrate 10 at this after prebake conditions.Wherein this printing material can be conducting resinl or electroconductive resin, please refer to Fig. 2 and shows that the present invention prints the sketch map to the film substrate with the antenna collection of illustrative plates.
Punching on this film substrate 10, the hole, location 15 (step 104) with as this film substrate 10 please refer to Fig. 3 shows that the present invention punches on film substrate sketch map.
These film substrate 10 mold pressings are formed three dimensional shapes (forming) (step 105).This film substrate 10 is put on the hot pressing die 30 according to reference column 16 allocations on location hole 15 and the mould, makes that via 40 heating of the heater on the mould film substrate 10 is softening, please refer to Fig. 4, and Fig. 4 is positioned over the sketch map on the hot pressing die for film substrate.Then the film substrate 10 after the heating is pressed in hot pressing die 30; For example can adopt mould pressing pressurization, gas pressurized or vacuumize and make its shaping; Please refer to Fig. 5, for hot pressing die among the present invention carries out the sketch map that heating and pressurizing is shaped to film substrate.
In the process that is shaped; Because film substrate 10 can produce extensional in heat pressure forming process, so the antenna collection of illustrative plates 20 that printed originally on it also can and then produce distortion, among the present invention; Further use laser engraving; Antenna diagram on the hot forming rear film base material is carved, and obtaining accurate antenna pattern 20, and makes the radiation electric wave can reach predefined specification (step 107).Especially during high frequency,, can reach original designing requirement with the performance of guaranteeing antenna so necessarily require more accurate dimensions because wavelength is short.
Three-dimensional film base material behind the laser engraving is fitted into (step 108) in the mould.
Because antenna must have the pin of pin and ground connection of feed-in electric current with the usefulness as current feed and signal conduction; Notion in the past be in the die casting process prior to pin position reserving hole, after casting, just this two pin is connected with antenna through hole then.Just this mode makes that manufacture craft is complicated and the quality control is difficult.Among the present invention, conductive connecting pin and ground connection pin are used the silver slurry or conducting resinl is pasted in advance above printed antenna, perhaps can put this conductive connecting pin and ground connection pin (step 109) in advance on respect to another half module of putting film substrate.
With the two-half die matched moulds; With the plastics injection of desiring to process electronic device housing; The plastics solidification postforming is a casing, and this film substrate has been coated on the casing outer surface, and printed antenna then is coated between film substrate and the casing plastics; Conductive connecting pin and ground connection pin have then connected printed antenna, and are coated in the casing plastics.When using with the casing assembling electronic device, internal circuit and earth point that this conductive connecting pin and ground connection pin can connect electronic installation respectively give this antenna with supply of current and signal.
Among the present invention, this film substrate can be transparent, opaque or is printed on decorative pattern.
This antenna is between film substrate and casing in the embodiment shown in the preceding text.But the present invention is not limited to this structure, also can be that this antenna is positioned at the film substrate outer surface, and this all within the scope of the invention.
Mode of the present invention is applicable to various portable electronic devices, like mobile phone, and PDA, laptop computer etc.
Advantage of the present invention makes that for using the technology of laser engraving the printed antenna size on it still can reach design and go up needed accuracy, so can guarantee the good signal quality after the step of film substrate through shaping.Moreover; Being about to conductive connecting pin and ground connection pin before the mold uses silver slurry or conducting resinl in advance and pastes (attaching) in advance on the printed antenna or be seated on another half module; So can in the mold process, promptly accomplish the installation exercise of antenna conductive connecting pin and ground connection pin, install separately after needn't waiting finished product to accomplish, therefore can save man-hour; Promote qualification rate, reduce manufacturing cost.
In sum, the design of consideration of human natureization of the present invention quite meets actual demand.Its concrete improvement has disappearance now, obviously has breakthrough progressive advantage compared to prior art, the enhancement that has effect really, and non-being easy to reached.The present invention disclosed or was exposed on domestic and the external document and market, had met patent statute.Above-listed detailed description is specifying to one of the present invention possible embodiments; Just this embodiment is not in order to limit claim of the present invention; All do not break away from skill of the present invention spirit institute for it equivalence implement or change, all should be contained in the claim of the present invention.
Claims (10)
1. a method of using in-mold decoration and laser engraving manufacturing antenna is characterized in that, comprises step and is:
Get a film substrate, as the film substrate of printed antenna;
Using screen painting is printed onto on this film substrate the collection of illustrative plates of antenna as the electronic installation emission or receives the usefulness of wireless signal;
Film substrate after the printing is dried to solidify this printing material;
This film substrate hot pressing is formed three dimensional shapes;
Whole this three-dimensional film substrate of edge processing is to form needed profile;
Use laser engraving, the antenna collection of illustrative plates on the engraving three-dimension film base material to obtain accurate in size antenna pattern, makes the radiation electric wave reach predefined specification;
With whole edge processing and the three-dimension film base material behind laser engraving antenna collection of illustrative plates, be fitted in the mould; And with the two-half die matched moulds, then with the plastics injection mould of desiring to process electronic device housing; So these plastics are that a casing and this three-dimension film base material are coated on the casing in solidifying postforming, and antenna is formed between casing plastics and the film substrate.
2. according to the method for claim 1, it is characterized in that, before the step of matched moulds, conductive connecting pin and ground connection pin are used the silver slurry or conducting resinl is pasted on this printed antenna, with as antenna current feed-in pin and ground connection pin.
3. according to the method for claim 1, it is characterized in that, before the step of matched moulds, on another half module, put conductive connecting pin and ground connection pin in advance with respect to film substrate.
4. according to the method for claim 1, it is characterized in that hot forming adopts mould pressing, gas pressurized or vacuumizes and makes its shaping.
5. according to the method for claim 1, it is characterized in that whole edge processing with diel or laser cutting for it.
6. according to the method for claim 1, it is characterized in that the laser engraving step is put in order the edge first being processed after being arranged in compression molding.
7. according to the method for claim 1, it is characterized in that this antenna is between film substrate and casing plastics.
8. according to the method for claim 1, it is characterized in that this casing is the casing of portable electronic apparatus.
9. according to the method for claim 1, it is characterized in that, on this film substrate, be equipped with hole as the hole, location of this film substrate.
10. according to the method for claim 1, it is characterized in that this printing material is conducting resinl, electrically conductive ink or electroconductive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100340781A CN102623788A (en) | 2011-01-31 | 2011-01-31 | Method for manufacturing antenna by applying IMF and laser engraving |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100340781A CN102623788A (en) | 2011-01-31 | 2011-01-31 | Method for manufacturing antenna by applying IMF and laser engraving |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102623788A true CN102623788A (en) | 2012-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100340781A Pending CN102623788A (en) | 2011-01-31 | 2011-01-31 | Method for manufacturing antenna by applying IMF and laser engraving |
Country Status (1)
| Country | Link |
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| CN (1) | CN102623788A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300212A (en) * | 2013-07-19 | 2015-01-21 | 骏熠电子科技(昆山)有限公司 | Method for manufacturing antenna housing |
| CN106935965A (en) * | 2017-03-24 | 2017-07-07 | 苏州胜利精密制造科技股份有限公司 | A kind of housing and preparation technology with antenna decorating function |
| CN110350292A (en) * | 2019-06-24 | 2019-10-18 | 武汉中鼎智科物联网科技有限公司 | A kind of manufacturing method of environment-friendly type RFID label antenna |
| CN110784564A (en) * | 2018-07-31 | 2020-02-11 | 华为技术有限公司 | Mobile terminal and preparation method of antenna thereof |
-
2011
- 2011-01-31 CN CN2011100340781A patent/CN102623788A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300212A (en) * | 2013-07-19 | 2015-01-21 | 骏熠电子科技(昆山)有限公司 | Method for manufacturing antenna housing |
| CN106935965A (en) * | 2017-03-24 | 2017-07-07 | 苏州胜利精密制造科技股份有限公司 | A kind of housing and preparation technology with antenna decorating function |
| CN106935965B (en) * | 2017-03-24 | 2024-03-19 | 苏州胜利精密制造科技股份有限公司 | Shell with antenna decoration function and preparation process |
| CN110784564A (en) * | 2018-07-31 | 2020-02-11 | 华为技术有限公司 | Mobile terminal and preparation method of antenna thereof |
| CN110784564B (en) * | 2018-07-31 | 2021-09-14 | 华为技术有限公司 | Mobile terminal and preparation method of antenna thereof |
| US11450946B2 (en) | 2018-07-31 | 2022-09-20 | Huawei Technologies Co., Ltd. | Mobile terminal and mobile terminal antenna production method |
| US11831062B2 (en) | 2018-07-31 | 2023-11-28 | Huawei Technologies Co., Ltd. | Mobile device radiating antenna disposed on an inner side of an insulation rear housing |
| CN110350292A (en) * | 2019-06-24 | 2019-10-18 | 武汉中鼎智科物联网科技有限公司 | A kind of manufacturing method of environment-friendly type RFID label antenna |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: QINGDAO LONGBOW PLASTIC MOLD CO.,LTD. Free format text: FORMER OWNER: NEW ZEALAND QINGDAO LONGBOW ELECTRONICS CO., LTD. Effective date: 20130819 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 266555 QINGDAO, SHANDONG PROVINCE |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20130819 Address after: 266555 No. nine the Great Wall Road, Qingdao economic and Technological Development Zone, Shandong, China Applicant after: Qingdao Longbow Plastic Mold Co.,Ltd. Address before: New Zealand Oakland region with Tucker ray Sun Leijie, Henderson Lixiqi Street No. 14 Applicant before: Qingdao Longbow Electronics Co., Ltd. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120801 |