CN101115354A - Moulding circuit board and manufacturing method therefor - Google Patents
Moulding circuit board and manufacturing method therefor Download PDFInfo
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- CN101115354A CN101115354A CNA2006101090246A CN200610109024A CN101115354A CN 101115354 A CN101115354 A CN 101115354A CN A2006101090246 A CNA2006101090246 A CN A2006101090246A CN 200610109024 A CN200610109024 A CN 200610109024A CN 101115354 A CN101115354 A CN 101115354A
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- circuit
- electrically
- backing plate
- conductive backing
- manufacture method
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Abstract
A model made circuit board manufacturing method comprises steps that: a circuit is formed on a conductive substrate, the circuit comprises a first part and a second part that have a common plane; model press technique is adopted to lead the conductive substrate distorted, and the first part and the second part are translated into a non-common plane; the injection molding technique is adopted to cover the circuit and the conductive substrate by plastic, and the plastic is solidified; the conductive substrate is removed to lead the circuit to be exposed. The invention also provides the model made circuit board manufactured by the method.
Description
Technical field
The present invention is about a kind of moulding circuit board, and especially about a kind of moulding circuit board, its circuit has not coplanar first and second portion.
Background technology
The available circuit plate is the tabular rectangular object of rigidity normally.Though the sort circuit plate can make circuit or the electronic building brick on it that good supporting is arranged, the profile of its rigidity has the shortcoming that is difficult to cooperate the variation of product demand do.For example, as existing internal memory, display card, network card, sound card or the like, because its flat profile, the slot that need be provided with many long strip types on the motherboard is installed these spare parts, and therefore the configuration of circuit is restricted on the motherboard.As for motherboard itself, also normally flat circuit board, thus when carrying out design of electronic products, small-sized electronic product especially, the configuration of motherboard always makes the designer puzzle one's brains.
As mentioned above, this traditional flat circuit board because when assembling is relatively poor with the elasticity that product design changes, can not be applied on the compact electronic product gradually.Therefore, need more to save space, more resilient method,, solve existing problem so that the circuit board of innovation to be provided.
Summary of the invention
The invention provides a kind of moulding circuit board that utilizes mould pressing process, jetting formation process, reaches the transfer technique made.The circuit of the circuit board of manufacturing of the present invention can be not at grade, and the profile of circuit board also can have various variations, is not subject to classic flat-plate formula shape.Therefore, the present invention can make full use of the space for the designer, to improve the compact function of electronic product.In addition, circuit board of the present invention more can be directly as electronic product shell, and is like this then have more the advantage of saving space and material cost.
The present invention provides a kind of circuit board on the one hand, comprises: plastic base, and its profile is defined by ejection forming technique; And circuit, being embedded in the plastic base, this circuit has not coplanar first and second portion, and wherein, copline does not see through compression molding technology and forms.Plastic base of the present invention can be further used as the shell of electronic installation, the employed electronic product of electronic installation general reference ordinary consumer, for example various electrical home appliances, communication appliance and electronic, computer or the like.
The present invention provides the manufacture method of above-mentioned moulding circuit board on the other hand, comprises: electrically-conductive backing plate is provided; Form circuit on electrically-conductive backing plate, this circuit has coplanar first and second portion; Utilize first patrix and the first counterdie pressing electrically-conductive backing plate, make the electrically-conductive backing plate distortion, and change first and second portion into not copline; Utilize ejection forming technique,, and solidify these plastics to form plastic base with plastic covered electrically-conductive backing plate and circuit; And remove electrically-conductive backing plate.
The definition of the word of above-mentioned " copline " and " not copline " is shown in Figure 1A-1B.Figure 1A is the schematic diagram of existing flat circuit board 10, and wherein the first 12 of circuit 11 all is positioned on the same plane X with second portion 13, so first 12 and second portion 13 are " copline ".Figure 1B is the circuit board 10 ' through moulded section of the present invention, wherein then the position is on plane Y and plane Z inequality respectively for the first 12 ' of circuit 11 ' and second portion 13 ', so first 12 ' and second portion 13 ' are " not copline ".In other words, the judgement of this paper indication " copline " or " not copline " is with the whole sight of circuit board, but not with the profile topographical view of circuit board it.
Description of drawings
Figure 1A is the schematic diagram of existing flat circuit board;
Figure 1B is the schematic diagram of moulding circuit board of the present invention;
Fig. 2 to Figure 13 shows the first embodiment of the present invention with profile;
Figure 14 A to Figure 14 C shows the second embodiment of the present invention with profile;
Figure 15 A to Figure 15 C shows the third embodiment of the present invention with profile;
Figure 16 is for forming a plurality of moulding circuit boards in the schematic diagram of electrically-conductive backing plate;
Figure 17 is with the schematic diagram of moulding circuit board of the present invention as the casing of mobile phone.
The primary clustering symbol description
10,10 ' circuit board
11,11 ' circuit
12,12 ' first
13,13 ' second portion
X, Y, Z plane
20 electrically-conductive backing plates
21 planes
30 photoresists
40 circuits
41 protective layers
42 etch stop layers
401 firsts
402 second portions
70 adhesion layers
81 first patrixes
82 second patrixes
101 plastics
103 second patrixes
104 second counterdies
105 spaces
110 plastic bases
130 semiconductor subassemblies
140 moulding circuit boards
141 passive blocks
150 semiconductor subassemblies
160 moulding circuit boards
171 hand set machine shells
172 curved surfaces
173,174 surfaces
Embodiment
Below with reference to appended graphic demonstration the preferred embodiments of the present invention.Appended in graphic similar assembly adopt identical element numbers.Should note presenting the present invention for clear, appended each assembly in graphic is not the scale according to material object, and also omits existing spare part, associated materials and correlation processing technique thereof for avoiding fuzzy content of the present invention, below illustrating.
Fig. 2 to Figure 13 is first embodiment that makes moulding circuit board with the present invention of profile illustration.As shown in Figure 2, provide electrically-conductive backing plate 20, have plane 21.In this embodiment, electrically-conductive backing plate 20 mainly is the carrier when making as circuit, and it can be any electric conducting material and makes, for example steel plate or copper coin, and thickness also can optionally change arbitrarily.With this embodiment, electrically-conductive backing plate 20 thickness are preferably at about 0.075mm to 1mm.
Then, as shown in Figure 3, form a patterning photoresist 30 on the plane 21 of electrically-conductive backing plate 20, the method for formation can be utilized technology such as existing little shadow, impression or half tone.Then, as shown in Figure 4, be shielding with patterning photoresist 30, form a circuit 40 on electrically-conductive backing plate 20, can electroplate or other suitable method is carried out.Circuit 40 materials can be copper or any other suitable electric conducting material, and thickness is preferably between the 0.2mil to 2mil.It should be noted that as shown in Figure 4 circuit 40 comprises a first 401 and a second portion 402, first 401 all is positioned on the plane 21 with second portion, so first 401 and second portion 402 are " copline ".Circuit 40 can be shielding with patterning photoresist 30 equally after forming, and optionally forms a protective layer 41 in circuit 40 tops, can electroplate or other suitable method is carried out.Protective layer 41 is except can be used to protection circuit 40, makes outside it avoids going to pot in the subsequent technique, also can have good adhesive properties, with promote circuit 40 with to be connected afterwards layer binding.So, can select any suitable material to make protective layer 41 according to above-mentioned demand, its thickness preferably is thinner than circuit 40.Implement example at this point, preferably with nickeliferous material as protective layer 41, its thickness is extremely thin, so that the visual situation of designer is with its easy removal.
In addition, more as shown in Figure 4, before forming circuit 40, can be shielding optionally also with patterning photoresist 30, form an etch stop layer 42 on electrically-conductive backing plate 20, can electroplate or other suitable method is carried out.The usefulness that etch stop layer 42 is made is intended to, when follow-up will electrically-conductive backing plate 20 being removed with etching mode, but etch stop layer 42 protection circuits 40.The material of etch stop layer 42 can be nickel or any other suitable material, and thickness preferably is thinner than circuit 40, and is better extremely thin, so that the visual situation of designer is with its easy removal.
After finishing circuit 40 and optionally formed protective layer 41 and etch stop layer 42, can utilize existing etch process that photoresist 30 is removed, to form the structure of relief printing plate as shown in Figure 5.
Then, as shown in Figure 6, carry out a Technology for Heating Processing, softnessization electrically-conductive backing plate 20 and on circuit 40, in subsequent technique, produce the cracking phenomenon to prevent it.The selection of the temperature of Technology for Heating Processing can have different variations according to employed material.Implement example, heat treated temperature is preferably 300 ℃ to 400 ℃ scope at this point.
Then, as shown in Figure 7, apply an adhesion layer 70 and cover circuit 40 and protective layer 41.The main function of adhesion layer 70 is for promoting the binding of circuit 40 or protective layer 41 and the follow-up storeroom that will engage.The material of adhesion layer 70 can be any suitable material, and as epoxy resin or Polyimide etc., its thickness is also unrestricted, as long as can make circuit 40 or protective layer 41 form good binding with the follow-up material layer that will link.Should notice that this step also is optionally.If the follow-up material that will link can be directly and circuit 40 or protective layer 41 form good binding, this step can be omitted.
Then, as Fig. 8 and shown in Figure 9, utilize a compression molding technology with electrically-conductive backing plate 20 distortion, so that the first 401 of circuit 40 and second portion 402 change not copline into.In detail, the electrically-conductive backing plate 20 that contains circuit 40 can be seated between one first patrix 81 and one first counterdie 82, mat first patrix 81 and second patrix, 82 pressing electrically-conductive backing plates 20, make its distortion, and it is crooked that circuit 40 is produced, and promptly the first 401 of circuit 40 and second portion 402 change not copline into.The degree of crook of the shape of electrically-conductive backing plate 20 and circuit 40 depends on first patrix 81 and first counterdie 82 after the pressing.Present embodiment is with simple arch illustration first patrix 81 and first counterdie 82, right those who are familiar with this art should be appreciated that, according to the present invention,, can produce other not coplanar three-dimensional line pattern as long as change first patrix 81 and second patrix 82 easily.
Then,, can utilize an ejection forming technique, plastics 101 are combined with the circuit 40 of process pressing with reference to Figure 10 and Figure 11.In detail, as shown in figure 10, the electrically-conductive backing plate 20 that contains circuit 40 can be seated between one second patrix 103 and one second counterdie 104.Second patrix 103 and contain between the electrically-conductive backing plate 20 of circuit 40 and have a space 105 injects for plastics 101.Utilize gases at high pressure to make the plastics 101 of fusion fill up space 105 fast, to cover circuit 40, electrically-conductive backing plate 20 or optionally formed adhesion layer 70 and protective layer 41 etc.The material of plastics 101 can be any suitable material, adds fibre, transparent PVC, PEI, PPS, POM, PBT or PBT etc. as PC, PC.
Treat second patrix 103 and one second counterdie 104 to be removed after plastics 101 solidify, to form structure as shown in figure 11.Plastics 101 after the curing change plastic base 110 into, and can combine with circuit 40, support circuit 40 and the follow-up various electronic building bricks that may be formed at circuit 40 tops to replace electrically-conductive backing plate 20.In other words, see through above-mentioned ejection forming technique, circuit 40 is transferred to the plastic base 110 from electrically-conductive backing plate 20, so electrically-conductive backing plate 20 can remove in subsequent technique.In addition, the profile that should note plastic base 110 depends on second patrix 103.Present embodiment simply with second patrix 110 of arch as demonstration, right those who are familiar with this art should be appreciated that, according to the present invention, as long as change second patrix 103 easily, can produce the plastic base 110 with other various profiles.
As shown in figure 12, after plastic base 110 forms, electrically-conductive backing plate 20 can be removed, so that etch stop layer 42 or circuit 40 expose.The method that removes can be used existing etch process.The electrically-conductive backing plate 20 that should note present embodiment is Removing All as exemplary illustration, yet the part that also can keep electrically-conductive backing plate 20 if necessary is to make other purposes, and this also belongs to scope of the present invention.
Ensuing technology is on circuit 40 gold-plated or zinc-plated and coat the anti-solder ink (not shown).Then, as shown in figure 13, semiconductor assembly 130 can be connected on the circuit 40, it is linked to each other with first 401 and second portion 402 electricity, should note not copline of first 401 and second portion 402.
Figure 14 A to Figure 14 C illustration one second embodiment of the present invention.Compared to first embodiment, second embodiment also comprises the step of formation one passive block 141 on this electrically-conductive backing plate 20.This step is executed in circuit 40 and forms step (as Fig. 5) afterwards, and pressing electrically-conductive backing plate 20 steps (as Fig. 8) before.In detail, shown in Figure 14 A, form circuit 40 on electrically-conductive backing plate 20.Then, as shown in Figure 14B, utilize existing screen painting, gluing process or any other suitable technique, form a passive block 141, as resistance or electric capacity etc., on electrically-conductive backing plate 20 surfaces.The first 401 and the second portion 402 of circuit 40 can be used as electrode, and passive block 141 links to each other with its electricity.The material of passive block 141 can be to contain conductive particle and have flexual macromolecule thick film to be formed.After passive block 141 forms, can be as above-mentioned enforcement mold pressing and jetting formation process, and remove electrically-conductive backing plate 20, to form moulding circuit board 140 as Figure 14 C.It should be noted that when passive block 141 forms first 401 and second portion 402 are copline on electrically-conductive backing plate 20, and when implementing mould pressing process, just make first 401 and second portion 402 change non-copline into, and make passive block 141 produce bending simultaneously, shown in Figure 14 C.
Figure 15 A to Figure 15 C illustration one the 3rd embodiment of the present invention.Compared to first embodiment, the 3rd embodiment also comprises the step of formation semiconductor assembly 150 on this electrically-conductive backing plate 20.This step is executed in first patrix 81 and second patrix 82 pressing electrically-conductive backing plates, 20 steps (as Fig. 8) afterwards, carries out ejection forming technique (as Figure 10) before.In detail, shown in Figure 15 A, provide the electrically-conductive backing plate 20 once pressing, have circuit 40 on it, circuit 40 has not coplanar first 401 and second portion 402.Then, shown in Figure 15 B, with semiconductor assembly 150 glutinous being filled in the first 401 and second portion 402 of circuit 40.After semiconductor subassembly 150 glutinous dresses are finished, can implement, form a plastic base 110 and cover circuit 40 and semiconductor subassembly 150, and remove electrically-conductive backing plate 20, to form the structure shown in Figure 15 C as above-mentioned jetting formation process.
Figure 16 shows that the present invention can form a plurality of moulding circuit boards 160 simultaneously on an electrically-conductive backing plate 20.After treating that necessary step is finished, removable electrically-conductive backing plate 20, edge dotted line cutting as shown in figure 16 can obtain single moulding circuit board 160 again.
Figure 17 is applied to the example of the casing 171 of a mobile phone for the present invention.As shown in figure 17, inlay circuit 40 in the casing 171.Circuit 40 has not coplanar first 401 and second portion 402, this not copline be and utilize the above-mentioned compression molding technology of the present invention and form.In addition, Figure 17 also shows the semiconductor subassembly 130 that is installed on the curved surface 172, and is positioned at the passive block 141 on not coplanar surperficial 173 and surperficial 174.
The above is the preferred embodiments of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of being finished under the disclosed spirit and changes or modification, all should be included in the appended claim scope.
Claims (24)
1. the manufacture method of a moulding circuit board comprises:
Form circuit on electrically-conductive backing plate, this circuit has coplanar first and second portion;
Utilize first patrix and first this electrically-conductive backing plate of counterdie pressing, make this electrically-conductive backing plate distortion, and change this first and this second portion into not copline; And
Remove this electrically-conductive backing plate.
2. manufacture method as claimed in claim 1 wherein, before removing this electrically-conductive backing plate, also comprises and utilizes ejection forming technique, with this electrically-conductive backing plate and this circuit of plastic covered through pressing, and solidifies these plastics to form plastic base.
3. manufacture method as claimed in claim 2, wherein, the profile of this plastic base is defined by this ejection forming technique, and this plastic base is the shell of electronic installation.
4. manufacture method as claimed in claim 1 wherein, before the step of utilizing this first patrix and this this electrically-conductive backing plate of first counterdie pressing, also comprises the formation passive block on this electrically-conductive backing plate, and this passive block links to each other with this line electricity.
5. manufacture method as claimed in claim 2 wherein, before utilizing this ejection forming technique, also comprises the formation semiconductor subassembly on this circuit, and this semiconductor subassembly links to each other with this first and this second portion electricity.
6. manufacture method as claimed in claim 1 wherein, before the step of utilizing this first patrix and this this electrically-conductive backing plate of first counterdie pressing, also comprises this electrically-conductive backing plate that contains this circuit is heat-treated.
7. manufacture method as claimed in claim 1 wherein, before the step of utilizing this first patrix and this this electrically-conductive backing plate of first counterdie pressing, also comprises and applies organic adhesion layer and cover this circuit.
8. manufacture method as claimed in claim 2, wherein, utilize this ejection forming technique to comprise following steps:
The electrically-conductive backing plate that will contain this circuit is placed between second patrix and second counterdie;
Make these plastics inject this second patrix and contain space between this electrically-conductive backing plate of this circuit, wherein, this second patrix determines the profile of this plastic base.
9. manufacture method as claimed in claim 1 wherein, after removing the step of this electrically-conductive backing plate, also comprises semiconductor subassembly is connected on (bonding) this circuit, and this semiconductor subassembly links to each other with this first and this second portion electricity.
10. manufacture method as claimed in claim 1 wherein, forms the step of this circuit on this electrically-conductive backing plate and comprises:
Form the patterning photoresist on this electrically-conductive backing plate;
With this patterning photoresist is shielding, electroplates this circuit on this electrically-conductive backing plate; And
Remove this patterning photoresist.
11. manufacture method as claimed in claim 10 wherein, was being electroplated this circuit before the step on this electrically-conductive backing plate, also comprising with this patterning photoresist is shielding, electroplates etch stop layer on this electrically-conductive backing plate.
12. manufacture method as claimed in claim 10, wherein, after electroplating the step of this circuit on this electrically-conductive backing plate, also comprising with this patterning photoresist is shielding, and electro-cladding is on this circuit.
13. the manufacture method of the shell of an electronic installation is inlayed circuit in this shell, this method comprises:
Form this circuit on electrically-conductive backing plate, this circuit has coplanar first and second portion;
Utilize ejection forming technique, make this electrically-conductive backing plate of plastic covered and this circuit, and solidify these plastics to form shell; And
Remove this electrically-conductive backing plate.
14. manufacture method as claimed in claim 13, wherein, before utilizing this ejection forming technique, also comprise and utilize first patrix and first this electrically-conductive backing plate of counterdie pressing, make this electrically-conductive backing plate distortion, and change this first and this second portion into not copline.
15. manufacture method as claimed in claim 13, wherein, this ejection forming technique comprises following steps:
The electrically-conductive backing plate that will contain this circuit is placed between second patrix and second counterdie;
Make this second patrix and contain between this electrically-conductive backing plate of this circuit to have the space, inject for these plastics, wherein, this second patrix determines the profile of this shell.
16. manufacture method as claimed in claim 13 wherein, before utilizing this ejection forming technique, also comprises the formation passive block on this electrically-conductive backing plate, this passive block links to each other with this line electricity.
17. manufacture method as claimed in claim 13 wherein, before utilizing this ejection forming technique, also comprises and applies organic adhesion layer on this circuit.
18. manufacture method as claimed in claim 13 wherein, before utilizing this ejection forming technique, also comprises the formation semiconductor subassembly on this circuit, this semiconductor subassembly links to each other with this first and this second portion electricity.
19. manufacture method as claimed in claim 13 wherein, before utilizing this ejection forming technique, also comprises this electrically-conductive backing plate that contains this circuit is heat-treated.
20. manufacture method as claimed in claim 13 wherein, after removing the step of this electrically-conductive backing plate, also comprises semiconductor subassembly is connected on (bonding) this circuit, this semiconductor subassembly links to each other with this first and this second portion electricity.
21. a circuit board comprises:
Plastic base, the profile of this plastic base is defined by ejection forming technique; And
Circuit is embedded in this plastic base, and this circuit has not coplanar first and second portion, and wherein, compression molding technology is passed through in this not coplanar formation.
22. circuit board as claimed in claim 21, wherein, this plastic base is the shell of electronic installation.
23. circuit board as claimed in claim 21 wherein, also comprises semiconductor subassembly in this plastic base, link to each other with this first and second portion electricity.
24. circuit board as claimed in claim 21 also comprises organic adhesion layer between this circuit and this plastic base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101090246A CN101115354B (en) | 2006-07-25 | 2006-07-25 | Moulding circuit board and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101090246A CN101115354B (en) | 2006-07-25 | 2006-07-25 | Moulding circuit board and manufacturing method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101115354A true CN101115354A (en) | 2008-01-30 |
| CN101115354B CN101115354B (en) | 2010-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101090246A Expired - Fee Related CN101115354B (en) | 2006-07-25 | 2006-07-25 | Moulding circuit board and manufacturing method therefor |
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| Country | Link |
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| CN (1) | CN101115354B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104103674A (en) * | 2014-08-04 | 2014-10-15 | 石益坚 | Capacitive driving electroluminescence display and manufacturing method thereof |
| CN104600022A (en) * | 2013-10-30 | 2015-05-06 | 泉州市金太阳照明科技有限公司 | Method for manufacturing interconnect circuit |
| CN105792549A (en) * | 2014-12-26 | 2016-07-20 | 宏达国际电子股份有限公司 | Electronic device and manufacturing method thereof |
| CN108337814A (en) * | 2018-01-04 | 2018-07-27 | 瑞声科技(新加坡)有限公司 | The production method and wiring board of wiring board |
| CN109743845A (en) * | 2019-03-06 | 2019-05-10 | 宁波舜宇光电信息有限公司 | Molded circuit board and preparation method thereof, molded circuit board semi-finished product |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4944908A (en) * | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
| CN1234261C (en) * | 2002-09-13 | 2005-12-28 | 联测科技股份有限公司 | Method for mfg. circuit board |
-
2006
- 2006-07-25 CN CN2006101090246A patent/CN101115354B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600022A (en) * | 2013-10-30 | 2015-05-06 | 泉州市金太阳照明科技有限公司 | Method for manufacturing interconnect circuit |
| CN104103674A (en) * | 2014-08-04 | 2014-10-15 | 石益坚 | Capacitive driving electroluminescence display and manufacturing method thereof |
| CN104103674B (en) * | 2014-08-04 | 2017-04-12 | 石益坚 | Capacitive driving electroluminescence display and manufacturing method thereof |
| CN105792549A (en) * | 2014-12-26 | 2016-07-20 | 宏达国际电子股份有限公司 | Electronic device and manufacturing method thereof |
| CN108337814A (en) * | 2018-01-04 | 2018-07-27 | 瑞声科技(新加坡)有限公司 | The production method and wiring board of wiring board |
| CN109743845A (en) * | 2019-03-06 | 2019-05-10 | 宁波舜宇光电信息有限公司 | Molded circuit board and preparation method thereof, molded circuit board semi-finished product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101115354B (en) | 2010-11-17 |
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