Summary of the invention
The present invention, in order to above technical problem, gives the LED tubular lamp of a kind of heat transfer substrate from clamping.
A kind of radiator for LED tubular lamp of the present invention, comprises heat sink body, heat transfer substrate installation portion, and described heat transfer substrate installation portion is connected with described heat sink body, and the cross section of described heat sink body is hollow half arc body; It is characterized in that: described heat transfer substrate installation portion has a strip-shaped clamp groove for holding heat transfer substrate formed by the heat transfer bottom surface of two T-shaped snap fits of described heat transfer substrate installation portion, described heat sink body.
According to the above-described radiator for LED tubular lamp, preferably: the elastic deformability of the support cylinder of described two T-shaped snap fits makes the position of the pinching end opposing heat transfer bottom surface of described two T-shaped snap fits to adjust.
According to the above-described radiator for LED tubular lamp, preferably: described heat transfer bottom surface has a boss bottom surface.
According to the above-described radiator for LED tubular lamp, preferably: two T-shaped snap fits of described heat transfer substrate installation portion are symmetricly set on heat sink body bottom surface.
According to the above-described radiator for LED tubular lamp, preferably: the boss bottom surface of described heat transfer substrate installation portion is parallel with the pinching end of two T-shaped snap fits of heat transfer substrate installation portion.
According to the above-described radiator for LED tubular lamp, preferably: on described T-shaped snap fit, the length of force side is greater than the length of pinching end.
According to the above-described radiator for LED tubular lamp, preferably: on the boss bottom surface of described heat transfer substrate installation portion and heat transfer substrate installation portion two T-shaped snap fits pinching end between vertical range be less than the thickness being arranged on heat transfer substrate in strip-shaped clamp groove.
According to the above-described radiator for LED tubular lamp, preferably: the pinching end of described two T-shaped snap fits has angle with the boss bottom surface of described heat transfer substrate installation portion respectively.
A kind of heat transfer substrate of above-described radiator that uses of the present invention is from the LED tubular lamp of clamping, and described LED tubular lamp comprises heat sink body, heat transfer substrate installation portion, heat transfer substrate, lampshade and end cap; Described end cap is arranged on the described lamp tube ends be made up of heat sink body, heat transfer substrate installation portion, heat transfer substrate and lampshade; It is characterized in that: described heat transfer substrate relies on the elasticity predeformation power of heat transfer substrate installation portion two T-shaped snap fits to be fixed in strip-shaped clamp groove.
According to the LED tubular lamp of above-described heat transfer substrate from clamping, preferably: the LED chip mounting plane of heat transfer substrate and the pinching end clamped contact of heat transfer substrate installation portion two T-shaped snap fits.
According to the LED tubular lamp of above-described heat transfer substrate from clamping, preferably: plane-plane contact at the bottom of the boss on the heat transfer plane of heat transfer substrate and heat sink body bottom surface.
According to the LED tubular lamp of above-described heat transfer substrate from clamping, preferably: the width of described strip-shaped clamp groove is greater than heat transfer substrate width.
In the LED luminescence chip course of work of heat transfer substrate of the present invention in the LED tubular lamp of clamping, the luminous heat produced passes to heat sink body by heat transfer substrate, and the fin that heat passes to heat sink body by close-connected three faces of heat sink body (boss bottom surface, two pinching ends), the heat adopted from heat transfer substrate can be arranged by heat sink body extrados or smooth heat sink body extrados are dispersed in air.Because heat sink body and heat transfer substrate installation portion together constitute whole radiator, the heat that boss bottom surface absorbs from heat transfer substrate at most, the heat that absorbs from the relative boss bottom surface of heat that heat transfer substrate absorbs from heat transfer substrate of two pinching ends lacks.
When heat transfer substrate self-clamp type LED tubular lamp of the present invention is in confined state, two T-shaped snap fits of heat transfer substrate installation portion can rely on the elastic deformation force of himself to be clamped in tightly by heat transfer substrate in the strip-shaped clamp groove of heat transfer substrate installation portion, achieve the boss bottom surface of heat transfer substrate and heat transfer substrate installation portion, two pinching end close contacts, can ensure that heat passes to radiator by heat transfer substrate and the close-connected boss bottom surface of heat sink body or two pinching ends.Clamped contact is realized with the boss bottom surface of heat transfer substrate installation portion and two pinching ends, three faces in the strip-shaped clamp groove that the heat transfer substrate of heat transfer substrate self-clamp type LED tubular lamp of the present invention is fastened on heat transfer substrate installation portion, heat transfer substrate self-clamp type LED tubular lamp of the present invention can improve heat transfer efficiency, avoids heat transfer substrate generation thermal deformation.
Heat transfer substrate self-clamp type LED tubular lamp of the present invention is owing to being limited by the restriction of fluorescent tube length, the real area of the boss bottom surface of heat transfer substrate installation portion is less than the base area of heat transfer substrate installation portion strip-shaped clamp groove, can ensure that the boss bottom surface of heat transfer substrate installation portion has higher flatness and linearity like this.The boss bottom surface of heat transfer substrate installation portion has higher flatness and linearity, and heat transfer substrate also has higher flatness and linearity, can ensure that the boss bottom surface of heat transfer substrate installation portion and heat transfer substrate are in close contact all the time.
In the strip-shaped clamp groove that radiator of the present invention relies on self-tightening power to be fixedly clamped thereon by heat transfer substrate, heat transfer substrate utilizes in the strip-shaped clamp groove realized at radiator from clamping action of radiator and is fixedly clamped, and radiating effect is better.The heat that the heat of heat transfer substrate is shed by the face contacted with radiator, heat transfer substrate produces can directly conduct to radiator, radiator again by conduct heat away in air.The thermal conductive surface of heat transfer substrate of the present invention is fitted on a heat sink all the time, and the heat dispersion of fluorescent tube is better, and heat transfer substrate can realize three-dimensional heat radiation, and radiating efficiency is higher.
In the assembling process of heat transfer substrate of the present invention and radiator, can realize the Automated assembly of heat transfer substrate and radiator, operating efficiency is very high.The present invention can use automation equipment to carry out Automated assembly, higher than the efficiency of Traditional Man mounting means doubly a lot.The present invention also can adopt manual type to assemble, and efficiency of assembling still exceeds doubly a lot than traditional approach.
The structure of fluorescent tube of the present invention is more simple, and do not need in fluorescent tube assembling process to use screw that heat transfer substrate is on a heat sink fastening, this greatly simplifies assembly technology, the suitable dress of fluorescent tube is very good, is conducive to Automated assembly.Efficiently solve heat transfer substrate and radiator in prior art and cause the thermal deformation problem of heat transfer substrate in Long contact time, can ensure that heat transfer substrate and radiator are in all the time and contact completely, avoid the generation of heat transfer substrate thermal deformation, advantageously in heat radiation.Heat transfer substrate of the present invention contacts with the boss bottom surface of radiator all the time, and radiator plays clamping action to heat transfer substrate.
Do not need in fluorescent tube assembling process of the present invention to use heat-conducting glue, so greatly save heat-conducting glue material, simplify technological process, reduce production cost.Have certain pollution in the process of producing due to heat-conducting glue and use, present invention omits the effect using the operation of heat conductive silica gel can obtain protection of the environment.
Detailed description of the invention
A kind of preferred embodiment 1
Fig. 2 is the first radiator view of heat transfer substrate self-clamp type LED tubular lamp of the present invention; Fig. 3 is the first radiator stereogram one of heat transfer substrate self-clamp type LED tubular lamp of the present invention; Fig. 4 is the first radiator view two of heat transfer substrate self-clamp type LED tubular lamp of the present invention; Fig. 5 be heat transfer substrate self-clamp type LED tubular lamp of the present invention the first radiator on the schematic diagram after heat transfer substrate is installed; Fig. 7 be heat transfer substrate self-clamp type LED tubular lamp of the present invention the first radiator on the structural representation after heat transfer substrate and lampshade is installed.
The radiator that the present embodiment provides comprises heat sink body 1 and the heat transfer substrate installation portion 2 of bar shaped, the cross section of heat sink body 1 is arc radiating surface, heat transfer substrate installation portion 2 is positioned on the bottom surface of heat sink body 1, and heat transfer substrate installation portion 2 has the strip-shaped clamp groove 21 for installing heat transfer substrate 3.Radiator for LED tubular lamp of the present invention, comprise heat sink body 1, heat transfer substrate installation portion 2, the cross section of heat sink body 1 is similar hollow semi-cylindrical, the extrados of heat sink body 1 can be arranged the fin of zigzag or rectangle, heat transfer substrate installation portion 2 is connected with the bottom surface of heat sink body 1, and heat transfer substrate installation portion 2 has the strip-shaped clamp groove 21 for installing heat transfer substrate 3.Heat sink body 1 is hollow structure, can alleviate the weight of radiator and can reduce material cost; The zigzag that the extrados of heat sink body 1 is arranged or the fin of rectangle can increasing heat radiation areas improve radiating efficiency.
The radiator be made up of heat sink body 1 and heat transfer substrate installation portion 2 can adopt aluminum alloy materials to be made, adopt the radiator of aluminum alloy materials making can alleviate the weight of himself, and due to the radiating efficiency in the radiator course of work can be improved the while that aluminium alloy having excellent heat conductivility.
The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 is formed by the support cylinder 243 of pinching end 241, two T-shaped snap fits 24 of two T-shaped snap fits 24, the bottom surface of heat sink body 1; The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 is for installing heat transfer substrate 2.The cross section of strip-shaped clamp groove 21 can be opening elongated rectangular shape, namely the bottom surface that the top of strip-shaped clamp groove 21 is equivalent to the bottom surface (or bottom surface of heat sink body 1) of strip-shaped clamp groove 21, strip-shaped clamp groove 21 has two T-shaped snap fits 24, between bottom surface (i.e. the bottom surface of heat sink body 1) that heat transfer substrate 3 is arranged on strip-shaped clamp groove 21 and the pinching end 241 of two T-shaped snap fits 24, the LED chip mounting plane 31 of heat transfer substrate 3 contacts with the pinching end 241 of T-shaped snap fit 24, the heat transfer plane 32 of heat transfer substrate 3 is near the bottom surface of strip-shaped clamp groove 21; The width of strip-shaped clamp groove 21 is greater than the width being arranged on heat transfer substrate 3 in strip-shaped clamp groove 21, meets the morpheme dimensional requirement that heat transfer substrate 3 assembles in strip-shaped clamp groove 21.
Can there be a boss bottom surface 22 bottom surface (i.e. the bottom surface of strip-shaped clamp groove 21) of heat sink body 1, and boss bottom surface 22 is along the bar shaped boss on strip-shaped clamp groove 21 length direction.The pinching end 241 of two T-shaped snap fits 24 of heat transfer substrate installation portion 2 is symmetrical arranged, and the boss bottom surface 22 of heat transfer substrate installation portion 2 is parallel with the pinching end 241 of two T-shaped snap fits 24 of heat transfer substrate installation portion 2.
Boss bottom surface 22 on strip-shaped clamp groove 21 bottom surface is for abutting the heat transfer plane 32 of heat transfer substrate 3, after installing heat transfer substrate 3 in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, two T-shaped snap fits 24 hold out against the two ends of the LED chip mounting plane 31 at heat transfer substrate 3, the heat transfer plane 32 of heat transfer substrate 3 holds out against on boss bottom surface 22, and the heat transfer substrate 3 be arranged in strip-shaped clamp groove 21 is installed in strip-shaped clamp groove 21 tightly.Elasticity denaturation power is applied by giving two T-shaped snap fits 24, the LED chip mounting plane 31 of heat transfer substrate 3 realizes face closely with the pinching end 241 of two T-shaped snap fits 24 and contacts, heat transfer plane 32 and the boss bottom surface 22 of heat transfer substrate 3 realize face closely and contact, and make the heat transfer plane 32 of heat transfer substrate 3 and LED chip mounting plane 31 all realize face completely with the strip-shaped clamp groove 21 of heat transfer substrate 3 installation portion and contact.
The LED chip that the LED chip mounting plane 31 of heat transfer substrate 3 is installed is in the axis place of LED chip mounting plane 31, and the heat that LED chip produces concentrates on along the midline of LED chip mounting plane 31 length, heat flow density herein maximum mostly.When radiator is in running order, the region maximum with heat flow density in heat transfer substrate 3, bar shaped boss bottom surface 22 directly contacts, can guarantee that the heat that LED chip produces effectively passes to radiator by heat transfer substrate 3 like this.
On the boss bottom surface 22 of heat transfer substrate installation portion 2 and heat transfer substrate installation portion 2 two T-shaped snap fits 24 pinching end 241 between vertical range be less than the thickness being arranged on heat transfer substrate 3 in strip-shaped clamp groove 21.When being provided with heat transfer substrate 3 in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, under the acting in conjunction of two T-shaped snap fit 24 elastic restoring forces and boss bottom surface 22 holding power, there is small elastic deformation by producing at the end positions place contacted with two T-shaped snap fits 24 towards direction, boss bottom surface 22 in heat transfer substrate 3; After the small elastic deformation that heat transfer substrate 3 produces under the effect of two T-shaped snap fit 24 elastic restoring forces, heat transfer plane 32 and the boss bottom surface 22 of heat transfer substrate 3 can realize complete face and contact, and the LED chip mounting plane 31 of heat transfer substrate 3 can realize complete face with the pinching end 241 of two T-shaped snap fits 24 and contact; Strip-shaped clamp groove 21 installs heat transfer substrate 3, and the pinching end 241 of heat transfer plane 32 and strip-shaped clamp groove 21 boss bottom surface 22, LED chip mounting plane 31 and two T-shaped snap fits 24 realizes clamped contact simultaneously.
On T-shaped snap fit 24, the length of force side 242 can be greater than the length of pinching end 241, the support cylinder 243 of T-shaped snap fit 24, force side 242 and pinching end 241 are equivalent to a lever, the fulcrum that length is equivalent to two arm of forces of lever, support cylinder 243 is equivalent to lever of force side 242 and pinching end 241.The process that heat transfer substrate 3 is installed in strip-shaped clamp groove 21, the force side 242 of the T-shaped snap fit 24 of both sides applies two smaller upwards active forces respectively, can cause two T-shaped snap fits 24 that small elastic deformation occurs causing the real space of strip-shaped clamp groove 21 to increase to hold heat transfer substrate 3.
The process that heat transfer substrate 3 is installed in strip-shaped clamp groove 21 is as follows:
The first step be outwards pull the T-shaped snap fit 24 (namely apply towards the active force in direction, heat sink body 1 bottom surface on the force side 242 of two T-shaped snap fits 24, make two T-shaped snap fits 24 produce micro-strain) of two strip-shaped clamp groove 21, there is small elastic deformation and cause the actual volume of strip-shaped clamp groove 21 to increase in two T-shaped snap fits 24;
Second step is can penetrate into strip-shaped clamp groove 21 by heat transfer substrate 3 from the side mouth of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 by robot apparatus or manual type;
3rd step be install heat transfer substrate 3 in strip-shaped clamp groove 21 after, remove the external force be applied on two T-shaped snap fits 24, heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 by T-shaped snap fit 24 under the effect of elastic restoring force;
4th step is that two T-shaped snap fits 24 are under elastic restoring force effect, the heat transfer plane 32 of heat transfer substrate 3 and boss bottom surface 22 are realized, and face contacts, the two ends of the LED chip mounting plane 31 of heat transfer substrate 3 realize face with the pinching end 241 of two T-shaped snap fits 24 respectively and contact, and makes the upper and lower surface of heat transfer substrate 3 all realize clamped contact with strip-shaped clamp groove 21.
Fig. 6 is the light fixture schematic diagram of heat transfer substrate self-clamp type LED tubular lamp of the present invention, and the LED lamp that the present embodiment provides comprises radiator, heat transfer substrate 3, end cap 5 and lampshade 4.Heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 of radiator, and lampshade 4 is located on heat transfer substrate 3, and end cap 5 is coated on the two ends of the fluorescent tube be made up of radiator 2, heat transfer substrate 3 and lampshade 4, and lampshade 4 can be fastened on the draw-in groove of radiator 2 two ends.
Heat transfer substrate of the present invention comprises heat sink body 1, heat transfer substrate installation portion 2, heat transfer substrate 3, lampshade 4 and end cap 5 from the LED tubular lamp of clamping; End cap 5 is arranged on the lamp tube ends be made up of heat sink body 1, heat transfer substrate installation portion 2, heat transfer substrate 3 and lampshade 4; Heat transfer substrate 3 relies on the elasticity predeformation power of heat transfer substrate installation portion 2 two T-shaped snap fits 24 to be fixed in strip-shaped clamp groove 21.
The pinching end 241 of LED chip mounting plane 31 and heat transfer substrate installation portion 2 two T-shaped snap fits 24 of heat transfer substrate 3 contacts.The heat transfer plane 32 of heat transfer substrate 3 contacts with 22, boss bottom surface on heat sink body 1 bottom surface.
In actual applications, when after the LED chip energising on heat transfer substrate 3, the heat that LED chip produces passes to the fin on heat sink body 1 by the pinching end 241 of boss bottom surface 22 and two T-shaped snap fits 24, the fin on heat sink body 1 distributes heat in air again.
The radiator that the present embodiment provides, owing to being provided with strip-shaped clamp groove 21 on heat transfer substrate installation portion 2, can heat transfer substrate 3 be fastened in strip-shaped clamp groove 21, no longer need by screw, heat transfer substrate 3 to be fixed on a heat sink, thus efficiency of assembling is high, can meet the requirement that automation is produced fast, and heat transfer substrate card 3 to be located in strip-shaped clamp groove 21 and to contact with multiple of strip-shaped clamp groove 21, thus can improve radiating efficiency, avoid heat transfer substrate 3 that thermal deformation occurs.
The LED lamp that the present embodiment provides, owing to being provided with strip-shaped clamp groove 21 on heat transfer substrate installation portion 2, can heat transfer substrate 3 be fastened in strip-shaped clamp groove 21, no longer need by screw, heat transfer substrate 3 to be fixed on a heat sink, thus efficiency of assembling high energy meets the requirement that automation is produced fast, heat transfer substrate 3 to be fastened in strip-shaped clamp groove 21 and to contact with multiple of strip-shaped clamp groove 21, thus can improve radiating efficiency, avoid heat transfer substrate 3 that thermal deformation occurs.
The lamp body heat transfer flow process of heat transfer substrate self-clamp type LED tubular lamp of the present invention: the fin that the heat that the heat come from heat transfer substrate 3 comes by passing to heat sink body 1 with close-connected three faces of heat sink body 1 (22, two, boss bottom surface pinching end 241), from heat transfer substrate 3 can arrange zigzag or rectangle by heat sink body 1 extrados is dispersed in air.Because heat sink body 1 and heat transfer substrate installation portion 2 together constitute whole radiator, the heat that boss bottom surface 22 absorbs from heat transfer substrate 3 at most, the heat that absorbs from the relative boss bottom surface 22 of heat that heat transfer substrate 3 absorbs from heat transfer substrate 3 of two pinching ends 241 lacks.
When heat transfer substrate self-clamp type LED tubular lamp of the present invention is in confined state, two T-shaped snap fits 24 of heat transfer substrate installation portion 2 can rely on the elastic deformation force of himself only to be stepped up by heat transfer substrate 3 in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, achieve heat transfer substrate 3 and contact with 22, two, boss bottom surface pinching end 241 complete face of heat transfer substrate installation portion 2.
Due in the strip-shaped clamp groove that the heat transfer substrate 3 of heat transfer substrate self-clamp type LED tubular lamp of the present invention is fastened on heat transfer substrate installation portion 2 21 and realize face completely with 241 3 faces in boss bottom surface 22 and two pinching ends of heat transfer substrate installation portion 2 and contact, thus heat transfer substrate self-clamp type LED tubular lamp of the present invention can improve heat transfer efficiency, avoids heat transfer substrate 3 that thermal deformation occurs.
Owing to being limited by the length restriction of heat transfer substrate self-clamp type LED tubular lamp of the present invention, the real area of the boss bottom surface 22 of heat transfer substrate installation portion 2 is less than the bottom surface of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, can ensure that the boss bottom surface 22 of heat transfer substrate installation portion 2 has higher flatness and linearity like this.The boss bottom surface 22 of heat transfer substrate installation portion 2 has higher flatness and linearity, and heat transfer substrate 3 also has higher flatness and linearity, can ensure that the boss bottom surface 22 of heat transfer substrate installation portion 2 is in close contact all the time with heat transfer substrate 3.
A kind of preferred embodiment 2
The second radiator view one of Fig. 8 heat transfer substrate self-clamp type of the present invention LED tubular lamp; Fig. 9 be heat transfer substrate self-clamp type LED tubular lamp of the present invention the second radiator on the structural representation after heat transfer substrate is installed; Figure 10 be heat transfer substrate self-clamp type LED tubular lamp of the present invention the second radiator on the structural representation after heat transfer substrate and lampshade is installed; The second radiator view two of Figure 11 heat transfer substrate self-clamp type of the present invention LED tubular lamp; Figure 12 is the second radiator stereogram of heat transfer substrate self-clamp type LED spot of the present invention.
The radiator that the present embodiment provides comprises heat sink body 1 and the heat transfer substrate installation portion 2 of bar shaped, the cross section of heat sink body 1 is arc radiating surface, heat transfer substrate installation portion 2 is positioned on the bottom surface of heat sink body 1, and heat transfer substrate installation portion 2 has the strip-shaped clamp groove 21 for installing heat transfer substrate 3.Radiator for LED tubular lamp of the present invention, comprise heat sink body 1, heat transfer substrate installation portion 2, the cross section of heat sink body 1 is similar hollow semi-cylindrical, the extrados of heat sink body 1 is not arranged the fin of zigzag in preferred embodiment 1 or rectangle, heat transfer substrate installation portion 2 is connected with the bottom surface of heat sink body 1, and heat transfer substrate installation portion 2 has the strip-shaped clamp groove 21 for installing heat transfer substrate 3.Heat sink body 1 is hollow structure, can alleviate the weight of radiator and can reduce material cost; The extrados of heat sink body 1 directly contacts with air equally can increasing heat radiation area improve the effect of radiating efficiency.
The radiator be made up of heat sink body 1 heat transfer substrate installation portion 2 can adopt aluminum alloy materials to be made, the radiator adopting aluminum alloy materials to make can alleviate the weight of himself, and can ensure to have higher radiating efficiency in the radiator course of work because aluminium alloy has excellent heat conductivility simultaneously.
The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 is formed by the support cylinder 243 of pinching end 241, two T-shaped snap fits 24 of two T-shaped snap fits 24, the bottom surface of heat sink body 1; The strip-shaped clamp groove 21 of radiator heat transfer substrate installation portion 2 is provided with the heat transfer substrate 2 of LED chip for being installed.The cross section of strip-shaped clamp groove 21 is opening elongated rectangular shape, and the bottom surface that namely top of strip-shaped clamp groove 21 is equivalent to the bottom surface (or bottom surface of heat sink body 1) of strip-shaped clamp groove 21, strip-shaped clamp groove 21 has two T-shaped snap fits 24.Heat transfer substrate 3 is arranged between the bottom surface (i.e. the bottom surface of heat sink body 1) of strip-shaped clamp groove 21 and the pinching end 241 of two T-shaped snap fits 24, and the LED chip mounting plane 31 of heat transfer substrate 3 contacts with the pinching end 241 of T-shaped snap fit 24, the heat transfer plane 32 of heat transfer substrate 3 is near the bottom surface of strip-shaped clamp groove 21.The length of strip-shaped clamp groove 21 is consistent with the length being arranged on heat transfer substrate 3 in strip-shaped clamp groove 21, the width of strip-shaped clamp groove 21 is greater than the width being arranged on heat transfer substrate 3 in strip-shaped clamp groove 21, meets the morpheme dimensional requirement that heat transfer substrate 3 assembles in strip-shaped clamp groove 21.
Can there be a boss bottom surface 22 bottom surface (i.e. the bottom surface of strip-shaped clamp groove 21) of heat sink body 1, and boss bottom surface 22 is along the bar shaped boss on strip-shaped clamp groove 21 length direction.The pinching end 241 of two T-shaped snap fits 24 of heat transfer substrate installation portion 2 is symmetrical arranged, and the boss bottom surface 22 of heat transfer substrate installation portion 2 can be parallel with the pinching end 241 of two of a heat transfer substrate installation portion 2 T-shaped snap fit 24.Boss bottom surface 22 is arranged along the Central Symmetry of radiator cross section, and two T-shaped snap fits 24 are also all arrange along the Central Symmetry of radiator cross section.
After radiator installs heat transfer substrate 3, boss bottom surface 22 in strip-shaped clamp groove 21 is for abutting the heat transfer plane 32 of heat transfer substrate 3, after heat transfer substrate 3 being installed in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, two T-shaped snap fits 24 hold out against the LED chip mounting plane 31 at heat transfer substrate 3 two-end part, under the elastic acting force of two T-shaped snap fits 24, the heat transfer plane 32 of heat transfer substrate 3 is tightly fitted on boss bottom surface 22, heat transfer substrate 3 is installed in strip-shaped clamp groove 21 tightly.Elasticity denaturation power is applied by giving two T-shaped snap fits 24, the LED chip mounting plane 31 of heat transfer substrate 3 realizes contacting closely with the pinching end 241 of two T-shaped snap fits 24, heat transfer plane 32 and the boss bottom surface 22 of heat transfer substrate 3 realize face closely and contact, and make the heat transfer plane 32 of heat transfer substrate 3 and LED chip mounting plane 31 all realize contacting completely with the strip-shaped clamp groove 21 of heat transfer substrate 3 installation portion.
The LED chip that the LED chip mounting plane 31 of heat transfer substrate 3 is installed is in the medium line place of LED chip mounting plane 31, and the heat that LED chip produces concentrates on along the midline of LED chip mounting plane 31 length, heat flow density herein maximum mostly.Be provided with the LED tubular lamp of radiator in running order time, the region that the boss bottom surface 22 of elongate in shape is maximum with heat flow density in heat transfer substrate 3 directly contacts, can guarantee that the heat that LED chip produces effectively passes to radiator by heat transfer substrate 3 like this.
On the boss bottom surface 22 of heat transfer substrate installation portion 2 and heat transfer substrate installation portion 2 two T-shaped snap fits 24 pinching end 241 between vertical range can be slightly less than the thickness being arranged on heat transfer substrate 3 in strip-shaped clamp groove 21; There is elastic deformation in latter two T-shaped snap fit 24 of active force applying to be in reverse to strip-shaped clamp groove 21 to two T-shaped snap fits 24 respectively, the actual volume space of strip-shaped clamp groove 21 can increase, and heat transfer substrate 3 can be inserted into strip-shaped clamp groove 21 from the side mouth of strip-shaped clamp groove 21; Heat transfer substrate 3 is installed to after in strip-shaped clamp groove 21, removes the active force put on two T-shaped snap fits 24, two T-shaped snap fits 24 can with heat transfer substrate 3 LED chip mounting plane 31 clamped contact.
The pinching end 241 of two T-shaped snap fits 24 also can have angle with the boss bottom surface 22 of heat transfer substrate installation portion 2 respectively, and these two angles are no more than 1 degree.There is elastic deformation in latter two T-shaped snap fit 24 of active force applying to be in reverse to strip-shaped clamp groove 21 to two T-shaped snap fits 24 respectively, the actual volume space of strip-shaped clamp groove 21 can increase to be enough to hold heat transfer substrate 3, and heat transfer substrate 3 can be inserted into strip-shaped clamp groove 21 from the side mouth of strip-shaped clamp groove 21; Heat transfer substrate 3 is installed to after in strip-shaped clamp groove 21, removes the active force put on two T-shaped snap fits 24, two T-shaped snap fits 24 can with heat transfer substrate 3 LED chip mounting plane 31 clamped contact.
When being provided with heat transfer substrate 3 in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, under the acting in conjunction of two T-shaped snap fit 24 elastic restoring forces and boss bottom surface 22 holding power, there is small elastic deformation by producing at the end positions place contacted with two T-shaped snap fits 24 towards direction, boss bottom surface 22 in heat transfer substrate 3; After the small elastic deformation that heat transfer substrate 3 produces under the effect of two T-shaped snap fit 24 elastic restoring forces, heat transfer plane 32 and the boss bottom surface 22 of heat transfer substrate 3 can realize complete face and contact, and the LED chip mounting plane 31 of heat transfer substrate 3 can realize complete face with the pinching end 241 of two T-shaped snap fits 24 and contact; Strip-shaped clamp groove 21 installs heat transfer substrate 3, and the pinching end 241 of heat transfer plane 32 and strip-shaped clamp groove 21 boss bottom surface 22, LED chip mounting plane 31 and two T-shaped snap fits 24 realizes clamped contact simultaneously.
On T-shaped snap fit 24, the length of force side 242 can be greater than the length of pinching end 241, the support cylinder 243 of T-shaped snap fit 24, force side 242 and pinching end 241 be a composition lever jointly, the fulcrum that length is equivalent to two arm of forces of lever, support cylinder 243 is equivalent to lever of force side 242 and pinching end 241.In the process that heat transfer substrate 3 is installed in strip-shaped clamp groove 21, the force side 242 of the T-shaped snap fit 24 of two applies two smaller upwards active forces respectively, can make two T-shaped snap fits 24 that small elastic deformation occurs to cause the real space of strip-shaped clamp groove 21 to increase to hold heat transfer substrate 3.
The process that heat transfer substrate 3 is installed in strip-shaped clamp groove 21 is as follows:
The first step be outwards pull the T-shaped snap fit 24 (can be apply towards the active force in direction, heat sink body 1 bottom surface on the force side 242 of two T-shaped snap fits 24, make two T-shaped snap fits 24 produce small elastic deformation) of two strip-shaped clamp groove 21, there is small elastic deformation and cause the actual volume of strip-shaped clamp groove 21 to increase in two T-shaped snap fits 24;
Second step is can penetrate into strip-shaped clamp groove 21 by heat transfer substrate 3 from the side mouth of any one end of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 by robot apparatus or manual type;
3rd step be install heat transfer substrate 3 in strip-shaped clamp groove 21 after, remove the external force be applied on two T-shaped snap fits 24, heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 by two T-shaped snap fits 24 under the effect of elastic restoring force;
4th step be two T-shaped snap fits 24 under elastic restoring force effect, the heat transfer plane 32 of heat transfer substrate 3 and boss bottom surface 22 are realized, and face contacts, the two ends of the LED chip mounting plane 31 of heat transfer substrate 3 realize clamped contact with the pinching end 241 of two T-shaped snap fits 24 respectively; Under the clamping force effect of two T-shaped snap fits 24, the heat transfer plane 32 of heat transfer substrate 3 also achieves clamped contact with boss bottom surface 22, so just makes the upper and lower surface of heat transfer substrate 3 all realize clamped contact with strip-shaped clamp groove 21.
A kind of LED lamp that present embodiment provides comprises radiator, heat transfer substrate 3, end cap 5 and lampshade 4, similar to the light fixture of the LED tubular lamp in Fig. 6 of preferred embodiment 1.Heat transfer substrate 3 is fastened in the strip-shaped clamp groove 21 of radiator, and lampshade 4 is located on heat transfer substrate 3, and end cap 5 is coated on the two ends of the fluorescent tube be made up of radiator 2, heat transfer substrate 3 and lampshade 4, and lampshade 4 can be fastened on the draw-in groove of radiator 2 two ends.
Heat transfer substrate of the present invention comprises heat sink body 1, heat transfer substrate installation portion 2, heat transfer substrate 3, lampshade 4 and end cap 5 from the LED tubular lamp of clamping; End cap 5 is arranged on the lamp tube ends be made up of heat sink body 1, heat transfer substrate installation portion 2, heat transfer substrate 3 and lampshade 4; Heat transfer substrate 3 relies on the elasticity predeformation power of heat transfer substrate installation portion 2 two T-shaped snap fits 24 to be fixed in strip-shaped clamp groove 21.
The pinching end 241 of LED chip mounting plane 31 and heat transfer substrate installation portion 2 two T-shaped snap fits 24 of heat transfer substrate 3 contacts.The heat transfer plane 32 of heat transfer substrate 3 contacts with 22, boss bottom surface on heat sink body 1 bottom surface.
In actual applications, when after the LED chip energising on heat transfer substrate 3, the heat that LED chip produces passes on heat sink body 1 by the pinching end 241 of boss bottom surface 22 and two T-shaped snap fits 24, and the heatsink outer surface on heat sink body 1 distributes heat in air again.
The radiator that present embodiment provides owing to being provided with strip-shaped clamp groove 21 on heat transfer substrate installation portion 2, can heat transfer substrate 3 be fastened in strip-shaped clamp groove 21, no longer need by screw, heat transfer substrate 3 to be fixed on a heat sink, thus efficiency of assembling is high, the requirement that automation is produced fast can be met, heat transfer substrate 3 to be fastened in strip-shaped clamp groove 21 and to realize close contact with multiple of strip-shaped clamp groove 21, thus can improve radiating efficiency, avoid heat transfer substrate 3 that thermal deformation occurs.
The LED lamp that present embodiment provides owing to being provided with strip-shaped clamp groove 21, can being fastened in strip-shaped clamp groove 21 by heat transfer substrate 3 on heat transfer substrate installation portion 2, no longer need by screw, heat transfer substrate 3 to be fixed on a heat sink, the requirement that LED lamp efficiency of assembling is produced to meet automation fast compared with your pupil, heat transfer substrate 3 to be fastened in strip-shaped clamp groove 21 and with multiple close contacts of strip-shaped clamp groove 21, the radiating efficiency of LED lamp can be improved, avoid the heat transfer substrate 3 of LED lamp that thermal deformation occurs.
The lamp body heat transfer flow process of heat transfer substrate self-clamp type LED tubular lamp of the present invention: the heat that the heat come from heat transfer substrate 3 comes by passing to heat sink body 1 with close-connected three faces of heat sink body 1 (22, two, boss bottom surface pinching end 241), from heat transfer substrate 3 can be dispersed into air by heat sink body 1 extrados.Because heat sink body 1 and heat transfer substrate installation portion 2 together constitute whole radiator, the heat that boss bottom surface 22 absorbs from heat transfer substrate 3 at most, the heat that absorbs from the relative boss bottom surface 22 of heat that heat transfer substrate 3 absorbs from heat transfer substrate 3 of two pinching ends 241 lacks.Can ensure that the heat come from LED chip directly conducts to heat sink body 1 by boss bottom surface 22 for face contacts between boss bottom surface 22 and the heat transfer plane 32 of heat transfer substrate 3; Two pinching ends 241 are relatively far away apart from LED chip, and the heat that the heat that pinching end 241 absorbs from heat transfer substrate 3 absorbs relative to boss bottom surface 22 is few.
When heat transfer substrate self-clamp type LED tubular lamp of the present invention is in confined state, two T-shaped snap fits 24 of heat transfer substrate installation portion 2 can rely on the elasticity of himself raw deformation force to be clamped in tightly in the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2 by heat transfer substrate 3, achieve heat transfer substrate 3 clamped contact complete in 22, two, the boss bottom surface pinching end 241 of heat transfer substrate installation portion 2.
Due in the strip-shaped clamp groove that the heat transfer substrate 3 of heat transfer substrate self-clamp type LED tubular lamp of the present invention is fastened on heat transfer substrate installation portion 2 21 and also can realize clamping area completely with 241 3 faces in boss bottom surface 22 and two pinching ends of heat transfer substrate installation portion 2 and contact, heat transfer substrate self-clamp type LED tubular lamp of the present invention can improve heat transfer efficiency, keeps away exhausted heat transfer substrate 3 and thermal deformation occurs.
Owing to being limited by the length restriction of heat transfer substrate self-clamp type LED tubular lamp of the present invention, the real area of the boss bottom surface 22 of heat transfer substrate installation portion 2 is less than the bottom surface of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, can ensure that the boss bottom surface 22 of heat transfer substrate installation portion 2 has higher fineness, flatness and linearity like this.The boss bottom surface 22 of heat transfer substrate installation portion 2 has higher fineness, flatness and linearity, the heat transfer plane 32 of heat transfer substrate 3 also has higher fineness, flatness and linearity, can ensure that the boss bottom surface 22 of heat transfer substrate installation portion 2 in LED tubular lamp course of normal operation is in tight face all the time with the heat transfer plane 32 of heat transfer substrate 3 and contacts.In LED tubular lamp installation process, heat conductive silica gel can be scribbled between the boss bottom surface 22 of heat transfer substrate installation portion 2 and the heat transfer plane 32 of heat transfer substrate 3 and obtain better heat-transfer effect.