CN103298238B - The pcb board of integrated acoustic damper and manufacture method thereof - Google Patents
The pcb board of integrated acoustic damper and manufacture method thereof Download PDFInfo
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- CN103298238B CN103298238B CN201210040968.8A CN201210040968A CN103298238B CN 103298238 B CN103298238 B CN 103298238B CN 201210040968 A CN201210040968 A CN 201210040968A CN 103298238 B CN103298238 B CN 103298238B
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Abstract
The embodiment of the invention discloses a kind of pcb board of integrated acoustic damper, comprise first circuit board, second circuit board and sound dampening film.Sound dampening film is fixed between first circuit board and second circuit board by prepreg, first circuit board and second circuit board are respectively equipped with the tone-entering hole mutually aligned, position corresponding with tone-entering hole on prepreg is provided with through hole, and tone-entering hole and the through hole of sound dampening film and both sides thereof form acoustic damper jointly.Present invention also offers a kind of manufacture method of pcb board of integrated acoustic damper.Sound dampening film is arranged between first circuit board and second circuit board by pcb board of the present invention, and to realize integrated acoustic damper in doubling plate, the operatic tunes size of the microphone inside that this pcb board is formed can control, and is conducive to the miniaturization of microphone; And the conforming problem that hand assembled damping material causes can be avoided in the assembling process of microphone.
Description
Technical field
The present invention relates to PCB field, particularly relate to a kind of pcb board and manufacture method thereof of integrated acoustic damper.
Background technology
Along with the development of modern industry, the size of product is gradually to miniaturization, especially at microphone production field, also more and more harsher to the size requirements of microphone.Due under various noisy environment, certain directivity and directive property are needed to the collection of sound, so just can filter out noisy background noise and some unwanted interference noises.Existing microphone, by therein, is placed sound-resistance material in the operatic tunes namely after backplane, before circuit board, thus is reached the function of directive property.Although existing microphone can reach the function of directive property, there is following shortcoming: operatic tunes size can not control, the volume of the operatic tunes is comparatively large, and then causes the volume of product larger; Needing when assembling by hand damping material to be pressed in the operatic tunes, making the placement location of damping material and having dramatic difference with the tightness degree of chamber wall, well can not guarantee the consistency of product.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides a kind of pcb board and manufacture method thereof of integrated acoustic damper, and its manufacture method is simple and can guarantee the consistency of product, the microphone small volume be made up of this pcb board.
In order to solve the problems of the technologies described above, the embodiment of the present invention proposes a kind of pcb board of integrated acoustic damper, comprise first circuit board, second circuit board and sound dampening film, described sound dampening film is fixed between first circuit board and second circuit board by prepreg, described first circuit board and second circuit board are respectively equipped with the tone-entering hole mutually aligned, position corresponding with described tone-entering hole on described prepreg is provided with through hole, and tone-entering hole and the through hole of described sound dampening film and both sides thereof form acoustic damper jointly.
Correspondingly, the embodiment of the present invention additionally provides a kind of manufacture method of pcb board of integrated acoustic damper, comprises the steps:
Drill process: in two panels prepreg correspondence position holes drilled through respectively;
Pressing step: be cascading on the upper and lower surface of sound dampening film the prepreg and Copper Foil that are drilled with through hole, and make motherboard substrate by press equipment pressing;
Make motherboard step: on Copper Foil, make conducting wire, motherboard substrate is made motherboard;
Control gun drilling step: the Copper Foil covered on the through hole of prepreg is drilled to form tone-entering hole respectively on the Copper Foil on the upper and lower surface of motherboard by control gun drilling equipment.
The beneficial effect of the embodiment of the present invention is: sound dampening film is arranged between first circuit board and second circuit board by pcb board of the present invention, to realize integrated acoustic damper in pcb board, the operatic tunes size of the inside of the microphone be made up of this pcb board can control, and is conducive to the miniaturization of microphone; And the conforming problem that hand assembled damping material causes can be avoided in the assembling process of microphone.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pcb board of the integrated acoustic damper of the embodiment of the present invention.
Fig. 2 is the flow chart of the manufacture method of the pcb board of the integrated acoustic damper of the embodiment of the present invention.
Embodiment
With reference to accompanying drawing, the pcb board of integrated acoustic damper of the present invention and manufacture method thereof are described.
As shown in Figure 1, the pcb board of integrated acoustic damper of the present invention comprises first circuit board 1, second circuit board 2 and sound dampening film 3.Wherein, sound dampening film 3 is fixed between first circuit board 1 and second circuit board 2 by prepreg 4.First circuit board 1 and second circuit board 2 are respectively equipped with the position corresponding with tone-entering hole 6 on tone-entering hole 6, two prepregs 4 of mutually aligning and are equipped with through hole 5, tone-entering hole 6 and the through hole 5 of sound dampening film 3 and both sides thereof form acoustic damper jointly.
First circuit board 1 and second circuit board 2 are copper foil circuit layer, and prepreg 4 adopts the less epoxy resin of gummosis amount or bismaleimide-triazine resin to make.The diameter D=d+a of tone-entering hole 6, wherein d is the diameter of the through hole 5 on prepreg 4, a ∈ (0.05mm ~ 0.3mm).During concrete enforcement, do not blocked by the Copper Foil on surface in order to ensure through hole 5 and can 0.1mm be got, 0.15mm, 0.2mm or 0.25mm etc. according to the precision a of empty gun drilling equipment.
Be illustrated in figure 2 the flow chart of the manufacture method of the pcb board of integrated acoustic damper of the present invention.This manufacture method comprises the steps:
S1: drill process, in two panels prepreg 4 correspondence position holes drilled through 5 respectively.
During concrete enforcement, prepreg 4 must select the less epoxy resin of gummosis amount or bismaleimide-triazine resin to make, less with the amount of flow controlling resin in follow-up bonding processes.
S2: pressing step, be cascading on the upper and lower surface of sound dampening film 3 prepreg 4 and Copper Foil being drilled with through hole 5, and make motherboard substrate by press equipment pressing.
During concrete enforcement, after sound dampening film 3, prepreg 4 and Copper Foil are had good positioning by the mode of overlapping shop bolt, put into press and be pressed into motherboard substrate.
S3: make motherboard step: make conducting wire on Copper Foil, motherboard substrate is made motherboard.
Comprise the steps: during concrete enforcement
Bore functional hole: in motherboard substrate, first getting out the location hole for motherboard substrate being positioned on rig, then motherboard substrate being positioned machining functions hole on rig.
Heavy copper: by redox principle chemical deposition last layer conducting metal copper on the hole wall of the functional hole of motherboard substrate.
Plating: by electrolysis principle, electric plating of whole board is carried out to motherboard substrate, and continue electroplating deposition conducting metal copper on the wall of functional hole.
Graphics processing: stick light-sensitive surface on the surface in two of motherboard substrate, by the mode of film exposure, development, by the motherboard Graphic transitions that designs on light-sensitive surface.
Etching: etch motherboard figure in described motherboard substrate;
Being specially, with taking off film liquid, light-sensitive surface being faded away, stung the mode of erosion by acidic etching liquid chemistry, produce external conducting wire figure.
Welding resistance: stamp one deck photosensitive-ink on motherboard substrate surface;
Be specially, by screen printer in motherboard substrate surface printing one deck photosensitive-ink, and then prevent from wasting too much tin cream during follow-up assembling.
Exposure: the photosensitive-ink figure on motherboard substrate surface is solidified;
Be specially, solidify two kinds of modes by hot curing and ultraviolet (UV), the photosensitive-ink figure on motherboard substrate surface is solidified.
Motherboard applies: on the conducting metal of motherboard substrate, cover layer of surface coat, make described thick motherboard.
S4: control gun drilling step, drills on the Copper Foil on the upper and lower surface of motherboard, to form tone-entering hole 6 respectively by control gun drilling equipment by the Copper Foil covered on the through hole 5 of prepreg 4.The diameter D=d+a of tone-entering hole 6, wherein d is the diameter of the through hole 5 on prepreg 4, a ∈ (0.05mm ~ 0.3mm).
During concrete enforcement, do not blocked by the Copper Foil on surface in order to ensure through hole 5 and can 0.1mm be got, 0.15mm, 0.2mm or 0.25mm etc. according to the precision a of empty gun drilling equipment.
Sound dampening film 3 to be arranged between first circuit board 1 and second circuit board 2 by pcb board of the present invention, the prepreg 4 being covered in sound dampening film 3 both sides offered through hole 5 and offers tone-entering hole 6 to form entering tone passage by control gun drilling position corresponding with through hole 5 on first circuit board 1 and second circuit board 2, and then forming by the entering tone passage that sound dampening film 3 and its both sides are corresponding the acoustic damper be integrated in pcb board.Because acoustic damper is integrated in pcb board, so the operatic tunes size of the inside of the microphone be made up of this pcb board can control, be conducive to the miniaturization of microphone; And the conforming problem that hand assembled damping causes can be avoided in the assembling process of microphone.
The above is the specific embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (8)
1. the pcb board of an integrated acoustic damper, comprise first circuit board, second circuit board and sound dampening film, it is characterized in that, described sound dampening film is fixed between first circuit board and second circuit board by prepreg, described first circuit board and second circuit board are respectively equipped with the tone-entering hole mutually aligned, position corresponding with described tone-entering hole on described prepreg is provided with through hole, and tone-entering hole and the through hole of described sound dampening film and both sides thereof form acoustic damper jointly.
2. the pcb board of integrated acoustic damper as claimed in claim 1, is characterized in that, described first circuit board and second circuit board are copper foil circuit layer.
3. the pcb board of integrated acoustic damper as claimed in claim 1, is characterized in that, described prepreg adopts epoxy resin or bismaleimide-triazine resin to make.
4. the pcb board of integrated acoustic damper as claimed in claim 1, is characterized in that, the diameter D=d+a of described tone-entering hole, and wherein d is the through-hole diameter on prepreg, a ∈ (0.05mm, 0.3mm).
5. a manufacture method for the pcb board of integrated acoustic damper, is characterized in that, comprises the steps:
Drill process: in two panels prepreg correspondence position holes drilled through respectively;
Pressing step: be cascading on the upper and lower surface of sound dampening film the prepreg and Copper Foil that are drilled with through hole, and make motherboard substrate by press equipment pressing;
Make motherboard step: on Copper Foil, make conducting wire, motherboard substrate is made motherboard;
Control gun drilling step: the Copper Foil covered on the through hole of prepreg is drilled to form tone-entering hole respectively on the Copper Foil on the upper and lower surface of motherboard by control gun drilling equipment.
6. the manufacture method of the pcb board of integrated acoustic damper as claimed in claim 5, is characterized in that, makes motherboard step and is specially:
Bore functional hole: in described motherboard substrate, first getting out the location hole for motherboard substrate being positioned on rig, then motherboard substrate being positioned machining functions hole on rig;
Heavy copper: the copper simple substance of chemical deposition last layer conduction on the hole wall of the functional hole of motherboard substrate;
Plating: electric plating of whole board is carried out to described motherboard substrate;
Graphics processing: stick light-sensitive surface on the surface of described motherboard substrate, by the mode of film exposure, development, by the motherboard Graphic transitions that designs on light-sensitive surface;
Etching: etch motherboard figure in described motherboard substrate;
Welding resistance: stamp one deck photosensitive-ink on motherboard substrate surface;
Exposure: the photosensitive-ink figure on motherboard substrate surface is solidified;
Motherboard applies: on the conducting metal of motherboard substrate, cover layer of surface coat, make described motherboard.
7. the manufacture method of the pcb board of integrated acoustic damper as claimed in claim 5, is characterized in that, described prepreg adopts epoxy resin or bismaleimide-triazine resin to make.
8. the manufacture method of the pcb board of integrated acoustic damper as claimed in claim 5, is characterized in that, the diameter D=d+a of described tone-entering hole, and wherein d is the through-hole diameter on prepreg, a ∈ (0.05mm, 0.3mm).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210040968.8A CN103298238B (en) | 2012-02-22 | 2012-02-22 | The pcb board of integrated acoustic damper and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210040968.8A CN103298238B (en) | 2012-02-22 | 2012-02-22 | The pcb board of integrated acoustic damper and manufacture method thereof |
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| Publication Number | Publication Date |
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| CN103298238A CN103298238A (en) | 2013-09-11 |
| CN103298238B true CN103298238B (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210040968.8A Active CN103298238B (en) | 2012-02-22 | 2012-02-22 | The pcb board of integrated acoustic damper and manufacture method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105611720B (en) * | 2016-03-14 | 2018-09-14 | 江苏普诺威电子股份有限公司 | PCB acoustical cavities and its processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552209A (en) * | 1994-07-29 | 1996-09-03 | Minnesota Mining And Manufacturing Company | Internally damped circuit articles |
| CN100413384C (en) * | 2003-11-06 | 2008-08-20 | Lg电子株式会社 | Multi-layer printed circuit board and fabricating method thereof |
| CN102075838A (en) * | 2011-03-03 | 2011-05-25 | 深圳市豪恩声学股份有限公司 | Electret microphone |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101055471B1 (en) * | 2008-09-29 | 2011-08-08 | 삼성전기주식회사 | Electronic printed circuit board and its manufacturing method |
-
2012
- 2012-02-22 CN CN201210040968.8A patent/CN103298238B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552209A (en) * | 1994-07-29 | 1996-09-03 | Minnesota Mining And Manufacturing Company | Internally damped circuit articles |
| CN100413384C (en) * | 2003-11-06 | 2008-08-20 | Lg电子株式会社 | Multi-layer printed circuit board and fabricating method thereof |
| CN102075838A (en) * | 2011-03-03 | 2011-05-25 | 深圳市豪恩声学股份有限公司 | Electret microphone |
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| CN103298238A (en) | 2013-09-11 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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