CN103290462B - A kind of plating solution automatic adding machine - Google Patents
A kind of plating solution automatic adding machine Download PDFInfo
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- CN103290462B CN103290462B CN201310260702.9A CN201310260702A CN103290462B CN 103290462 B CN103290462 B CN 103290462B CN 201310260702 A CN201310260702 A CN 201310260702A CN 103290462 B CN103290462 B CN 103290462B
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- dipper
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- couveuse
- feed pump
- plating solution
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Abstract
The invention discloses a kind of plating solution automatic adding machine, including casing, it is characterized in that: also include couveuse, dipper, solution feed pump and the liquid feeding cup being arranged in casing, the bottom of casing is provided with couveuse, being provided with dipper in couveuse, be provided above solution feed pump and liquid feeding cup at dipper, the liquid outlet of described liquid feeding cup is connected with dipper import by pipeline, the outlet of described dipper is connected with solution feed pump import, and the outlet of described solution feed pump connects with electroplating bath.The present invention solves in surface treatment process, manually plating solution consumption of raw material is many, cost is high in interpolation, and manually add middle noble metal and drugs additive, people contacts with additive, easily causes and loses and the problem of intoxication accident, it is provided that a kind of simple in construction, noble metal can be added online according to drug dosage, drugs plating solution, production cost is low, uses more safe and reliable plating solution automatic adding machine.
Description
Technical field
Technical field of surface of the present invention, a kind of equipment automatically adding plating solution in precious metal surface processing procedure.
Background technology
In surface treatment process, traditional method is typically, by technological requirement, the plating solution prepared or additive are manually adding to coating bath, again carry out by result of laboratory test after producing certain time with addition of, ordinary circumstance is added once for every 4～5 hours.
Traditional surface treatment method is primarily present following shortcoming:
1, adding plating solution or additive in operation process on a time period, the chemical composition of plating solution is very big from initiateing time period end concentration change, is inconstant, and for product out in this time period, its electroplating quality is the most influenced to different extents.Also result in the waste of plating solution simultaneously, add production cost.
2, the kind of plating solution and additive is quite a lot of, has noble metal, huge drugs etc..If adding in use easily contact and disappearance by hand, causing security incident and stolen, producing much safety management hidden danger.
Summary of the invention
In order to solve in surface treatment process, manually plating solution consumption of raw material is many, cost is high in interpolation, and manually add middle noble metal and drugs additive, people contacts with additive, easily causes and loses and the problem of intoxication accident, the invention provides a kind of simple in construction, noble metal can be added online according to drug dosage, drugs plating solution, production cost is low, uses more safe and reliable plating solution automatic adding machine.
In order to solve the problems referred to above, the technical solution used in the present invention is:
A kind of plating solution automatic adding machine, including casing, it is characterized in that: also include couveuse, dipper, solution feed pump and the liquid feeding cup being arranged in casing, the bottom of casing is provided with couveuse, being provided with dipper in couveuse, be provided above solution feed pump and liquid feeding cup at dipper, the liquid outlet of described liquid feeding cup is connected with dipper import by pipeline, the outlet of described dipper is connected with solution feed pump import, and the outlet of described solution feed pump connects with electroplating bath.
Aforesaid a kind of plating solution automatic adding machine, it is characterised in that: also include heater, outside dipper, be provided with the heater to dipper heating.
Aforesaid a kind of plating solution automatic adding machine, it is characterised in that: also include locking device, box cover is provided with the locking device for opening box cover, casing door-plate is provided with the locking device for opening casing door-plate.
Aforesaid a kind of plating solution automatic adding machine, it is characterised in that: on casing, it is provided with control panel, described control panel is provided with height displaying instrument and temperature controller.
Aforesaid a kind of plating solution automatic adding machine, it is characterised in that: also including temperature sensor, arrange the temperature sensor of oriented temperature controller transmission temperature signal on couveuse, described temperature controller is connected with heater.
Aforesaid a kind of plating solution automatic adding machine, it is characterised in that: also including ultrasound probe, be provided with the ultrasound probe of liquid level in monitoring dipper at couveuse top, described ultrasound probe is connected with height displaying instrument.
Aforesaid a kind of plating solution automatic adding machine, it is characterised in that: described locking device uses electric control lock, padlock or coded lock.
The invention has the beneficial effects as follows: plating solution automatic adding machine of the present invention can set according to drug dosage and automatically add noble metal, drugs plating solution such as silver potassium cyanide, potassium auricyanide, reduce cost of human resources and security risk, and process is simple, production cost is low, has good economic benefit.
Accompanying drawing explanation
Fig. 1 is plating solution automatic adding machine external structure schematic diagram of the present invention.
Fig. 2 is plating solution automatic adding machine internal structure schematic diagram of the present invention.
Detailed description of the invention
The invention will be further described below in conjunction with the accompanying drawings.
As shown in Figure 1-2, a kind of plating solution automatic adding machine, including casing 1, heat preservation tank 2, dipper 3, solution feed pump 4, heater 5, temperature sensor 6, ultrasound probe 7, temperature controller 8, height displaying instrument 9, liquid feeding cup 10, control panel 15, safety lock 16 and the dialing lock 17.Couveuse 2, dipper 3, solution feed pump 4 and liquid feeding cup 10 in casing 1, the bottom of casing 1 is provided with couveuse 2, dipper 3 it is provided with in couveuse 2, it is provided above solution feed pump 4 and liquid feeding cup 10 at dipper 3, the liquid outlet of described liquid feeding cup 10 is connected with dipper 3 import 14 by pipeline, described dipper 3 exports 13 and is connected with solution feed pump 4 import 11, and described solution feed pump 11 exports 12 and connects with electroplating bath.
Casing 1 is provided with control panel 15, described control panel 15 is provided with height displaying instrument 9 and temperature controller 8.The heater 5 to dipper 3 heating it is provided with outside dipper 3.Arranging oriented temperature controller 8 on couveuse 2 and transmit the temperature sensor 6 of temperature signal, described temperature controller 8 is connected with heater 5.Be provided with the ultrasound probe 7 of liquid level in monitoring dipper 3 at couveuse 2 top, described ultrasound probe 7 is connected with height displaying instrument 9.Casing 1 covers the dialing lock 17 being provided with for opening box cover, casing 1 door-plate is provided with the safety lock 16 for opening casing door-plate.
Turning on the power switch, ultrasound probe 7 is started working, and now height displaying instrument 9 shows dipper 3 current level.Open the dialing lock 17, open casing 1 upper box lid.Then medicinal liquid is slowly injected to dipper 3 import 14 to setting liquid level by liquid feeding cup 10 liquid outlet.After the screen of solution feed pump 4 is configured by technological requirement addition, press activate switch to confirm, now add machine to start normally to work, export 13 by dipper 3 and carry medicinal liquid to solution feed pump 4 import 11, and export 12 to electroplating bath interpolation medicinal liquid by solution feed pump 11.Close upper box lid when interpolation machine normally works and lock the dialing lock 17.Adjust if desired for temperature, utilize the key that arranges of the temperature controller 8 on control panel 15 to send instruction, control heater 5 and dipper 3 is heated, change the temperature of dipper 3, and interpolation machine is incubated by the temperature after adjusting.
Equipped with safety lock 16 on casing 1, by the door-plate of casing 1 together with box lock, safety lock 16 just can be opened by password, the door of casing 1 is opened, it is easy to management, the only personnel of specified permission just know password, can effectively prevent each parts in casing 1 from comprising noble metal medicinal liquid, artificially lose in operation process.It is also possible to prevent unrelated person and arbitrarily operates interpolation machine, change effects of process parameters plating piece product quality.
Plating solution automatic adding machine of the present invention can set according to drug dosage and automatically add noble metal, and drugs plating solution such as silver potassium cyanide, potassium auricyanide reduce cost of human resources and security risk, and process is simple, and production cost is low, has good economic benefit.
The ultimate principle of the present invention, principal character and advantage have more than been shown and described.Skilled person will appreciate that of the industry; the present invention is not restricted to the described embodiments; the principle that the present invention is simply described described in above-described embodiment and description; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements both fall within scope of the claimed invention.Claimed scope is defined by appending claims and equivalent thereof.
Claims (1)
- null1. a plating solution automatic adding machine，Including casing，The couveuse being arranged in casing、Dipper、Solution feed pump and liquid feeding cup，The bottom of casing is provided with couveuse，Dipper it is provided with in couveuse，It is provided above solution feed pump and liquid feeding cup at dipper，It is characterized in that: the liquid outlet of described liquid feeding cup is connected with dipper import by pipeline，The outlet of described dipper is connected with solution feed pump import，The outlet of described solution feed pump connects with electroplating bath，Also include heater，The heater to dipper heating it is provided with outside dipper，Also include locking device，Box cover is provided with the locking device for opening box cover，Casing door-plate is provided with the locking device for opening casing door-plate，Casing is provided with control panel，Height displaying instrument and temperature controller it is provided with on described control panel，Also include temperature sensor，Couveuse arranges the temperature sensor of oriented temperature controller transmission temperature signal，Described temperature controller is connected with heater，Also include ultrasound probe，The ultrasound probe of liquid level in monitoring dipper it is provided with at couveuse top，Described ultrasound probe is connected with height displaying instrument，Described locking device uses electric control lock、Padlock or coded lock.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310260702.9A CN103290462B (en) | 2013-06-27 | 2013-06-27 | A kind of plating solution automatic adding machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310260702.9A CN103290462B (en) | 2013-06-27 | 2013-06-27 | A kind of plating solution automatic adding machine |
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| Publication Number | Publication Date |
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| CN103290462A CN103290462A (en) | 2013-09-11 |
| CN103290462B true CN103290462B (en) | 2016-08-10 |
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| CN201310260702.9A Active CN103290462B (en) | 2013-06-27 | 2013-06-27 | A kind of plating solution automatic adding machine |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103741199B (en) * | 2013-12-31 | 2016-06-29 | 江阴康强电子有限公司 | A kind of silver plating liquid predissolve technique |
| CN108103560A (en) * | 2018-02-05 | 2018-06-01 | 深圳市瑞世兴科技有限公司 | A kind of metal plating refining device |
| CN110129869A (en) * | 2019-05-24 | 2019-08-16 | 江西景旺精密电路有限公司 | A kind of method and system automatically analyzing addition gold salt based on real-time online |
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| JPS57149499A (en) * | 1981-03-11 | 1982-09-16 | C Uyemura & Co Ltd | Method of automatic supplying brightner for plating |
| JP2003313699A (en) * | 2002-04-24 | 2003-11-06 | Okuno Chem Ind Co Ltd | Method for controlling cyanide ion concentration |
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| CN201942776U (en) * | 2011-01-07 | 2011-08-24 | 深圳崇达多层线路板有限公司 | Automatic metal salt adding device in PCB (Printed Circuit Board) gold immersion production capable of saving cost |
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| CN202139322U (en) * | 2011-06-27 | 2012-02-08 | 昆山同心表面科技有限公司 | Surface-processing automatic adding machine |
| CN202755092U (en) * | 2012-09-03 | 2013-02-27 | 广东嘉元科技股份有限公司 | Electrolytic copper foil dosing device |
| CN103088396A (en) * | 2013-01-29 | 2013-05-08 | 惠州中京电子科技股份有限公司 | Chemical water treatment method for PCB (printed circuit board) electro-coppering trough |
| CN203333806U (en) * | 2013-06-27 | 2013-12-11 | 昆山同心表面科技有限公司 | Automatic plating solution addition machine |
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2013
- 2013-06-27 CN CN201310260702.9A patent/CN103290462B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149499A (en) * | 1981-03-11 | 1982-09-16 | C Uyemura & Co Ltd | Method of automatic supplying brightner for plating |
| JP2003313699A (en) * | 2002-04-24 | 2003-11-06 | Okuno Chem Ind Co Ltd | Method for controlling cyanide ion concentration |
| CN2755109Y (en) * | 2004-11-26 | 2006-02-01 | 程才用 | Two-in-one electrolytical filter |
| CN201942776U (en) * | 2011-01-07 | 2011-08-24 | 深圳崇达多层线路板有限公司 | Automatic metal salt adding device in PCB (Printed Circuit Board) gold immersion production capable of saving cost |
| CN102268721A (en) * | 2011-06-27 | 2011-12-07 | 昆山同心表面科技有限公司 | Automatic adding machine for surface treatment |
| CN202139322U (en) * | 2011-06-27 | 2012-02-08 | 昆山同心表面科技有限公司 | Surface-processing automatic adding machine |
| CN202755092U (en) * | 2012-09-03 | 2013-02-27 | 广东嘉元科技股份有限公司 | Electrolytic copper foil dosing device |
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| CN103290462A (en) | 2013-09-11 |
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