CN110129869A - A kind of method and system automatically analyzing addition gold salt based on real-time online - Google Patents
A kind of method and system automatically analyzing addition gold salt based on real-time online Download PDFInfo
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- CN110129869A CN110129869A CN201910441098.7A CN201910441098A CN110129869A CN 110129869 A CN110129869 A CN 110129869A CN 201910441098 A CN201910441098 A CN 201910441098A CN 110129869 A CN110129869 A CN 110129869A
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- Prior art keywords
- gold
- concentration
- addition
- preset
- plating solution
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Abstract
The invention discloses a kind of method and system that addition gold salt is automatically analyzed based on real-time online, are related to noble metal plating or electroplating technology.Wherein, the method includes S1, obtain the gold concentration of plating solution；S2 judges whether the gold concentration is identical as preset concentration, if the gold concentration is lower than the preset concentration, issues the first addition signal, the solution containing high concentration gold is added, keeps the gold concentration of plating solution identical as preset concentration.The technical program is taken leave of according to the adding method added by timing analysis or formulated according to the relationship between work piece production area and experience consumption；Realize integrated, the automation of the gold solution addition in plating solution；The range of gold concentration in plating solution is more accurately controlled, control precision can achieve ± 0.02g/L, reduce the variation of different production batch gold thickness, make the entirety of golden thickness more evenly.The system implementation method for automatically analyzing addition gold salt based on real-time online is succinctly simple, strong operability.
Description
Technical field
The present invention relates to noble metal plating or electroplating technologies, more particularly to a kind of automatically analyzed based on real-time online to add
Add the method and system of gold salt.
Background technique
In precise circuit board industry, chemical nickel gold or electroplating gold occupy very importantly in entire PCB process
Position, while being also the highest process of cost of manufacture in entire PCB process, electroplating gold or the cost of chemical metal working position in entire process
Highest, due to the limitation of electroplating technology at this stage, gold-plated process has irreplaceability, while gold salt belongs to toxic articles to environment
Influence it is also big, so the usage amount for reducing the gold salt of electroplating gold or chemical metal working position is particularly important.
Influence the big factor of station gold salt usage amount three: the thickness of gold-plated epithelium, gold-plated epithelium uniformity, the band of station workpiece
Out, it thirdly big factor is all related to the gold concentration of gold-plated station, is wanted since the needs with a thickness of PCB itself of gold-plated epithelium are specified
It asks, there are the characteristics that reduce, so improving the uniformity of gold-plated epithelium and reducing taking out of for workpiece is two critically important
Method.
It is narrow in a reasonable range to promote concentration golden in the uniformity desired control station plating solution of gold-plated epithelium
Fluctuation, the method that industry generallys use at present are that addition frequency is formulated according to the relationship between production area and experience consumption,
The method is manually controlling and between experience consumption and actual consumption there are deviation of using, is caused in station plating solution golden
Fluctuation of concentration range it is still very big, can generally stablize in the range of ± 0.1g/L, this concentration deviation can be in production to gold
Thickness control and taking out of have an impact, cause to waste.
Summary of the invention
Technical problem to be solved by the invention is to provide it is a kind of based on real-time online automatically analyze addition gold salt method,
It reduces gold caused by influence of the fluctuation of gold concentration to gold plating thickness to waste, obtains better economic benefit and environmental benefit.
To solve the above-mentioned problems, the present invention proposes following technical scheme:
In a first aspect, the present invention provides a kind of method for automatically analyzing addition gold salt based on real-time online, including following step
It is rapid:
S1 obtains the gold concentration of plating solution；
S2 judges whether the gold concentration is identical as preset concentration, if the gold concentration is lower than the preset concentration, sends out
First addition signal out, is added the solution containing high concentration gold, keeps the gold concentration of plating solution identical as preset concentration.
Further technical solution is for it, and the step S1 is the gold concentration for obtaining plating solution at preset timed intervals.
Further technical solution is for it, and the step S2 further includes, if the gold concentration is higher than the preset concentration,
The second addition signal is issued, the solution containing low-concentration gold is added, keeps the gold concentration of plating solution identical as preset concentration.
Second aspect, the present invention provides a kind of system for automatically analyzing addition gold salt based on real-time online, including executes such as
The unit of any one of claim 1-3 method.
5, the system that addition gold salt is automatically analyzed based on real-time online as claimed in claim 4, which is characterized in that including
With lower unit:
Acquiring unit, for obtaining the gold concentration of plating solution；
Analytical unit, for judging whether the gold concentration is identical as preset concentration, if the gold concentration is lower than described pre-
If concentration, then the first addition signal is issued, the solution containing high concentration gold is added, makes the gold concentration of plating solution and preset concentration phase
Together.
Further technical solution is for it, and the acquiring unit for obtaining the gold concentration of plating solution at preset timed intervals.
Further technical solution is for it, and the analytical unit is also used to, if the gold concentration is higher than the preset concentration,
The second addition signal is then issued, the solution containing low-concentration gold is added, keeps the gold concentration of plating solution identical as preset concentration.
Compared with prior art, the accessible technical effect of the present invention includes:
1. it is proposed by the present invention based on the data of on line real time as in plating solution gold solution add method, take leave of according to
According to the adding method added by timing analysis or formulated according to the relationship between work piece production area and experience consumption；
2. the technical program realizes the integrated of the addition of the gold solution in plating solution, automation；
3. this technology solution more accurately controls the range of gold concentration in plating solution compared with previous technology, allow
It is fluctuated in smaller range, and control precision can achieve ± 0.02g/L, reduces the change of different production batch gold thickness
Change, makes the entirety of golden thickness more evenly.
4., strong operability succinctly simple based on the system implementation method that real-time online automatically analyzes addition gold salt.
Detailed description of the invention
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to needed in embodiment description
Attached drawing is briefly described, it should be apparent that, drawings in the following description are some embodiments of the invention, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the system schematic that addition gold salt is automatically analyzed based on real-time online.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, is clearly and completely retouched to the technical solution in embodiment
It states, similar reference numerals represent similar component in attached drawing.
It should be appreciated that ought use in this specification and in the appended claims, term " includes " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but one or more of the other feature, whole is not precluded
Body, step, operation, the presence or addition of element, component and/or its set.
It is also understood that in this embodiment of the present invention term used in the description merely for the sake of description particular implementation
Example purpose and be not intended to limit the embodiment of the present invention.Such as the institute in specification and appended book of the embodiment of the present invention
As use, other situations unless the context is clearly specified, otherwise " one " of singular, "one" and "the" are intended to wrap
Include plural form.
The embodiment of the present invention provides a kind of method for automatically analyzing addition gold salt based on real-time online, comprising the following steps:
S1 obtains the gold concentration of plating solution；
S2 judges whether the gold concentration is identical as preset concentration, if the gold concentration is lower than the preset concentration, sends out
First addition signal out, is added the solution containing high concentration gold, keeps the gold concentration of plating solution identical as preset concentration.
In specific implementation, the step S1 is the gold concentration for obtaining plating solution at preset timed intervals.
In specific implementation, the step S2 further includes, if the gold concentration is higher than the preset concentration, issues second and adds
Plus signal is added the solution containing low-concentration gold, keeps the gold concentration of plating solution identical as preset concentration.
Another embodiment of the present invention provides a kind of systems for automatically analyzing addition gold salt based on real-time online, including execute such as
The unit of above embodiments method.It specifically includes with lower unit:
Acquiring unit, for obtaining the gold concentration of plating solution；
Analytical unit, for judging whether the gold concentration is identical as preset concentration, if the gold concentration is lower than described pre-
If concentration, then the first addition signal is issued, the solution containing high concentration gold is added, makes the gold concentration of plating solution and preset concentration phase
Together.
In specific implementation, the acquiring unit for obtaining the gold concentration of plating solution at preset timed intervals.
In specific implementation, the analytical unit is also used to, if the gold concentration is higher than the preset concentration, issues second
Signal is added, the solution containing low-concentration gold is added, keeps the gold concentration of plating solution identical as preset concentration.
Referring to Fig. 1, show for the system for automatically analyzing addition gold salt based on real-time online that one embodiment of the invention provides
It is intended to.Wherein, 1. coating baths, 2. sampling lines, 3.Au automatic analyzer, 4. signal output lines, 5. signal resolutions, 6. first medical fluids
Add bucket, 7. first quantitative addition pumps, 8. medical fluid adding tubes.Its workflow is as follows:
Au automatic analyzer 3 periodically extracts plating solution by sampling line 2, Au divides automatically according to setting time from coating bath 1
Analyzer 3 carries out analysis measurement using the method for titration to the gold concentration in plating solution, by the gold concentration numerical value conversion measured at signal,
It is by signal output line 4 that signal is defeated to signal resolution 5.
Signal resolution 5 signal received is parsed and judge the gold concentration measured and preset concentration value whether phase
Together, if gold concentration is lower than preset value, export the first addition signal to the first quantitative addition pump 7, the first quantitative addition pumps 7 from the
The solution containing high concentration gold is added pipeline 8 by medical fluid in one medical fluid addition bucket 6 to be added in coating bath 1, makes to plate in coating bath 1
The gold concentration of liquid is identical as preset concentration.
In specific implementation, Au automatic analyzer 3 periodically extracts plating solution from coating bath 1 according to setting, using U002, U004,
The commercially available titrimetry titer of U005, U006 model carries out automatic Titration point to GOLD FROM PLATING SOLUTION concentration using constant-current titration method
Analysis, exports the gold concentration numerical value measured to signal resolution 5.
Signal resolution 5 is parsed to the data from Au automatic analyzer 3 are received, according to preset gold concentration value with
Measured value is compared, therefore, it is determined that whether executing addition operation, the gold concentration such as measured issues the first addition lower than preset value
Signal pumps 7 to the first quantitative addition.
First quantitative addition pump 7: receiving the first addition signal that signal resolution 5 issues and execute addition instruction, quantitative to add
First medical fluid adds the high concentration gold solution in bucket 6.
In a specific implementation, signal resolution 5 is parsed to the data from Au automatic analyzer 3 are received, foundation
Preset gold concentration value is compared with measured value, therefore, it is determined that whether executing addition operation, the gold concentration such as measured is higher than pre-
If value, then the second addition signal is issued to the second quantitative addition pump (not shown).
Second addition pump: it receives the second addition signal that signal resolution 5 issues and executes addition instruction, quantitatively add the second medicine
Liquid adds the low-concentration gold solution in bucket (not shown).
In specific implementation, in order to improve automatization level, keep the gold solution of the high concentration in the first medical fluid addition bucket 6 dense
Spend constant, signal resolution 5, which passes through, parses the difference of the gold concentration and preset concentration value measured, if the gold concentration measured is lower than
The default density then converses the additive amount of high concentration gold solution to be added, and by control first, quantitatively addition pumps 7 to coating bath
In additive amount can reach so that the gold concentration of plating solution technical effect identical with preset concentration in coating bath 1；Keep the second medical fluid
The gold solution concentration for adding the low concentration in bucket is constant, and signal resolution 5, which passes through, parses the gold concentration measured and preset concentration
The difference of value converses the additive amount of high concentration gold solution to be added if the gold concentration measured is higher than the default density, leads to
Crossing control second, quantitatively additive amount of the addition pump into coating bath can reach so that the gold concentration of plating solution and preset concentration phase in coating bath 1
Same technical effect.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, reference can be made to the related descriptions of other embodiments.
The above is a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, any ripe
It knows those skilled in the art in the technical scope disclosed by the present invention, various equivalent modifications can be readily occurred in or replaces
It changes, these modifications or substitutions should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with right
It is required that protection scope subject to.
Claims (7)
1. a kind of method for automatically analyzing addition gold salt based on real-time online, which comprises the following steps:
S1 obtains the gold concentration of plating solution；
S2 judges whether the gold concentration is identical as preset concentration, if the gold concentration is lower than the preset concentration, issues the
One addition signal, is added the solution containing high concentration gold, keeps the gold concentration of plating solution identical as preset concentration.
2. the method for automatically analyzing addition gold salt based on real-time online as described in claim 1, which is characterized in that the step
S1 is the gold concentration for obtaining plating solution at preset timed intervals.
3. the method for automatically analyzing addition gold salt based on real-time online as described in claim 1, which is characterized in that the step
S2 further includes, if the gold concentration is higher than the preset concentration, issues the second addition signal, addition contains the molten of low-concentration gold
Liquid keeps the gold concentration of plating solution identical as preset concentration.
4. a kind of system for automatically analyzing addition gold salt based on real-time online, which is characterized in that including executing such as claim 1-3
The unit of any one method.
5. the system for automatically analyzing addition gold salt based on real-time online as claimed in claim 4, which is characterized in that including following
Unit:
Acquiring unit, for obtaining the gold concentration of plating solution；
Analytical unit, for judging whether the gold concentration identical as preset concentration, if the gold concentration lower than it is described preset it is dense
Degree then issues the first addition signal, the solution containing high concentration gold is added, keeps the gold concentration of plating solution identical as preset concentration.
6. the system for automatically analyzing addition gold salt based on real-time online as claimed in claim 4, which is characterized in that the acquisition
Unit for obtaining the gold concentration of plating solution at preset timed intervals.
7. the system for automatically analyzing addition gold salt based on real-time online as claimed in claim 4, which is characterized in that the analysis
Unit is also used to, if the gold concentration is higher than the preset concentration, issues the second addition signal, addition contains low-concentration gold
Solution keeps the gold concentration of plating solution identical as preset concentration.
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| CN201910441098.7A CN110129869A (en) | 2019-05-24 | 2019-05-24 | A kind of method and system automatically analyzing addition gold salt based on real-time online |
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| CN201910441098.7A CN110129869A (en) | 2019-05-24 | 2019-05-24 | A kind of method and system automatically analyzing addition gold salt based on real-time online |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110747452A (en) * | 2019-12-12 | 2020-02-04 | 汉德车桥(株洲)齿轮有限公司 | Phosphorization method for precision forging gear |
| CN110904441A (en) * | 2019-12-12 | 2020-03-24 | 深南电路股份有限公司 | Method and device for controlling addition of noble metal solution |
| CN113189940A (en) * | 2021-03-16 | 2021-07-30 | 广州广合科技股份有限公司 | Method for realizing PCB liquid medicine analysis and adjustment based on ERP system, electronic equipment and storage medium |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101532160A (en) * | 2008-03-11 | 2009-09-16 | 上村工业株式会社 | Continuous copper electroplating method |
| CN102011154A (en) * | 2010-12-15 | 2011-04-13 | 秦雅军 | Gold plating solution for plating gold finger on circuit board |
| CN103290462A (en) * | 2013-06-27 | 2013-09-11 | 昆山同心表面科技有限公司 | Automatic plating solution adding machine |
| CN104818513A (en) * | 2014-02-04 | 2015-08-05 | 丰田自动车株式会社 | Electroplating cell, metal coating and method of forming the same |
| CN105256347A (en) * | 2015-11-17 | 2016-01-20 | 南通富士通微电子股份有限公司 | Method for controlling silver containing content of tin-silver protruding block |
| CN105839171A (en) * | 2016-05-27 | 2016-08-10 | 无锡雷德环保设备有限公司 | Intelligent metal generator for precious metal electroplating |
| CN106191822A (en) * | 2016-07-03 | 2016-12-07 | 昆山中冶宝钢焊接材料有限公司 | A kind of on-line monitoring for preparation technology of welding wire and Real-time Feedback and self compensating system |
| CN106367793A (en) * | 2016-11-30 | 2017-02-01 | 合肥亿福自动化科技有限公司 | Automatic adjustment system for bath solution |
| CN206986322U (en) * | 2017-06-19 | 2018-02-09 | 深圳兴汇祥科技有限公司 | Automatic feeding system |
| CN207248808U (en) * | 2017-08-23 | 2018-04-17 | 确信乐思化学（上海）有限公司 | Automatic adding device for the potentiometric analyzer of on-line monitoring chemical plating fluid stability |
| CN207331070U (en) * | 2017-06-09 | 2018-05-08 | 巨钛科技股份有限公司 | Copper concentration management system |
| CN207525370U (en) * | 2017-10-12 | 2018-06-22 | 金悦通电子（翁源）有限公司 | A kind of gold salt automatic adding machine |
| CN207672148U (en) * | 2017-09-25 | 2018-07-31 | 确信乐思化学（上海）有限公司 | Measurement device for the lasting monitoring of silver concentration in electroplating solution |
| CN108914197A (en) * | 2018-09-19 | 2018-11-30 | 广东天承科技有限公司 | A kind of on-Line Monitor Device and its application |
| CN109097815A (en) * | 2018-08-06 | 2018-12-28 | 珠海市万顺睿通科技有限公司 | A kind of autocontrol method of circuit board electroplating |
-
2019
- 2019-05-24 CN CN201910441098.7A patent/CN110129869A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101532160A (en) * | 2008-03-11 | 2009-09-16 | 上村工业株式会社 | Continuous copper electroplating method |
| CN102011154A (en) * | 2010-12-15 | 2011-04-13 | 秦雅军 | Gold plating solution for plating gold finger on circuit board |
| CN103290462A (en) * | 2013-06-27 | 2013-09-11 | 昆山同心表面科技有限公司 | Automatic plating solution adding machine |
| CN104818513A (en) * | 2014-02-04 | 2015-08-05 | 丰田自动车株式会社 | Electroplating cell, metal coating and method of forming the same |
| CN105256347A (en) * | 2015-11-17 | 2016-01-20 | 南通富士通微电子股份有限公司 | Method for controlling silver containing content of tin-silver protruding block |
| CN105839171A (en) * | 2016-05-27 | 2016-08-10 | 无锡雷德环保设备有限公司 | Intelligent metal generator for precious metal electroplating |
| CN106191822A (en) * | 2016-07-03 | 2016-12-07 | 昆山中冶宝钢焊接材料有限公司 | A kind of on-line monitoring for preparation technology of welding wire and Real-time Feedback and self compensating system |
| CN106367793A (en) * | 2016-11-30 | 2017-02-01 | 合肥亿福自动化科技有限公司 | Automatic adjustment system for bath solution |
| CN207331070U (en) * | 2017-06-09 | 2018-05-08 | 巨钛科技股份有限公司 | Copper concentration management system |
| CN206986322U (en) * | 2017-06-19 | 2018-02-09 | 深圳兴汇祥科技有限公司 | Automatic feeding system |
| CN207248808U (en) * | 2017-08-23 | 2018-04-17 | 确信乐思化学（上海）有限公司 | Automatic adding device for the potentiometric analyzer of on-line monitoring chemical plating fluid stability |
| CN207672148U (en) * | 2017-09-25 | 2018-07-31 | 确信乐思化学（上海）有限公司 | Measurement device for the lasting monitoring of silver concentration in electroplating solution |
| CN207525370U (en) * | 2017-10-12 | 2018-06-22 | 金悦通电子（翁源）有限公司 | A kind of gold salt automatic adding machine |
| CN109097815A (en) * | 2018-08-06 | 2018-12-28 | 珠海市万顺睿通科技有限公司 | A kind of autocontrol method of circuit board electroplating |
| CN108914197A (en) * | 2018-09-19 | 2018-11-30 | 广东天承科技有限公司 | A kind of on-Line Monitor Device and its application |
Non-Patent Citations (1)
| Title |
|---|
| 姚冰凌 等: ""CVS技术在监控电镀槽液的运用及操作注意事项"", 《中国石油和化工标准与质量》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110747452A (en) * | 2019-12-12 | 2020-02-04 | 汉德车桥(株洲)齿轮有限公司 | Phosphorization method for precision forging gear |
| CN110904441A (en) * | 2019-12-12 | 2020-03-24 | 深南电路股份有限公司 | Method and device for controlling addition of noble metal solution |
| CN113189940A (en) * | 2021-03-16 | 2021-07-30 | 广州广合科技股份有限公司 | Method for realizing PCB liquid medicine analysis and adjustment based on ERP system, electronic equipment and storage medium |
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Application publication date: 20190816 |