CN103290453B - Ctp版材封孔处理用封孔剂 - Google Patents

Ctp版材封孔处理用封孔剂 Download PDF

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CN103290453B
CN103290453B CN201310173470.3A CN201310173470A CN103290453B CN 103290453 B CN103290453 B CN 103290453B CN 201310173470 A CN201310173470 A CN 201310173470A CN 103290453 B CN103290453 B CN 103290453B
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CN103290453A (zh
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李煜
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Huangshan Jinruitai Technology Co ltd
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Abstract

本发明公开了一种CTP版材封孔处理用封孔剂，包含5～15重量份的主剂以及2.5～8重量份的助剂；所述的主剂为硫代硫酸钠、亚硫酸钠、亚硝酸钠和硝酸钠中的一种或几种构成；所述的助剂为柠檬酸、植酸、酒石酸和磷酸中的一种或几种构成，该封孔剂的PH为3.8～5。通过上述原料配置而成的封孔剂成本低，在25～55℃下对阳极氧化后的铝板进行喷淋或浸泡10～30s，然后再用去离子水清洗即可完成铝板的封孔处理。其操作简单，而且经其封孔处理后的CTP版材的网点还原、亲水性、耐印力等性能优异。

Description

CTP版材封孔处理用封孔剂
技术领域
本发明涉及印刷版材生产领域，具体涉及一种CTP版材封孔处理用封孔剂。
背景技术
CTP版材生产所采用的工艺大致如下：铝板—除油处理—电解砂目处理—氧化处理—封孔处理—涂布感光液—烘干处理—裁切包装；其中封孔处理是通过化学方法对经过阳极氧化处理的铝板表面氧化膜的微孔进行处理，以调节其表面性能，该工艺过程对制得的CTP版材的感光度、亲水性、耐印力及保存期起关键作用。
目前，已报道的封孔处理主要有以下几种：（1）利用氟锆酸钾或醋酸盐（醋酸镍）或PF（磷酸二氢钠与氟化钠的混合物）或PVPA（聚乙烯磷酸）对铝板进行常温或高温淋洗；（2）利用水玻璃85℃进行封孔处理；（3）利用水蒸气进行封孔处理。上述三种方案虽然都能实现对阳极氧化处理后的铝板进行封孔处理，但其普遍存在不同的缺陷，如：方法（1）中利用氟锆酸钾进行封孔处理，其封孔不易控制，容易导致过封孔，使得铝板表面的亲水性降低；利用醋酸盐进行处理容易在铝板的表面形成白点、废液量大等等问题；采用PVPA封孔，主要原材料的价格昂贵、一般2000元/kg左右，不利用于提高CTP版材的生产效益。方法（2）中主要是其封孔处理时间过长、易产生结晶，无法实现CTP版材的快速生产。方法（3）中装置复杂且能耗很高，也不利用于提高CTP版材的生产效益。
因此，有必要提供一种价格低廉、封孔操作方便、时间短且易于控制的封孔剂。
发明目的
本发明的目的在于提供一种符合上述要求的CTP版材封孔处理用封孔剂。
其采取的方案为：一种CTP版材封孔处理用封孔剂，包含5～15重量份的主剂以及2.5～8重量份的助剂；所述的主剂为硫代硫酸钠、亚硫酸钠、亚硝酸钠和硝酸钠中的一种或几种构成；所述的助剂为柠檬酸、植酸、酒石酸和磷酸中的一种或几种构成，该封孔剂的PH为3.8～5。
通过上述原料配置而成的封孔剂成本低，在25～55℃下对阳极氧化后的铝板进行喷淋或浸泡10～30s，然后再用去离子水清洗即可完成铝板的封孔处理。其操作简单，而且经其封孔处理后的CTP版材的网点还原、亲水性、耐印力等性能优异。上述封孔剂中还可以包含稳定性盐等物质，如氟化钠、氯化钾等等。
但随着进一步的实验和研究发现，在实现上目的同时，按照不同比例原料配置成的封孔剂进行封孔处理，制得的CTP版材的性能之间还是存在一些差异。因此，通过长期试验、不断调节各原料的比例，最终确定采取以下两个方案作为最优化方案进行实施，进一步提高封孔处理的效果，即：
该封孔剂包含2～5%的硫代硫酸钠、3～5%亚硫酸钠、1～3%柠檬酸、2～4%植酸，余量为水。
或该封孔剂包含3～5%的硫代硫酸钠、5～10%亚硝酸钠、1～4%柠檬酸、1～4%植酸，余量为水。本申请中封孔剂中各物质的浓度，如无特别说明均指质量浓度。
具体实施方式
以下通过具体实施例来对本发明的技术方案做进一步解释和说明，但不应理解为对本发明保护范围的限定。
其中，实施例1～5中制取的封孔剂是对以H16、H18型号的铝版材为CTP版材的版基，经过除油处理、电解砂目处理、除灰处理、阳极氧化处理后得到的砂目Ra=0.45～0.60um，Rz=2.7～3.8um；氧化膜平均重量为2.5～3.0g/m2的铝板进行封孔处理。封孔处理后再在铝板上涂布感光液，涂层控制在1.45～1.65g/m2，经烘干、剪裁后制得成品CTP版材。然后再在保利特900型热敏CTP制版机上进行制版，显影采用旺昌显影机，柯达显影液：23～25℃，30秒，对显影后版材进行检测。
实施例1
取原料配置以下组分含量的封孔剂：
利用该封孔剂在25℃下对阳极氧化后的铝板进行喷淋或浸泡20s，然后用去离子水清洗即可完成铝板的封孔处理，对经过该封孔处理制得CTP板材制版、显影并对版材进行相应的检测，结果如表1所示。
实施例2：
取原料配置以下组分含量的封孔剂：
利用该封孔剂在30℃下对阳极氧化后的铝板进行喷淋或浸泡15s，然后用去离子水清洗即可完成铝板的封孔处理，对经过该封孔处理制得CTP板材制版、显影并对版材进行相应的检测，结果如表1所示。
实施例3
取原料配置以下组分含量的封孔剂：
利用该封孔剂在35℃下对阳极氧化后的铝板进行喷淋或浸泡12s，然后用去离子水清洗即可完成铝板的封孔处理，对经过该封孔处理制得CTP板材制版、显影并对版材进行相应的检测，结果如表1所示。
实施例4
取原料配置以下组分含量的封孔剂：
利用该封孔剂在35℃下对阳极氧化后的铝板进行喷淋或浸泡10s，然后用去离子水清洗即可完成铝板的封孔处理，对经过该封孔处理制得CTP板材制版、显影并对版材进行相应的检测，结果如表1所示。
实施例5
取原料配置以下组分含量的封孔剂：
利用该封孔剂在55℃下对阳极氧化后的铝板进行喷淋或浸泡10s，然后
用去离子水清洗即可完成铝板的封孔处理，对经过该封孔处理制得CTP
板材制版、显影并对版材进行相应的检测，结果如表1所示。
注：版面留底色情况按(A)→(A+)→(B-)→(B)→(B+)→(C)(从无到有)进行评价
表1为利用实施例1～5中封孔剂进行封孔处理制得的CTP板材进行制版和显影后的检测结果。

Claims (3)

1.一种CTP版材封孔处理用封孔剂，包含5～15重量份的主剂以及2.5～8重量份的助剂；所述的主剂为硫代硫酸钠、亚硫酸钠、亚硝酸钠和硝酸钠中的一种或几种构成；所述的助剂为柠檬酸、植酸、酒石酸和磷酸中的一种或几种构成，该封孔剂的pH为3.8～5。
2.如权利要求1所述的CTP版材封孔用封孔剂，其特征在于：该封孔剂包含质量浓度为2～5％的硫代硫酸钠、3～5％亚硫酸钠、1～3％柠檬酸、2～4％植酸，余量为水。
3.如权利要求1所述的CTP版材封孔处理用封孔剂，其特征在于：该封孔剂包含质量浓度为3～5％的硫代硫酸钠、5～10％亚硝酸钠、1～4％柠檬酸、1～4％植酸，余量为水。
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CN103660665A (zh) * 2013-12-05 2014-03-26 泰州市东方印刷版材有限公司 一种印刷制版的封孔工艺
CN108360039A (zh) * 2017-12-29 2018-08-03 江苏乐彩印刷材料有限公司 一种热敏ctp版材封孔剂
CN110284173B (zh) * 2019-07-29 2020-02-28 江苏卡普丹金属科技有限公司 一种铝合金阳极氧化膜的制备方法

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