CN103289366B - Heat resistance insulating plastic for electronic products, and preparation method thereof - Google Patents
Heat resistance insulating plastic for electronic products, and preparation method thereof Download PDFInfo
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- CN103289366B CN103289366B CN201310251276.2A CN201310251276A CN103289366B CN 103289366 B CN103289366 B CN 103289366B CN 201310251276 A CN201310251276 A CN 201310251276A CN 103289366 B CN103289366 B CN 103289366B
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Abstract
The present invention relates to a heat resistance insulating plastic for electronic products, and a preparation method thereof. The plastic comprises the following components, by mass: 50-80 parts of polycarbamide, 25-45 parts of an AS resin, 10-15 parts of polyetherimide, 10-15 parts of a SBS thermoplastic elastomer, 3.5-6 parts of PPO-g-MAH, 50-60 parts of magnesium oxide, 20-30 parts of alumina, 0.3-0.6 part of paraffin, 0.4-0.8 part of bisphenol A, 5-10 parts of a toughening agent, and 1.2-4.5 parts of lead sulfate tribasic. The heat resistance insulating plastic for electronic product has characteristics of strong impact resistance, high heat resistance, high insulation and high toughness, and is suitable for electronic products with a high electronic circuit integration level.
Description
Technical field
The present invention relates to a kind of plastics and preparation method thereof, particularly relate to a kind of use for electronic products high temperature insulation plastics and preparation method thereof.
Background technology
At present, the usage quantity of electronic product is in continuous increase, and in some electronic product, the integrated level of electronic circuit is very high, and the accumulation of heat is a lot, when heat acquires a certain degree, can damage performance and the life-span of electronic product.If the plastics resistance toheat that electronic product uses is not high, easily there is the situations such as distortion, affect the use of electronic product.Meanwhile, the requirement of electronic product to insulation is very high, such as the shell of radiating element, mobile communication equipment, electrical isolation plate etc.These electronic products are easy to builds up heat equally, therefore, need a kind of heat-resisting and plastics that are insulating property of simultaneously possessing.
Summary of the invention
the technical problem solved:need to possess requirement that is heat-resisting and insulation two kinds of performances for above-mentioned use for electronic products plastics, the invention provides a kind of use for electronic products high temperature insulation plastics and preparation method thereof.
technical scheme:use for electronic products high temperature insulation plastics, in mass parts containing following composition:
Polycarbonamide 50 ~ 80 parts
AS resin 25 ~ 45 parts
Polyetherimide 10 ~ 15 parts
SBS thermoplastic elastomer 10 ~ 15 parts
PPO-g-MAH 3.5 ~ 6 parts
50 ~ 60 parts, magnesium oxide
20 ~ 30 parts, aluminum oxide
0.3 ~ 0.6 part, paraffin
Dihydroxyphenyl propane 0.4 ~ 0.8 part
Toughner 5 ~ 10 parts
Lead sulfate tribasic 1.2 ~ 4.5 parts.
Use for electronic products high temperature insulation plastics described above, in mass parts containing following composition:
Polycarbonamide 60 ~ 70 parts
AS resin 30 ~ 40 parts
Polyetherimide 11 ~ 14 parts
SBS thermoplastic elastomer 10 ~ 13 parts
PPO-g-MAH 4 ~ 5 parts
53 ~ 57 parts, magnesium oxide
22 ~ 27 parts, aluminum oxide
0.4 ~ 0.5 part, paraffin
Dihydroxyphenyl propane 0.5 ~ 0.7 part
Toughner 6 ~ 9 parts
Lead sulfate tribasic 2 ~ 3.5 parts.
Toughner described above is the polymkeric substance of methyl methacrylate, vinylbenzene and organosilicon composition.
The preparation process of use for electronic products high temperature insulation plastics described above is as follows:
The first step: first magnesium oxide, aluminum oxide, PPO-g-MAH and SBS thermoplastic elastomer are added in mixing machine, rotating speed be 500 ~ 600rpm, temperature mixes at being 80 ~ 100 DEG C;
Second step: then add polycarbonamide, AS resin and polyetherimide, stir 10min under above-mentioned rotating speed and temperature, then add paraffin, dihydroxyphenyl propane, toughner and lead sulfate tribasic, discharging after stirring;
3rd step: then mixture is dropped into forcing machine, extruding pelletization at temperature is 250 ~ 270 DEG C, obtains use for electronic products high temperature insulation plastics.
beneficial effect:use for electronic products high temperature insulation plastics provided by the invention and preparation method thereof, these plastics have very strong shock resistance, and have the high heat-resisting performance with insulating, its toughness is also very high simultaneously, are well suited for the high electronic product of electronic circuit integrated level and use.
Embodiment
embodiment 1
The present embodiment provides a kind of use for electronic products high temperature insulation plastics, in mass parts containing following composition:
Polycarbonamide 80 parts
AS resin 45 parts
Polyetherimide 15 parts
SBS thermoplastic elastomer 15 parts
PPO-g-MAH 6 parts
60 parts, magnesium oxide
30 parts, aluminum oxide
0.6 part, paraffin
Dihydroxyphenyl propane 0.8 part
Toughner 10 parts
Lead sulfate tribasic 4.5 parts.
The preparation process of use for electronic products high temperature insulation plastics is as follows:
The first step: first magnesium oxide, aluminum oxide, PPO-g-MAH and SBS thermoplastic elastomer are added in mixing machine, rotating speed be 500 ~ 600rpm, temperature mixes at being 80 ~ 100 DEG C;
Second step: then add polycarbonamide, AS resin and polyetherimide, stir 10min under above-mentioned rotating speed and temperature, then add paraffin, dihydroxyphenyl propane, toughner and lead sulfate tribasic, discharging after stirring;
3rd step: then mixture is dropped into forcing machine, extruding pelletization at temperature is 250 ~ 270 DEG C, obtains use for electronic products high temperature insulation plastics.
embodiment 2
The present embodiment provides a kind of use for electronic products high temperature insulation plastics, in mass parts containing following composition:
Polycarbonamide 60 parts
AS resin 30 parts
Polyetherimide 11 parts
SBS thermoplastic elastomer 10 parts
PPO-g-MAH 4 parts
53 parts, magnesium oxide
22 parts, aluminum oxide
0.4 part, paraffin
Dihydroxyphenyl propane 0.5 part
Toughner 6 parts
Lead sulfate tribasic 2 parts.
The preparation process of use for electronic products high temperature insulation plastics is as follows:
The first step: first magnesium oxide, aluminum oxide, PPO-g-MAH and SBS thermoplastic elastomer are added in mixing machine, rotating speed be 500 ~ 600rpm, temperature mixes at being 80 ~ 100 DEG C;
Second step: then add polycarbonamide, AS resin and polyetherimide, stir 10min under above-mentioned rotating speed and temperature, then add paraffin, dihydroxyphenyl propane, toughner and lead sulfate tribasic, discharging after stirring;
3rd step: then mixture is dropped into forcing machine, extruding pelletization at temperature is 250 ~ 270 DEG C, obtains use for electronic products high temperature insulation plastics.
embodiment 3
The present embodiment provides a kind of use for electronic products high temperature insulation plastics, in mass parts containing following composition:
Polycarbonamide 70 parts
AS resin 40 parts
Polyetherimide 14 parts
SBS thermoplastic elastomer 13 parts
PPO-g-MAH 5 parts
57 parts, magnesium oxide
27 parts, aluminum oxide
0.5 part, paraffin
Dihydroxyphenyl propane 0.7 part
Toughner 9 parts
Lead sulfate tribasic 3.5 parts.
The preparation process of use for electronic products high temperature insulation plastics is as follows:
The first step: first magnesium oxide, aluminum oxide, PPO-g-MAH and SBS thermoplastic elastomer are added in mixing machine, rotating speed be 500 ~ 600rpm, temperature mixes at being 80 ~ 100 DEG C;
Second step: then add polycarbonamide, AS resin and polyetherimide, stir 10min under above-mentioned rotating speed and temperature, then add paraffin, dihydroxyphenyl propane, toughner and lead sulfate tribasic, discharging after stirring;
3rd step: then mixture is dropped into forcing machine, extruding pelletization at temperature is 250 ~ 270 DEG C, obtains use for electronic products high temperature insulation plastics.
embodiment 4
The present embodiment provides a kind of use for electronic products high temperature insulation plastics, in mass parts containing following composition:
Polycarbonamide 65 parts
AS resin 35 parts
Polyetherimide 12 parts
SBS thermoplastic elastomer 11 parts
PPO-g-MAH 4.3 parts
55 parts, magnesium oxide
24.5 parts, aluminum oxide
0.46 part, paraffin
Dihydroxyphenyl propane 0.6 part
Toughner 8 parts
Lead sulfate tribasic 3 parts.
The preparation process of use for electronic products high temperature insulation plastics is as follows:
The first step: first magnesium oxide, aluminum oxide, PPO-g-MAH and SBS thermoplastic elastomer are added in mixing machine, rotating speed be 500 ~ 600rpm, temperature mixes at being 80 ~ 100 DEG C;
Second step: then add polycarbonamide, AS resin and polyetherimide, stir 10min under above-mentioned rotating speed and temperature, then add paraffin, dihydroxyphenyl propane, toughner and lead sulfate tribasic, discharging after stirring;
3rd step: then mixture is dropped into forcing machine, extruding pelletization at temperature is 250 ~ 270 DEG C, obtains use for electronic products high temperature insulation plastics.
The above-mentioned technical performance index stating the use for electronic products high temperature insulation plastics of embodiment 1 ~ embodiment 4, its detected result is as follows:
Detected result
| Test item | Commercial samples | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 |
| Heat-drawn wire (DEG C) | 75 | 95 | 98 | 102 | 105 |
| Volume specific resistance (Ω ㎝) | 1.86E+14 | 8.87E+13 | 3.28E+14 | 4.43E+14 | 7.85E+14 |
| Shock strength (KJ/ m 2） | 69 | 92 | 93 | 95 | 98 |
Above use for electronic products high temperature insulation plastics that the embodiment of the present invention provides and preparation method thereof are described in detail, for one of ordinary skill in the art, according to the thought of the embodiment of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (3)
1. use for electronic products high temperature insulation plastics, to is characterized in that in mass parts containing following composition:
Polycarbonamide 50 ~ 80 parts
AS resin 25 ~ 45 parts
Polyetherimide 10 ~ 15 parts
SBS thermoplastic elastomer 10 ~ 15 parts
PPO-g-MAH 3.5 ~ 6 parts
50 ~ 60 parts, magnesium oxide
20 ~ 30 parts, aluminum oxide
0.3 ~ 0.6 part, paraffin
Dihydroxyphenyl propane 0.4 ~ 0.8 part
Toughner 5 ~ 10 parts
Lead sulfate tribasic 1.2 ~ 4.5 parts;
Described toughner is the polymkeric substance of methyl methacrylate, vinylbenzene and organosilicon composition.
2. use for electronic products high temperature insulation plastics according to claim 1, to is characterized in that in mass parts containing following composition:
Polycarbonamide 60 ~ 70 parts
AS resin 30 ~ 40 parts
Polyetherimide 11 ~ 14 parts
SBS thermoplastic elastomer 10 ~ 13 parts
PPO-g-MAH 4 ~ 5 parts
53 ~ 57 parts, magnesium oxide
22 ~ 27 parts, aluminum oxide
0.4 ~ 0.5 part, paraffin
Dihydroxyphenyl propane 0.5 ~ 0.7 part
Toughner 6 ~ 9 parts
Lead sulfate tribasic 2 ~ 3.5 parts.
3. the preparation method of use for electronic products high temperature insulation plastics as claimed in claim 1, is characterized in that the preparation process of the method is as follows:
The first step: first magnesium oxide, aluminum oxide, PPO-g-MAH and SBS thermoplastic elastomer are added in mixing machine, rotating speed be 500 ~ 600rpm, temperature mixes at being 80 ~ 100 DEG C;
Second step: then add polycarbonamide, AS resin and polyetherimide, stir 10min under above-mentioned rotating speed and temperature, then add paraffin, dihydroxyphenyl propane, toughner and lead sulfate tribasic, discharging after stirring;
3rd step: then mixture is dropped into forcing machine, extruding pelletization at temperature is 250 ~ 270 DEG C, obtains use for electronic products high temperature insulation plastics.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310251276.2A CN103289366B (en) | 2013-06-24 | 2013-06-24 | Heat resistance insulating plastic for electronic products, and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310251276.2A CN103289366B (en) | 2013-06-24 | 2013-06-24 | Heat resistance insulating plastic for electronic products, and preparation method thereof |
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| CN103289366A CN103289366A (en) | 2013-09-11 |
| CN103289366B true CN103289366B (en) | 2015-04-29 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105348785A (en) * | 2015-11-12 | 2016-02-24 | 国网河南内乡县供电公司 | Electric power safety cap inner liner layer material |
| CN107189306B (en) * | 2017-07-02 | 2019-02-19 | 闽东圣源机电有限公司 | A kind of motor blower fan high heat conductive insulating AS material and preparation method thereof |
| CN107400352A (en) * | 2017-08-25 | 2017-11-28 | 江苏菲勒电气有限公司 | A kind of electronics high temperature insulation plastics |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4167505A (en) * | 1978-01-12 | 1979-09-11 | Rohm And Haas Company | Impact modified high melt flow polycarbonamide |
| CN101040004A (en) * | 2004-10-14 | 2007-09-19 | 旭化成化学株式会社 | Resin composition |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7071282B2 (en) * | 2003-06-03 | 2006-07-04 | General Electric Company | Benzimidazole diamine-based polyetherimide compositions and methods for making them |
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2013
- 2013-06-24 CN CN201310251276.2A patent/CN103289366B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4167505A (en) * | 1978-01-12 | 1979-09-11 | Rohm And Haas Company | Impact modified high melt flow polycarbonamide |
| CN101040004A (en) * | 2004-10-14 | 2007-09-19 | 旭化成化学株式会社 | Resin composition |
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