CN108129819A - A kind of excellent heat conductivity PC/ABS compositions and preparation method thereof - Google Patents
A kind of excellent heat conductivity PC/ABS compositions and preparation method thereof Download PDFInfo
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- CN108129819A CN108129819A CN201711173402.1A CN201711173402A CN108129819A CN 108129819 A CN108129819 A CN 108129819A CN 201711173402 A CN201711173402 A CN 201711173402A CN 108129819 A CN108129819 A CN 108129819A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The present invention relates to a kind of excellent heat conductivity PC/ABS compositions and preparation method thereof, including following components and parts by weight：Polycarbonate resin PC：50~80, acrylonitrile butadiene styrene copolymer A BS：10~40, heat filling：5 10, antioxidant：0.1~1, lubricant：0.1~1；The preparation method of the alloy includes the following steps：It will be fed after the above components are mixed by the main spout of double screw extruder, blending is granulated, and by melting extrusion, is granulated and is obtained the excellent PC/ABS compositions of heat conductivility.Compared with prior art, the present invention significantly improves the heat transfer efficiency of material, the thermal conductivity factor of material greatly increases by carbon nanotube and the synergistic conductive force of boron nitride.
Description
Technical field
The present invention relates to polymeric material field, more particularly, to a kind of excellent heat conductivity PC/ABS compositions and its preparation
Method.
Background technology
PC/ABS alloys have excellent mechanical property and insulation performance, are widely used in automobile, household electrical appliances, digital product etc.
Field.It is generated heat under long-term work state using the molding household electrical appliances of PC/ABS or office equipment shell larger, if heat is long-term
It cannot distribute, not only result in material deformation, can also influence service life；Some materials'uses on automobile engine periphery
PC/ABS, since its heat is difficult to distribute, the service life between largely influencing, with new energy vehicle increasingly
Universal, for certain auto parts and components to work near high voltage, distributing for heat is extremely critical, therefore is studied
A kind of high-termal conductivity PC/ABS is also the trend of Materials.
Chinese patent CN102604358B discloses a kind of heat conduction antistatic PC/ABS materials and preparation method thereof, the PC/
ABS material, by weight percentage content, it is composed of the following components：PC resin 30-50%, ABS resin 10-25%, conductive powder
20-35%, antistatic agent 10-20%, compatilizer 2.5-5.5%, toughener 4-7%, lubricant 0.1-0.5%, antioxidant
0.1-1%, anti ultraviolet agent 0.1-1%；Wherein, the conductive powder uses coupling agent treatment mistake.The patent uses 20-35% heat conduction
For powder as heat filling, the main component of heat filling is one kind or several of alundum (Al2O3), magnesia, boron nitride or aluminium nitride
Kind, using this spheroidal particle as heat filling, heat reaches heat-conducting effect by the mutual conduction of particle.This mode is formed
Heat Conduction Material need to add a large amount of heat filling, heat transfer efficiency is relatively low.
Invention content
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of excellent heat conductivity PC/
ABS compositions and preparation method thereof.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of excellent heat conductivity PC/ABS compositions are prepared using the raw material of following parts by weight content：
PC resin：50~80；
ABS resin：10~40；
Heat filling：5~10；
Antioxidant：0.1~1；
Lubricant：0.1~1.
As preferred embodiment, PC resin is bisphenol A polycarbonate resin, under the conditions of 300 DEG C/1.2kg
Melt index is 8~20g/10min, and melt index of the ABS resin under the conditions of 220 DEG C/10kg is 10~15g/min.PC and
The melt index of ABS preferably this section allows for the balance of physical property and processability, when melting means is more than this section, toughness of material compared with
It is poor, crisp；When less than this range, poor in processability, it is difficult to be molded.
As preferred embodiment, heat filling is carbon nanotube and boron nitride mixture, and the carbon nanotube contains
Amount accounts for the 20~50% of filler weight part.When content of carbon nanotubes is less than 20%, heat is difficult to transmit and distribute, when higher than 50%
When, thermal conductivity factor is relatively low, and heat transfer efficiency is poor.In addition, by carbon nanotube and the heat conduction synergistic effect of boron nitride, it can be relatively low
Filer content under reach very high heat transfer efficiency.
As more preferred embodiment, the draw ratio L/d of heat filling wherein carbon nanotube is 300-500, is nitrogenized
Boron grain size is 2-3 μm, and the carbon nanotube and boron nitride heat conduction synergistic effect of this range are more preferable.
As preferred embodiment, antioxidant includes one kind in antioxidant 245, antioxidant 1076 or irgasfos 168
It is or several.
As preferred embodiment, lubricant includes one in silicone powder, pentaerythritol ester or ethylene bis stearic amide
Kind is several.
The preparation method of excellent heat conductivity PC/ABS compositions, using following steps：
(a) PC resin, ABS resin, heat filling, antioxidant and lubricant are added in mixing and blending machine and mixed；
(b) mixture obtained by step a is fed by the main spout of double screw extruder, blending is granulated, by melting
It squeezes out, is granulated and obtains the PC/ABS compositions of excellent heat conductivity.
Compared with prior art, the present invention plays synergistic work by the way that carbon nanotube and boron nitride are added in PC/ABS
With, boron nitride particles are dispersed in PC/ABS matrixes, the certain major diameter of carbon nanotube when heat transfer efficiency between boron carbide particle
Bridging action is played, as shown in Figure 1, heat can be transmitted effectively, solves the dispersion under low boron nitride content and heat transfer
Problem has very high heat transfer efficiency, adds the heat conduction compounding filler of 10phr, and the heat transfer efficiency of material can promote 100-200
Times.
Description of the drawings
Fig. 1 is the synergistic heat conduction schematic diagram of carbon nanotube and boron nitride in PC/ABS.
Specific embodiment
With reference to specific embodiment, the present invention is described in detail.Following embodiment will be helpful to the technology of this field
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill to this field
For personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made.These belong to the present invention
Protection domain.
The L-1250Y of the PC selected in following embodiment and comparative example Di Ren Asahi Chemical Industries, according to ASTM D1234 standards,
It is 10g/10min that melt index is tested at 300 DEG C；Hunan petrochemical industry PC-1220, melting means 20g/10min；ABS uses high bridge stone
The ABS8434 of change, test melting means is 12g/10min at 220 DEG C；Many walls nanotube of the carbon nanotube for the triumphant graphite in Qingdao east, nitrogen
Change the cubic boron nitride that boron is rich Nike；Antioxidant 1010, irgasfos 168 of the antioxidant for the production of CIBA companies, lubricant are
Calcium stearate.
Comparative example 1
PC/ABS compositions of a kind of excellent heat conductivity and preparation method thereof, this method includes the following steps：
(1) each component is weighed by weight：PC is L1250Y：60,ABS8434：40, antioxidant 1010 0.1, antioxidant
168 0.1, lubricant PETS 0.3.
(2) raw material are fed from extruder feed port, the melting extrusion at 220~260 DEG C, screw extruder rotating speed is
500rpm, pressure 2MPa by melting extrusion, are granulated and obtain product.
Comparative example 2
A kind of transparent scratch resistant polycarbonate compositions and preparation method thereof, this method includes the following steps：
(1) each component is weighed by weight：PC is PC-1220：70, ABS8434：20, boron nitride：10, antioxidant 1010
0.1, irgasfos 168 0.1, lubricant PETS 0.3.
(2) all raw material are fed after mixing from extruder feed port, the melting extrusion at 220~260 DEG C,
Screw extruder rotating speed is 500rpm, pressure 2MPa, by melting extrusion, is granulated and obtains product.
Embodiment 1
A kind of preparation method of excellent heat conductivity PC/ABS compositions, using following steps：
(1) each component is weighed by weight：PC is PC-1220：60,ABS8434：30, boron nitride：8, CNT：2, antioxidant
1010 0.1, irgasfos 168 0.1, lubricant PETS 0.3.
(2) boron nitride and CNT are pre-mixed and then fed after mixing from extruder feed port with other raw material
Enter, the melting extrusion at 220~260 DEG C, screw extruder rotating speed is 500rpm, pressure 2MPa, by melting extrusion, is granulated
Obtain product.
Embodiment 2
A kind of preparation method of excellent heat conductivity PC/ABS compositions, using following steps：
(1) each component is weighed by weight：PC is L1250Y：80,ABS8434：10, CNT：2, boron nitride：8, antioxidant
1010 0.1, irgasfos 168 0.1, lubricant PETS 0.3.
(2) boron nitride and CNT are pre-mixed and are fed after mixing from extruder feeding with other raw material,
Melting extrusion at 220~260 DEG C, screw extruder rotating speed are 500rpm, and pressure 2MPa by melting extrusion, is granulated to obtain the final product
To product.
Embodiment 3
A kind of preparation method of excellent heat conductivity PC/ABS compositions, using following steps：
(1) each component is weighed by weight：PC is PC-1220：70,ABS8434：30, boron nitride：8, CNT：2, antioxidant
1010 0.1, irgasfos 168 0.1, lubricant PETS 0.3.
(2) boron nitride and CNT are pre-mixed and are fed after mixing from extruder feeding with other raw material,
Melting extrusion at 220~260 DEG C, screw extruder rotating speed are 500rpm, and pressure 2MPa by melting extrusion, is granulated to obtain the final product
To product
Each comparative example and embodiment are molded into the tablet of 100*80*3mm, using the DRL-3 type measuring thermal conductivity instrument of Hunan section
Test, as a result such as following table：
| Comparative example 1 | Comparative example 2 | Embodiment 1 | Embodiment 2 | Embodiment 3 | |
| Thermal conductivity factor (W/mk) | 0.2 | 15 | 87 | 123 | 96 |
| Notch impact strength (KJ/m2) | 50 | 45 | 48 | 46 | 45 |
| Tensile strength (MPa) | 52 | 52 | 54 | 54 | 54 |
As seen from table, when being added without any heat filling, the thermal conductivity factor of PC/ABS about 0.2W/mk or so (PC and
ABS is 0.2~0.25), when the cubic boron nitride that 10 parts are added in PC/ABS, the thermal conductivity factor of material is increased to 15 from 0.2；
Comparative example 1 and comparative example 1, after heat filling is added in, the thermal conductivity coefficient of material has 0.2 to be increased to 87, and 2 He of comparative example
Embodiment 2 the result shows that, the synergistic effect of 2 parts of CNT can greatly improve the heat transfer efficiency of boron nitride, and thermal conductivity factor increases from 15
123W/mk is added to, embodiment 3 also further demonstrates that the efficiency of CNT and boron nitride heat conduction synergistic, is cooperateed with by CNT and boron nitride
The high PC/ABS of thermal conductivity factor prepared by heat conduction can be effectively utilized requires field in high heat conduction, and by carbon nanotube and
The heat conduction synergistic effect of boron nitride can reach very high heat transfer efficiency under relatively low filer content.
Embodiment 4
A kind of excellent heat conductivity PC/ABS compositions are prepared using the raw material of following parts by weight content：PC resin：
50th, ABS resin：40th, heat filling：5th, antioxidant：0.1st, lubricant：0.1.
Wherein, the PC resin used is bisphenol A polycarbonate resin, the melt index under the conditions of 300 DEG C/1.2kg
For 8~20g/10min, melt index of the ABS resin under the conditions of 220 DEG C/10kg is 10~15g/min.The melting of PC and ABS
Index preferably this section allows for the balance of physical property and processability, and when melting means is more than this section, toughness of material is poor, crisp；When
During less than this range, poor in processability, it is difficult to be molded.Heat filling be carbon nanotube and boron nitride mixture, content of carbon nanotubes
The 20% of filler weight part is accounted for, when content of carbon nanotubes is less than 20%, heat is difficult to transmit and distribute.In addition, pass through carbon nanotube
, can be under relatively low filer content with the heat conduction synergistic effect of boron nitride, the condition as there was only 5 in the present embodiment in parts by weight
Very high heat transfer efficiency can be reached down.Antioxidant is antioxidant 245, and lubricant is silicone powder.
The preparation method of excellent heat conductivity PC/ABS compositions, using following steps：
(a) PC resin, ABS resin, heat filling, antioxidant and lubricant are added in mixing and blending machine and mixed；
(b) mixture obtained by step a is fed by the main spout of double screw extruder, blending is granulated, by melting
It squeezes out, is granulated and obtains the PC/ABS compositions of excellent heat conductivity.
Embodiment 5
A kind of excellent heat conductivity PC/ABS compositions, preparation method is roughly the same with embodiment 4, using following parts by weight
The raw material of content is prepared：PC resin：60th, ABS resin：30th, heat filling：6th, antioxidant：0.5th, lubricant 0.5.
Wherein, the PC resin used is bisphenol A polycarbonate resin, the melt index under the conditions of 300 DEG C/1.2kg
For 8~20g/10min, melt index of the ABS resin under the conditions of 220 DEG C/10kg is 10~15g/min.Heat filling is carbon
Nanotube and boron nitride mixture, content of carbon nanotubes account for the 30% of filler weight part.Antioxidant is irgasfos 168, lubricant
For ethylene bis stearic amide.
Embodiment 6
A kind of excellent heat conductivity PC/ABS compositions, preparation method is roughly the same with embodiment 4, using following parts by weight
The raw material of content is prepared：PC resin：80th, ABS resin：10th, heat filling：10th, antioxidant：1st, lubricant 1.
Wherein, the PC resin used is bisphenol A polycarbonate resin, the melt index under the conditions of 300 DEG C/1.2kg
For 8~20g/10min, melt index of the ABS resin under the conditions of 220 DEG C/10kg is 10~15g/min.Heat filling is carbon
Nanotube and boron nitride mixture, content of carbon nanotubes account for the 50% of filler weight part, when higher than 50%, thermal conductivity factor compared with
Low, heat transfer efficiency is poor.Antioxidant is antioxidant 1076, and lubricant is pentaerythritol ester.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (8)
1. a kind of excellent heat conductivity PC/ABS compositions, which is characterized in that the composition uses the raw material of following parts by weight content
It is prepared：
PC resin：50~80；
ABS resin：10~40；
Heat filling：5~10；
Antioxidant：0.1~1；
Lubricant：0.1~1.
2. a kind of excellent heat conductivity PC/ABS compositions according to claim 1, which is characterized in that the PC resin is
Bisphenol A polycarbonate resin, the melt index under the conditions of 300 DEG C/1.2kg are 8~20g/10min.
A kind of 3. excellent heat conductivity PC/ABS compositions according to claim 1, which is characterized in that the ABS resin
Melt index under the conditions of 220 DEG C/10kg is 10~15g/min.
A kind of 4. excellent heat conductivity PC/ABS compositions according to claim 1, which is characterized in that the heat filling
For carbon nanotube and boron nitride mixture, the content of carbon nanotubes accounts for the 20~50% of filler weight part.
A kind of 5. excellent heat conductivity PC/ABS compositions according to claim 1, which is characterized in that the heat filling
For carbon nanotube and the mixture of boron nitride, the wherein draw ratio L/d of carbon nanotube is 300-500, and boron nitride grain size is 2-3 μ
m。
A kind of 6. excellent heat conductivity PC/ABS compositions according to claim 1, which is characterized in that the antioxidant packages
Include one or more of antioxidant 245, antioxidant 1076 or irgasfos 168.
A kind of 7. excellent heat conductivity PC/ABS compositions according to claim 1, which is characterized in that the lubricant packet
Include one or more of silicone powder, pentaerythritol ester or ethylene bis stearic amide.
8. the preparation method of excellent heat conductivity PC/ABS compositions as described in claim 1, which is characterized in that this method uses
Following steps：
(a) PC resin, ABS resin, heat filling, antioxidant and lubricant are added in mixing and blending machine and mixed；
(b) mixture obtained by step a being fed by the main spout of double screw extruder, blending is granulated, by melting extrusion,
It is granulated and obtains the PC/ABS compositions of excellent heat conductivity.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900273A (en) * | 2020-07-16 | 2020-11-06 | 惠州市吉昀精密部件有限公司 | Heat-dissipation waterproof composite lithium ion battery shell material and preparation method thereof |
| CN113214627A (en) * | 2021-05-10 | 2021-08-06 | 昆山世铭金属塑料制品有限公司 | Shell material for mobile hard disk and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111900273A (en) * | 2020-07-16 | 2020-11-06 | 惠州市吉昀精密部件有限公司 | Heat-dissipation waterproof composite lithium ion battery shell material and preparation method thereof |
| CN111900273B (en) * | 2020-07-16 | 2022-09-23 | 惠州市吉昀精密部件有限公司 | Heat-dissipation waterproof composite lithium ion battery shell material and preparation method thereof |
| CN113214627A (en) * | 2021-05-10 | 2021-08-06 | 昆山世铭金属塑料制品有限公司 | Shell material for mobile hard disk and preparation method thereof |
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