CN103273054B - Copper powder and heat radiating piece using same - Google Patents
Copper powder and heat radiating piece using same Download PDFInfo
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- CN103273054B CN103273054B CN201310171047.XA CN201310171047A CN103273054B CN 103273054 B CN103273054 B CN 103273054B CN 201310171047 A CN201310171047 A CN 201310171047A CN 103273054 B CN103273054 B CN 103273054B
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Abstract
The invention discloses copper powder and a heat radiating piece using the same. The apparent density of the copper powder is 0.8g/cm3 to 2.0g/cm3, the copper powder is mainly composed of non-arborization and irregular single-particle copper powder, and the surfaces of the particles of the copper powder are rough and are provided with holes or clearances. Compared with the prior art, the copper powder is ultra-small in apparent density and is mainly composed of the single-particle copper powder with irregular shapes, a grouping phenomenon does not exist, or very few grouping phenomena exist, the porosity of the copper powder after jolt ramming and sintering is larger, and a good heat radiating property is achieved.
Description
Technical field
The present invention relates to metal powder material field, particularly relate to a kind of apparent density lower than 2.0g/cm
3copper powder and apply the radiating piece of this copper powder.
Background technology
Copper powder is the important raw and processed materials of electronics industry, machinery manufacturing industry and auto industry, the apparent density of copper powder is then the important parameter of copper powder performance, different applications is different to the requirement of apparent density, some field (as injection-molded product) requires the copper powder of high apparent density, some field (as the heat pipe in scattering industry and hot plate) then requires the copper powder of low-apparent-density, and commercial its apparent density of copper powder is generally 2.8g/cm at present
3-3.8g/cm
3, several enterprises can produce 2.0g/cm
3-2.8g/cm
3low-apparent-density copper powder, for apparent density lower than 2.0g/cm
3copper powder still belong to blank, bring restriction to the application of some high-order product and new product.
Summary of the invention
One of the object of the invention is to provide a kind of copper powder.
Another object of the present invention is to provide a kind of radiating piece applying above-mentioned copper powder.
One of for achieving the above object, a kind of copper powder of the present invention, the apparent density of this copper powder is 0.8g/cm
3to 2.0g/cm
3, and primarily of non-dendroid individual particle copper powder in irregular shape composition, the rough surface of described copper powder particle is also provided with hole or crack.
As a further improvement on the present invention, the tap density of described copper powder is 1.2-2.5g/cm3, its through jolt ramming and 980 DEG C sintering 30 minutes after porosity be greater than 63%.
As a further improvement on the present invention, the granularity of described copper powder is 18 order to 500 orders.
For realizing another goal of the invention above-mentioned, a kind of radiating piece of the present invention, comprise the heat sink body of metal material and be covered in the copper powder layer of described heat sink body, the thickness of described copper powder layer is 0.2mm-10mm, the copper powder of this copper powder layer to be apparent density be 0.8g/cm3 to 2.0g/cm3, and copper powder forms primarily of individual particle copper powder in irregular shape, the tap density of described copper powder is 1.2-2.5g/cm3, its through jolt ramming and 980 DEG C sintering 30 minutes after porosity be greater than 63%.
As a further improvement on the present invention, the granularity of described copper powder is 18 order to 500 orders.
Compared to prior art, beneficial effect of the present invention is, copper powder of the present invention has ultralow apparent density, and primarily of individual particle copper powder composition in irregular shape, there is not or exists the dough phenomenon of only a few, the porosity of copper powder after jolt ramming sintering is comparatively large, has good heat dispersion.
Accompanying drawing explanation
Fig. 1 is the producing device schematic diagram of ultralow apparent-density copper powder of the present invention.
Fig. 2 is for utilizing the copper powder structural form under an electron microscope obtained by the ultralow apparent-density copper powder preparation method of the present invention.
Fig. 3 is the configuration of surface of copper particle in the copper powder utilizing preparation method of the present invention to obtain in Fig. 2.
Fig. 4 is hole or the crack structural form under an electron microscope of individual particle Copper Powder Surface in copper powder of the present invention.
Fig. 5 is the generalized section of a kind of radiating tube utilizing copper powder of the present invention.
Fig. 6 is the generalized section of a kind of temperature uniforming heat radiation plate utilizing copper powder of the present invention.
Detailed description of the invention
As shown in Figures 1 to 6, the invention provides a kind of preparation method of ultralow apparent-density copper powder, it improves on the water atomization of routine, can obtain apparent density lower than 0.8-2.0g/cm
3copper powder, this preparation method at least comprises following several step: melting process, atomization process, dry process, reduction treatment and post-processed.
Described melting process is at the temperature of 1150 DEG C-1400 DEG C (optimum temperature is 1220 DEG C-1350 DEG C), solid pure copper raw material is melted as in smelting furnace 1, and oxygenation operation is carried out in this fusion process, this oxygenation operation is joined by oxygen in described smelting furnace 1, the oxygen content of the molten copper liquid 2 after oxygenation is made to be 0.1%-10%(mass percent), optimum value is 0.2%-5%, and described oxygenation operation can be that the molten metal copper in smelting furnace 1 is carried out to oxygen blast or blows air.The liquid copper melt 2 of described melting process gained is poured in bottom pour ladle 11, and flows out from the small opening 3 bottom bottom pour ladle 11, enters atomization treatment process subsequently, and the aperture of described small opening 3 is 4mm to 10mm(optimum aperture is 6-8mm).
Described atomization process is when liquid copper melt 2 flows out smelting furnace 1, adopts atomising device (the present invention refers to shower nozzle 4) to spray aqueous water (being generally pure water) to described liquid copper melt 2, makes liquid copper melt 2 be cooled rapidly into graininess copper powder 6.Described shower nozzle is Conic nozzle 4 and is placed in the below of described smelting furnace small opening 3, refer to shown in Fig. 1, this shower nozzle 4 is made up of (optimal number is 12 to 40) the nozzle 5 that 4 to 45 are arranged in annular, in Fig. 1, the quantity of nozzle 5 is only signal, described each nozzle 5 all sprays towards the same spray site A being positioned at described annular central lower, and the jet apex angle of described nozzle 5 (angle namely between injection direction M and vertical direction) is 30 degree to 55 degree, so constitutes described Conic nozzle 4.The diameter of described nozzle 5 is 1.0mm to 4.0mm(optimum diameter is 2.0mm-3.0mm), water pressure in nozzle 5 is 2MPa to 10MPa, described liquid copper melt 2 vertically flows through described spray site A after described small opening 3 flows out, under the effect of described Conic nozzle 4, liquid copper melt 2 can cool rapidly and form copper powder 6, and is contained in storage bucket 7.
Described drying process processes to described atomization the copper powder 6 obtained to carry out drying, drying comprises the drying of normal temperature centrifuge dewatering or heats, these two kinds of modes can be carried out separately also can in conjunction with carrying out, and heating-up temperature during heating is between 100 DEG C to 400 DEG C.
Described reduction treatment utilizes reducing gas to reduce to the copper powder after drying process, and described reducing gas comprises hydrogen or nitrogen hydrogen mixeding gas, and the temperature of reduction treatment is between 200 DEG C to 800 DEG C, and wherein, optimum temperature is between 300 DEG C to 600 DEG C.
Described post-processed comprises carries out the operations such as fragmentation, anti-oxidant and screening to copper powder, obtain the finished product copper powder that apparent density is 0.8-2.0g/cm3, wherein, the composition of the antioxidant that described anti-oxidant operation adopts is containing C, H, O, N, Cl, F and Si, and its content is 0.001-0.2% (mass percent).
The present invention is because adopting above-mentioned smelting technology, change mobility and the surface tension of molten metal, especially oxygenation operational sequence, oxygen is circulated the inside of described copper melt, increase the viscosity of metal liquid, better resist the nodularization process of metallic copper drop when cooled and solidified, simultaneously, in atomization processing procedure, the optimum configurations of described Conic nozzle 4 effectively can utilize the impact property of atomized water, optimum molten drop cooling velocity can be obtained, thus make the copper particle A forming copper powders have changeable, irregular shape (only there is the spherical or class spherical powder lower than 10%), can join shown in Fig. 2, so significantly reduce the apparent density of copper powder.In addition, reduction treatment of the present invention can effectively remove the oxygen contained in copper powder, the oxygen of hydrogen in reducing gas in copper powder is combined form water and at high temperature evaporated, the evaporation of moisture causes the surface of described copper particle A to form hole or crack B, can join shown in Fig. 3.
Compared to prior art, preparation method of the present invention can obtain apparent density between 0.8-2.0g/cm
3between copper powder, and described copper powder is made up of individual particle copper powder A, owing to cooling fast copper melt under the optimum temperature of 1220 DEG C-1350 DEG C, make the dough phenomenon that there is not or only exist very minority between the copper powder particle in copper powder, and the granularity of copper powder is between 18 order to 500 orders, in copper powder, the rough surface of individual particle copper powder A is rough, and is provided with the hole or crack B that are formed because of moisture evaporation, please refer to Fig. 4.Described hole, crack B produce in above-mentioned reducing process process, because oxygenation operation during melting makes to dissolve a large amount of oxygen in copper liquid, under reducing atmosphere, hydrogen atom enters into copper powder inside due to its minimum atomic radius, with oxygen water generation reaction steam, water vapour goes out from the inner loss of copper powders, forms a large amount of crackle and hole thus on the surface of copper powder particle.In addition, the copper powder that the present invention obtains is after jolt ramming sintering, porosity is greater than 63%, wherein, the tap density of copper powder after jolt ramming is 1.2-2.5g/cm3, sintering temperature 980 DEG C, sintering time 30 minutes, so-called tap density is the comprehensive embodiment of the multiple physical property of powder, refer to and the powder contained in a reservoir (is specified to carry out by GB5162) by the density (i.e. the quality of unit volume) after jolt ramming under defined terms, as a rule, tap density and bulk density, granule-morphology, size distribution etc. have relation, copper powder of the present invention forms primarily of individual particle copper powder, and the shape of individual particle copper powder is extremely irregular, therefore, make the porosity between copper powder particle higher.
The copper powder of apparent density of the present invention between 0.8-2.0g/cm3 can be widely used in every field, due to its higher porosity (being greater than 63%), individual particle copper powder irregularly shaped, make space between individual particle copper powder comparatively large and void count is more, and be made up of individual particle copper powder in copper powder, there is not or exists the dough phenomenon of only a few between copper powder particle, aforementioned structure characteristic determines copper powder of the present invention can be widely used in field of radiating very much, as computer innernal CPU with or VGA video card radiating piece on, because the microstructure of copper powder of the present invention can make air, the heat eliminating mediums such as cooling water are well by described hole, there is good heat dispersion, effectively can improve the radiating effect of radiating piece, below illustrate.
Figure 6 shows that the cross section view of the radiating tube of a kind of CPU use or VGA video card, the heat sink body 21 of this radiating tube 20 is made for metal material, it is cylindrical and be provided with a circular inner chamber 22, the copper powder layer 24 that this inner chamber 22 is provided with an inner surface 23 and is covered on described inner surface 23, the thickness of this copper powder layer 24 is 0.2mm-10mm, this copper powder layer apparent density that make use of obtained by the present invention is the copper powder between 0.8-2.0g/cm3, because apparent density is lower, the shape of copper powder particle is changeable, add the surface area of copper powder particle, and its higher porosity also increases percent of pass, air or cooling medium (as cooling water) can very easily be passed through, substantially increase the radiating efficiency of radiating tube, copper powder compared to existing technology, utilize the radiating tube of copper powder of the present invention greatly can improve radiating effect.
In addition, except above-mentioned radiating tube, described VGA video card also has a kind of temperature uniforming heat radiation plate (vapor chamber, also cavity soaking plate is) 30, it is provided with in tabular and is positioned at the heat sink body 31 of chip (not shown) top, this heat sink body 31 is metal material, it is provided with an inner chamber 32, the inner surface of this inner chamber 32 is coated with one deck copper powder layer 33, this copper powder layer 33 adopts copper powder of the present invention, because in this copper powder layer 33, containing a large amount of individual particle copper powders, (copper powder particle spherical in Fig. 6 is only signal, copper powder particle of the present invention is actual is irregularly shaped), and after its jolt ramming sintering, there is the porosity being greater than 63%, make the gap flow through between copper powder particle that in inner chamber 32, air or cooling water can be unobstructed, and in inner chamber, carry out circulating cooling well, substantially increase the heat dispersion of heat sink body 31 surface of internal cavity, heat is well passed on another outer surface 34 of temperature uniforming heat radiation plate by this heat sink body 31 by heat, thus improve the radiating effect of temperature uniforming heat radiation plate.
The above is only most preferred embodiment of the present invention, not does any pro forma restriction to the present invention.Any those of ordinary skill in the art, are not departing under technical solution of the present invention ambit, utilize the method content of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, all belong to the scope of claims protection.
Claims (5)
1. a copper powder, is characterized in that: the apparent density of this copper powder is 0.8g/cm
3to 2.0g/cm
3, and primarily of non-dendroid individual particle copper powder in irregular shape composition, the rough surface of described copper powder particle is also provided with hole or crack.
2. copper powder as claimed in claim 1, is characterized in that: the tap density of described copper powder is 1.2-2.5g/cm3, and it is through jolt ramming and be greater than 63% in the porosity of 980 DEG C of sintering after 30 minutes.
3. copper powder as claimed in claim 2, is characterized in that: the granularity of described copper powder is 18 order to 500 orders.
4. a radiating piece, comprise the heat sink body of metal material and be covered in the copper powder layer of described heat sink body, it is characterized in that: the thickness of described copper powder layer is 0.2mm-10mm, the copper powder of this copper powder layer to be apparent density be 0.8g/cm3 to 2.0g/cm3, and copper powder forms primarily of individual particle copper powder in irregular shape, the tap density of described copper powder is 1.2-2.5g/cm3, its through jolt ramming and 980 DEG C sintering 30 minutes after porosity be greater than 63%.
5. radiating piece as claimed in claim 4, is characterized in that: the granularity of described copper powder is 18 order to 500 orders.
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|---|---|---|---|
| CN201310171047.XA CN103273054B (en) | 2011-10-14 | 2011-10-14 | Copper powder and heat radiating piece using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310171047.XA CN103273054B (en) | 2011-10-14 | 2011-10-14 | Copper powder and heat radiating piece using same |
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|---|---|---|---|
| CN2011103112772A Division CN102476184A (en) | 2010-11-19 | 2011-10-14 | Copper powder as well as manufacture method, manufacture device and heat radiation element thereof |
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| CN103273054A CN103273054A (en) | 2013-09-04 |
| CN103273054B true CN103273054B (en) | 2015-01-28 |
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|---|---|---|---|---|
| CN104368805B (en) * | 2014-09-16 | 2017-03-22 | 湖南省天心博力科技有限公司 | Method for producing composite copper powder for ultrathin heat pipe |
| CN104711075A (en) * | 2015-04-08 | 2015-06-17 | 苏惠卿 | Preparation method and application of micron copper powder lubricating oil additive with low apparent density |
| CN113245543B (en) * | 2021-07-15 | 2021-10-01 | 江苏集萃先进金属材料研究所有限公司 | Copper powder, preparation method thereof and capillary core prepared from copper powder |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS644401A (en) * | 1987-06-24 | 1989-01-09 | Fukuda Metal Foil Powder | Production of spheroidal copper powder |
| JP4701426B2 (en) * | 1999-12-01 | 2011-06-15 | Ｄｏｗａエレクトロニクス株式会社 | Copper powder and copper powder manufacturing method |
| CN1115300C (en) * | 2000-05-26 | 2003-07-23 | 李国胜 | Process for modifying atomized copper powder by oxidization |
| CN1358592A (en) * | 2000-12-09 | 2002-07-17 | 甘肃雷诺换热设备有限公司 | Method for reducing metal powder bulk loading density |
| CN1358593A (en) * | 2000-12-09 | 2002-07-17 | 甘肃雷诺换热设备有限公司 | Method for reducing atomized copper powder bulk loading density |
| US20050182161A1 (en) * | 2000-12-15 | 2005-08-18 | Rajesh Khattar | Irregular shaped copper particles and methods of use |
| CN1286604C (en) * | 2003-05-29 | 2006-11-29 | 中科铜都粉体新材料股份有限公司 | Method for preparing copper powder by water atomization method |
| CN100450674C (en) * | 2005-12-12 | 2009-01-14 | 绍兴市吉利来金属材料有限公司 | Method for preparing low apparent density copper powder by reduction of water atomized dry powder |
| CN100488670C (en) * | 2006-04-07 | 2009-05-20 | 郭德林 | Spray method for preparing low apparent density copper powder |
| CN1824435A (en) * | 2006-04-07 | 2006-08-30 | 郭德林 | Spray method for preparing low apparent density bronze powder |
| CN101704103B (en) * | 2009-12-22 | 2012-12-05 | 元磁新型材料(苏州)有限公司 | Compound copper powder for manufacturing capillary structure of inner wall of heat pipe |
| CN101837460B (en) * | 2010-04-26 | 2011-12-28 | 吴棕洋 | Method for preparing low-apparent-density copper powder through water atomization |
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