CN103268142A - Heat-dissipating device of computer central processing unit - Google Patents
Heat-dissipating device of computer central processing unit Download PDFInfo
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- CN103268142A CN103268142A CN2013102217437A CN201310221743A CN103268142A CN 103268142 A CN103268142 A CN 103268142A CN 2013102217437 A CN2013102217437 A CN 2013102217437A CN 201310221743 A CN201310221743 A CN 201310221743A CN 103268142 A CN103268142 A CN 103268142A
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- processing unit
- central processing
- heat
- dissipating device
- computer central
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat-dissipating device of a computer central processing unit. The heat-dissipating device of the computer central processing unit comprises a metal heat dissipater (1), air holes (2) and a fan (3). The heat-dissipating device of the computer central processing unit is characterized in that the air holes (2) are formed in the bottom of the metal heat dissipater (1), and the fan (3) is arranged on the upper portion of the metal heat dissipater (1). When the fan (3) is started, cold air can be sent to the central processing unit closely attached to the metal heat dissipater (1) and the periphery of the central processing unit along the air holes (3), and therefore the dual heat-dissipating cooling effect that the central processing unit and the metal heat dissipater are cooled directly by the cold air. Therefore, compared with an existing heat-dissipating device, the heat-dissipating device of the computer central processing unit is better in heat-dissipating and cooling effect. In addition, the heat-dissipating device of the computer central processing unit is simple in structure, easy to manufacture and good in heat-dissipating and cooling effect on the computer central processing unit.
Description
Technical field
Patent of the present invention relates to a kind of heat abstractor, and more particularly, patent of the present invention relates to the heat abstractor of central processing unit (CPU).
Background technology
During central processing unit work, because the effect of resistance can produce certain temperature, when temperature surpasses a threshold value, computer corruption can be caused, also central processing unit and mainboard can be burnt out when serious.So when design, central processing unit generally all can supporting design heat abstractor.But present heat abstractor is that central processing unit is bonded on the Aluminium Radiator, forces the blowing heat radiation by fan then, reaches the purpose of radiating and cooling.The defective of this design is: central processing unit can't directly contact with the cold air that fan blows by force, only depend on the heat of Aluminium Radiator to transmit radiating and cooling, thereby radiating efficiency is low, can not well solve central processing unit because the too high and computer corruption of when work temperature even the problem that burns out.According to field measurement (room temperature is 30 degree), under this heat abstractor condition, the maximum temperature of central processing unit can reach 80 degree, working temperature also is everlasting about 65 degree, very easily cause deadlock, up to the present, the also more imperfect design of the heat abstractor of central processing unit.
Summary of the invention
The purpose of patent of the present invention is to overcome the deficiencies in the prior art, provides a kind of radiating efficiency high central processing unit (CPU) heat abstractor.
The purpose of patent of the present invention is achieved by following technical proposals.
Establish pore 2 in the bottom of metal heat sink 1, establish fan 3 on the top of metal heat sink 1.
The beneficial effect of patent of the present invention is:
1. owing to be provided with pore 2 in metal heat sink 1 bottom, when starting fan 3, cold air will blow to central processing unit and the periphery of being close to metal heat sink 1 bottom along pore 2, thereby the heat that central processing unit produces when directly taking away its computer operation rapidly reaches the purpose of direct radiating and cooling.Central processing unit directly contacts radiating and cooling with cold air, and metal heat sink 1 can directly be taken away a part of heat again and reach the effect of dual radiating and cooling, overcome traditional heat abstractor to only depend on the heat radiator radiating and cooling, thereby the inefficient defective of lowering the temperature.Be 30 to survey when spending in room temperature, with the heat abstractor of two same specification shapes number, one is not establish the hole, establishes the hole for one, and the heat sink temperature of not establishing the hole can reach 75 degree, and the temperature of establishing the hole is 42 to 51 degree.This shows that cooling-down effect is remarkable, thereby guarantee that computing machine does not have the problem that crashes and burn out central processing unit and mainboard.
2. patent structure of the present invention is simple, makes easily, and cost is low, is fit to central processing unit (CPU) and computing machine manufacturer and promotes the use of.
Description of drawings
Fig. 1 is patent master's TV structure synoptic diagram of the present invention (partial cutaway is shown);
Fig. 2 is patent plan structure synoptic diagram of the present invention;
Fig. 3 looks up structural representation for patent of the present invention;
Fig. 4 is patent of the present invention left side TV structure synoptic diagram;
Fig. 5 is patent A-A sectional structure synoptic diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing to being further described for patent of the present invention.
Embodiment 1: make heating radiator 1 with metal material, get pore 2 between two heat radiator of metal heat sink 1 bottom, tighten connection fan 3 at metal heat sink 1.
Claims (1)
1. central processing unit (CPU) heat abstractor, by metal heat sink (1), pore (2), fan (3) is formed, and it is characterized in that: establish heat radiation pore (2) in the bottom of metal heat sink (1), fan (3) is established on the top of metal heat sink (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102217437A CN103268142A (en) | 2013-06-06 | 2013-06-06 | Heat-dissipating device of computer central processing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102217437A CN103268142A (en) | 2013-06-06 | 2013-06-06 | Heat-dissipating device of computer central processing unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103268142A true CN103268142A (en) | 2013-08-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102217437A Pending CN103268142A (en) | 2013-06-06 | 2013-06-06 | Heat-dissipating device of computer central processing unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103268142A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2535842Y (en) * | 2002-02-08 | 2003-02-12 | 邓淑贞 | Radiating fin |
| CN1835671A (en) * | 2005-03-14 | 2006-09-20 | 林项武 | Radiator of electronic component |
-
2013
- 2013-06-06 CN CN2013102217437A patent/CN103268142A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2535842Y (en) * | 2002-02-08 | 2003-02-12 | 邓淑贞 | Radiating fin |
| CN1835671A (en) * | 2005-03-14 | 2006-09-20 | 林项武 | Radiator of electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130828 |