CN103267938B - CIS wafer becomes survey machine - Google Patents
CIS wafer becomes survey machine Download PDFInfo
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- CN103267938B CN103267938B CN201310183519.3A CN201310183519A CN103267938B CN 103267938 B CN103267938 B CN 103267938B CN 201310183519 A CN201310183519 A CN 201310183519A CN 103267938 B CN103267938 B CN 103267938B
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- camera lens
- light source
- supply apparatus
- installing plate
- light supply
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- 230000007246 mechanism Effects 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 230000013011 mating Effects 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to integrated circuit (IC) chip processing technology field, disclose a kind of CIS wafer and become survey machine, comprise base and light supply apparatus, described light supply apparatus is arranged on described base, described light supply apparatus comprises camera lens installing plate, described camera lens installing plate is provided with multiple camera lens mounting hole, in described each camera lens mounting hole, a camera lens is set, in the below of described camera lens installing plate, light source installing plate is set, multiple light source board is provided with, described multiple light source board and described multiple camera lens mounting hole one_to_one corresponding in described light source installing plate.The setting of sliding platform of the present invention makes camera lens accurate with aiming at of chip; The setting of light source, makes into survey machine compact conformation, easy to operate; The fast and easy when mounting means of camera lens and light source makes camera lens and replacing light source.
Description
Technical field
The present invention relates to integrated circuit (IC) chip processing technology field, particularly a kind of CIS wafer becomes survey machine.
Background technology
CIS chip is a kind of image-signal processor chip, and this chip aims at image sensor chip, and it processes the light (image) accepted, and is widely used in scanner, facsimile recorder, Digital Video, camera.CIS wafer scale becomes survey machine to be for tested object with the packaged wafer of full wafer, according to the mode of middle survey probe station, electrical property and image property test are carried out to every CIS chip on wafer, be a kind of be better than JEDEC or CHIP pallet dress chip testing processor, have simple, easy to use, cost is low, not easily cause the advantages such as damage to chip.
Existing CIS wafer scale becomes survey machine structure simple, and operation inconvenience, also will increase secondary light source when testing, can not meet the demand of the wafer-level test to CIS chip.
Summary of the invention
The object of the invention is to solve the problems of the technologies described above, providing a kind of CIS wafer to become survey machine, becoming survey machine to realize light source to making CIS wafer provides and detects one.
The technical scheme that the present invention takes is:
A kind of CIS wafer becomes survey machine, comprise base and light supply apparatus, described light supply apparatus is arranged on described base, described light supply apparatus comprises camera lens installing plate, and described camera lens installing plate is provided with multiple camera lens mounting hole, in described each camera lens mounting hole, arrange a camera lens, it is characterized in that, light source installing plate is set in the below of described camera lens installing plate, in described light source installing plate, is provided with multiple light source board, described multiple light source board and described multiple camera lens mounting hole one_to_one corresponding.
Further, equal mating plate is set between each light source board and camera lens mounting hole.
Further, described light supply apparatus is arranged on described base by two groups of orthogonal sliding platforms of sense of displacement.
Further, described sliding platform of often organizing comprises slip slide rail and chute, and arranges locking member on slide rail or chute.
Further, described sliding platform regulates its displacement by adjustment member, and described adjustment member is manual or motorized adjustment parts.
Further, also height adjustment mechanism is provided with between described base and light supply apparatus, described height adjustment mechanism comprises the motor be arranged in described base and the push rod be arranged on below described light supply apparatus, and the convert rotational motion of motor is that the height of rectilinear motion to light supply apparatus of push rod regulates by described height adjustment mechanism.
The invention has the beneficial effects as follows:
(1) setting of sliding platform makes camera lens accurate with aiming at of chip;
(2) setting of light source, makes into survey machine compact conformation, easy to operate;
(3) the fast and easy when mounting means of camera lens and light source makes camera lens and replacing light source.
Accompanying drawing explanation
Accompanying drawing 1 is structural representation of the present invention;
Accompanying drawing 2 is the A direction view of accompanying drawing 1;
Accompanying drawing 3 is the B-B cut-open view of accompanying drawing 2.
Mark in accompanying drawing is respectively:
1. base; 2. light supply apparatus;
3. sliding platform; 4. sliding platform;
5. camera lens installing plate; 6. camera lens mounting hole;
7. light source installing plate; 8. light source board;
9. equal mating plate; 10. slide rail;
11. chutes; 12. motors;
13. push rods; 14. locking members.
Embodiment
The embodiment of survey machine is become to elaborate below in conjunction with accompanying drawing to CIS wafer of the present invention.
Become survey machine to comprise base 1 and light supply apparatus 2 see accompanying drawing 1,2,3, CIS wafer, light supply apparatus 2 is arranged on base 1 by two groups of orthogonal sliding platforms 3,4 of sense of displacement.Light supply apparatus 2 comprises camera lens installing plate 5, camera lens installing plate 5 is arranged on the top of light supply apparatus, camera lens installing plate 5 is provided with multiple camera lens mounting hole 6, and camera lens mounting hole 6 is arranged in dot matrix, and the distance between its spacing with the chip on CIS wafer to be measured is corresponding or become multiple proportion.Send in mounting hole 6 at each mirror and a camera lens is set.In the below of camera lens installing plate 5, light source installing plate 7 is set, multiple light source board 8 is provided with in light source installing plate 7, the quantity of light source board 8 is consistent with the quantity of camera lens mounting hole 6, namely each camera lens mounting hole 6 configures a light source board 8, between camera lens mounting hole 6 and light source board 8, also arrange equal mating plate 9, equal mating plate 9 is for improving light quality.
See accompanying drawing 3, sliding platform 3 and sliding platform 4 vertical setting mutually, it includes slip slide rail 10 and chute 11 separately, sliding platform 3,4 is also provided with adjustment member for regulating its displacement, adjustment member is manual or motorized adjustment parts, slide rail or chute arrange locking member 14, when sliding platform 3,4 moves to correct position, is fixed by locking member 14.Sliding platform 3,4, except with except slide rail 10 and this sliding type of chute 11, also will use various slide construction of the prior art, as long as make light supply apparatus 2 reach any movement doing XY direction on platform.
Continue see accompanying drawing 3, also height adjustment mechanism is provided with between base 1 and light supply apparatus 2, height adjustment mechanism comprises the motor 12 be arranged in base 1 and the push rod 13 be arranged on below light supply apparatus 2, the convert rotational motion of motor 12 is that the height of rectilinear motion to light supply apparatus 2 of push rod 13 regulates by height adjustment mechanism, makes the spacing of the camera lens on light supply apparatus 2 and CIS wafer to be measured reach the parameter of testing requirement.
Continue see accompanying drawing 3, the course of work of the present invention is, move to the below of CIS wafer to be measured by becoming survey machine and fix, regulate the adjustment member of sliding platform 3,4, make the chip on the alignment lens CIS wafer in camera lens mounting hole 6, once can aim at one or more chip, tighten locking member 14, drive motor 12 makes light supply apparatus 2 moves, until the distance between camera lens and chip to be measured reaches preset parameter, open light source, make light source board 8 luminous, start to detect the chip of CIS wafer.After part chip detection completes, close light source, driving light source device 2 is displaced downwardly to precalculated position, unclamp locking member 14, regulating sliding platform 3,4 to make the chip of alignment lens next group for detecting, repeating first time testing process, until the chip detection of a CIS wafer completes.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (4)
1. a CIS wafer becomes survey machine, comprise base and light supply apparatus, described light supply apparatus is arranged on described base, described light supply apparatus comprises camera lens installing plate, described camera lens installing plate is provided with multiple camera lens mounting hole, a camera lens is set in each camera lens mounting hole, it is characterized in that: in the below of described camera lens installing plate, light source installing plate is set, multiple light source board is provided with in described light source installing plate, described multiple light source board and described multiple camera lens mounting hole one_to_one corresponding, between each light source board and camera lens mounting hole, equal mating plate is set, described light supply apparatus is arranged on described base by two groups of orthogonal sliding platforms of sense of displacement.
2. CIS wafer according to claim 1 becomes survey machine, it is characterized in that: often organize sliding platform and comprise slip slide rail and chute, and arrange locking member on slide rail or chute.
3. CIS wafer according to claim 1 and 2 becomes survey machine, it is characterized in that: described sliding platform regulates its displacement by adjustment member, and described adjustment member is manual or motorized adjustment parts.
4. CIS wafer according to claim 1 and 2 becomes survey machine, it is characterized in that: between described base and light supply apparatus, be also provided with height adjustment mechanism, described height adjustment mechanism comprises the motor be arranged in described base and the push rod be arranged on below described light supply apparatus, and the convert rotational motion of motor is that the height of rectilinear motion to light supply apparatus of push rod regulates by described height adjustment mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310183519.3A CN103267938B (en) | 2013-05-17 | 2013-05-17 | CIS wafer becomes survey machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310183519.3A CN103267938B (en) | 2013-05-17 | 2013-05-17 | CIS wafer becomes survey machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103267938A CN103267938A (en) | 2013-08-28 |
| CN103267938B true CN103267938B (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310183519.3A Active CN103267938B (en) | 2013-05-17 | 2013-05-17 | CIS wafer becomes survey machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN103267938B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018176349A1 (en) * | 2017-03-30 | 2018-10-04 | 深圳市汇顶科技股份有限公司 | Light emitting device and wafer testing device |
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| JP2003007783A (en) * | 2001-06-20 | 2003-01-10 | Enplas Corp | Semiconductor measuring fixture |
| JP2006222325A (en) * | 2005-02-14 | 2006-08-24 | Nikon Corp | Light illumination device |
| JP2008091626A (en) * | 2006-10-02 | 2008-04-17 | Hamamatsu Photonics Kk | Wafer supporting device and wafer observing device |
| CN201556005U (en) * | 2009-09-27 | 2010-08-18 | 西门子威迪欧汽车电子(惠州)有限公司 | Automatic detecting device for LCD fault point |
| CN202002892U (en) * | 2011-02-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Detecting device for pins of products |
| CN102654628A (en) * | 2011-11-25 | 2012-09-05 | 吴江市博众精工科技有限公司 | Mechanical adjustment module |
| CN203275587U (en) * | 2013-05-17 | 2013-11-06 | 嘉兴景焱智能装备技术有限公司 | CIS wafer testing machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100395879C (en) * | 2005-12-05 | 2008-06-18 | 深圳市矽电半导体设备有限公司 | Multiplex test method for semiconductor wafer and multiplex test probe station therefor |
| CN101210951B (en) * | 2006-12-27 | 2010-12-22 | 中茂电子(深圳)有限公司 | Built-in illuminating source photo-sensor detection device and test bench possessing same |
| CN101923105A (en) * | 2009-06-16 | 2010-12-22 | 励威电子股份有限公司 | Probe card used for testing image sense chip |
| CN102435787B (en) * | 2011-09-15 | 2014-10-29 | 嘉兴景焱智能装备技术有限公司 | Testing method and testing probe platform for image sensor chip |
-
2013
- 2013-05-17 CN CN201310183519.3A patent/CN103267938B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003007783A (en) * | 2001-06-20 | 2003-01-10 | Enplas Corp | Semiconductor measuring fixture |
| JP2006222325A (en) * | 2005-02-14 | 2006-08-24 | Nikon Corp | Light illumination device |
| JP2008091626A (en) * | 2006-10-02 | 2008-04-17 | Hamamatsu Photonics Kk | Wafer supporting device and wafer observing device |
| CN201556005U (en) * | 2009-09-27 | 2010-08-18 | 西门子威迪欧汽车电子(惠州)有限公司 | Automatic detecting device for LCD fault point |
| CN202002892U (en) * | 2011-02-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Detecting device for pins of products |
| CN102654628A (en) * | 2011-11-25 | 2012-09-05 | 吴江市博众精工科技有限公司 | Mechanical adjustment module |
| CN203275587U (en) * | 2013-05-17 | 2013-11-06 | 嘉兴景焱智能装备技术有限公司 | CIS wafer testing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103267938A (en) | 2013-08-28 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: CIS wafer forming machine Effective date of registration: 20230526 Granted publication date: 20160330 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20160330 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: CIS wafer forming machine Granted publication date: 20160330 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2024980018023 |