CN103261323B - Aromatic polycarbonate resin composition - Google Patents
Aromatic polycarbonate resin composition Download PDFInfo
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- CN103261323B CN103261323B CN201180059695.5A CN201180059695A CN103261323B CN 103261323 B CN103261323 B CN 103261323B CN 201180059695 A CN201180059695 A CN 201180059695A CN 103261323 B CN103261323 B CN 103261323B
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- methyl
- mass parts
- resin
- copolymer
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- 239000000203 mixture Substances 0.000 title claims abstract description 118
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 55
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 23
- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 23
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 11
- 239000011342 resin composition Substances 0.000 claims description 36
- 229920001577 copolymer Polymers 0.000 claims description 26
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 26
- 238000006116 polymerization reaction Methods 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 18
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 12
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 239000012764 mineral filler Substances 0.000 claims description 9
- 229920006243 acrylic copolymer Polymers 0.000 claims description 8
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 2
- -1 phosphate ester Chemical class 0.000 abstract description 46
- 229920005989 resin Polymers 0.000 abstract description 37
- 239000011347 resin Substances 0.000 abstract description 37
- 238000000465 moulding Methods 0.000 abstract description 22
- 229920000515 polycarbonate Polymers 0.000 abstract description 21
- 239000004417 polycarbonate Substances 0.000 abstract description 21
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 14
- 238000007720 emulsion polymerization reaction Methods 0.000 abstract description 10
- 229910019142 PO4 Inorganic materials 0.000 abstract description 4
- 239000010452 phosphate Substances 0.000 abstract description 4
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 description 27
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 24
- 239000002585 base Substances 0.000 description 24
- 239000000178 monomer Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 22
- 239000000126 substance Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 18
- 229920001971 elastomer Polymers 0.000 description 15
- 239000005060 rubber Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 15
- 238000007334 copolymerization reaction Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 12
- 230000035939 shock Effects 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000007493 shaping process Methods 0.000 description 8
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000004305 biphenyl Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- LDHQCZJRKDOVOX-UHFFFAOYSA-N 2-butenoic acid Chemical compound CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- 235000010290 biphenyl Nutrition 0.000 description 6
- 125000006267 biphenyl group Chemical group 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000000454 talc Substances 0.000 description 6
- 235000012222 talc Nutrition 0.000 description 6
- 229910052623 talc Inorganic materials 0.000 description 6
- 125000005250 alkyl acrylate group Chemical group 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000012662 bulk polymerization Methods 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000001118 alkylidene group Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 description 3
- 229960001545 hydrotalcite Drugs 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 3
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229920006358 Fluon Polymers 0.000 description 2
- 229910001051 Magnalium Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920006361 Polyflon Polymers 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004427 Tarflon Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- KLIYQWXIWMRMGR-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate Chemical compound C=CC=C.COC(=O)C(C)=C KLIYQWXIWMRMGR-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- IOXXVNYDGIXMIP-UHFFFAOYSA-N n-methylprop-2-en-1-amine Chemical compound CNCC=C IOXXVNYDGIXMIP-UHFFFAOYSA-N 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 229920006163 vinyl copolymer Polymers 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- RPPHVWXGHJVLOL-UHFFFAOYSA-N 1-(4,5-dihydro-1,3-oxazol-2-yl)prop-2-en-1-one Chemical compound C=CC(=O)C1=NCCO1 RPPHVWXGHJVLOL-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical group CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- KDYHQAWOWCCBAJ-UHFFFAOYSA-N 1h-indole-2,3-dione;2-methylphenol Chemical compound CC1=CC=CC=C1O.CC1=CC=CC=C1O.C1=CC=C2C(=O)C(=O)NC2=C1 KDYHQAWOWCCBAJ-UHFFFAOYSA-N 0.000 description 1
- XSXWOBXNYNULJG-UHFFFAOYSA-N 2-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=CC=C1O XSXWOBXNYNULJG-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- XISFOXBYRQWDNK-UHFFFAOYSA-N 2-(2-methylphenyl)propan-2-amine;hydrochloride Chemical compound [Cl-].CC1=CC=CC=C1C(C)(C)[NH3+] XISFOXBYRQWDNK-UHFFFAOYSA-N 0.000 description 1
- NDAJRGYVXNVVNP-UHFFFAOYSA-N 2-(2-phenylethenyl)-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C=CC1=CC=CC=C1 NDAJRGYVXNVVNP-UHFFFAOYSA-N 0.000 description 1
- RSNDTPFSMDVWCS-UHFFFAOYSA-N 2-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCC(=C)C(N)=O RSNDTPFSMDVWCS-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- ASYDHHZLJPHNJY-UHFFFAOYSA-N 2-[(2-ethenylphenyl)methyl]oxirane Chemical compound C=CC1=CC=CC=C1CC1OC1 ASYDHHZLJPHNJY-UHFFFAOYSA-N 0.000 description 1
- BQBSIHIZDSHADD-UHFFFAOYSA-N 2-ethenyl-4,5-dihydro-1,3-oxazole Chemical compound C=CC1=NCCO1 BQBSIHIZDSHADD-UHFFFAOYSA-N 0.000 description 1
- CCIDRBFZPRURMU-UHFFFAOYSA-N 2-methyl-n-propylprop-2-enamide Chemical compound CCCNC(=O)C(C)=C CCIDRBFZPRURMU-UHFFFAOYSA-N 0.000 description 1
- TVONJMOVBKMLOM-UHFFFAOYSA-N 2-methylidenebutanenitrile Chemical compound CCC(=C)C#N TVONJMOVBKMLOM-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 1
- LBSXSAXOLABXMF-UHFFFAOYSA-N 4-Vinylaniline Chemical compound NC1=CC=C(C=C)C=C1 LBSXSAXOLABXMF-UHFFFAOYSA-N 0.000 description 1
- LEDTWDICPMFGDW-UHFFFAOYSA-N 4-cyclodecylphenol Chemical compound C1=CC(O)=CC=C1C1CCCCCCCCC1 LEDTWDICPMFGDW-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920006357 Algoflon Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- KHBQMWCZKVMBLN-UHFFFAOYSA-N Benzenesulfonamide Chemical compound NS(=O)(=O)C1=CC=CC=C1 KHBQMWCZKVMBLN-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229920003314 Elvaloy® Polymers 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- OCKWAZCWKSMKNC-UHFFFAOYSA-N [3-octadecanoyloxy-2,2-bis(octadecanoyloxymethyl)propyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(COC(=O)CCCCCCCCCCCCCCCCC)(COC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC OCKWAZCWKSMKNC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
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- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000004171 alkoxy aryl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000006085 branching agent Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical group CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
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- PYOXKUJLQNOEIK-UHFFFAOYSA-N chloromethyl but-2-enoate Chemical compound CC=CC(=O)OCCl PYOXKUJLQNOEIK-UHFFFAOYSA-N 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical compound OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- FNIATMYXUPOJRW-UHFFFAOYSA-N cyclohexylidene Chemical group [C]1CCCCC1 FNIATMYXUPOJRW-UHFFFAOYSA-N 0.000 description 1
- 125000004979 cyclopentylene group Chemical group 0.000 description 1
- PWAPCRSSMCLZHG-UHFFFAOYSA-N cyclopentylidene Chemical group [C]1CCCC1 PWAPCRSSMCLZHG-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- LJXTYJXBORAIHX-UHFFFAOYSA-N diethyl 2,6-dimethyl-1,4-dihydropyridine-3,5-dicarboxylate Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1 LJXTYJXBORAIHX-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- VDPZSJPWAQBRQC-UHFFFAOYSA-N ethyl N-propylcarbamate prop-2-enoic acid Chemical compound C(C=C)(=O)O.C(CC)NC(=O)OCC VDPZSJPWAQBRQC-UHFFFAOYSA-N 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
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- 229930195733 hydrocarbon Natural products 0.000 description 1
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- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 150000004713 phosphodiesters Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000176 photostabilization Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
- C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention is an aromatic polycarbonate resin composition comprising 60 to 95% by mass of an aromatic polycarbonate resin, 5 to 40% by mass of (B) a thermoplastic resin obtained by emulsion polymerization, and (C) a component of the general formula (I) (R-O) in a proportion of 0.001 to 1 part by mass relative to 100 parts by mass of the total amount of the components and (B)n-PO-(OH)3-n(I) [ R represents an alkyl group having 1 to 30 carbon atoms, and n is 1 or 2.]The shown acidic phosphate ester. According to the present invention, it is possible to suppress the decrease in the molecular weight of the polycarbonate due to residence in high-temperature molding or large-scale molding machines, and to improve the mechanical strength of the resin molded article.
Description
Technical field
The present invention relates to aromatic copolycarbonate resin composition, more specifically, the molecular weight related to when suppressing the melting of polycarbonate reduces, what thermostability, outward appearance, chemical proofing improves contain aromatic copolycarbonate and the resin combination of thermoplastic resin obtained by letex polymerization.Aromatic copolycarbonate resin composition of the present invention, may be used for the inside and outside shell of office automation (OA) equipment (duplicating machine, printer, projector etc.), television enclosure (communication terminal such as TV framework, support cover, telepilot), notebook computer casing etc. are particularly useful for slim molding, large-scale molding.
Background technology
The mechanicalness excellents such as the shock-resistance of polycarbonate resin, and thermotolerance, the transparency are excellent, therefore can use in various field.In addition, by polycarbonate resin and the such as ABS resin mixing of other resins, can cost degradation, improve the thickness interdependence etc. of the shaping processability of polycarbonate resin, shock-resistance, may be used for the casing of electronic communication equipment, OA equipment, also can be used for the various fields (patent documentation 1 ~ 5) such as automobile inside component.
; the resin component used in such OA equipment, TV; in order to tackle the maximization of goods in recent years, along with the thin-walled property of the light-weighted goods declined in order to cost, the shaping of compound cast gate, gas assist formation etc. is utilized to carry out the mobility of assisted resin.But, due to compound cast gate be shaped in the increase in molten trace portion, thin-walled property all can produce the problem of undercapacity in gas assist formation.Meanwhile, the resin component used in OA equipment etc., in order to its security, must have flame retardant resistance, utilize thin-walled to guarantee that flame retardant resistance becomes problem.In addition, from the viewpoint of environmental protection, in order to tackle the recycling of goods, the recovery characteristic of fire retardant material improves and also becomes problem in recent years.But, in the resin combination recorded in those patent documentations above-mentioned, there is following problem, not gratifying technology.
In patent documentation 1 (Japanese Patent No. 3836638 publication), disclose the resin combination of ABS coordinating polycarbonate and manufactured by mass polymerization, but shock-resistance value is not enough for thin-wall shell product.
In patent documentation 2 (Japanese Patent No. 4372285 publication), in order to the physical property produced when improving formed machining reduces, report the raising of polycarbonate ratio, the utilization of the cooperation of shock-resistance modifying agent, phosphorus flame retardant that acid number is low, but when molding large goods, thin-gage goods, illiquidity, physical property improving effect during shaping is also not enough.
In patent documentation 3 (Japanese Patent No. 4489242 publication), the composition of butadiene-based graft copolymer describing polycarbonate, the rubber modified styrene series resin obtained by mass polymerization or solution polymerization process and obtained by emulsion polymerization, be the resin combination of melt fluidity, flame retardant resistance, good heat stability, but its thin-wall flame retardance, thermostability are not enough.
In patent documentation 4 (Japanese Patent No. 3608510 publication), disclose the resin combination of excellent in stability of a kind of mobility, mechanical properties, but the control of the dispersing morphology of the selection by means of only the acid number for fire retardant, the composition containing rubber guarantees that humidity resistance is insufficient, do not relate to the shock strength of thin-walled and the record of thin-wall flame retardance yet.
In patent documentation 5 (Japanese Unexamined Patent Application Publication 2008-516070 publication), disclose in polycarbonate and the mixture by the polymkeric substance of emulsion polymerization derived, by the reaction with water, the molecular weight of polymkeric substance reduces, not damaging in the scope of physical properties, be added with the composition burning till carbonic acid magnalium.But, with the addition of the mechanicalness characteristic of composition when making thin-wall shell product of burning till carbonic acid magnalium insufficient especially, in addition, chemical proofing, delay thermostability deficiency sometimes, or produce bad order.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent No. 3836638 publication
Patent documentation 2: Japanese Patent No. 4372285 publication
Patent documentation 3: Japanese Patent No. 4489242 publication
Patent documentation 4: Japanese Patent No. 3608510 publication
Patent documentation 5: Japanese Unexamined Patent Application Publication 2008-516070 publication
Summary of the invention
The problem that invention will solve
The present invention researches and develops to solve above-mentioned problem, object is, in order to improve the shaping processability of polycarbonate, in the resin combination having coordinated the ABS resin, AS resin etc. that are manufactured by emulsion polymerization, suppress because of hot forming, use large-scale forming mill time delay and the molecular weight of polycarbonate that causes reduces, improve the mechanical strength of resin forming product.In addition, in thin molded development now, seek the flame retardant resistance of thin-walled, the raising of shock-resistance is also necessary problem.
Solve the method for problem
The present inventor conducts in-depth research to solve above-mentioned problem, found that, by in the resin combination of the thermoplastic resin containing aromatic copolycarbonate with specific ratio and obtained by letex polymerization, coordinate the acid phosphoric acid ester of ad hoc structure as stablizer using specific ratio, can suppress to be considered to the molecular weight reduction owing to using the thermoplastic resin obtain by letex polymerization and polycarbonate component in the polymeric blends caused, the thermostability of resin combination can be improved, the outward appearance of molding, chemical proofing, mechanicalness characteristic, thus complete the present invention.
That is, the invention provides following aromatic copolycarbonate resin composition.
1. an aromatic copolycarbonate resin composition, it contains:
(A) aromatic polycarbonate resin of 60 ~ 95 quality %,
(B) of 5 ~ 40 quality % through letex polymerization thermoplastic resin and
Relative to total amount 100 mass parts of described (A) composition and (B) composition acid phosphoric acid ester shown in (C) general formula (I) that is 0.001 ~ 1 mass parts,
(R-O)
n-PO-(OH)
3-n(I)
In formula (I), R represents the alkyl of carbon number 1 ~ 30, and n is 1 or 2.
2. the aromatic copolycarbonate resin composition according to above-mentioned 1, wherein, (B) is make to be selected from least a kind of monomer-grafted copolymerization in (b-1) aromatic vinyl system monomer, (b-2) vinyl cyanide system monomer and (b-3) (methyl) alkyl acrylate monomer in the thermoplastic copolymer of (b-4) rubber polymer through the thermoplastic resin of letex polymerization.
3. the aromatic copolycarbonate resin composition according to above-mentioned 2, wherein, (b-4) rubber polymer is rubber-like butadiene-based polymkeric substance.
4. the aromatic copolycarbonate resin composition according to any one of above-mentioned 1 ~ 3, it is also that ethene-(methyl) acrylic copolymer of 0.5 ~ 5 mass parts and/or ethene-(methyl) acrylate copolymer are as (D) composition containing total amount 100 mass parts relative to (A) composition and (B) composition.
5. the aromatic copolycarbonate resin composition according to any one of above-mentioned 1 ~ 4, it also contains relative to total amount 100 mass parts of (A) composition and (B) composition is that the not halogen-containing phosphoric acid ester of 3 ~ 25 mass parts is as (E) composition.
6. the aromatic copolycarbonate resin composition according to any one of above-mentioned 1 ~ 5, it also contains relative to total amount 100 mass parts of (A) composition and (B) composition is that the mineral filler of 0.5 ~ 20 mass parts is as (F) composition.
7. the aromatic copolycarbonate resin composition according to any one of above-mentioned 1 ~ 6, it contains relative to total amount 100 mass parts of (A) composition and (B) composition is that the tetrafluoroethylene of 0.1 ~ 2 mass parts is as (G) composition.
The effect of invention
By coordinating the acid phosphoric acid ester of ad hoc structure, the ABS resin manufactured by emulsion polymerization, MBS resin, MB resin etc. are made molten mixture together with polycarbonate, when obtaining thin molded article, flame retardant resistance, the shock-resistance in the delay thermostability in forming mill, hot forming, thin-walled situation can be improved, the aromatic copolycarbonate resin composition that the outward appearance of molding, chemical proofing, mechanical strength are excellent can be obtained.The present invention is maximization, the OA shell field of thin-walled property development, TV domain are useful especially technology in recent years.
Embodiment
Aromatic copolycarbonate resin composition of the present invention, be acid phosphoric acid ester containing (A) aromatic polycarbonate resin, the thermoplastic resin of (B) letex polymerization and (C) ad hoc structure as neccessary composition, the poly carbonate resin composition containing (D) ethene-(methyl) acrylic copolymer as other compositions as required and/or ethene-(methyl) acrylate copolymer, (E) not halogen-containing phosphoric acid ester, (F) mineral filler, (G) tetrafluoroethylene (PTFE).Below, be described in detail.
As the aromatic polycarbonate resin of (A) composition used in aromatic copolycarbonate resin composition of the present invention, be not particularly limited, various aromatic copolycarbonate can be enumerated, but preferably can use the polymkeric substance of the repeating unit of the structure had represented by general formula (1).
[changing 1]
In above-mentioned general formula (1), R
1and R
2be respectively halogen atom (such as, chlorine, fluorine, bromine, iodine) or the alkyl (such as, methyl, ethyl, propyl group, sec.-propyl, various butyl (normal-butyl, isobutyl-, sec-butyl, the tertiary butyl), various amyl group, various hexyl, various heptyl, various octyl group) of carbon number 1 ~ 8.
M and n is respectively the integer of 0 ~ 4, R when m is 2 ~ 4
1can be identical or different mutually, R when n is 2 ~ 4
2can be identical or different mutually.
Z represents the alkylidene of the alkylene base of carbon number 1 ~ 8 or carbon number 2 ~ 8 (such as, methylene radical, ethylene group, trimethylene base, fourth support group, pentamethylene base, hexamethylene base, ethidine, isopropylidene etc.), the cycloalkylene of carbon number 5 ~ 15 or the ring alkylidene of carbon number 5 ~ 15 are (such as, cyclopentylene base, hexamethylene support group, cyclopentylidene base, cyclohexylidene base etc.), or singly-bound ,-SO
2-,-SO-,-S-,-O-,-CO-key or following formula (2) or the combination represented by formula (2 ').
[changing 2]
Above-mentioned polymkeric substance easily can manufacture by making the carbonate precursor reactions such as the dihydric phenol photoreactive gas represented by general formula (3) usually.
[changing 3]
[in formula, R
1, R
2, Z, m be identical with above-mentioned general formula (1) with n.]
That is, such as, in methylene dichloride equal solvent, under the existence of known acid acceptor, molecular weight regulator, the carbonate precursor of dihydric phenol photoreactive gas and so on can be reacted, manufactures thus.In addition, also manufacture by the transesterification reaction etc. of dihydric phenol and the such carbonate precursor of carbonate products.
As the dihydric phenol represented by above-mentioned general formula (3), various compound can be enumerated, from the view point of shock-resistance, particularly preferably 2,2-two (4-hydroxy phenyl) propane [being commonly referred to as dihydroxyphenyl propane].
As the dihydric phenol beyond dihydroxyphenyl propane, such as, two (4-hydroxy phenyl) methane can be enumerated, 1, two (4-hydroxy phenyl) ethane of 1-, 1, two (4-hydroxy phenyl) alkane such as two (4-hydroxy phenyl) ethane of 2-, 1, 1-bis(4-hydroxyphenyl) cyclohexane, 1, two (4-hydroxy phenyl) naphthenic hydrocarbon such as two (4-hydroxy phenyl) cyclodecane of 1-, 4, 4 '-dihydroxybiphenyl, two (4-hydroxy phenyl) ether, two (4-hydroxy phenyl) thioether, two (4-hydroxy phenyl) sulfone, two (4-hydroxy phenyl) sulfoxide, two (4-hydroxy phenyl) ketone etc.In addition, as dihydric phenol, Resorcinol etc. can be enumerated.These dihydric phenols can individually use, and also can mix more than two kinds uses.
In addition, in the present invention, as the aromatic polycarbonate resin of (A) composition, polycarbonate-poly organo alkyl copolymer can be used.As this polycarbonate-poly organo alkyl copolymer, such as, the material in the organopolysiloxane portion of the polycarbonate portion comprising the repeating unit of the structure had represented by following general formula (1) and the repeating unit with the structure represented by following general formula (4).
[changing 4]
[in formula, R
1, R
2, Z, m and n be same as described above.]
[changing 5]
[in formula, R
3, R
4and R
5be respectively hydrogen atom, the alkyl (such as, methyl, ethyl, propyl group, normal-butyl, isobutyl-etc.) of carbon number 1 ~ 5 or phenyl, p and q is respectively the integer of more than 0 or 1, but p and q add up to more than 1 integer.]
Here, the polymerization degree in polycarbonate portion is preferably 3 ~ 100, and in addition, the polymerization degree in organopolysiloxane portion is preferably 2 ~ 500.
Above-mentioned polycarbonate-poly organo alkyl copolymer, for comprising the polycarbonate portion of the repeating unit had represented by above-mentioned general formula (1) and having the segmented copolymer in organopolysiloxane portion of the repeating unit represented by above-mentioned general formula (4), can improve flame retardant resistance, shock-resistance.
Such polycarbonate-poly organo alkyl copolymer is by following methods manufacture: such as, by the polycarbonate oligomer in formation polycarbonate portion manufactured in advance, the end forming organopolysiloxane portion has the organopolysiloxane of reactive group (such as, polydimethylsiloxane (PDMS), polydialkysiloxane or the PSIs etc. such as polydiethylsiloxane) at methylene dichloride, chlorobenzene, dissolve in chloroform equal solvent, add the aqueous sodium hydroxide solution of bis-phenol, as catalyzer, use triethylamine, trimethyl benzyl ammonia chloride etc., reacted by interfacial polycondensation and manufacture.
In addition, the polycarbonate-poly organo alkyl copolymer utilizing the method recorded in Japanese Patent Publication 44-30105 publication, the method recorded in Japanese Patent Publication 45-20510 publication to manufacture can also be used.
As carbonate products, such as, the dialkyl carbonates etc. such as diaryl carbonate, dimethyl carbonate, diethyl carbonate such as dipheryl carbonate base ester can be enumerated.
As molecular weight adjusting agent, as long as usually use in the polymerization of polycarbonate, such as, can enumerate as the phenol of monohydric phenol, p-cresol, p-tert-butylphenol, to tert-octyl phenol, p-cumylphenol, nonylphenol etc.
Polycarbonate resin can be the homopolymer using a kind of above-mentioned dihydric phenol, can also be the use of the multipolymer of more than two kinds.
And then, also can be by multi-functional aromatics and above-mentioned dihydric phenol and the randomly branched polycarbonate resin of thermoplasticity used and obtain.
This multi-functional aromatics is commonly referred to as branching agent, specifically, can 1 be enumerated, 1,1-tri-(4-hydroxy phenyl) ethane, α, α ', α "-three (4-hydroxy phenyls)-1; 3,5-triisopropylbenzene, 1-[Alpha-Methyl-α-(4 '-hydroxy phenyl) ethyl]-4-[α ', α '-bis-(4 "-hydroxy phenyl) ethyl] benzene, Phloroglucinol, trimellitic acid, isatin di-ortho-cresol etc.In the polycarbonate resin of above-mentioned explanation, can be used alone, but also two or more is also used.
Usually, owing to easily obtaining, shock-resistance is also excellent, is preferably used as dihydric phenol to employ the polycarbonate resin of dihydroxyphenyl propane.
There is the polycarbonate resin of such characteristic, such as commercially available with the form of the such aromatic polycarbonate resin of TARFLON FN3000A, FN2500A, FN2200A, FN1900A, FN1700A, FN1500 (trade(brand)name, the emerging product of bright dipping (strain) make).These aromatic polycarbonate resins, can be used alone, but also two or more is also used.
The preferred viscosity-average molecular weight of aromatic polycarbonate resin used as (A) composition in this present invention is 18000 ~ 40000, more preferably 20000 ~ 26000.When viscosity-average molecular weight is less than 18000, chemical proofing, shock-resistance reduce, and are deteriorated with the balance of other physical property.In addition, when viscosity-average molecular weight is more than 40000, plasticity reduces.
In addition, with regard to viscosity-average molecular weight (Mv), be use Ubbelohde viscometer, measure the viscosity of the dichloromethane solution of 20 DEG C, obtain limiting viscosity [η] thus, then by [η]=1.23 × 10
-5mv
0.83the value that calculates of formula.
The thermoplastic resin of the letex polymerization of (B) composition used in aromatic copolycarbonate resin composition of the present invention, it is the polymkeric substance obtained by the monomer of ethene base system is carried out letex polymerization, make to be selected from (b-1) aromatic vinyl base system monomer, (b-2) vinyl cyanide base system monomer, (b-3) at least a kind in alkyl acrylate monomer or alkyl methacrylate monomer (both are collectively referred to as (methyl) alkyl acrylate monomer sometimes), graft copolymerization is carried out by emulsion polymerization and the multipolymer obtained with (b-4) rubber polymer.
(b-4) rubber polymer used in the multipolymer of graft copolymerization is not particularly limited, but preferred glass temperature is the material of less than 0 DEG C, can use diene series rubber, acrylic rubber, ethene system rubber etc.As the concrete example of rubber polymer, polyhutadiene can be enumerated, styrene-butadiene copolymer, styrene-butadiene block copolymer, acrylonitrile butadiene copolymer, butyl acrylate-butadienecopolymer, polyisoprene, divinyl-methylmethacrylate copolymer, butyl acrylate-methyl ester copolymer, butadiene-acrylic acid methacrylate copolymers, ethylene-propylene copolymer, ethylene propylene diene multipolymer, ethene-isoprene copolymer and ethylene-methyl acrylate copolymer etc., in these rubber polymers, from the view point of shock-resistance, preferred use polyhutadiene, styrene-butadiene copolymer, the rubber-like such as styrene-butadiene block copolymer and acrylonitrile butadiene copolymer butadiene-based polymkeric substance.
Form the not special restriction of weight average particle diameter of (b-4) rubber polymer of the multipolymer of graft copolymerization, but from the view point of shock strength, be preferably 0.1 ~ 2 μm, be more preferably the particle diameter of the scope of 0.2 ~ 1 μm.
These (b-4) rubber polymers can use one kind or two or more mixture.
As (b-1) aromatic vinyl base system monomer used in graft copolymerization, be not particularly limited, vinylbenzene, alpha-methyl styrene, Vinyl toluene, adjacent ethyl styrene, p-tert-butylstyrene etc. can be enumerated, wherein, particularly preferably vinylbenzene.These can use one kind or two or more.
As (b-2) vinyl cyanide base system monomer used in graft copolymerization, be not particularly limited, vinyl cyanide, methacrylonitrile and ethyl acrylonitrile etc. can be enumerated, wherein most preferably use vinyl cyanide.Can use one kind or two or more like this.
In addition, (b-3) (methyl) alkyl acrylate monomer that can carry out copolymerization used in graft copolymerization, preferably has the alkyl of carbon number 1 ~ 6 or the acrylate of substituted alkyl or methacrylic ester.As concrete example, (methyl) methyl acrylate can be enumerated, (methyl) ethyl propenoate, (methyl) n-propyl, (methyl) n-butyl acrylate, (methyl) tert-butyl acrylate, the just own ester of (methyl) vinylformic acid, (methyl) cyclohexyl acrylate, (methyl) vinylformic acid chloromethyl ester, (methyl) vinylformic acid 2-chloroethene ester, (methyl) vinylformic acid 2-hydroxy methacrylate, (methyl) vinylformic acid 3-hydroxy propyl ester, (methyl) vinylformic acid 2, 3, 4, 5, 6-penta hydroxy group hexyl and (methyl) vinylformic acid 2, 3, 4, 5-tetrahydroxy pentyl ester etc., wherein preferable methyl methyl acrylate.These can use one kind or two or more.
And then, except the ethene base system monomer of above-mentioned (b-1), (b-2) and (b-3) used in graft copolymerization, can use (b-5) that other ethene base system monomers of copolymerization can be carried out as required.As these other ethene base system monomers, such as, (methyl) vinylformic acid can be enumerated, (methyl) glycidyl acrylate, glycidyl itoconate, allyl glycidyl ether, vinylbenzene-to glycidyl ether, to glycidyl vinylbenzene, toxilic acid, maleic anhydride, ethyl maleate, methylene-succinic acid, itaconic anhydride, phthalic acid, N-methylmaleimido, NEM, N-N-cyclohexylmaleimide, N-phenylmaleimide, acrylamide, Methacrylamide, N methacrylamide, butoxy methyl acrylamide, N-propyl methacrylamide, acrylate, vinylformic acid propylcarbamic ethyl ester, dimethylaminoethyl methacrylate, methacrylic acid ethylamino propyl ester, methacrylic acid phenyl amino ethyl ester, methacrylic acid Cyclohexylamino ethyl ester, N-vinyl diethylamide, N-acetyl vinyl amine, allylamine, methyl allyl amine, N-methyl allyl amine, p-aminophenyl ethene, 2-pseudoallyl-oxazoline, 2-vinyl-oxazoline, 2-acryl-oxazoline and 2-styryl-oxazoline etc., these can use one kind or two or more.
(B) as the multipolymer of the graft copolymerization of the thermoplastic resin of letex polymerization, obtain by the following method: under the existence about (b-4) rubber polymer 20 ~ 70 mass parts, being the mode of 100 mass parts with the total amount of (b-4) rubber polymer, use and be selected from above-mentioned (b-1) aromatic vinyl base system monomer about 30 ~ 80 mass parts, (b-2) vinyl cyanide base system monomer and at least a kind of monomer in (b-3) (methyl) alkyl acrylate monomer, and (b-5) as required other ethene base system monomers of copolymerization can carry out graft polymerization and obtains.As polymerization process, because manufacturing cost is cheap, the ratio of rubber polymer can be improved, shock strength can be obtained and improve the reasons such as the high multipolymer of effect, can emulsion polymerization be used.Thus, when the ratio of (b-1), (b-2), (b-3) composition is the scope of about 30 ~ 80 quality %, good thermal stability.In addition, in (B) composition, when the ratio of (b-4) composition is the scope of about 20 ~ 70 quality %, shock-resistance improves the balancing good of effect and thermostability, thus preferably.
As the concrete example of (B) thermoplastic resin of this graft copolymerization, such as, acrylonitrile-butadiene rubber-styrol copolymer (ABS resin) can be enumerated, methyl methacrylate butadiene rubber-styrol copolymer (MBS resin), methyl methacrylate butadiene rubber multipolymer (MB resin), acrylonitri Ie-acrylic rubber-styrol copolymer (AAS resin), with vinyl cyanide-(ethylene propylene diene rubber)-styrol copolymer (AES resin), polyhutadiene etc., in these, effect and shock-resistance raising effect is improved from the viewpoint of hydrolytic resistance, particularly preferably use vinyl cyanide, divinyl, the ABS resin of styrene copolymerisation, by the MBS resin of polyhutadiene and methyl methacrylate and styrene polymerization, make the MB resin that methyl methacrylate and polyhutadiene are polymerized.In addition, as these (B) compositions, can be used alone, also can mix two or more and use.
For (B) composition, being the mode of 100 quality % with the total amount of (A) composition, according to the aromatic polycarbonate resin of (A) composition be 60 ~ 95 quality %, the thermoplastic resin of the letex polymerization of (B) composition, preferably graft polymerization multipolymer be that the scope of 5 ~ 40 quality % is coordinated and uses.
(B) use level of composition is 5 ~ 40 quality %, is preferably 40 ~ 10 quality %, when the scope for 25 ~ 10 quality %, can obtain the more excellent product of balance of intensity, mobility, flame retardant resistance, is therefore preferred scope further.When use level is more than 40 quality %, shock strength, the flame retardant resistance of thin-walled reduce.In addition, when use level is less than 5 quality %, shock strength, the mobility of thin-walled reduce.
The acid phosphoric acid ester of (C) composition used in aromatic copolycarbonate resin composition of the present invention is the compound represented by general formula (I),
(R-O)
n-PO-(OH)
3-n(I)
R is the alkyl of carbon number 1 ~ 30, and n is 1 or 2, and when n is 2, R can be the same or different.As the alkyl of R, the various alkyl such as methyl, ethyl, propyl group, butyl, amyl group, hexyl, octyl group, nonyl, decyl, dodecyl, stearyl, iso stearyl, palmityl, oil base can be enumerated, in these, from the view point of the dispersiveness in resin, the phosphodiester of preferred stearyl, iso stearyl, palmityl, oil base etc. or monoesters, particularly preferredly enumerate stearyl, iso stearyl.
Such acid phosphoric acid ester, the known method such as the method such as, be hydrolyzed after can reacting with corresponding alcohol by making phosphoryl chloride or method that Vanadium Pentoxide in FLAKES is reacted with corresponding alcohol is synthesized, also Adeka Stab AX-71 (trade(brand)name can be utilized in addition, mono phosphoric acid ester stearyl and di(2-ethylhexyl)phosphate stearyl mixture, ADEKA Inc.) etc. commercially available product.
The acid phosphoric acid ester of (C) composition used in aromatic copolycarbonate resin composition of the present invention is to improve delay thermostability, reduces the bad order of molding and the material that adds.As the use level of the acid phosphoric acid ester of (C) composition, relative to total 100 mass parts of the aromatic polycarbonate resin of (A) composition with the thermoplastic resin of the letex polymerization of (B) composition, needing is 0.001 ~ 1 mass parts, be preferably 0.01 ~ 1 mass parts, more preferably 0.01 ~ 0.5 mass parts.When use level is this scope, be detained excellent heat stability, bad order significantly reduces.When use level is less than 0.001 mass parts, can not get above-mentioned effect, in addition, during more than 1 mass parts, be detained thermostability and reduce.
Aromatic copolycarbonate resin composition of the present invention with each composition of above-mentioned (A) ~ (C) for neccessary composition, particularly when (B) that manufactured by emulsion polymerization composition is mixed with the aromatic polycarbonate resin of (A) composition, as (C) composition, by adding the acid phosphoric acid ester of ad hoc structure, the shock strength of thin-walled can be realized, the raising of thermostability, the effect that the bad order reaching molding reduces, but as required, except each composition of (A) ~ (C), each composition of following (D) ~ (G) can also be contained.Such as, by ethene-(methyl) acrylic copolymer, ethene-(methyl) acrylate copolymer also with (D) composition, chemical proofing is improved, in addition, by the not halogen-containing phosphoric acid ester also with (E) composition, flame retardant resistance can be improved, and then, by the mineral filler also with (F) composition, rigidity, flame retardant resistance can be improved, by the tetrafluoroethylene also with (G) composition, flame retardant resistance can also be improved further.
In aromatic copolycarbonate resin composition of the present invention, as described above, as (D) composition, the vinyl copolymer such as ethene-(methyl) acrylic copolymer, ethene-(methyl) acrylate copolymer can be contained, or containing ethene-(methyl) acrylic copolymer and ethene-(methyl) acrylate copolymer, certainly, the multipolymer of ethene, (methyl) vinylformic acid and (methyl) acrylic ester copolymerization can be used equally.
As the monomer of spendable vinyl copolymer, except (methyl) vinylformic acid, as (methyl) acrylate, (methyl) methyl acrylate can be enumerated, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) amyl acrylate, (methyl) Ethyl acrylate, (methyl) Octyl acrylate, (methyl) 2-EHA, (methyl) cyclohexyl acrylate, (methyl) lauryl ester, (methyl) octadecyl ester, (methyl) phenyl acrylate, (methyl) acrylate, the monomers such as (methyl) benzyl acrylate, these can be used alone or in combination with two or more kinds.In these (methyl) acrylate, from viewpoint preferably (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) butyl acrylate etc. of the dispersiveness resin.
In addition, beyond above-mentioned, the 3rd other monomers also can be suitably used as to employ the multipolymer of carbon monoxide, maleic anhydride etc.And then, also can preferably use ethene-(methyl) acrylic copolymer to be coordinated in the ionomer of metal.
(D) composition is for improving shock-resistance, chemical proofing and the composition contained, as content, relative to total amount 100 mass parts of (A) composition with (B) composition, be preferably 0.5 ~ 3 mass parts, from shock-resistance, set out in the balancing good aspect of chemical proofing, further preferred 1 ~ 2 mass parts.When content is less than 0.5 mass parts, be difficult to obtain above-mentioned effect, in addition, when content is more than 3 mass parts, flame retardant resistance reduces.
In aromatic copolycarbonate resin composition of the present invention, as (E) composition, not halogen-containing phosphoric acid ester can be contained.
As operable not halogen-containing phosphoric acid ester, as long as the phosphoric acid ester of not halogen atom-containing, be not particularly limited, but preferably can use the such as phosphoric acid ester shown in general formula (II),
[changing 6]
(in formula, R
6, R
7, R
8, R
9separately represent hydrogen atom or organic group, X represents the organic group of more than divalent, a be 0 or 1, b be the integer of more than 1, r represents the integer of more than 0.)。
In above-mentioned general formula (II), so-called organic group, refers to substituted or unsubstituted alkyl, cycloalkyl, aryl etc.In addition, substituting group time alternatively, has alkyl, alkoxyl group, aryl, aryloxy, artyl sulfo etc.And then also have with the group of following group alternatively base, described group is: as the alkoxy aryl alkyl etc. of the group combined by these substituting groups, or by aryl sulfo group aryl etc. that these substituting group bondings are combined into by Sauerstoffatom, nitrogen-atoms, sulphur atom etc.
In addition, in general formula (II), as organic group X more than divalent, can represent from above-mentioned organic group and remove the group that more than 1 is bonded to more than the divalent of the hydrogen atom of carbon atom.Such as, the group derived by the bisphenols of alkylidene group, (replacement) phenylene, polynuclear phenol class.As preferred group, there is the residue of dihydroxyphenyl propane, Resorcinol, Resorcinol, ditan, dihydroxybiphenyl, dihydroxy naphthlene etc.
This not halogen-containing phosphoric acid ester can be monomer, oligopolymer, polymkeric substance or these mixture.Specifically, tricresyl phosphate methyl ester can be illustrated, tricresyl phosphate ethyl ester, tributyl, tricresyl phosphate octyl group ester, three butoxy ethyl ester of phosphoric acid, Triphenyl phosphate, tricresyl phosphate (tolyl) ester, tricresyl phosphate base diphenyl, octyl diphenyl phosphate, tri-2-ethylhexyl phosphate, di(2-ethylhexyl)phosphate isopropyl phenyl ester, tricresyl phosphate (xylyl) ester, tricresyl phosphate (isopropyl phenyl) ester, tricresyl phosphate naphthyl ester, dihydroxyphenyl propane biphosphonate, dihydroxyphenyl propane two (diphenyl phosphoester), Resorcinol biphosphonate, Resorcinol biphosphonate, Resorcinol-diphenyl phosphoester, three (oxygen base benzene) triguaiacyl phosphate, or these substituent, polycondensate etc.
Here, as commercially available not halogen-containing phosphate compound, such as can enumerate large eight chemical industrial companies, TPP (Triphenyl phosphate), TXP (tricresyl phosphate (xylyl) ester), CR-741 (dihydroxyphenyl propane two (diphenyl phosphoester)), CR-733S (Resorcinol two (diphenyl phosphoester)), PX200 (1, 3-phenylene-four (2, 6-3,5-dimethylphenyl) phosphoric acid ester), PX201 (1, 4-phenylene-four (2, 6-3,5-dimethylphenyl) phosphoric acid ester), PX202 (4, 4 '-biphenylene-four (2, 6-3,5-dimethylphenyl) phosphoric acid ester) etc., suitably can use them.
From flame retardant resistance, the viewpoint of shock-resistance is set out, and the content of (E) composition, relative to total amount 100 mass parts of (A) composition with (B) composition, is preferably the scope of 3 ~ 25 mass parts, more preferably 10 ~ 25 mass parts.When this content is less than 3 mass parts, the flame retardant resistance of thin-walled is difficult to obtain, and in addition, when content is more than 25 mass parts, the reduction of shock-resistance is remarkable, and in addition, because of the gas that the decomposition of fire retardant produces when being mixed into shaping, the outward appearance of molding can significantly reduction.
In addition, in aromatic copolycarbonate resin composition of the present invention, for improving rigidity, the flame retardant resistance of molding further, can containing mineral filler as (F) composition.
As spendable mineral filler, talcum, mica, kaolin, diatomite, calcium carbonate, calcium sulfate, barium sulfate, glass fibre, carbon fiber, potassium titanate fiber etc. can be enumerated.Wherein, preferably as the talcum, mica etc. of tabular, fibrous filling material.As talcum, be the hydrosilicate of magnesium, general commercially available product can be used.In addition, for the median size of the mineral filler of this (F) composition is preferably 0.1 ~ 50 μm, 0.2 ~ 20 μm is more preferably.In these (F) mineral fillers, from the view point of the dispersiveness in resin, particularly preferably talcum.
(F) mineral filler of composition is described above, in order to improve rigidity and thin-wall flame retardance (special 5VB performance) and contain, as its content, relative to total amount 100 mass parts of (A) composition with (B) composition, be preferably 0.5 ~ 20 mass parts, further preferred 2 ~ 10 mass parts.When content is less than 0.5 mass parts, can't see the raising of rigidity, thin-wall flame retardance, in addition, when content is more than 20 mass parts, shock-resistance reduces, and produces bad order.
As (G) composition, in thermoplastic resin composition of the present invention, (G) tetrafluoroethylene (PTFE) can be added as required.By containing (G) composition, the effect preventing melting dripping can be given, thus improve flame retardant resistance.
(G) composition in the present invention, is just not particularly limited as long as have the composition forming fiber ability.Here, " formation fiber ability " refers to that display is bonded to each other by outside interaction resin such as shearing forces and forms fibrous tendency.As (G) of the present invention composition, such as, tetrafluoroethylene can be enumerated, tetrafluoroethylene based copolymer (such as, tetrafluoroethylene/hexafluoropropylene copolymer etc.) etc.Preferably polytetrafluoroethylene in these.
There is the tetrafluoroethylene (PTFE) forming fiber ability there is ultra high molecular weight, according to the number-average molecular weight meter obtained by standard specific gravity, be generally more than 500,000, be preferably 500,000 ~ 10,000,000.
In addition, except fine powder shape, also can use aqueous liquid dispersion (dispersion) form, the material of particulate form, as the commercially available product of fine powder shape, such as, CD076 can be enumerated, CD097E (trade(brand)name, Asahi Glass Inc.), as the commercially available product of aqueous liquid dispersion shape, such as Polyflon D210C (trade(brand)name can be enumerated, Daikin Industries Inc.), FluonAD938L, Fluon AD939E (trade(brand)name, Asahi Glass Inc.), as the commercially available product of particulate form, such as Algoflon F5 (trade(brand)name can be enumerated, Solvay Solexis Inc.) etc.
Above-mentioned have the tetrafluoroethylene (PTFE) forming fiber ability, can be used alone, also two or more use capable of being combined.
The addition of (G) composition in the present invention, relative to total amount 100 mass parts of (A) composition with (B) composition, is preferably 0.1 ~ 2 mass parts usually.For the flame retardant resistance of thermoplastic resin composition of the present invention better improves, add (G) composition, but even if add the amount more than 2 mass parts, also can not obtain the raising effect of the flame retardant resistance on this level.When being below 2 mass parts, can not worry to there is bad impact for the shock-resistance of resin combination, plasticity (outward appearance of molding), even if when mixing extrusion, extrude also good, Absorbable organic halogens ground manufactures material grain.
In addition, in aromatic copolycarbonate resin composition of the present invention, in order to appearance investigation, anti-electrostatic, photostabilization is improved, the objects such as rigidity improvement, except above-mentioned (A) ~ (G) composition, also can containing suitable any additive.As such additive, such as, the exterior lubricant such as aliphatic carboxylic acid esters, system, paraffin can be enumerated, the releasing agent such as polyethylene wax, pentaerythritol tetrastearate, the antistatic agents such as benzene sulfonamide acid alkali metal salt, the UV light absorber such as benzotriazole system, benzophenone series, the photostabilizers (weathering resistance improvement) such as hindered amine system, glass fibre (rigidity improvement), tinting material etc.The content of these additives, usually according to aromatic copolycarbonate resin composition total amount, is about 0.05 ~ 5 quality %.
Aromatic copolycarbonate resin composition of the present invention, by coordinating above-mentioned (A) composition, (B) composition and (C) composition and other compositions (D) as required ~ (G) composition etc., is obtained by melting mixing.This cooperation, mixing by normally used method, such as use ribbon mixer, Henschel stirrer, banbury mixers, tumbler mixer, single shaft screw extrusion press, two axle screw extrusion presss, altogether kneader, the method for multiaxis screw extrusion press etc. is carried out.In addition, carry out Heating temperature during melting mixing, usually select in the scope of 220 ~ 260 DEG C.
Aromatic copolycarbonate resin composition of the present invention, using above-mentioned melting mixing thing or the material grain obtained as raw material, various molding can be manufactured by hollow forming method, injection moulding method, injection-molded compression forming method, extrusion molding method, vacuum forming process, pressure empty moulding method, hot-bending forming method, compression forming method, calendaring molding method, spinning-shaping method etc.As the manufacturing process of aromatic copolycarbonate resin composition of the present invention, preferably by above-mentioned melting mixing method, manufacture the shaping raw material that material is granular, then, use this material grain, carry out injection molding forming, injection-molded compression molding.
In aromatic copolycarbonate resin composition of the present invention, using as the ABS resin, MBS resin, MB resin etc. of (B) composition manufactured by emulsion polymerization with aromatic copolycarbonate melting mixing time, by adding (C) acid phosphoric acid ester of ad hoc structure, the shock strength of thin-walled, thermostability can be improved, reduce the bad order of molding, when particularly obtaining thin molded article, improve the delay thermostability in forming mill, hot forming can be carried out, the flame retardant resistance in thin-walled situation can be improved, shock-resistance.
Therefore, aromatic copolycarbonate resin composition of the present invention can be widely used in the inside and outside shell, television enclosure (communication terminal such as TV framework, support cover, telepilot), notebook computer casing etc. of office automation (OA) equipment (duplicating machine, printer, projector etc.) that maximization thin-walled property constantly advances.
Embodiment
Below, illustrate in greater detail the present invention by embodiment, but the present invention is not by these routine any restrictions.
In following embodiment and comparative example, carry out performance evaluation by following method.
(1) Charpy impact intensity
Test is implemented according to ISO179-1.Wherein, when implementing, the test film of length 80mm, wide 10mm, thickness 1/16 inch is utilized material cylinder temperature 260 DEG C, the condition of die temperature 40 DEG C forms, apply breach in the direction of the width, calculate according to the impact value during back side with hammer stroke notch part.For the forming cycle usual molding condition of 30 seconds and the delay condition of taking out again after making it be detained in forming mill with forming cycle 20 points, evaluate physical property.
In addition, shock strength conservation rate is the value calculated by following formula.
Shock strength conservation rate (%)=(shock strength/be shaped shock strength to be usually detained postforming) × 100
(2) tensile yield strength
Test is implemented according to ISO527-1/ISO527-2.Test film is shaped under material cylinder temperature 260 DEG C, die temperature 40 DEG C of conditions, for the forming period usual molding condition of 30 seconds and the delay condition of taking out again after making it be detained in forming mill with forming period 20 points, evaluation physical property.
In addition, tensile yield strength conservation rate is the value calculated by following formula.
Tensile yield strength conservation rate (%)=(tensile yield strength/be shaped tensile yield strength to be usually detained postforming) × 100
(3) outward appearance
Mold fouling during (i) continuous molding
Under the condition of the material cylinder temperature 280 DEG C of injection molding machine, die temperature 60 DEG C, with forming period 30 seconds, carry out being shaped for 120 times after, the presence or absence of visual observation dirt settling in a mold.
(ii) appearance change (occurring with or without crazing) after being detained
Under the condition of the material cylinder temperature 280 DEG C of injection molding machine, die temperature 60 DEG C, after making it be detained 30 minutes in forming mill, form, the appearance change (particularly the generation of crazing) on visual observation molding surface.
(iii) what melt trace portion is involved in gas evaluation
Under the condition of the material cylinder temperature 260 DEG C of injection molding machine, die temperature 60 DEG C, the molten trace portion of visual observation molding is involved in or without gas.
(4) chemical proofing
Test film shape is length 127mm, width 12.7mm, thickness 3.2mm, this test film is applied under 3 case of bendings the strain of 1.5%, at the medicine of Response Division coating regulation, and the presence or absence of visual observation appearance change (albefaction, crackle, cracking).In medicine, employ the LOCTITE648 (the anaerobic caking agent of screw part) of HENKEL Inc..
(5) mobility
Under the condition of the material cylinder temperature 240 DEG C of injection molding machine, die temperature 40 DEG C, under thickness 2mm condition, measure helical flow long.
In addition, the evaluation of mobility is implemented for embodiment 16 ~ embodiment 28 and comparative example 14 ~ comparative example 23.
(6) flame retardant resistance
According to UL94 specification, V test is implemented for test film thickness 0.6mm and 1.0mm, 5VB test is implemented for test film thickness 1.0mm.
The result of V test judges according to V-0, V-1, V-2, V-2out, and the result of 5VB test is judged to be acceptance or rejection.
In addition, the evaluation of flame retardant resistance, implements for embodiment 16 ~ embodiment 28 and comparative example 14 ~ comparative example 23.
Embodiment 1 ~ 28, comparative example 1 ~ 31
To show the ratio shown in 1-1, table 1-2, table 1-3, table 2-1 and table 2-2; coordinate each composition, for exhaust two axle extrusion shaper [machine name: TEM35, toshiba machine (strain) is made]; carry out melting mixing at 240 DEG C, carried out expecting granulation.The material grain obtained after dry 5 hours, is carried out injection molding forming, obtains test film under 80 ~ 120 DEG C of conditions under forming temperature 260 DEG C, die temperature 80 DEG C of conditions.Use the test film of gained, by aforesaid various evaluation test assess performance.Result is shown in table 1-1, table 1-2, table 1-3, table 2-1 and table 2-2.
[table 1]
[table 2]
[table 3]
[table 4]
[table 5]
In addition, (A) ~ (H) composition in each table is as follows.
(A) composition
The aromatic copolycarbonate (goods name: TARFLON FN2200A, bright dipping is emerging to be produced) of viscosity-average molecular weight 21500
(B) composition
(B1) ABS resin (goods name: KralasticSXH-330, Japanese A & L system) (letex polymerization product)
(B2) MBS resin (goods name: Metablen C-223A, the beautiful sun system of Mitsubishi) (letex polymerization product)
(B3) MB resin (goods name: Paraloid EXL2603, Rohm and Haas system) (letex polymerization product)
(B4) AS resin (goods name: S101N, UMG ABS system) (suspension polymerization product)
(B5) ABS resin (goods name: AT-05, Japanese A & L system) (mass polymerization product)
(C) composition
Acid phosphoric acid ester: mono phosphoric acid ester stearyl ester and di(2-ethylhexyl)phosphate stearyl ester mixture
(trade(brand)name: Adeka Stab AX-71, ADEKA system)
(D) composition
Ethylene-acrylic acid copolymer (goods name: Elvaloy HP662, Mitsui Du Pont system)
(E) composition
(E1) two (diphenyl phosphoester) (goods name: CR-741, large eight chemical industry systems) of dihydroxyphenyl propane
(E2) two (two-2,6-dixylenyl phosphate) (goods name: PX-200, large eight chemical industry systems) of 1,3-phenylene
(E3) two (diphenyl phosphoester) (goods name: CR-733S, large eight chemical industry systems) of 1,3-phenylene
(F) composition
Talcum (goods name: TP-A25, Fuji's talcum industry system)
(G) composition
(G1) tetrafluoroethylene (PTFE) (goods name: Polyflon D210C, Daikin Industries system)
(G2) tetrafluoroethylene (PTFE) (goods name: Fluon AD938L, Asahi Glass system)
(H) composition
Burn till hydrotalcite (goods name: DHT-4C, Kisuma Inc.)
According to table 1-1, table 1-2, table 1-3, table 2-1 and table 2-2, by coordinating specific acid phosphoric acid ester, the reduction of the molecular weight of the polycarbonate that delay when being shaped can be suppressed to cause.That is, shock strength, tensile yield strength, also has high conservation rate after retardation assay, can confirm that the intensity based on polycarbonate component keeps.
Also known in addition, because mobility is excellent, even if the excellent and molding that flame retardant resistance is excellent of mechanical strength also can be obtained in thin-walled situation.
Known in addition, replace the multipolymer be polymerized by the letex polymerization of (B) composition, use when utilizing the multipolymer of mass polymerization, mobility reduces, degraded appearance, and the mechanical strength etc. being detained postforming product also reduces.In addition, replace the acid phosphoric acid ester of (C) composition and use (H) composition burn till hydrotalcite time, can not suppress the reduction of molecular weight of the polycarbonate after being detained, the known hydrotalcite that burns till is without any effect.
Industry utilizes possibility
In aromatic copolycarbonate resin composition of the present invention, in order to improve the shaping processability of polycarbonate, it is the resin combination coordinating the ABS resin, AS resin etc. that are manufactured by emulsion polymerization, energy suppression reduces because of the molecular weight of the polycarbonate that delay when hot forming, large-scale forming mill use causes, and can improve the mechanical strength of resin forming product.In addition, in thin molded development, also can realize the raising of the flame retardant resistance in thin-walled situation, shock-resistance.
Claims (4)
1. an aromatic copolycarbonate resin composition, it is the aromatic copolycarbonate resin composition containing following composition:
(A) aromatic polycarbonate resin of 60 ~ 95 quality %;
Acrylonitrile-butadiene rubber-styrol copolymer, the i.e. ABS resin of (B) letex polymerization of 5 ~ 40 quality %;
(C) acid phosphoric acid ester shown in general formula (I),
(R－O)
n－PO－(OH)
3－n(I)
In formula (I), R represents the alkyl of carbon number 1 ~ 30, and n is 1 or 2; And
(D) ethene-(methyl) acrylic copolymer, or, ethene-(methyl) acrylic copolymer and ethene-(methyl) acrylate copolymer,
Wherein, relative to total amount 100 mass parts of described (A) composition with (B) composition, respectively containing described (C) composition 0.001 ~ 1 mass parts, described (D) composition 0.5 ~ 5 mass parts.
2. aromatic copolycarbonate resin composition according to claim 1, it also contains relative to total amount 100 mass parts of (A) composition and (B) composition is that the not halogen-containing phosphoric acid ester of 3 ~ 25 mass parts is as (E) composition.
3. aromatic copolycarbonate resin composition according to claim 1 and 2, it also contains relative to total amount 100 mass parts of (A) composition and (B) composition is that the mineral filler of 0.5 ~ 20 mass parts is as (F) composition.
4. the aromatic copolycarbonate resin composition according to any one of claims 1 to 3, it contains relative to total amount 100 mass parts of (A) composition and (B) composition is that the tetrafluoroethylene of 0.1 ~ 2 mass parts is as (G) composition.
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| JP2011085709A JP5736223B2 (en) | 2010-12-14 | 2011-04-07 | Aromatic polycarbonate resin composition |
| JP2011-085709 | 2011-04-07 | ||
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